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The Impact of Introducing University Research Administrators(URAs) into Japanese National Universities - Strengthening Research Capabilities and Improving Reputation Management
Masakuni Taniguchi, Keisuke Uenishi, Kiminori Gemba
Proceedings of 10th International Conference on Business Management of Technology 2025/07 Research paper, summary (international conference)
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データを用いたヘルスケアビジネス（サービス）の提案〜健康な若者からヘルスデータを持続的に収集する仕組み〜
石井拓馬, 江口卓郎, 杉本琢真, 趙張晏, 黒田聡, 松浦博一, 上西啓介
センサーネットワーク研究会 第189回研究会資料 2025/01 Lecture material (seminar, tutorial, course, lecture, etc.)
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Research on the Practice and Effectiveness of Intellectual Property Education for Cultivating Creativity
Yuito Ota
Vol. 22 2024/12 Research paper, summary (national, other academic conference)
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Research on the process of increasing oligopoly in the semiconductor manufactureing equipment industry
Toshiyuki Watanabe, Keisuke Uenishi, Hiroyuki Nagano, Shuichi Ishida
Vol. 73 p. 260-263 2024/12 Research paper, summary (national, other academic conference)
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Empirical research for research management in Japanese universities
Masaki Taniguchi, Keisuke Uenishi, Kiminori Gemba
Vol. 73 p. 154-157 2024/12 Research paper, summary (national, other academic conference)
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A New Approach to IP Creativity Education in Secondary Education: Fostering Creativity and IP Awareness through Design Thinking and AI Evaluation
Yuito OHTA
2024/11 Research paper, summary (national, other academic conference)
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Research of the relationship between URA and University Rankings
Masakuni TANIGUCHI, Keisuke UENISHI, Kiminori GEMBA
72th Meeting of Japan Association for Management System Vol. 72 2024/05 Research paper, summary (national, other academic conference)
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Impact of Future Power Source Composition and Business Changes on CO2 Emissions from Passenger Cars in Japan - A Case Study of Car-Sharing
T.Hamada, K.Uenishi
19th meeting of the Institute of Life Cycle Assessment 2024/03 Research paper, summary (national, other academic conference)
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Analysis of Product Development Strategies at Keyence Based on Intellectual Property Application Trends
Katsuya ABIKO, Keisuke UENISHI
2023/11 Research paper, summary (national, other academic conference)
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Analysis on the relationship between environmental performance indicators and corporate value
Kazunori KISHI, Keisuke UENISHI
2022/10 Research paper, summary (national, other academic conference)
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Creation and Development of Regional Industrial Ecosystems -A Case Study of Ishikari Bay New Port Area in Hokkaido, Japan-
Makoto TANIFUJI, Keisuke UENISHI
2022/05 Research paper, summary (national, other academic conference)
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Creating Business Domain Concepts in Regional Projects: in the Case of Japan
M.Tanifuji, K.Uenishi
Proc. 2021 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM2021) p. 989-993 2021/12 Research paper, summary (international conference)
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Engineering Education by OJE Method -33.Educational Effectiveness of Speech Measurement
S.Matsubayashi, S.Seino, K.Uenishi
Vol. 69 p. 232-233 2021/09 Research paper, summary (national, other academic conference)
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Ideation in IKANKOGEI collaboration ～Fostering an Entrepreneurship Mind to Engineers through On the Job Education
E.Yoshida, M.Yagi, Y.Ohno, H.Anai, A.Tatsumi, K.Uenishi
The 60th Annual Conference of Japan Society for Medical and Biological Engineering 2021/06/15 Research paper, summary (national, other academic conference)
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A Study of Competitive Advantage of Semiconductor Equipment Suppliers Based on Managerial Indicators and Patent Analysis
T.Watanabe, K.Uenishi, H.Nagano, S.Ishida
Proceeding of of XXXⅡ ISPIM Innovation Conference 2021/06 Research paper, summary (international conference)
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Consideration on high value addition strategies for differentiation of products
A.Nakamura, K.Uenishi
2021/02 Research paper, summary (national, other academic conference)
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Innovation Through Diversity Management in Practical Education
T.Masuda, K.Uenishi
Proceedings of ISPIM Connects Osaka 2020/12 Research paper, summary (international conference)
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Discussion of B to B Rate and Diversification Analysis in Japanese Manufacturing Companies
H.Imahashi, K.Uenishi, K.Gemba
2020/10 Research paper, summary (national, other academic conference)
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日本製造業におけるB to B率及び研究開発多角化度と収益性の分析
今橋裕, 今橋裕, 上西啓介, 玄場公規
研究・イノベーション学会年次学術大会講演要旨集(CD-ROM) Vol. 35th 2020
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Technology Development of CMOS Image Sensor and Acquisition of Competitive Advantage from the Viewpoint of Mass Production Technology and Corporate Organizational Structure
Y.Iwanaga, K.Uenishi
2019/11 Research paper, summary (national, other academic conference)
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Effects of UV-LED Irradiation Towards Leaf-Lettuce Roots in Plant Factory
M.Urano, K.Uenishi
Student Paper Abstracts of 2019 International Meeting for Future of Electron Devices 2019/11
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Consideration for oligopoly in the semiconductor equipment market : Comparative study of Dry-Etching Equipment manufacturers
Vol. 62 p. 196-199 2019/05/25 Research paper, summary (national, other academic conference)
Publisher: 日本経営システム学会
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日本製造業におけるB to B率と収益性との関係性分析
今橋裕, 上西啓介, 玄場公規
研究・イノベーション学会年次学術大会講演要旨集(CD-ROM) Vol. 34th 2019
-
Measurement of Students' Mental-state in Class through Objective Biometrics and Subjective Questionnaire
Y.Tanaka, K.Uenishi
Technical Report of IEICE. Vol. 118 No. 261 p. 71-76 2018/10
-
Competitive Advantages through CSV: Quantative Analysis of CSV-promoting Companies
Keiko Nishioka, Kiminori Gemba, Keisuke Uenishi, Atsuko Kaga
Proceedings - 2017 6th IIAI International Congress on Advanced Applied Informatics, IIAI-AAI 2017 p. 52-57 2017/11/15
Publisher: Institute of Electrical and Electronics Engineers Inc.
-
Analysis of R&D System for Technological Diversification Based on Patent Information
R.Fujinaga, K.Uenishi
Vol. 59 p. 84-85 2017/10 Research paper, summary (national, other academic conference)
-
Product Decelopment and Intellectual Property Strategy to Secure Market Creation and Competitive Advantage
H.Kojima, K.Uenishi
Vol. 59 p. 88-89 2017/10 Research paper, summary (national, other academic conference)
-
Role and Application of Collaborative Persons for Diversity Company
T.Masuda, K.Uenishi
Vol. 59 p. 86-87 2017/09 Research paper, summary (national, other academic conference)
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Sn-Ag-Bi-In-Cu系はんだの接合信頼性に及ぼす熱サイクル負荷とSb添加の影響
三原一樹, 日根清裕, 乗峯笙汰, 酒谷 茂昭, 秋山真之介, 上西啓介
第27回マイクロエレクトロニクスシンポジウム論文集 Vol. 27 2017/09
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Consideration for oligopoly in the semiconductor equipment market : Deriving hypotheses of oligopolistic mechanism
Vol. 58 p. 64-67 2017/05/27
Publisher: 日本経営システム学会
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エレクトロマイグレーションによるInSn共晶はんだ接合部の組織変化
上村泰紀, 酒井泰治, 作山誠樹, 上西啓介
第23回「エレクトロニクスにおけるマイクロ接合・実装技術」シンポジウム概要集 Vol. 23 2017/01
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食品製造業における技術革新と戦略変化の関係性
今橋 裕, 上西啓介, 玄場公規
研究・イノベーション学会第３０回年次学術大会講演集 2016/11
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日本製造企業の研究開発投資・設備投資と収益性の実証分析
玄場公規, 竹岡紫陽, 今橋裕, 上西啓介
研究・イノベーション学会第３０回年次学術大会講演集 2016/11
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中小企業への投資における企業審査基準に関する研究
細川 茜, 今橋 裕, 上西啓介
日本経営システム学会 第57回全国研究発表大会概要集 Vol. 57 2016/10
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OJE法による工学教育 -25. 超人を創る (障がい者支援機器のあり方の考察と試作・評価)-
上西啓介, 松田靖史
H28年度工学教育研究講演会講演論文集 p. 542-543 2016/09
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ファミリービジネスのCSV戦略による地方活性化
西岡慶子, 玄場公規, 上西啓介, 加賀有津子
地域活性学会第8回研究大会講演概要集 Vol. 8 2016/09
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Effect of Sb Addition on Phase Transformation and Thermal Fatigue Properties of Sn-Ag-Bi-In Soplder
S.Norimine, K.Mihara, K.Hine, S.Sakatani, S.Akiyama, K.Uenishi
Proceedings on 22nd Symposium on Microjoining and Assembly Technology in Electronics Vol. 22 p. 441-442 2016/02
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Electromigration Behavior in Micro-joints between In-Sn and Copper
Y.Oyabu, A.Sato, K.Uenishi, Y.Uemura, S.Sakuyama
Proceedings of 22ns Symposium on Microjoing and Assembly Technology in Electronics Vol. 22 p. 437-438 2016/02
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Strategies for the brand-building of small- and medium-sized enterprises Case analysis of traditional food manufacturing
Hiroshi Imahashi, Kiminori Gemba, Keisuke Uenishi
PROCEEDINGS 2016 5TH IIAI INTERNATIONAL CONGRESS ON ADVANCED APPLIED INFORMATICS IIAI-AAI 2016 p. 853-856 2016
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Formation of Compounds and Increase of Melting Temperature of Solder Joints by Using Reaction between Ag and Sn Particles
Akari Terao, Keisuke Uenishi
Vol. 21 p. 441-442 2015/02
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試験法標準に準拠した鉛系および非鉛系はんだの力学的基礎データ集構築
旭吉雅健, 伊藤隆基, 稲田将人, 上西啓介
Mate2015 「エレクトロニクスにおけるマイクロ接合・実装技術」シンポジウム論文集 Vol. 21 p. 421-422 2015/02
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Synthesis of Monodispersed Silver nanoparticles by Chemical Reduction Method using Low Molecular Tertiary Amine
Joji Wakita, Keisuke Uenishi
Vol. 21 p. 429-430 2015/02
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Effect of Indium Addition on Microstructure of Sn-Bi Eutectic Alloy
S.Tanaka, Y.Tsuruta, K.Uenishi, Y.Uemura, T.Akamatsu, S.Sakuyama
Vol. 21 p. 169-172 2015/02
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自動車業界のライフタイムバリュー戦略の分析と一考察 ～直営店の貢献とその短・長期的効果
小林篤功, 上原宏敏, 長野寛之, 志方宣之, 上西啓介, 石田修一
第53回日本経営システム学会全国研究発表大会概要集 2014/10
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Relationship Between Shrinkage and Conductivity Properties of Cured Isotropic Conductive Adhesives
Shigeru Kohinata, Yoshihiko Shiraki, Masahiro Inoue, Keisuke Uenishi
2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP) p. 316-321 2014
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Engineering Education based on OJE (On the Job Education) Method : 19.Practical Exercise of Engineering Education based on Community Cooperation
KURASHIKI Tetsusei, MORI Hiroaki, WAKAMOTO Kazuhito, IKEDA Junji, UENISHI Keisuke, OHMURA Etsuji
Vol. 25 No. 61 p. 630-631 2013/08/29
Publisher: Japanese Society for Engineering Education
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低温実装用Sn-Bi共晶はんだの延性と接合信頼性改善 (特集 種々のニーズに応えて進化する最近の鉛フリーはんだ実装)
上西 啓介
金属 Vol. 82 No. 12 p. 1105-1111 2012/12
Publisher: アグネ技術センター
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Solder-joint Reliability of Eutectic Sn-Bi with Added Third Elements
Seiki Sakuyama, Toshiya Akamatsu, Keishiro Okamoto, Keisuke Uenishi
Proceeding on 18th Symposium on Microjoining and Assembly Technology for Electronics (Mate2012) 2012/01
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Influence of Growth of Intermetallic Compound Layers on Electromigration resistance of Micro Solder Joints
Daisuke Toyoshima, Keisuke Uenishi, Yasumitsu Orii
Proceeding on 18th Symposium on Microjoining and Assembly Technology for Electronics (Mate2012) 2012/01
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Growth Observation of Intermetallic Compounds on Solder Capped Cu pillar bump in Electomigration Test
Yasumitsu Orii, Yuichi Noma, Sayuri Kohara, Keiji Okamoto, Kazushige Toriyama, Daisuke Toyoshima, Keisuke Uenishi
Proceeding on 18th Symposium on Microjoining and Assembly Technology for Electronics (Mate2012) 2012/01
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Contact Phenomena between MEMS Metallic Probe and Al Substrate
Keisuke Uenishi, Takuya Matsumoto, Takehiko Sato, Tomohiro Ishida
Proceeding on 18th Symposium on Microjoining and Assembly Technology for Electronics (Mate2012) 2012/01
-
High-Density Wiring Technology for LSI Packages
TANI Motoaki, SASAKI Shinya, UENISHI Keisuke
Vol. 111 No. 327 p. 35-40 2011/11/21
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Effects of Sb Addition on Impact Resistance Improvement of Sn-Bi Solder BGA Joints
K.Okamoto, N.Imaizumi, T.Akamatsu, S.Sakuyama, K.Uenishi
Proceedings of the 21th Micro Electronics Sympojium 2011/09
Publisher: エレクトロニクス実装学会
-
イノベーションリーダー養成を狙ったOJE法による実践型演習
S.Seino, A.Kaga, K.Uenishi, E.Ohmura, T.Yamamoto
日本工学教育協会 平成23年度 工学・工業教育研究講演会講演論文集 2011/08
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Effects of showing other's behavior on separating garbage
Yasuhiro Miyai, Keisuke Uenishi, Masahiro Matsumura
Proceedings on the 25th Annual Conference of the Japanese Society for Artificial Intelligence, 2011 2011/06
-
Influence of Zn Addition to Eutectic Sn-Bi Solder on Joint Reliability with Cu Electrode
Poceedings of International Conference on Electronics Packaging 2011 2011
-
銅ポストバンプを用いたプリフェラル型超微細フリップチップ接合におけるはんだ組織の観察と信頼性
Mate2011 「エレクトロニクスにおけるマイクロ接合・実装技術」シンポジウム論文集 Vol. Vol.17, p.59-62 2011
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金スタッドバンプを用いたフリップチップ接合部の熱ストレスによるはんだ組織変化の観察
Mate2011 「エレクトロニクスにおけるマイクロ接合・実装技術」シンポジウム論文集 Vol. Vol.17, p.55-58 2011
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ナノ流体の冷媒としての伝熱特性に関する研究
Mate2011 「エレクトロニクスにおけるマイクロ接合・実装技術」シンポジウム論文集 Vol. Vol.17, p.355-356 2011
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はんだ接合部でのエレクトロマイグレーション挙動に及ぼすＵＢＭ層の影響
Mate2011 「エレクトロニクスにおけるマイクロ接合・実装技術」シンポジウム論文集 Vol. Vol.17, p.63-66 2011
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Sn-Bi 共晶はんだへのZn 添加によるCuとの接合性向上
服部
Mate2011 「エレクトロニクスにおけるマイクロ接合・実装技術」シンポジウム論文集 Vol. Vol.17, p.25-30 p. 25-30 2011
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Infl uence of UBM Layers on Electro-migration Behavior of Micro-joints using Sn-Ag Solders
Poceedings of International Conference on Electronics Packaging 2011 2011
-
8-111 Engineering education based on OJE (On the Job Education) method : Part XIII, Check of educational effect of OJE by means of questionnaire and interview
YAMAMOTO Takao, UENISHI Keisuke, Maiya Kiyoshi
Vol. 22 p. 174-175 2010/08/19
Publisher: Japanese Society for Engineering Education
-
Service Science: Analysis of the Business System of Service Manufacturing Companies
IProceedings of EEE International Conference on Industrial Engineering and Engineering Management Vol. No.5674488, p.448-452 2010
-
Microstructure and Mechanical Properties of Sb Addition Eutectic Sn-Bi Solder
IEICE TRANSACTIONS on Electronics Vol. Volume E93-C No.11 (2010) p.48 2010
-
Microstructural Changes in Micro-joints between Sn-58Bi Solders and Copper by Electro-migration
Poceedings of International Conference on Electronics Packaging 2010 Vol. p.475-478 2010
-
ＯＪＥ法による工学教育 －11.ビジネスエンジニアリング専攻におけるテクノロジーデザイン教育－
平成22年度 工学・工業教育研究講演会 講演論文集 Vol. pp.172-173 2010
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Microstructural Changes in Micro-joints between Sn-58Bi Solders and Copper by Electro-migration
Poceedings of International Conference on Electronics Packaging 2010 Vol. p.475-478 2010
-
Microstructure and Mechanical Properties of Sn-Bi Eutectic Solders Added with a Third Element
Proceeding on the International Conference on Electronics Packaging (ICEP2009) Vol. p.151-156 2009
-
Interface Metallurgy fo Micro Joint using Lead Free Solders
Kinzoku Materials Scienve & Technology Vol. Vol.79, No.5 (2009) p.396-402 2009
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Evaluation of Electric Contact Phenomena under Small Contact Load
Proceeding on the International Conference on Electronics Packaging (ICEP2009) Vol. p.423-428 2009
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ＯＪＥ法による工学教育－徳島県阿南市をフィールドとした演習－
(社)日本工学教育協会 平成21年度 工学・工業教育研究講演会講演論文集 Vol. (2009-8) 526-527 2009
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鉛フリーはんだ接合における界面メタラジー
金属 Vol. Vol.79, No.5 (2009) p.396-402 2009
-
第三元素添加によるSn-Bi共晶はんだの組織微細化と延性改善効果
第15回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(MATE2009)論文集 Vol. Vol.15, pp.345-348 2009
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エレクトロマイグレーションによるはんだ・銅微細接合部の組織変化
第19回マイクロエレクトロニクスシンポジウム論文集 2009
-
イノベーションリーダー養成プログラム－産業クラスターの高度化に向けて－
(社)日本工学教育協会 平成21年度 工学・工業教育研究講演会講演論文集 Vol. (2009-8) 596-597 2009
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はんだ・銅微細接合部におけるエレクトロマイグレーション現象
第15回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(MATE2009)論文集 Vol. Vol.15, pp.39-42 2009
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Microstructure and Mechanical Properties of Sn-Bi Eutectic Solders Added with a Third Element
Proceeding on the International Conference on Electronics Packaging (ICEP2009) Vol. p.151-156 2009
-
MEMSプローブとAl電極との接触性評価
第15回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(MATE2009)論文集 Vol. Vol.15 pp.259-262 2009
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Evaluation of Electric Contact Phenomena under Small Contact Load
Proceeding on the International Conference on Electronics Packaging (ICEP2009) Vol. p.423-428 2009
-
Microjoining and nanojoining
Woodhead Publishing Limited 2008
-
非共沸系混合冷媒による沸騰熱伝達限界の改善
電子情報通信学会論文誌Ｃ Vol. Vol.J91-C, No.11, pp. 2008
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微小荷重における電気接点現象の評価
第18回マイクロエレクトロニクスシンポジウム（MES2008）論文集 Vol. Vol.18 (2008) p. 2008
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レーザアブレーションを用いたSi基板低環境負荷電極形成プロセス
第14回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム Vol. Vol.13, p.315-318 2008
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Sn-Bi共晶はんだへの第三元素添加効果
第18回マイクロエレクトロニクスシンポジウム(MES2008)論文集 Vol. Vol.18 (2008) p. 2008
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OJE法による工学教育 -11. ビジネスエンジニアリング専攻における知的財産権教育
平成20年度 工学・工業教育研究講演会 講演論文集 Vol. p.486-487 2008
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Microjoining and nanojoining
Woodhead Publishing Limited 2008
-
MEMSプローブモジュールの開発 －Al電極への接触の検討－
第14回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム Vol. Vol.14, p.283-286 2008
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MEMS プローブとAu 及びAl 電極との接触性評価
第18回マイクロエレクトロニクスシンポジウム（MES2008）論文集 2008
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Development of MEMS Probe for Fine Pitch Contact
Smart Processing Technology Vol. Vol.2 (2008) p.175-178 2008
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A-019 Method of the engineering education in Department of Management of Industry and Technology : Practical Exercise by the OJE (On the Job Education) Method
MATSUMURA Nobuhiko, UENISHI Keisuke, KURASHIKI Tetsusei, SEINO Satoshi, MURATA Masato
Vol. 19 p. 728-729 2007/08/02
Publisher: Japanese Society for Engineering Education
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8-333 Engineering Education based on OJE (On the Job Education) method : Part VIII : Production of Graduate Students with Master's Degrees both of Engineering and Business Administration
UENISHI Keisuke, SATO Takehiko, MATSUMURA Nobuhiko, ASADA Takayuki, TAKEDA Eiji, NISHIGAKI Aoi
Vol. 19 p. 634-635 2007/08/02
Publisher: Japanese Society for Engineering Education
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On the Job Education Performed by the Collaboration of Graduate School of Engineering and Economy
上西啓介, 加賀有津子, 座古勝, 鳴海邦碩, 佐藤武彦, 山本孝夫, 村田雅人, 松村暢彦, 倉敷哲生, 清野智史
映像情報メディア学会技術報告 Vol. 31 No. 58(ENT2007 41-52) 2007
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Effect of Ag Addition to Sn-Bi Eutectic Solders on the Microstructure and Properties of Joints with Cu
Proceedings of International Conference on Electronics Packaging, 2007, Tokyo Japan, (2007) Vol. p.193-196 2007
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Effect of Ag Addition to Sn-Bi Eutectic Solders on the Microstructure and Properties of Joints with Cu
Proceedings of International Conference on Electronics Packaging, 2007, Tokyo Japan, (2007) Vol. p.193-196 2007
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9-214 Engineering Education based on OJE (On the Job Education) method : Part I: Toward a sustainable self-development
KURASHIKI Tetsusei, ZAKO Masaru, SATO Takehiko, UENISHI Keisuke
Vol. 18 p. 470-471 2006/07/28
Publisher: Japanese Society for Engineering Education
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9-214 Engineering Education based on OJE (On the Job Education) method : Part II: Introduction of practical exercises and their educational aim
UENISHI Keisuke, ZAKO Masaru, SATO Takehiko, MURATA Masato, KURASHIKI Tetsusei
Vol. 18 p. 472-473 2006/07/28
Publisher: Japanese Society for Engineering Education
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Engineering Education based on OJE (On the Job Education) method
松村暢彦, 加賀有津子, 座古勝, 鳴海邦碩, 佐藤武彦, 山本孝夫, 村田雅人, 上西啓介, 倉敷哲生, 清野智史
映像情報メディア学会技術報告 Vol. 30 No. 56(ENT2006 18.21-29) 2006
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Solder Joint Reliability of Flip-Chip BGA by Using Sn-Bi System Solder
12th Symposium on Microjoining and Assembly Technology in Electronics Vol. p.259-264 2006
-
Recycling of Waste Si Wafer to Solar Cell
Proceedings of Asia Pacific Symposium on Eco Design 2006 2006
-
Photo catalytic Properties of hybrid TiO2 Spray Coating with Au Nano Particles
Smart Processing Technology Vol. Vol.1 P.69-72 2006
-
On a Practical Exercise with OJE (On the Job Education)
Journal of Japanese Society for Engineering Education Vol. Vol.54, No.2, pp.69-75 2006
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Microstructure and Strength of Ag Added Eutectic Sn-Bi Solders
12th Symposium on Microjoining and Assembly Technology in Electronics Vol. p.19-22 2006
-
Laser Cladding of Fe-Cu Based Alloys on Aluminum
Solid State Phenomena 2006
-
Joint property of packages prepared by low temperature soldering using Ag added Sn-Bi solders
Proceedings of 16th Symposium on Micro Electronics (MES2006) Vol. p. 2006
-
Interfacial Microstructure of Joint between Various Barrier Metals and Sn-Ag Based Solders
12th Symposium on Microjoining and Assembly Technology in Electronics Vol. p.145-148 2006
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ＯＪＥ(On the Job Education)方式による実践型演習
工学教育 Vol. Vol.54, No.2, pp.69-75 2006
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次世代電子ＳＩ会 第四回シンポジウム（若手ポスターセッション）報告
電子材料 Vol. Vol.2 (2006) p.92-93 2006
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廃棄シリコンウェハの太陽電池へのリサイクル
Proceedings of Asia Pacific Symposium on Eco Design 2006 2006
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各種バリア金属材料とSn-Ag系はんだとの接合界面組織
第12回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム Vol. p.145-148 2006
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低融点はんだを用いた Flip-chip BGAはんだ接合部の信頼性
第12回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム Vol. p.259-264 2006
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Sn-Ag系はんだと各種バリア金属との接合性評価
MES2006 第16回マイクロエレクトロニクスシンポジウム論文集 Vol. p. 2006
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Ag添加したSn-Bi系共晶はんだの組織と強度
第12回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム Vol. p.19-22 2006
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Ag添加Sn-Bi系はんだを用いた低温実装部の接合性評価
MES2006 第16回マイクロエレクトロニクスシンポジウム論文集 Vol. p. 2006
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Reactivity between Sn-Ag solder and Au/Ni-Co plating to form intermetallic phases
T Yamamoto, S Sakatani, S Kobayashi, K Uenishi, KF Kobayashi, M Ishio, K Shiomi, A Hashimoto, M Yamamoto
MATERIALS TRANSACTIONS Vol. 46 No. 11 p. 2406-2412 2005/11
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Laser cladding of Fe-Cr-C alloys on A5052 aluminum alloy using diode laser
S Iwatani, Y Ogata, K Uenishi, KF Kobayashi, A Tsuboi
MATERIALS TRANSACTIONS Vol. 46 No. 6 p. 1341-1347 2005/06
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Reactivity between Sn-Ag Solder and Au/Ni-Co Plating to Form Intermetallic Phases
Materials Transaction Vol. Vol.46 No.11 p.2406-2412 2005
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Photo catalytic Properties of hybrid TiO2 Spray Coating with Au Nano Particles
special issue by High Temperature Society of Japan 2005
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Interfacial Reaction between Sn-Ag Based Solders and Au/Ni Alloy Platings
Materials Science Forum Vol. Vol.502, pp.411-416/, 2005
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Diode laser cladding on A5052 aluminium alloy for wear resistant
Shingo Iwatani, Yasuhito Ogata, Keisuke Uenishi, Kojiro F. Kobayashi, Akihiko Tsuboi
HT2005: Proceedings of the ASME Summer Heat Transfer Conference 2005, Vol 3 Vol. HT2005-72442 p. 295-301 2005
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Diode Laser Cladding on A5052 Aluminum Alloy for Wear Resistance
Proc. ASME Heat Transfer Conference, HT2005-72442 Vol. HT2005-72442 2005
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Dielectric Properties of Pb(Zr,Ti)O3 Ceramics Prepared by Pulsed Electric Current Sintering
Novel Materials Processing Vol. p.325-328 2005
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Reactivity between Sn-Ag Solder and Au/Ni-Co Plating to Form Intermetallic Phases
Materials Transaction Vol. Vol.46 No.11 p.2406-2412 2005
-
Photo catalytic Properties of hybrid TiO2 Spray Coating with Au Nano Particles
special issue by High Temperature Society of Japan 2005
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Laser Cladding of Fe-Cr-C Alloys on A5052 Aluminium Alloy Using Diode Laser
Materials Transactions Vol. Vol.46, No.6, pp.1341-1347/, 2005
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Jisso技術立国への道 若手のネットワーク作り
電子材料 Vol. 9月号 p.6-7 2005
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Interfacial reaction between Sn-Ag based solders and Au/Ni alloy platings
Keisuke Uenishi, Kojiro F. Kobayashi
Materials Science Forum Vol. 502 p. 411-416 2005
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Diode laser cladding on a5052 aluminium alloy for wear resistant
Shingo Iwatani, Yasuhito Ogata, Keisuke Uenishi, Kojiro F. Kobayashi, Akihiko Tsuboi
Proceedings of the ASME Summer Heat Transfer Conference Vol. 3 p. 295-301 2005
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Dielectric Properties of Pb(Zr,Ti)O3 Ceramics Prepared by Pulsed Electric Current Sintering
Novel Materials Processing Vol. p.325-328 2005
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Sn-AgはんだとAu/Ni-Coめっきとのマイクロ接合部急速合金化に関する研究
小林 真司, 山本 孝志, 上西 啓介
マイクロエレクトロニクスシンポジウム論文集 Vol. 14 p. 233-236 2004/10/14
Publisher: エレクトロニクス実装学会
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Tensile strength and pseudo-elasticity oT YAG laser spot melted Ti-Ni shape memory alloy wires
Y Ogata, M Takatugu, T Kunimasa, K Uenishi, KF Kobayashi
MATERIALS TRANSACTIONS Vol. 45 No. 4 p. 1070-1076 2004/04
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International Conference on Processing & Manufacturing of Advanced Materials (THERMEC '2003)(Reports on the International Conference)
UENISHI Keisuke
Journal of the Japan Welding Society Vol. 73 No. 1 p. 54-55 2004/01/05
Publisher: Japan Welding Society
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Preparation of Ni-Al-Si Intermetallic Compound by Combustion Synthesis and its Application to Dissimilar Bonding with Cast Iron
Vol. 第76巻 9号 pp.767-772 2004
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Effect of Platings on Cu Surface on Reliability of Micro Joints Using Sn-Ag Based Lead Free Solders
Vol. 43巻 1号 p251-255 2004
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Dissimilar Joining of Nickel Aluminide Intermetallic Compound with Spheroidal Graphite Cast Iron by Using Combustion Synthesis
Materials Science Forum, Vols.449-452 (2004) p.193-196 Vol. Vols.449-452 p.193-196 2004
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Dissimilar joining of nickel aluminide with spheroidal graphite cast iron and Cu alloy by hot pressing
T Kimata, K Uenishi, A Ikenaga, KF Kobayashi
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS Vol. 5 No. 1-2 p. 251-254 2004/01
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Dissimilar Brazing of Shape Memory Alloy with Stainless Steel
Welding Technology Vol.52 No.6 (2004) p.75-79 Vol. Vol.52 No.6 p.75-79 2004
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Combustion Synthesis Process of Ag Added Al3Ti Intermetallic Compound
Materials Science Forum, Vols.449-452 (2004) p.201-204 Vol. Vols.449-452 p.201-204 2004
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BGA Joint Microstructure of Sn-Ag Based Solders with Au/Ni-P Plating
Transactions of the Materials Research Society of Japan, Vol.29 No.5 (2004) p.1995-1999 Vol. Vol.29 No.5 p.1995-1999 2004
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形状記憶合金とステンレス鋼のろう付
溶接技術 Vol.52 No.6 (2004) p.75-79 Vol. Vol.52 No.6 p.75-79 2004
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Combustion synthesis process of Ag added Al3Ti intermetallic compound
Y Miyazaki, K Uenishi, KF Kobayashi
DESIGNING, PROCESSING AND PROPERTIES OF ADVANCED ENGINEERING MATERIALS, PTS 1 AND 2 Vol. 449-4 p. 201-204 2004
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Joint microstructure of FCD450 and BC6 formed by combustion synthesis of Ni-Al
Kimata Tetsuro, Uenishi Keisuke, Kobayashi Kojiro F., Ikenaga Akira
Pre-Prints of the National Meeting of JWS No. 73 p. 280-281 2003/09/08
Publisher: Japan Welding Society
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Sinterig Process of Piezoelectric Ceramic Using Pulsed Electric Current Sintering Method
Sugimura Masahiko, Uenishi Keisuke, Fujimoto Kozo, Goto Tomoaki
Pre-Prints of the National Meeting of JWS No. 73 p. 120-121 2003/09/08
Publisher: Japan Welding Society
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Nd-YAG Laser Micro Welding of Ti-Ni Type Shape Memory Alloy Wire and its Corrosion Resistance
Ogata Yasuhito, Takatugu Masaya, Kunimasa Takeshi, Uenishi Keisuke, Kobayashi Kojiro F.
Pre-Prints of the National Meeting of JWS No. 73 p. 108-109 2003/09/08
Publisher: Japan Welding Society
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Formation of Al_3Ti intermetallic compound by combustion synthesis of Al-Ti-Ag powder mixture
Miyazaki Yoji, Uenishi Keisuke, Kobayashi Kojiro F.
Pre-Prints of the National Meeting of JWS No. 73 p. 412-413 2003/09/08
Publisher: Japan Welding Society
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Interfacial Reaction and Joint strength between Sn-Ag Based Solders and Electroles Plated Ni-P Alloys
Keisuke Uenishi, Yasuhiro Kohara, Shigeaki Sakatani, Kojiro F. Kobayashi
2003/02
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Enhanced densification of combustion synthesized Ni-Al or Ti-Al intermetallic compounds by third element addition
K Uenishi, T Kimata, Y Miyazaki, KF Kobayashi
THERMEC'2003, PTS 1-5 Vol. 426-4 p. 1789-1794 2003
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Observation of Interfacial Microstructure between Ni-P Plating and Sn-Ag Solder Ball for BGA Package
Shigeaki Sakatani, Yasuhiro Kohara, Toshio Saeki, Keisuke Uenishi, Kojiro F. Kobayashi
2002/10
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Reflow Properties of Sn-Bi/Sn-Ag Coated Cu Core Solder Balls
Shigeaki Sakatani, Yasuhiro Kohara, Keisuke Uenishi, Kojiro F. Kobayashi, Masaharu Yamamoto
2002/01
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Effect of Cu in Solder on the Interfacial Reaction in the BGA Joint
Keisuke Uenishi, Yasuhiro Kohara, Shigeaki Sakatani, Kojiro F.Kobayashi
2001/10
Publisher: エレクトロニクス実装学会
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Brazing of Ti-Ni Shape Memory Alloy with OPure Titanium
Kunimasa Takeshi, Seki Masanori, Yamamoto Hiroki, Nojiti Makoto, Uenishi keisuke, Kobayashi Kojiro
Pre-Prints of the National Meeting of JWS No. 69 p. 362-363 2001/09/10
Publisher: Japan Welding Society
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Effect of Cu in Pb free solder ball on the microstructure of BGA joints with Au/Ni coated Cu pads
K Uenishi, T Saeki, Y Kohara, KF Kobayashi, Shoji, I, M Nishiura, M Yamamoto
MATERIALS TRANSACTIONS Vol. 42 No. 5 p. 756-760 2001/05
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The Microstructure and Shear Strength of the BGA Joint Using Cu Cored Sn-3.5Ag Solder
Journal of Japan Institute of Electronics Packaging Vol. 4 No. 3 p. 192-199 2001
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Application of Sn and Ag Multi Plated Cu Core Pb Free Solder Ball to BGA Package
Vol. p.119-124 2001
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CuコアSn-3.5Agはんだを用いたBGA接合部組織とせん断強度
エレクトロニクス実装学会誌 Vol. Vol.4 No.3 p.192-199 2001
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BGAパッケージへのSn,Ag多層めっきを施したCuコアPbフリーはんだボールの適用
Proc. 7th Sympo. on Microjoining and Assembly Technologies for Electronics, 2001, Yokohama Japan, p.119-124 Vol. p.119-124 2001
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Fabrication of a thick layer of Al_3Ti/TiB_2 composite by reactiv pulsed electric current sintering : (Report 1) Influence of TiB_2 addition
SHIBUTANI Tomohide, MATSUBARA Toshio, UENISHI Keisuke, KOBAYASHI Kojiro
Pre-Prints of the National Meeting of JWS No. 67 p. 512-513 2000/09/05
Publisher: Japan Welding Society
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fabrication of a thick layer of Al_3Ti/TiB_2 composite by reactive-pulsed electric current sintering : (Report 2)Addition of elemental B for in-situ TiB_2 formation
MATSUBARA Toshio, SHIBUTANI Tomohide, UENISHI Keisuke, KOBAYASHI Kojiro
Pre-Prints of the National Meeting of JWS No. 67 p. 514-515 2000/09/05
Publisher: Japan Welding Society
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Effect of Cu Addition to Su-Pb or Sn-Ag Solder on BGA Joint Microstrusture
Saeki T., Kohara Y., Uenishi K., Kobayashi K.F., Shoji I., Yamamoto M.
Pre-Prints of the National Meeting of JWS No. 67 p. 154-155 2000/09/05
Publisher: Japan Welding Society
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Dissimilar joing of Ti-Ni shape memory alloy to stainless steel by brazing
Seki Masanori, Yamamoto Hiroki, Uenishi Keisuke, Kobayashi Kojiro
Pre-Prints of the National Meeting of JWS No. 67 p. 228-229 2000/09/05
Publisher: Japan Welding Society
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Brazing of Ti-Ni shape memory alloy with stainless steel
M Seki, H Yamamoto, M Nojiri, K Uenishi, KF Kobayashi
JOURNAL OF THE JAPAN INSTITUTE OF METALS Vol. 64 No. 8 p. 632-640 2000/08
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Fabrication of a thick surface layer of Al3Ti on Ti substrate by reactive-pulsed electric current sintering
T Matsubara, T Shibutani, K Uenishi, KF Kobayashi
INTERMETALLICS Vol. 8 No. 7 p. 815-822 2000/07
-
日本における溶接の展望（1999年）～圧接および固相接合（拡散接合、熱間圧接・冷間圧接、その他）
上西啓介
溶接学会誌、69巻、5号、p.28-31 2000/05
Publisher: 日本溶接学会
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Microstructure and strength of BGA joint using Cu cored Sn-Ag solder
Uenishi K., Saeki T., Kohara Y., Kobayashi K.F., Shoji I., Yamamoto M.
Pre-Prints of the National Meeting of JWS No. 66 p. 162-163 2000/03/13
Publisher: Japan Welding Society
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Effect of Cu Core on BGA Joint Microstructure Using Sn-Ag Solder
Toshio Saeki, Keisuke Uenishi, F.Kobayashi, Ikuo Shoji, Masaharu Yamamoto
2000/02
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Brazing of α+βTi alloys with Ti-based Amorphous Filler Metal
YAMAMOTO Hiroki, Ito Hirotake, Uenishi Keisuke, F.Kobayasi Kojiro
Pre-Prints of the National Meeting of JWS No. 65 p. 126-127 1999/09/21
Publisher: Japan Welding Society
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Fabrication of Al_3Ti thick layer on Ti substrate by pulse electric current sintering-combustion synthesis
MATSUBARA Toshio, SHIBUTANI Tomohide, UENISHI Keisuke, F.KOBAYASHI Kojiro
Pre-Prints of the National Meeting of JWS No. 65 p. 588-589 1999/09/21
Publisher: Japan Welding Society
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Effect of Cu Cored Ball in Solder Ball on Strength of BGA Joint : Joint with Electro Plated Pad
Kiyono Shinya, Saeki Toshio, Uenishi Keisuke, F.Kobayashi Kojiro, Shohji Ikuo, Yamamoto Masaharu
Pre-Prints of the National Meeting of JWS No. 65 p. 330-331 1999/09/21
Publisher: Japan Welding Society
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Effect of Cu cored Ball in Solder Ball on Strength of Joint : Joint with Electroless Plated Pad
Kiyono Shinya, Fujii Toshio, Saeki Toshio, Uenishi Keisuke, F.Kobayashi Kojiro, Shohji Ikuo, Yamamoto Masaharu
Pre-Prints of the National Meeting of JWS No. 65 p. 332-333 1999/09/21
Publisher: Japan Welding Society
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Formation of Ultra-fine Intermetallic Compound Ti_3Al Layer by Low Pressure Plasma Spraying
UENISHI Keisuke, MURASE Minoru, INOUE Tetsushi, F.KOBAYASHI Kojiro
Pre-Prints of the National Meeting of JWS No. 65 p. 412-413 1999/09/21
Publisher: Japan Welding Society
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III 溶接及び切断機器と施工法 III-2 圧接及び固相接合 2.拡散接合 3.熱間圧接・冷間圧接 4.摩擦圧接 5.その他
上西 啓介
溶接学会誌 = Journal of the Japan Welding Society Vol. 68 No. 5 p. 371-374 1999/07/05
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日本における溶接の展望（1998年）～圧接および固相接合（拡散接合、熱間圧接・冷間圧接、摩擦圧接、その他）
上西啓介
溶接学会誌, 68巻, 5号, p.25-28 1999/05
Publisher: 日本溶接学会
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Influence of Initial Particle Size on Surface Modified Layer Fabricated by SHS Reaction.
Matsubara Toshio, Uenishi Keisuke, Kobayashi F. Kojiro
Pre-Prints of the National Meeting of JWS No. 64 p. 254-255 1999/03/23
Publisher: Japan Welding Society
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Synthesis of Bulk Amorphous by Using Solid State Amorphization of Mechanically Alloyed Al-Cr Powders.
UENISHI Keisuke, KOBAYASHI F Kojiro
Pre-Prints of the National Meeting of JWS No. 64 p. 120-121 1999/03/23
Publisher: Japan Welding Society
-
Microstructure and Mechanical Properties of BGA Joint with Cu Cared Solder Ball
Shinya Kiyono, Keisuke Uenishi, Kojiro F. Kobayashi, Ikuo Shoji, Masaharu Yamamoto
1999/02
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Microstructure and Mechanical Propertiy of Al Based MMC Friction Joints.
UENISHI Keisuke, KOBAYASHI F Kojiro, Bendzsak G. B., North T. H.
Pre-Prints of the National Meeting of JWS No. 63 p. 334-335 1998/09/10
Publisher: Japan Welding Society
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トロント大学留学記 : 新しいものに向かって
上西 啓介
溶接学会誌 Vol. 66 No. 8 p. 630-630 1997/12/05
Publisher: 社団法人溶接学会
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トロント大学留学記
上西啓介
溶接学会誌, 66巻, 8号, p.65 Vol. 89 No. 4 p. 149-151 1997/08
Publisher: 日本溶接学会
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Combustion synthesis of Al3Ti coatings on Cu substarate
Morino Shinya, Fujiwara Shinichi, Uenishi Keisuke, Kobayashi Kojiro F.
Pre-Prints of the National Meeting of JWS No. 59 p. 250-251 1996/09/05
Publisher: Japan Welding Society
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Low Pressure Plasma Spraying of Mechanically Alloyed TiAl Powders on Al Substrate
Murase Minoru, Hata Hiroaki, Uenishi Keisuke, Kobayashi Kojiro F.
Pre-Prints of the National Meeting of JWS No. 58 p. 268-269 1996/03/15
Publisher: Japan Welding Society
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燃焼合成法による球状黒鉛鋳鉄基板へのNiAlおよびNi_3Alコーティング膜の生成
池永 明, 川本 信, 後藤 佳行, 新田 康寛, 小林 紘二郎, 上西 啓介
鋳物 : 講演大会講演概要集 Vol. 127 p. 84-84 1995/10/01
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Wear Properties of Al3Ti/TiB2,TiC Composite Layers Formed on Aluminum by Laser
UENISHI K., Nashiro M., Kiyono T., Kobayashi K.F.
Pre-Prints of the National Meeting of JWS No. 56 p. 248-249 1995/03/12
Publisher: Japan Welding Society
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アルミニウム基材上への金属間化合物Al3Tiのレ-ザクラッディング
上西 啓介, 小林 紘二郎
軽金属溶接 Vol. 31 No. 4 p. p153-157 1993/04
Publisher: 軽金属溶接構造協会
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Formation of Al_3Ti Based Composite Layer on Al Surface by Laser Cladding
Uenishi K., Sugimoto A., Adachi M., Kobayashi K.F
Pre-Prints of the National Meeting of JWS No. 52 p. 116-117 1993/03/15
Publisher: Japan Welding Society
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Disbonding of High Temperature Superconductive Thick Film : Forming of High Temperature Superconductive Thick Film on Metal Substrate
Katsutani R., Matsui K., Tagami M., Nakanishi Y., Uenishi K., Kobayashi K.
Pre-Prints of the National Meeting of JWS No. 51 p. 198-199 1992/09/01
Publisher: Japan Welding Society
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Bonding of Intermetallic Compound TiAl Using SHS Process
SUMI Hiroyuki, YAMAMOTO Masahiro, WATANABE Kazunori, UENISHI Keisuke, F.KOBAYASHI Kojiro
Pre-Prints of the National Meeting of JWS No. 50 p. 168-169 1992/03/15
Publisher: Japan Welding Society
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Joining of SiC/Ti-6Al-4V FRM
Fukumoto Shinji, Kotoh Masahiro, Uenishi Keisuke, Hirose Akio, Kobayashi Kojiro
Pre-Prints of the National Meeting of JWS No. 49 p. 402-403 1991/08/25
Publisher: Japan Welding Society
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Application of CIP treatment for forming of Y_1Ba_2Cu_3O_<7-y> superconductor thick film on metal
Katsutani R., Matsui K., Nakanishi Y., Uenishi K., Kobayashi K.
Pre-Prints of the National Meeting of JWS No. 49 p. 416-417 1991/08/25
Publisher: Japan Welding Society
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Laser Surface Alloying of Aluminium
Uenishi Keisuke, Sugimoto Akiyoshi, Kabayashi Kojiro
Pre-Prints of the National Meeting of JWS No. 48 p. 94-95 1991/03/10
Publisher: Japan Welding Society
