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Uenishi Keisuke

上西　啓介

Graduate School of Engineering　Department of Management of Industry and Technology, Professor

keyword Management of Technology，Materials Processing

Education

  • 1986/04 - 1990/03, Kyoto University
  • 1982/04 - 1986/03, Kyoto University, Faculty of Engineering

Research History

  • 2008/04 - Present, Osaka University, Graduate School of Engineering Department of Management of Industry and Technology, Professor
  • 2004/04 - 2008/03, Osaka University, Graduate School of Engineering Department of Management of Industry and Technology, Associate Professor
  • 2002/04 - 2004/03, Osaka University, Graduate School of Engineering Division of Materials and Manufacturing Science, Associate Professor
  • 1989/04 - 2002/03, Osaka University, Research Associate
  • 1996/06 - 1997/05, University of Toronto, Department of Materials Science and Engineering, Visiting Researcher

Research Areas

  • Humanities & social sciences, Business administration, Management of Technology
  • Nanotechnology/Materials, Material fabrication and microstructure control
  • Nanotechnology/Materials, Nano/micro-systems, Electronics Packaging
  • Nanotechnology/Materials, Nanomaterials
  • Environmental science/Agricultural science, Environmental load reduction/restoration technology

Professional Memberships

  • Japan Association for Management System
  • プロジェクトマネジメント学会
  • 日本工学教育協会
  • Japan Institute of Electronics Packaging

Papers

  • The Effects of the Diversity of Students and their Dialogical Attitudes on the Evaluations of Group Activities in a Practical Exercise, T.Masuda,K.Uenishi, Vol. 70, No. 2, p. 22-27, 2022/03
  • The Effects of Diversity Students on the Group Activity Outcomes in the Practical Exercise with OJE (On the Job Education), Tomoka MASUDA,Keisuke UENISHI, Journal of JSEE, Japanese Society for Engineering Education, Vol. 69, No. 2, p. 69-74, 2021/03
  • Consideration for Oligopoly in the Semiconductor Manufacturing Equipment Market: The Case Study of the Dry Etching Equipment Industry, T.Watanabe,K.Uenishi,H.Nagano,S.Ishida, Journal of Japan Association for Management Systems, Vol. 37, No. 2, p. 85-90, 2020/11
  • Analysis of the Internal Effects of Health and Productivity Management in Japan, Takuji ARAI,Keisuke UENISHI,Kiminori GEMBA, Forum Scientiae Oeconomia, Vol. 8, No. 1, p. 17-28, 2020/03
  • Quantitative Analysis of the Smile Curve - Empirical Analysis Targeted for the Japanese Food and Manufacturing Industries, H.Imahashi,K.Uenishi,K.Gemba, International Journal of Business and System Research, Vol. 14, No. 1, p. 426-447, 2020/02
  • Analysis of Return on Health Investment of "Health and Productivity Management, T.Arai,K.Uenishi,K.Gemba, Pharmacometrics, Vol. 96, 2019/08
  • Expected effects and actual situation of "Health and Productivity Management" in Japan, T.Arai,K.Uenishi,K.Gemba, Journal of Japan Association for Management Systems, Vol. 36, No. 1, 2019/08
  • Consideration for Oligopoly in the Semiconductor Manufacturing Equipment Market : Deriving Hypotheses of Oligopolistic Mechanism, Vol. 35, No. 3, p. 235-240, 2019/03
  • Electrostatic MEMS Vibration Energy Harvesters inside of Tire Treads, Y.Naito,K.Uenishi, Sensors, Vol. 19, No. 4, p. 890-898, 2019/02
  • Laterally Movable Triple Electrodes Actuator toward Low Voltage and Fast Response RF-MEMS Switches, Y.Naito,K.Nakamura,K.Uenishi, Sensors, Vol. 19, No. 4, p. 864-873, 2019/02
  • Verification of Smiling Curve of Food Industry in Japan, H.Imahashi,K.Uenishi,K.Gemba, Forum Scientiae Oeconomia, Vol. 6, No. 4, 2018/12
  • Considerations for avoiding commoditisation in the automotive industry – analysis of factors that enhance customisation, Hirotoshi Uehara,Atsunari Kobayashi,Keisuke Uenishi,Junji Ikeda,Hiroyuki Nagano,Shuichi Ishida, International Journal of Business and Systems Research, Vol. 12, No. 1, p. 85-105, 2018
  • Brand management of small and medium-sized enterprises in Japan, Hiroshi IMAHASHI,Keisuke UENISHI,Kiminori GEMBA, International Journal of Japan Association for Management Systems, Vol. 9, No. 1, p. 79-84, 2017/12
  • Effects of Sb Addition on Phase Transformation and Thermal Fatigue in Sn-Ag-Bi-In Solder Joints, Kiyohiro HINE,Shigeaki SAKATANI,Keisuke UENISHI, Transactions of The Japan Institute of Electronics Packaging, Vol. 10, 2017/03
  • Competitive Strategy of Family Businesses through CSV - Case Study of a Family Business in Mie Prefecture -, keiko Nishioka,Kiminori Gemba,Keisuke Uenishi,Atsuko Kaga, International Journal of Business and System Research, 2016/12
  • Effects of additive element on interfacial reaction and thermal fatigue properties of Sn-Ag-Bi-In solder joints, Kiyohiro Hine,Shigeaki Sakatani,Hidetoshi Kitaura,Masato Mori,Akio Furusawa,Keisuke Uenishi, Journal of Japan Institute of Electronics Packaging, Japan Institute of Electronics Packaging, Vol. 19, No. 3, p. 177-183, 2016
  • Explanation for superiority of thermal fatigue characteristics of Sn-3.5Ag-0.5Bi-6In solder, Shigeaki SAKATANI,Kiyohiro HINE,Taichi NAKAMURA,Hidetoshi KITAURA,Masato MORI,Akio FURUSAWA,Keisuke UENISHI, Journal of Smart Processing, Smart Processing Society for Materials, Environment & Energy (High Temperature Society of Japan), Vol. 4, No. 5, p. 254-259, 2015/09
  • Considerations for Commoditization Factors in Flat-Screen TV Industry, H.Uehara,K.Uenishi,J.Ikeda,H.Nagano,S.Ishida, Journal of Japan Association for Management Systems, Vol. 31, No. 3, p. 307-315, 2015/03
  • Considerations for commoditization factors in flat-screen TV industry, Hirotoshi Uehara,Yusuke Makino,Hiroyuki Nagano,Keisuke Uenishi,Shuichi Ishida, IEEE International Conference on Industrial Engineering and Engineering Management, p. 381-384, 2014/11/18
  • Investigation of the Influence of the Cure Shirinkage in Electrically Conductive Adhesive and Mechanism for Conductivity, Shigeru Kohinata,Yoshihiko Shiraki,Masahiro Inoue,Keisuke Uenishi, Journal of Smart Processing for Materials, Environment & Energy, Vol. 3, No. 4, p. 246-253, 2014/07
  • New Business Creation in the Electronics Industry -Case Study of the Electronics Devices (in Japanese)., Tsuyoshi Nomura,Junji Ikeda,Keisuke Uenishi,Shuichi Ishida, Journal of Japan Association for Management Systems, Vol. 29, No. 3, p. 267-274, 2013/03
  • A competitive product development strategy using modular architecture for product and service systems, Noriyuki Shikata,Kiminori Gemba,Keisuke Uenishi, International Journal of Business and Systems Research, Inderscience Enterprises Ltd., Vol. 7, No. 4, p. 375-394, 2013
  • New Business Creation Process for the field of Electronics -From the perspective of Project Leaders (in Japanese)., Tsuyoshi Nomura,Junji Ikeda,Keisuke Uenishi,Shuichi Ishida, Journal of Japan Association for Management Systems, Vol. 29, No. 1, 2012/07
  • Effect of preformed Cu-Sn IMC Layer on Electromigration Reliability of Solder Capped Cu Pillar Bump Interconnection on an organic substrate, Yasumitsu Orii,Kazushige Toriyama,Sayuri Kohara,Hirokazu Noma,Keishi Okamoto,Keisuke Uenishi, 2012 2ND IEEE CPMT SYMPOSIUM JAPAN, IEEE, 2012
  • Micro Structure Observation and Reliability Behavior of Peripheral Flip Chip Interconnections with Solder-Capped Cu Pillar Bumps, Yasumitsu Orii,Kazushige Toriyama,Sayuri Kohara,Hirokazu Noma,Keishi Okamoto,Daisuke Toyoshima,Keisuke Uenishi, Transactions of The Japan Institute of Electronics Packaging, The Japan Institute of Electronics Packaging, Vol. 4, No. 1, p. 73-86, 2011/12
  • Adhesion Improvement on Smooth Cu Wiring Surfaces of Printed Circuit Boards, Motoaki Tani,Shinya Sasaki,Keisuke Uenishi, Transactions of The Japan Institute of Electronics Packaging, The Japan Institute of Electronics Packaging, Vol. 4, No. 1, p. 24-30, 2011/12
  • Effect of preformed IMC Layer on Electromigration of Peripheral Ultra Fine Pitch C2 Flip Chip Interconnection with Solder Capped Cu Pillar Bump, Y.Orii,K.Toriyama,S.Kohara,H.Noma,K.Okamoto,D.Toyoshima,K.Uenishi, Proceedings of International Micorsystems, Packaging, Assembly and Circuit Technology Conference 2011 (IMPACT2011), 2011/10
  • Influence of Zn Addition to Eutectic Sn-Bi Solder on Joint Reliability with Cu Electrode, T.Akamatsu,N.Imaizumi,S.Sakuyama,T.Nakanishi,Y.Hattori,K.Uenishi, Poceedings of International Conference on Electronics Packaging 2011 (ICEP2011), 2011/04
  • Infl uence of UBM Layers on Electro-migration Behavior of Micro-joints using Sn-Ag Solders, D.Toyoshima,K.Yasaka,T.Sakai,T.Akamatsu,N.Imaizumi,S.Sakuyama,K.Uenishi, Poceedings of International Conference on Electronics Packaging 2011 (ICEP2011), 2011/04
  • Electromigration Analysis of Peripheral Ultra Fine Pitch C2 Flip Chip Interconnection with Solder Capped Cu Pillar Bump, Yasumitsu Orii,Kazushige Toriyama,Sayuri Kohara,Hirokazu Noma,Keishi Okamoto,Daisuke Toyoshima,Keisuke Uenishi, 2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), IEEE, p. 340-345, 2011
  • Microstructure and Mechanical Properties of Sb Addition Eutectic Sn-Bi Solder, Seiki Sakuyama,Toshiya Akamatsu,Keisuke Uenishi,Takehiko Sato, IEICE TRANSACTIONS on Electronics, The Institute of Electronics, Information and Communication Engineers, Vol. 93, No. 11, p. 485-492, 2010/11
  • Microstructural Changes in Micro-joints between Sn-58Bi Solders and Copper by Electro-migration, Kenichi YASAKA,Yasuhisa OHTAKE,Toshiya AKAMATSU,Nobuhiro IMAIZUMI,Seiki SAKUYAMA,Keisuke UENISHI, Poceedings of International Conference on Electronics Packaging 2010, 2010/04
  • Engineering Education based on OJE (On the Job Education) method : Exercise for Anan-shi, Tokushima, Japan, KAGA Atsuko,KURASHIKI Tetsusei,MORI Hiroaki,MATSUMURA Nobuhiko,YAMAMOTO Takao,OHMURA Etsuji,UENISHI Keisuke, ITE Technical Report, The Institute of Image Information and Television Engineers, Vol. 34, p. 7-10, 2010
  • Service science: An analysis of the business system of product service companies, Noriyuki Shikata,Kiminori Gemba,Keisuke Uenishi, IEEM2010 - IEEE International Conference on Industrial Engineering and Engineering Management, p. 448-452, 2010
  • Effect of a Third Element on Microstrucutre and Mechanical Properties of Eutectic Sn-Bi Solder, S.Sakuyama,T.Akamatsu,K.Uenishi,T.Sato, Transsactions of The Japan Institute of Electronics Packaging, The Japan Institute of Electronics Packaging, Vol. 2, No. 1, p. 98-103, 2009/12
  • Evaluation of Electric Contact Phenomena under Small Contact Load, Mukhatar Omer,Hiroyuki Kaneda,Yusuke Ozawa,Yu Yonezawa,Tadashi Nakatani,Keisuke Uenishi,Takehiko Sato, Proceeding on the International Conference on Electronics Packaging (ICEP2009), 2009/04
  • Microstructure and Mechanical Properties of Sn-Bi Eutectic Solders Added with a Third Element, Seiki Sakuyama,Toshiya Akamatsu,Hitoshi Kaneko,Keisuke Uenishi,Takehiko Sato, Proceeding on the International Conference on Electronics Packaging (ICEP2009), 2009/04
  • Ultrafine-pitch C2 flip chip interconnections with solder-capped Cu pillar bumps, Yasumitsu Orii,Kazushige Toriyama,Hirokazu Noma,Yukifumi Oyama,Hidetoshi Nishiwaki,Mitsuya Ishida,Toshihiko Nishio,Nancy C.labianca,Claudius Feger, Proceedings - Electronic Components and Technology Conference, p. 948-953, 2009
  • Improvement of the Maximum Heat Flux by Applying Zeotropic Coolant Mixture, Kishio Yokouchi,Keisuke Uenishi,Takehiko Sato, IEICE TRANSACTIONS on Electronics, The Institute of Electronics, Information and Communication Engineers, Vol. 91, No. 11, p. 645-651, 2008/11
  • Low Temperature Sn-Bi Soldering Tecnology for Low Stress Packaging, Seiki Sakuyama,Toshiya Akamatsu,Keisuke Uenishi,Takehiko Sato, IEICE TRANSACTIONS on Electronics, The Institute of Electronics, Information and Communication Engineers, Vol. 91, No. 11, p. 534-541, 2008/11
  • Development of MEMS Probe for Fine Pitch Contact, Tomohiro ISHIDA,Teppei KIMURA,Tetsuhisa SAKAMOTO,Shohei TAJIMA,Yukiharu MAKINO,Keisuke UENISHI,Takehiko SATO, Smart Processing Technology, 2008/03
  • Effect of Ag Addition to Sn-Bi Eutectic Solders on the Microstructure and Properties of Joints with Cu, Keisuke Uenishi,H.Torii,S.Nakajima,T.Akamatsu,S.Sakuyama,Takehiko Sato, Proceedings of International Conference on Electronics Packaging, 2007, Tokyo Japan, (2007), 2007/04
  • Recycling of Reused Silicon Wafers in Solar Battery, Asako Miyakawa,Minoru Yamamoto,Mariko Kihara,Keisuke Uenishi,Takehiko Sato,Masakazu Sato, Journal of Japan Institute of Electronics Packaging, Vol. 10, No. 4, p. 268-272, 2007
  • Laser cladding of Fe-Cu based alloys on aluminum, Keisuke Uenishi,Yasuhito Ogata,Shingo Iwatani,Akira Adachi,Takehiko Sato,Kojiro F. Kobayashi, DESIGNING OF INTERFACIAL STRUCTURES IN ADVANCED MATERIALS AND THEIR JOINTS, TRANS TECH PUBLICATIONS LTD, Vol. 127, p. 331-+, 2007
  • Recycling of Waste Si Wafer to Solar Cell, Asako Miyakawa,Mariko Kihara,Keisuke Uenishi,Takehiko Sato,Masakazu Sato, Proceedings of Asia Pacific Symposium on Eco Design 2006, 2006/12
  • Photo catalytic Properties of hybrid TiO2 Spray Coating with Au Nano Particles, Takanobu Hagino,Keita Nagai,Keisuke Uenishi,Takehiko Sato,Fuxing Ye,Akira Ohmori, Smart Processing Technology, 2006/10
  • On a Practical Exercise with OJE (On the Job Education), Masaru ZAKO,Kunihiro NARUMI,Takehiko SATO,Takao YAMAMOTO,Keisuke HAMA,Kouji YANABU,Hiroshi SHINOHARA,Masato MURATA,Atsuko KAGA,Keisuke UENISHI,Nobuhiko MATSUMURA,Takashi NAKAGAWA,Tetsusei KURASHIKI, Journal of Japanese Society for Engineering Education, Vol. 56, No. 4, 2006/03
  • Reactivity between Sn-Ag solder and Au/Ni-Co plating to form intermetallic phases, Takashi Yamamoto,Shigeaki Sakatani,Shinji Kobayashi,Keisuke Uenishi,Kojiro F. Kobayashi,Masaaki Ishio,Kazuhiro Shiomi,Akio Hashimoto,Masaharu Yamamoto, Materials Transactions, Vol. 46, No. 11, p. 2406-2412, 2005/11
  • Diode Laser Cladding on A5052 Aluminum Alloy for Wear Resistance, S. Iwatani,Y. Ogata,K. Uenishi,K. F.Kobayashi, Proc. ASME Heat Transfer Conference, HT2005-72442, 2005/07
  • Laser cladding of Fe-Cr-C alloys on A5052 aluminum alloy using diode laser, Shingo Iwatani,Yasuhito Ogata,Keisuke Uenishi,Kojiro F. Kobayashi,Akihiko Tsuboi, Materials Transactions, Vol. 46, No. 6, p. 1341-1347, 2005/06
  • Interfacial reaction between Sn-Ag based solders and Au/Ni alloy platings, K Uenishi,KF Kobayashi, NEW FRONTIERS OF PROCESSING AND ENGINEERING IN ADVANCED MATERIALS, TRANS TECH PUBLICATIONS LTD, Vol. 502, p. 411-416, 2005
  • Dielectric properties of Pb(Zr,Ti)O3 ceramics prepared by pulsed electric current sintering, Keisuke Uenishi,Tomoaki Goto,Kozo Fujimoto,Kojiro F. Kobayashi, Novel Materials Processing by Advanced Electromagnetic Energy Sources, Elsevier, p. 325-328, 2005
  • Preparation of Ni-Al-Si Intermetallic Compound by Combustion Synthesis and its Application to Dissimilar Bonding with Cast Iron, Tetsuro Kimata,Kojiro F. Kobayashi,Keisuke Uenishi,Akira Ikenaga,Makoto Kawamoto, Vol. 76, No. 9, p. 767-772, 2004/09
  • Effect of Platings on Cu Surface on Reliability of Micro Joints Using Sn-Ag Based Lead Free Solders, Keisuke Uenishi,Akio Hirose,Kojiro F. Kobayashi, 2004/08
  • Dissimilar Joining of Nickel Aluminide Intermetallic Compound with Spheroidal Graphite Cast Iron and Cu Alloy by hot pressing, Tetsuro Kimata,Keisuke Uenishi,Akira Ikenaga,Kojiro F. Kobayashi, Science and Technology of Advanced Materials, Vol.5 (2004) pp.251-254, 2004/05
  • BGA Joint Microstructure of Sn-Ag Based Solders with Au/Ni-P Plating, Keisuke Uenishi,Shigeaki Sakatani,Takashi Yamamoto,Kojiro F. Kobayashi, Transactions of the Materials Research Society of Japan, Vol.29 No.5 (2004) p.1995-1999, Vol. 29, No. 5, p. 1995-1999, 2004/05
  • Combustion Synthesis Process of Ag Added Al3Ti Intermetallic Compound, Yoji Miyazaki,Keisuke Uenishi,Kojiro F. Kobayashi, Materials Science Forum, Vols.449-452 (2004) p.201-204, 2004/05
  • Tensile strength and pseudo-elasticity oT YAG laser spot melted Ti-Ni shape memory alloy wires, Y Ogata,M Takatugu,T Kunimasa,K Uenishi,KF Kobayashi, MATERIALS TRANSACTIONS, JAPAN INST METALS, Vol. 45, No. 4, p. 1070-1076, 2004/04
  • Dissimilar joining of nickel aluminide intermetallic compound with spheroidal graphite cast iron by using combustion synthesis, T Kimata,K Uenishi,A Ikenaga,KF Kobayashi, DESIGNING, PROCESSING AND PROPERTIES OF ADVANCED ENGINEERING MATERIALS, PTS 1 AND 2, TRANS TECH PUBLICATIONS LTD, Vol. 449-4, p. 193-196, 2004
  • Enhanced Densification of Combustion Synthesized Ni-Al and Ti-Al Intermetallic Compounds by Third Element Addition, Keisuke Uenishi,Tetsuro Kimata,Yoji Miyazaki,Kojiro F. Kobayashi, 2003/07
  • Enhanced Densification of Combustion Synthesized Ni-Al Intermetallic Compound by Si Addition, Tetsuro Kimata,Keisuke Uenishi,Akira Ikenaga,Kojiro F. Kobayashi, 2003/06
  • Effect of ag addition on formation of intermetallic compound Al3Ti by combustion synthesis, Y Miyazaki,K Uenishi,KF Kobayashi, JOURNAL OF THE JAPAN INSTITUTE OF METALS, JAPAN INST METALS, Vol. 67, No. 6, p. 302-307, 2003/06
  • Formation of thick Ni-Al composite coating on spheroidal graphite cast iron substrates by reaction synthesis processing, T Kimata,K Uenishi,A Ikenaga,KF Kobayashi, MATERIALS TRANSACTIONS, JAPAN INST METALS, Vol. 44, No. 3, p. 407-410, 2003/03
  • Sintering Process of PB(Zr,Ti)O3 Ceramics and Dielectrical Properties, Tomoaki Goto,Keisuke Uenishi,Kozo Fujimoto,Kojiro F. Kobayashi, Journal of High Temperature Society., Vol. 29, No. 2, p. 51-57, 2003/03
  • Pseudo-elastic and bio-chemical properties of Ti-Ni shape memory alloy wires micro-welded by YAG laser, K Uenishi,M Takatsugu,KF Kobayashi, FOURTH INTERNATIONAL SYMPOSIUM ON LASER PRECISION MICROFABRICATION, SPIE-INT SOC OPTICAL ENGINEERING, Vol. 5063, p. 282-286, 2003
  • Solderability of BGA Joints between Cu Core Solder Balls with Sn/Ag Multi Plating and Ni/Au Coated Pads, Shigeaki Sakatani,Keisuke Uenishi,F. Kobayashi Kojiro,Toshio Saeki,Yasuhiro Kohara,Masaharu Yamamoto, Journal of Japan Institute of Electronics Packaging, Vol. 6, No. 6, p. 509-515, 2003
  • YAG laser micro welding of stainless steel and shape memory alloy, K Uenishi,M Seki,T Kunimasa,M Takatsugu,KF Kobayashi,T Ikeda,A Tsuboi, THIRD INTERNATIONAL SYMPOSIUM ON LASER PRECISION MICROFABRICATION, SPIE-INT SOC OPTICAL ENGINEERING, Vol. 4830, p. 57-62, 2003
  • Joint Microstructure of Ni-Al-(Si) Intermetallic Compound and Spheroidal Graphite Cast Iron Formed by Combustion Synthesis, Tetsuro Kimata,Keisuke Uenishi,Akira Ikenaga,Kojiro F. Kobayashi, 2002/11
  • Interfacial Reaction between Cu Core Pb Free Solder Balls and the Ni/Au Coated Cu Pads, Shigeaki Sakatani,Yasuhiro Kohara,Keisuke Uenishi,Kojiro F. Kobayashi,Masaharu Yamamoto, 2002/11
  • Effect of added Si on densification of Ni-Al intermetallic coating on spheroidal graphite cast iron substrates, Tetsuro Kimata,Keisuke Uenishi,Akira Ikenaga,Kojiro F. Kobayashi, 2002/10
  • Development of Sn Based Multi Component Solder Balls with Cu Core for BGA Package, Shigeaki Sakatani,Yasuhiro Kohara,Keisuke Uenishi,Kojiro F. Kobayashi,Masaharu Yamamoto, 2002/10
  • Nd-YAG Laser Micro Welding of Stainless Wire, Masaya Takatugu,Masanori Seki,Takeshi Kunimasa,Keisuke Uenishi,Kojiro F. Kobayashi,Takeshi Ikeda,Akihiko Tuboi, 2002/10
  • Interaction of Solder Balls Containing Cu with Au/Ni Plated Cu Pads, Keisuke Uenishi,Yasuhiro Kohara,Shigeaki Sakatani,Kojiro F.Kobayashi, 2002/08
  • Melting and Joining Behavior of Sn/Ag and Sn-Ag/Sn-Bi Plating on Cu Core Ball, Keisuke Uenishi,Yasuhiro Kohara,Shigeaki Sakatani,Kojiro F. Kobayashi,Masaharu Yamamoto, 2002/08
  • Fabrication of TiB2 Reinforced Al3Ti Composite Layer on Ti Substrate by Reactive-Pulsed Electric Current Sintering, Toshio Matsubara,Tomohide Shibutani,Keisuke Uenishi,Kojiro F.Kobayashi, 2002/06
  • Formation of nanostructured coating layers of Al3Ti and its composites by rapidly consolidation of mechanically alloyed powders, T Matsubara,T Shibutani,KF Kobayashi,K Uenishi, TRENDS IN MECHANICAL ALLOYING, SCIENCE PUBLISHERS INC, p. 112-118, 2002
  • Microstructure and tensile strength of stainless steel wires micro spot melted by YAG laser, Keisuke Uenishi,Masanori Seki,Masaya Takatsugu,Takeshi Kunimasa,Kojiro F. Kobayashi,Takeshi Ikeda,Akihiko Tsuboi, Materials Transactions, Japan Institute of Metals (JIM), Vol. 43, No. 12, p. 3083-3087, 2002
  • Mechanical strength and microstructure of BGA joints using lead-free solders, Masataka Nishiura,Akihiro Nakayama,Sigeaki Sakatani,Yasuhiro Kohara,Keisuke Uenishi,Kojiro F. Kobayashi, Materials Transactions, Japan Institute of Metals (JIM), Vol. 43, No. 8, p. 1802-1807, 2002
  • Wear and oxidation resistance of Al2O3 particle dispersed Al3Ti composite with a nanostructure prepared by pulsed electric current sintering of mechanically alloyed powders, Keisuke Uenishi,Toshio Matsubara,Tomohide Shibutani,Kojiro F. Kobayashi, Intermetallics, Vol. 10, No. 1, p. 105-111, 2002/01
  • Effect of Cu Cored Ball in Solder Ball on Microstructure and Strength of BGA Joint, Shinya Kiyono,Keisuke Uenishi,F. Kobayashi Kojiro,Ikuo Shohji,Masaharu Yamamoto, journal of the japan institute of electronics packaging, Vol. 2, No. 4, p. 298-302, 2002
  • Influence of Microstructure on Mechanical Strength of Electroless ni-P Plating and Pb Free Solder Joint, Masataka Nishiura,Akihiko Nakayama,Shigeaki Sakatani,Yasuhiro Kohara,Toshio Saeki,Keisuke Uenishi,Kojiro F. Kobayashi, 2001/10
  • Nanostructured titanium-aluminides and their composites formed by combustion synthesis of mechanically alloyed powders, K. Uenishi,T. Matsubara,M. Kambara,K. F. Kobayashi, Scripta Materialia, Vol. 44, No. 8-9, p. 2093-2097, 2001/05/18
  • Effect of Cu in Pb Free Solder Ball on the Microstructure of BGA Joints with Au / Ni Coated Cu Pads, Keisuke Uenishi,Toshio Saeki,Yasuhiro Kohara,Kojiro F.Kobayashi,Ikuo Shoji,Masataka Nishiura,Masaharu Yamamoto, Materials Transactions, Vol.42, No.5, p.756-760, 2001/05
  • Effect of Cu Cored Ball in Solder Ball on Microstructure and Strength of BGA Joint Using Electroless Plated Au/Ni Pad, Toshio Saeki,Yasuhiro Kohara,Keisuke Uenishi,Kojiro F.Kobayashi,Ikuo Shoji,Masaharu Yamamoto, 2001/03
  • Rapid Solidification of Ti-25 mol% Al Alloy by Plasma Spraying, UENISHI Keisuke,MURASE Minoru,KOBAYASHI Kojiro F., MATERIALS TRANSACTIONS, The Japan Institute of Metals and Materials, Vol. 42, No. 2, p. 269-274, 2001/02/20
  • Rapid solidification of Ti-25 mol%Al alloy by plasma spraying, K Uenishi,M Murase,KF Kobayashi, MATERIALS TRANSACTIONS JIM, JAPAN INST METALS, Vol. 42, No. 2, p. 269-274, 2001/02
  • Microstructure and reliability of BGA joint using lead free solders, K Uenishi,T Saeki,Y Kohara,M Nishiura,KF Kobayashi, PRICM 4: FORTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, VOLS I AND II, JAPAN INST METALS, p. 1063-1066, 2001
  • Brazing of Ti-Ni shape memory alloy with pure titanium, Takeshi Kunimasa,Masanori Seki,Hiroki Yamamoto,Makoto Nojiri,Keisuke Uenishi,Kojiro F. Kobayashi, Zairyo/Journal of the Society of Materials Science, Japan, Society of Materials Science Japan, Vol. 50, No. 11, p. 1218-1222, 2001
  • The Microstructure and Shear Strength of the BGA Joint Using Cu Cored Sn-3. 5Ag Solder, Yasuhiro Kohara,Toshio Saeki,Keisuke Uenishi,Kojiro K. Kobayashi,Ikuo Shohii,Masaharu Yamamoto, journal of the japan institute of Electronics Packaging, Vol. 4, No. 3, p. 192-199, 2001
  • Nano-structured Intermetallic Compound TiAl Obtained by Crystallization of Mechanically Alloyed Amorphous TiAl, and Its Subsequent Grain Growth, Makoto Kambara,K.Uenishi,K.F.Kobayashi, 2000/11
  • Fabrication of Thick Intermetallic Compound Al3Ti Layer on Ti Substrate by Reactive-Pulsed Electric Current Sintering, Toshio Matsubara,Keisuke Uenishi,Kojiro F. Kobayashi, 2000/07
  • Spiral Defect Formation in Friction Welded Aluminum, Keisuke Uenishi,Yang Zhai,rsity of Toronto,Tom H. North,sity of Toron,Gabor Bendszak,sity of Toro, 2000/07
  • Brazing of Ti-Ni shape memory alloy with stainless steel, Masanori Seki,Hiroki Yamamoto,Makoto Nojiri,Keisuke Uenishi,Kojiro F. Kobayashi, Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, Japan Inst of Metals, Vol. 64, No. 8, p. 632-640, 2000
  • Fabrication of thick intermetallic compound Al3Ti layer on metal substrate by combustion synthesis of ball-milled powder, Toshio Matsubara,Keisuke Uenishi,Kojiro F. Kobayashi, Materials Transactions, JIM, Japan Inst of Metals, Vol. 41, No. 5, p. 631-634, 2000
  • Formation of surface layer based on Al3Ti on aluminum by laser cladding and its compatibility with ceramics, K Uenishi,KF Kobayashi, INTERMETALLICS, ELSEVIER SCI LTD, Vol. 7, No. 5, p. 553-559, 1999/05
  • Effect of Cu Cored Ball in Solder Ball on Microstructure and Strength of BGA Joint, Shinya Kiyono,Keisuke Uenishi,Kojiro F. Kobayashi,Ikuo Shoji,IBM Japan,Masaharu Yamamoto,Sumitomo Special,Metals Co, 1999/04
  • Application of Mechamically Alloyed Ti-Bl Powders for Low Pressure Plasma Spraying, Keisuke Uenishi,Minoru Murase,Kojiro F.Kobayashi, 1999/04
  • Combustion Synthesis of Intermetallic Compound Al3Ti and Its Simultaneous Joining with TiAl, Keisuke Uenishi,Toshio Matsubara,Kojiro F. Kobayashi, 1999/02
  • Formation and Consolidation of Mechanically Alloyed Cu-Ti Amorphous Powders, P.Hideo Shingu,Keisuke Uenishi, 1998/07
  • Fabrication of Al3Ti layer on Cu substrate by SHS reaction of mechanically alloyed powder, Toshio Matsubara,Shinya Morino,Keisuke Uenishi,Kojiro F. Kobayashi, Zairyo/Journal of the Society of Materials Science, Japan, Soc Mater Sci, Japan, Vol. 47, No. 11, p. 1106-1111, 1998
  • Fabrication of Ni-Al Intermetallic Compound Layer on Spheroidal Graphite Cast Iron Substrate by SHS Reaction, Akira Ikenaga,sity,of,Osaka Prefecture,Yoshiyuki Goto,ity of,Osaka Prefecture,Yasuhiro Nitta,sity of,Osaka Prefecture,Makoto Kawamoto,ity,o,Osaka Prefecture,Kojiro F. Kobayashi,Keisuke Uenishi, Journal of Japan Foundry Engineering Society, Japan Foundry Engineering Society, Vol. 68, No. 5, p. 417-422, 1996/05
  • Intermetallic compound Al3Ti based composite layers formed on aluminum substrate by laser surface melting, K Uenishi,KF Kobayashi, SOLIDIFICATION SCIENCE AND PROCESSING, MINERALS, METALS & MATERIALS SOC, p. 231-238, 1996
  • Mechanical alloying in the Al-Bi alloy system, Keisuke Uenishi,Kim Ha Yong,Kojiro F. Kobayashi, Journal of Materials Science, Springer Netherlands, Vol. 31, No. 13, p. 3605-3611, 1996
  • Processing of intermetallic compounds for structural applications at high temperature, K Uenishi,KF Kobayashi, INTERMETALLICS, ELSEVIER SCI LTD, Vol. 4, p. S95-S101, 1996
  • Enhanced Milling Efficency for Amorphization by Mechanical Alloying the mixture of Pure Al and Atomized Al-20at%Cr Alloy Powders, Keisuke Uenishi,Kojiro F.Kobayashi, 1995/07
  • JOINING OF INTERMETALLIC COMPOUND TIAL BY USING AL FILLER METAL, K UENISHI,H SUMI,KF KOBAYASHI, ZEITSCHRIFT FUR METALLKUNDE, CARL HANSER VERLAG, Vol. 86, No. 4, p. 270-274, 1995/04
  • Microstructure of Mechanically Alloyed Al-In Alloys, Keisuke Uenishi,Hidemi Kawaguchi,Kojiro F.Kobayashi, 1994/10
  • Fabrication of bulk amorphous alloy by rolling of mechanically alloyed AlCr powders, Keisuke Uenishi,Kojiro F. Kobayashi, Materials Science and Engineering A, Vol. 181-182, No. C, p. 1165-1168, 1994/05/15
  • Laser Cladding of Intermetallic Compound Al3Ti on Aluminum Substrate, Keisuke Uenishi,Kojiro F. Kobayashi, 1993/04
  • MECHANICAL ALLOYING OF ALUMINUM-ALLOY, KF KOBAYASHI,K UENISHI, FIRST INTERNATIONAL CONFERENCE ON PROCESSING MATERIALS FOR PROPERTIES, MINERALS, METALS & MATERIALS SOC, p. 683-686, 1993
  • Formation of Titanium Aluminide on Aluminum Surface by CO2 Laser Alloying, Keisuke Uenishi,Akiyoshi Sugimoto,Kojiro F.Kobayashi, 1992/03
  • MECHANICAL ALLOYING IN THE FE-CU SYSTEM, K UENISHI,KF KOBAYASHI,S NASU,H HATANO,KN ISHIHARA,PH SHINGU, ZEITSCHRIFT FUR METALLKUNDE, CARL HANSER VERLAG, Vol. 83, No. 2, p. 132-135, 1992/02
  • NONEQUILIBRIUM PHASE FORMATION IN FE-AG-CU SYSTEM BY MECHANICAL ALLOYING, K UENISHI,KF KOBAYASHI,KN ISHIHARA,PH SHINGU, MECHANICAL ALLOYING, TRANS TECH PUBLICATIONS LTD, Vol. 88, p. 459-466, 1992
  • FORMATION OF (AL,IN)-SB ALLOYS BY MECHANICAL ALLOYING, K UENISHI,KF KOBAYASHI,KN ISHIHARA,PH SHINGU, MECHANICAL ALLOYING, TRANS TECH PUBLICATIONS LTD, Vol. 88, p. 453-458, 1992
  • Formation of a super-saturated solid solution in the AgCu system by mechanical alloying, K. Uenishi,K. F. Kobayashi,K. N. Ishihara,P. H. Shingu, Materials Science and Engineering A, Vol. 134, No. C, p. 1342-1345, 1991/03/25
  • METASTABLE ALLOY PHASE FORMATION BY REPEATED ROLLING IN SOME COMMON METALLIC BINARY ALLOY SYSTEMS, PH SHINGU,KN ISHIHARA,K UENISHI,J KUYAMA,B HUANG,S NASU, SOLID STATE POWDER PROCESSING, MINERALS, METALS & MATERIALS SOC, p. 21-34, 1990
  • Formation and Consolidation of Mechanically Alloyed Cu-Ti Amorphous Powders, P.Hideo Shingu,Keisuke Uenishi, 1988/10

Misc.

  • Impact of Future Power Source Composition and Business Changes on CO2 Emissions from Passenger Cars in Japan - A Case Study of Car-Sharing, T.Hamada,K.Uenishi, 19th meeting of the Institute of Life Cycle Assessment, 2024/03
  • Analysis of Product Development Strategies at Keyence Based on Intellectual Property Application Trends, Katsuya ABIKO,Keisuke UENISHI, 2023/11
  • Analysis on the relationship between environmental performance indicators and corporate value, Kazunori KISHI,Keisuke UENISHI, 2022/10
  • Creation and Development of Regional Industrial Ecosystems -A Case Study of Ishikari Bay New Port Area in Hokkaido, Japan-, Makoto TANIFUJI,Keisuke UENISHI, 2022/05
  • Creating Business Domain Concepts in Regional Projects: in the Case of Japan, M.Tanifuji,K.Uenishi, Proc. 2021 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM2021), 2021/12
  • Engineering Education by OJE Method -33.Educational Effectiveness of Speech Measurement, S.Matsubayashi,S.Seino,K.Uenishi, Vol. 69, p. 232-233, 2021/09
  • Ideation in IKANKOGEI collaboration ～Fostering an Entrepreneurship Mind to Engineers through On the Job Education, E.Yoshida,M.Yagi,Y.Ohno,H.Anai,A.Tatsumi,K.Uenishi, The 60th Annual Conference of Japan Society for Medical and Biological Engineering, 2021/06/15
  • A Study of Competitive Advantage of Semiconductor Equipment Suppliers Based on Managerial Indicators and Patent Analysis, T.Watanabe,K.Uenishi,H.Nagano,S.Ishida, Proceeding of of XXXⅡ ISPIM Innovation Conference, 2021/06
  • Consideration on high value addition strategies for differentiation of products, A.Nakamura,K.Uenishi, 2021/02
  • Innovation Through Diversity Management in Practical Education, T.Masuda,K.Uenishi, Proceedings of ISPIM Connects Osaka, 2020/12
  • Discussion of B to B Rate and Diversification Analysis in Japanese Manufacturing Companies, H.Imahashi,K.Uenishi,K.Gemba, 2020/10
  • Technology Development of CMOS Image Sensor and Acquisition of Competitive Advantage from the Viewpoint of Mass Production Technology and Corporate Organizational Structure, Y.Iwanaga,K.Uenishi, 2019/11
  • Effects of UV-LED Irradiation Towards Leaf-Lettuce Roots in Plant Factory, M.Urano,K.Uenishi, Student Paper Abstracts of 2019 International Meeting for Future of Electron Devices, 2019/11
  • Consideration for oligopoly in the semiconductor equipment market : Comparative study of Dry-Etching Equipment manufacturers, Vol. 62, p. 196-199, 2019/05/25
  • Measurement of Students' Mental-state in Class through Objective Biometrics and Subjective Questionnaire, Y.Tanaka,K.Uenishi, Technical Report of IEICE., Vol. 118, No. 261, p. 71-76, 2018/10
  • Competitive Advantages through CSV: Quantative Analysis of CSV-promoting Companies, Keiko Nishioka,Kiminori Gemba,Keisuke Uenishi,Atsuko Kaga, Proceedings - 2017 6th IIAI International Congress on Advanced Applied Informatics, IIAI-AAI 2017, Institute of Electrical and Electronics Engineers Inc., p. 52-57, 2017/11/15
  • Analysis of R&D System for Technological Diversification Based on Patent Information, R.Fujinaga,K.Uenishi, Vol. 59, p. 84-85, 2017/10
  • Product Decelopment and Intellectual Property Strategy to Secure Market Creation and Competitive Advantage, H.Kojima,K.Uenishi, Vol. 59, p. 88-89, 2017/10
  • Role and Application of Collaborative Persons for Diversity Company, T.Masuda,K.Uenishi, Vol. 59, p. 86-87, 2017/09
  • Sn-Ag-Bi-In-Cu系はんだの接合信頼性に及ぼす熱サイクル負荷とSb添加の影響, 三原一樹,日根清裕,乗峯笙汰,酒谷 茂昭,秋山真之介,上西啓介, 第27回マイクロエレクトロニクスシンポジウム論文集, Vol. 27, 2017/09
  • Consideration for oligopoly in the semiconductor equipment market : Deriving hypotheses of oligopolistic mechanism, Vol. 58, p. 64-67, 2017/05/27
  • エレクトロマイグレーションによるInSn共晶はんだ接合部の組織変化, 上村泰紀,酒井泰治,作山誠樹,上西啓介, 第23回「エレクトロニクスにおけるマイクロ接合・実装技術」シンポジウム概要集, Vol. 23, 2017/01
  • 食品製造業における技術革新と戦略変化の関係性, 今橋 裕,上西啓介,玄場公規, 研究・イノベーション学会第３０回年次学術大会講演集, 2016/11
  • 日本製造企業の研究開発投資・設備投資と収益性の実証分析, 玄場公規,竹岡紫陽,今橋裕,上西啓介, 研究・イノベーション学会第３０回年次学術大会講演集, 2016/11
  • 中小企業への投資における企業審査基準に関する研究, 細川 茜,今橋 裕,上西啓介, 日本経営システム学会 第57回全国研究発表大会概要集, Vol. 57, 2016/10
  • OJE法による工学教育 -25. 超人を創る (障がい者支援機器のあり方の考察と試作・評価)-, 上西啓介,松田靖史, H28年度工学教育研究講演会講演論文集, p. 542-543, 2016/09
  • ファミリービジネスのCSV戦略による地方活性化, 西岡慶子,玄場公規,上西啓介,加賀有津子, 地域活性学会第8回研究大会講演概要集, Vol. 8, 2016/09
  • Effect of Sb Addition on Phase Transformation and Thermal Fatigue Properties of Sn-Ag-Bi-In Soplder, S.Norimine,K.Mihara,K.Hine,S.Sakatani,S.Akiyama,K.Uenishi, Proceedings on 22nd Symposium on Microjoining and Assembly Technology in Electronics, Vol. 22, p. 441-442, 2016/02
  • Electromigration Behavior in Micro-joints between In-Sn and Copper, Y.Oyabu,A.Sato,K.Uenishi,Y.Uemura,S.Sakuyama, Proceedings of 22ns Symposium on Microjoing and Assembly Technology in Electronics, Vol. 22, p. 437-438, 2016/02
  • Strategies for the brand-building of small- and medium-sized enterprises Case analysis of traditional food manufacturing, Hiroshi Imahashi,Kiminori Gemba,Keisuke Uenishi, PROCEEDINGS 2016 5TH IIAI INTERNATIONAL CONGRESS ON ADVANCED APPLIED INFORMATICS IIAI-AAI 2016, IEEE, p. 853-856, 2016
  • Formation of Compounds and Increase of Melting Temperature of Solder Joints by Using Reaction between Ag and Sn Particles, Akari Terao,Keisuke Uenishi, Vol. 21, p. 441-442, 2015/02
  • 試験法標準に準拠した鉛系および非鉛系はんだの力学的基礎データ集構築, 旭吉雅健,伊藤隆基,稲田将人,上西啓介, Mate2015 「エレクトロニクスにおけるマイクロ接合・実装技術」シンポジウム論文集, Vol. 21, p. 421-422, 2015/02
  • Synthesis of Monodispersed Silver nanoparticles by Chemical Reduction Method using Low Molecular Tertiary Amine, Joji Wakita,Keisuke Uenishi, Vol. 21, p. 429-430, 2015/02
  • Effect of Indium Addition on Microstructure of Sn-Bi Eutectic Alloy, S.Tanaka,Y.Tsuruta,K.Uenishi,Y.Uemura,T.Akamatsu,S.Sakuyama, Vol. 21, p. 169-172, 2015/02
  • 自動車業界のライフタイムバリュー戦略の分析と一考察 ～直営店の貢献とその短・長期的効果, 小林篤功,上原宏敏,長野寛之,志方宣之,上西啓介,石田修一, 第53回日本経営システム学会全国研究発表大会概要集, 2014/10
  • Relationship Between Shrinkage and Conductivity Properties of Cured Isotropic Conductive Adhesives, Shigeru Kohinata,Yoshihiko Shiraki,Masahiro Inoue,Keisuke Uenishi, 2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), IEEE, p. 316-321, 2014
  • Engineering Education based on OJE (On the Job Education) Method : 19.Practical Exercise of Engineering Education based on Community Cooperation, KURASHIKI Tetsusei,MORI Hiroaki,WAKAMOTO Kazuhito,IKEDA Junji,UENISHI Keisuke,OHMURA Etsuji, Japanese Society for Engineering Education, Vol. 25, No. 61, p. 630-631, 2013/08/29
  • 低温実装用Sn-Bi共晶はんだの延性と接合信頼性改善 (特集 種々のニーズに応えて進化する最近の鉛フリーはんだ実装), 上西 啓介, 金属, アグネ技術センター, Vol. 82, No. 12, p. 1105-1111, 2012/12
  • Solder-joint Reliability of Eutectic Sn-Bi with Added Third Elements, Seiki Sakuyama,Toshiya Akamatsu,Keishiro Okamoto,Keisuke Uenishi, Proceeding on 18th Symposium on Microjoining and Assembly Technology for Electronics (Mate2012), 2012/01
  • Influence of Growth of Intermetallic Compound Layers on Electromigration resistance of Micro Solder Joints, Daisuke Toyoshima,Keisuke Uenishi,Yasumitsu Orii, Proceeding on 18th Symposium on Microjoining and Assembly Technology for Electronics (Mate2012), 2012/01
  • Growth Observation of Intermetallic Compounds on Solder Capped Cu pillar bump in Electomigration Test, Yasumitsu Orii,Yuichi Noma,Sayuri Kohara,Keiji Okamoto,Kazushige Toriyama,Daisuke Toyoshima,Keisuke Uenishi, Proceeding on 18th Symposium on Microjoining and Assembly Technology for Electronics (Mate2012), 2012/01
  • Contact Phenomena between MEMS Metallic Probe and Al Substrate, Keisuke Uenishi,Takuya Matsumoto,Takehiko Sato,Tomohiro Ishida, Proceeding on 18th Symposium on Microjoining and Assembly Technology for Electronics (Mate2012), 2012/01
  • High-Density Wiring Technology for LSI Packages, TANI Motoaki,SASAKI Shinya,UENISHI Keisuke, Vol. 111, No. 327, p. 35-40, 2011/11/21
  • Effects of Sb Addition on Impact Resistance Improvement of Sn-Bi Solder BGA Joints, K.Okamoto,N.Imaizumi,T.Akamatsu,S.Sakuyama,K.Uenishi, Proceedings of the 21th Micro Electronics Sympojium, 2011/09
  • イノベーションリーダー養成を狙ったOJE法による実践型演習, S.Seino,A.Kaga,K.Uenishi,E.Ohmura,T.Yamamoto, 日本工学教育協会 平成23年度 工学・工業教育研究講演会講演論文集, 2011/08
  • Effects of showing other's behavior on separating garbage, Yasuhiro Miyai,Keisuke Uenishi,Masahiro Matsumura, Proceedings on the 25th Annual Conference of the Japanese Society for Artificial Intelligence, 2011, 2011/06
  • Influence of Zn Addition to Eutectic Sn-Bi Solder on Joint Reliability with Cu Electrode, Poceedings of International Conference on Electronics Packaging 2011, 2011
  • 銅ポストバンプを用いたプリフェラル型超微細フリップチップ接合におけるはんだ組織の観察と信頼性, Mate2011 「エレクトロニクスにおけるマイクロ接合・実装技術」シンポジウム論文集, Vol. Vol.17, p.59-62, 2011
  • 金スタッドバンプを用いたフリップチップ接合部の熱ストレスによるはんだ組織変化の観察, Mate2011 「エレクトロニクスにおけるマイクロ接合・実装技術」シンポジウム論文集, Vol. Vol.17, p.55-58, 2011
  • ナノ流体の冷媒としての伝熱特性に関する研究, Mate2011 「エレクトロニクスにおけるマイクロ接合・実装技術」シンポジウム論文集, Vol. Vol.17, p.355-356, 2011
  • はんだ接合部でのエレクトロマイグレーション挙動に及ぼすＵＢＭ層の影響, Mate2011 「エレクトロニクスにおけるマイクロ接合・実装技術」シンポジウム論文集, Vol. Vol.17, p.63-66, 2011
  • Sn-Bi 共晶はんだへのZn 添加によるCuとの接合性向上, 服部, Mate2011 「エレクトロニクスにおけるマイクロ接合・実装技術」シンポジウム論文集, Vol. Vol.17, p.25-30, p. 25-30, 2011
  • Infl uence of UBM Layers on Electro-migration Behavior of Micro-joints using Sn-Ag Solders, Poceedings of International Conference on Electronics Packaging 2011, 2011
  • 8-111 Engineering education based on OJE (On the Job Education) method : Part XIII, Check of educational effect of OJE by means of questionnaire and interview, YAMAMOTO Takao,UENISHI Keisuke,Maiya Kiyoshi, Japanese Society for Engineering Education, Vol. 22, p. 174-175, 2010/08/19
  • Service Science: Analysis of the Business System of Service Manufacturing Companies, IProceedings of EEE International Conference on Industrial Engineering and Engineering Management, Vol. No.5674488, p.448-452, 2010
  • Microstructure and Mechanical Properties of Sb Addition Eutectic Sn-Bi Solder, IEICE TRANSACTIONS on Electronics, Vol. Volume E93-C No.11 (2010) p.48, 2010
  • Microstructural Changes in Micro-joints between Sn-58Bi Solders and Copper by Electro-migration, Poceedings of International Conference on Electronics Packaging 2010, Vol. p.475-478, 2010
  • ＯＪＥ法による工学教育 －11.ビジネスエンジニアリング専攻におけるテクノロジーデザイン教育－, 平成22年度 工学・工業教育研究講演会 講演論文集, Vol. pp.172-173, 2010
  • Microstructural Changes in Micro-joints between Sn-58Bi Solders and Copper by Electro-migration, Poceedings of International Conference on Electronics Packaging 2010, Vol. p.475-478, 2010
  • Microstructure and Mechanical Properties of Sn-Bi Eutectic Solders Added with a Third Element, Proceeding on the International Conference on Electronics Packaging (ICEP2009), Vol. p.151-156, 2009
  • Interface Metallurgy fo Micro Joint using Lead Free Solders, Kinzoku Materials Scienve & Technology, Vol. Vol.79, No.5 (2009) p.396-402, 2009
  • Evaluation of Electric Contact Phenomena under Small Contact Load, Proceeding on the International Conference on Electronics Packaging (ICEP2009), Vol. p.423-428, 2009
  • ＯＪＥ法による工学教育－徳島県阿南市をフィールドとした演習－, (社)日本工学教育協会 平成21年度 工学・工業教育研究講演会講演論文集, Vol. (2009-8) 526-527, 2009
  • 鉛フリーはんだ接合における界面メタラジー, 金属, Vol. Vol.79, No.5 (2009) p.396-402, 2009
  • 第三元素添加によるSn-Bi共晶はんだの組織微細化と延性改善効果, 第15回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(MATE2009)論文集, Vol. Vol.15, pp.345-348, 2009
  • エレクトロマイグレーションによるはんだ・銅微細接合部の組織変化, 第19回マイクロエレクトロニクスシンポジウム論文集, 2009
  • イノベーションリーダー養成プログラム－産業クラスターの高度化に向けて－, (社)日本工学教育協会 平成21年度 工学・工業教育研究講演会講演論文集, Vol. (2009-8) 596-597, 2009
  • はんだ・銅微細接合部におけるエレクトロマイグレーション現象, 第15回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(MATE2009)論文集, Vol. Vol.15, pp.39-42, 2009
  • Microstructure and Mechanical Properties of Sn-Bi Eutectic Solders Added with a Third Element, Proceeding on the International Conference on Electronics Packaging (ICEP2009), Vol. p.151-156, 2009
  • MEMSプローブとAl電極との接触性評価, 第15回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(MATE2009)論文集, Vol. Vol.15 pp.259-262, 2009
  • Evaluation of Electric Contact Phenomena under Small Contact Load, Proceeding on the International Conference on Electronics Packaging (ICEP2009), Vol. p.423-428, 2009
  • Microjoining and nanojoining, Woodhead Publishing Limited, 2008
  • 非共沸系混合冷媒による沸騰熱伝達限界の改善, 電子情報通信学会論文誌Ｃ, Vol. Vol.J91-C, No.11, pp., 2008
  • 微小荷重における電気接点現象の評価, 第18回マイクロエレクトロニクスシンポジウム（MES2008）論文集, Vol. Vol.18 (2008) p., 2008
  • レーザアブレーションを用いたSi基板低環境負荷電極形成プロセス, 第14回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム, Vol. Vol.13, p.315-318, 2008
  • Sn-Bi共晶はんだへの第三元素添加効果, 第18回マイクロエレクトロニクスシンポジウム(MES2008)論文集, Vol. Vol.18 (2008) p., 2008
  • OJE法による工学教育 -11. ビジネスエンジニアリング専攻における知的財産権教育, 平成20年度 工学・工業教育研究講演会 講演論文集, Vol. p.486-487, 2008
  • Microjoining and nanojoining, Woodhead Publishing Limited, 2008
  • MEMSプローブモジュールの開発 －Al電極への接触の検討－, 第14回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム, Vol. Vol.14, p.283-286, 2008
  • MEMS プローブとAu 及びAl 電極との接触性評価, 第18回マイクロエレクトロニクスシンポジウム（MES2008）論文集, 2008
  • Development of MEMS Probe for Fine Pitch Contact, Smart Processing Technology, Vol. Vol.2 (2008) p.175-178, 2008
  • A-019 Method of the engineering education in Department of Management of Industry and Technology : Practical Exercise by the OJE (On the Job Education) Method, MATSUMURA Nobuhiko,UENISHI Keisuke,KURASHIKI Tetsusei,SEINO Satoshi,MURATA Masato, Japanese Society for Engineering Education, Vol. 19, p. 728-729, 2007/08/02
  • 8-333 Engineering Education based on OJE (On the Job Education) method : Part VIII : Production of Graduate Students with Master's Degrees both of Engineering and Business Administration, UENISHI Keisuke,SATO Takehiko,MATSUMURA Nobuhiko,ASADA Takayuki,TAKEDA Eiji,NISHIGAKI Aoi, Japanese Society for Engineering Education, Vol. 19, p. 634-635, 2007/08/02
  • On the Job Education Performed by the Collaboration of Graduate School of Engineering and Economy, 上西啓介,加賀有津子,座古勝,鳴海邦碩,佐藤武彦,山本孝夫,村田雅人,松村暢彦,倉敷哲生,清野智史, 映像情報メディア学会技術報告, Vol. 31, No. 58(ENT2007 41-52), 2007
  • Effect of Ag Addition to Sn-Bi Eutectic Solders on the Microstructure and Properties of Joints with Cu, Proceedings of International Conference on Electronics Packaging, 2007, Tokyo Japan, (2007), Vol. p.193-196, 2007
  • Effect of Ag Addition to Sn-Bi Eutectic Solders on the Microstructure and Properties of Joints with Cu, Proceedings of International Conference on Electronics Packaging, 2007, Tokyo Japan, (2007), Vol. p.193-196, 2007
  • 9-214 Engineering Education based on OJE (On the Job Education) method : Part I: Toward a sustainable self-development, KURASHIKI Tetsusei,ZAKO Masaru,SATO Takehiko,UENISHI Keisuke, Japanese Society for Engineering Education, Vol. 18, p. 470-471, 2006/07/28
  • 9-214 Engineering Education based on OJE (On the Job Education) method : Part II: Introduction of practical exercises and their educational aim, UENISHI Keisuke,ZAKO Masaru,SATO Takehiko,MURATA Masato,KURASHIKI Tetsusei, Japanese Society for Engineering Education, Vol. 18, p. 472-473, 2006/07/28
  • Engineering Education based on OJE (On the Job Education) method, 松村暢彦,加賀有津子,座古勝,鳴海邦碩,佐藤武彦,山本孝夫,村田雅人,上西啓介,倉敷哲生,清野智史, 映像情報メディア学会技術報告, Vol. 30, No. 56(ENT2006 18.21-29), 2006
  • Solder Joint Reliability of Flip-Chip BGA by Using Sn-Bi System Solder, 12th Symposium on Microjoining and Assembly Technology in Electronics, Vol. p.259-264, 2006
  • Recycling of Waste Si Wafer to Solar Cell, Proceedings of Asia Pacific Symposium on Eco Design 2006, 2006
  • Photo catalytic Properties of hybrid TiO2 Spray Coating with Au Nano Particles, Smart Processing Technology, Vol. Vol.1 P.69-72, 2006
  • On a Practical Exercise with OJE (On the Job Education), Journal of Japanese Society for Engineering Education, Vol. Vol.54, No.2, pp.69-75, 2006
  • Microstructure and Strength of Ag Added Eutectic Sn-Bi Solders, 12th Symposium on Microjoining and Assembly Technology in Electronics, Vol. p.19-22, 2006
  • Microstructure and Strength of Ag Added Eutectic Sn-Bi Solders, 12th Symposium on Microjoining and Assembly Technology in Electronics, Vol. p.19-22, 2006
  • Laser Cladding of Fe-Cu Based Alloys on Aluminum, Solid State Phenomena, 2006
  • Laser Cladding of Fe-Cu Based Alloys on Aluminum, Solid State Phenomena, 2006
  • Joint property of packages prepared by low temperature soldering using Ag added Sn-Bi solders, Proceedings of 16th Symposium on Micro Electronics (MES2006), Vol. p., 2006
  • Interfacial Microstructure of Joint between Various Barrier Metals and Sn-Ag Based Solders, 12th Symposium on Microjoining and Assembly Technology in Electronics, Vol. p.145-148, 2006
  • Interfacial Microstructure of Joint between Various Barrier Metals and Sn-Ag Based Solders, 12th Symposium on Microjoining and Assembly Technology in Electronics, Vol. p.145-148, 2006
  • ＯＪＥ(On the Job Education)方式による実践型演習, 工学教育, Vol. Vol.54, No.2, pp.69-75, 2006
  • 次世代電子ＳＩ会 第四回シンポジウム（若手ポスターセッション）報告, 電子材料, Vol. Vol.2 (2006) p.92-93, 2006
  • 廃棄シリコンウェハの太陽電池へのリサイクル, Proceedings of Asia Pacific Symposium on Eco Design 2006, 2006
  • 各種バリア金属材料とSn-Ag系はんだとの接合界面組織, 第12回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム, Vol. p.145-148, 2006
  • 低融点はんだを用いた Flip-chip BGAはんだ接合部の信頼性, 第12回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム, Vol. p.259-264, 2006
  • Sn-Ag系はんだと各種バリア金属との接合性評価, MES2006 第16回マイクロエレクトロニクスシンポジウム論文集, Vol. p., 2006
  • Ag添加したSn-Bi系共晶はんだの組織と強度, 第12回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム, Vol. p.19-22, 2006
  • Ag添加Sn-Bi系はんだを用いた低温実装部の接合性評価, MES2006 第16回マイクロエレクトロニクスシンポジウム論文集, Vol. p., 2006
  • Reactivity between Sn-Ag solder and Au/Ni-Co plating to form intermetallic phases, T Yamamoto,S Sakatani,S Kobayashi,K Uenishi,KF Kobayashi,M Ishio,K Shiomi,A Hashimoto,M Yamamoto, MATERIALS TRANSACTIONS, JAPAN INST METALS, Vol. 46, No. 11, p. 2406-2412, 2005/11
  • Laser cladding of Fe-Cr-C alloys on A5052 aluminum alloy using diode laser, S Iwatani,Y Ogata,K Uenishi,KF Kobayashi,A Tsuboi, MATERIALS TRANSACTIONS, JAPAN INST METALS, Vol. 46, No. 6, p. 1341-1347, 2005/06
  • Reactivity between Sn-Ag Solder and Au/Ni-Co Plating to Form Intermetallic Phases, Materials Transaction, Vol. Vol.46 No.11 p.2406-2412, 2005
  • Photo catalytic Properties of hybrid TiO2 Spray Coating with Au Nano Particles, special issue by High Temperature Society of Japan, 2005
  • Interfacial Reaction between Sn-Ag Based Solders and Au/Ni Alloy Platings, Materials Science Forum, Vol. Vol.502, pp.411-416/,, 2005
  • Diode laser cladding on A5052 aluminium alloy for wear resistant, Shingo Iwatani,Yasuhito Ogata,Keisuke Uenishi,Kojiro F. Kobayashi,Akihiko Tsuboi, HT2005: Proceedings of the ASME Summer Heat Transfer Conference 2005, Vol 3, AMER SOC MECHANICAL ENGINEERS, Vol. HT2005-72442, p. 295-301, 2005
  • Diode Laser Cladding on A5052 Aluminum Alloy for Wear Resistance, Proc. ASME Heat Transfer Conference, HT2005-72442, Vol. HT2005-72442, 2005
  • Dielectric Properties of Pb(Zr,Ti)O3 Ceramics Prepared by Pulsed Electric Current Sintering, Novel Materials Processing, Vol. p.325-328, 2005
  • Dielectric Properties of Pb(Zr,Ti)O3 Ceramics Prepared by Pulsed Electric Current Sintering, Novel Materials Processing, Vol. p.325-328, 2005
  • Reactivity between Sn-Ag Solder and Au/Ni-Co Plating to Form Intermetallic Phases, Materials Transaction, Vol. Vol.46 No.11 p.2406-2412, 2005
  • Reactivity between Sn-Ag Solder and Au/Ni-Co Plating to Form Intermetallic Phases, Materials Transaction, Vol. Vol.46 No.11 p.2406-2412, 2005
  • Photo catalytic Properties of hybrid TiO2 Spray Coating with Au Nano Particles, special issue by High Temperature Society of Japan, 2005
  • Laser Cladding of Fe-Cr-C Alloys on A5052 Aluminium Alloy Using Diode Laser, Materials Transactions, Vol. Vol.46, No.6, pp.1341-1347/,, 2005
  • Jisso技術立国への道 若手のネットワーク作り, 電子材料, Vol. 9月号 p.6-7, 2005
  • Interfacial reaction between Sn-Ag based solders and Au/Ni alloy platings, Keisuke Uenishi,Kojiro F. Kobayashi, Materials Science Forum, Vol. 502, p. 411-416, 2005
  • Diode laser cladding on a5052 aluminium alloy for wear resistant, Shingo Iwatani,Yasuhito Ogata,Keisuke Uenishi,Kojiro F. Kobayashi,Akihiko Tsuboi, Proceedings of the ASME Summer Heat Transfer Conference, Vol. 3, p. 295-301, 2005
  • Dielectric Properties of Pb(Zr,Ti)O3 Ceramics Prepared by Pulsed Electric Current Sintering, Novel Materials Processing, Vol. p.325-328, 2005
  • Sn-AgはんだとAu/Ni-Coめっきとのマイクロ接合部急速合金化に関する研究, 小林 真司,山本 孝志,上西 啓介, マイクロエレクトロニクスシンポジウム論文集, エレクトロニクス実装学会, Vol. 14, p. 233-236, 2004/10/14
  • Tensile strength and pseudo-elasticity oT YAG laser spot melted Ti-Ni shape memory alloy wires, Y Ogata,M Takatugu,T Kunimasa,K Uenishi,KF Kobayashi, MATERIALS TRANSACTIONS, JAPAN INST METALS, Vol. 45, No. 4, p. 1070-1076, 2004/04
  • International Conference on Processing & Manufacturing of Advanced Materials (THERMEC '2003)(Reports on the International Conference), UENISHI Keisuke, Journal of the Japan Welding Society, Japan Welding Society, Vol. 73, No. 1, p. 54-55, 2004/01/05
  • Preparation of Ni-Al-Si Intermetallic Compound by Combustion Synthesis and its Application to Dissimilar Bonding with Cast Iron, Vol. 第76巻 9号 pp.767-772, 2004
  • Effect of Platings on Cu Surface on Reliability of Micro Joints Using Sn-Ag Based Lead Free Solders, Vol. 43巻 1号 p251-255, 2004
  • Dissimilar Joining of Nickel Aluminide Intermetallic Compound with Spheroidal Graphite Cast Iron by Using Combustion Synthesis, Materials Science Forum, Vols.449-452 (2004) p.193-196, Vol. Vols.449-452 p.193-196, 2004
  • Dissimilar joining of nickel aluminide with spheroidal graphite cast iron and Cu alloy by hot pressing, T Kimata,K Uenishi,A Ikenaga,KF Kobayashi, SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, NATL INST MATERIALS SCIENCE, Vol. 5, No. 1-2, p. 251-254, 2004/01
  • Dissimilar Brazing of Shape Memory Alloy with Stainless Steel, Welding Technology Vol.52 No.6 (2004) p.75-79, Vol. Vol.52 No.6 p.75-79, 2004
  • Combustion Synthesis Process of Ag Added Al3Ti Intermetallic Compound, Materials Science Forum, Vols.449-452 (2004) p.201-204, Vol. Vols.449-452 p.201-204, 2004
  • BGA Joint Microstructure of Sn-Ag Based Solders with Au/Ni-P Plating, Transactions of the Materials Research Society of Japan, Vol.29 No.5 (2004) p.1995-1999, Vol. Vol.29 No.5 p.1995-1999, 2004
  • 形状記憶合金とステンレス鋼のろう付, 溶接技術 Vol.52 No.6 (2004) p.75-79, Vol. Vol.52 No.6 p.75-79, 2004
  • Combustion synthesis process of Ag added Al3Ti intermetallic compound, Y Miyazaki,K Uenishi,KF Kobayashi, DESIGNING, PROCESSING AND PROPERTIES OF ADVANCED ENGINEERING MATERIALS, PTS 1 AND 2, TRANS TECH PUBLICATIONS LTD, Vol. 449-4, p. 201-204, 2004
  • Joint microstructure of FCD450 and BC6 formed by combustion synthesis of Ni-Al, Kimata Tetsuro,Uenishi Keisuke,Kobayashi Kojiro F.,Ikenaga Akira, Pre-Prints of the National Meeting of JWS, Japan Welding Society, No. 73, p. 280-281, 2003/09/08
  • Sinterig Process of Piezoelectric Ceramic Using Pulsed Electric Current Sintering Method, Sugimura Masahiko,Uenishi Keisuke,Fujimoto Kozo,Goto Tomoaki, Pre-Prints of the National Meeting of JWS, Japan Welding Society, No. 73, p. 120-121, 2003/09/08
  • Nd-YAG Laser Micro Welding of Ti-Ni Type Shape Memory Alloy Wire and its Corrosion Resistance, Ogata Yasuhito,Takatugu Masaya,Kunimasa Takeshi,Uenishi Keisuke,Kobayashi Kojiro F., Pre-Prints of the National Meeting of JWS, Japan Welding Society, No. 73, p. 108-109, 2003/09/08
  • Formation of Al_3Ti intermetallic compound by combustion synthesis of Al-Ti-Ag powder mixture, Miyazaki Yoji,Uenishi Keisuke,Kobayashi Kojiro F., Pre-Prints of the National Meeting of JWS, Japan Welding Society, No. 73, p. 412-413, 2003/09/08
  • Interfacial Reaction and Joint strength between Sn-Ag Based Solders and Electroles Plated Ni-P Alloys, Keisuke Uenishi,Yasuhiro Kohara,Shigeaki Sakatani,Kojiro F. Kobayashi, 2003/02
  • Enhanced densification of combustion synthesized Ni-Al or Ti-Al intermetallic compounds by third element addition, K Uenishi,T Kimata,Y Miyazaki,KF Kobayashi, THERMEC'2003, PTS 1-5, TRANS TECH PUBLICATIONS LTD, Vol. 426-4, p. 1789-1794, 2003
  • Observation of Interfacial Microstructure between Ni-P Plating and Sn-Ag Solder Ball for BGA Package, Shigeaki Sakatani,Yasuhiro Kohara,Toshio Saeki,Keisuke Uenishi,Kojiro F. Kobayashi, 2002/10
  • Reflow Properties of Sn-Bi/Sn-Ag Coated Cu Core Solder Balls, Shigeaki Sakatani,Yasuhiro Kohara,Keisuke Uenishi,Kojiro F. Kobayashi,Masaharu Yamamoto, 2002/01
  • Effect of Cu in Solder on the Interfacial Reaction in the BGA Joint, Keisuke Uenishi,Yasuhiro Kohara,Shigeaki Sakatani,Kojiro F.Kobayashi, 2001/10
  • Brazing of Ti-Ni Shape Memory Alloy with OPure Titanium, Kunimasa Takeshi,Seki Masanori,Yamamoto Hiroki,Nojiti Makoto,Uenishi keisuke,Kobayashi Kojiro, Pre-Prints of the National Meeting of JWS, Japan Welding Society, No. 69, p. 362-363, 2001/09/10
  • Effect of Cu in Pb free solder ball on the microstructure of BGA joints with Au/Ni coated Cu pads, K Uenishi,T Saeki,Y Kohara,KF Kobayashi,Shoji, I,M Nishiura,M Yamamoto, MATERIALS TRANSACTIONS, JAPAN INST METALS, Vol. 42, No. 5, p. 756-760, 2001/05
  • The Microstructure and Shear Strength of the BGA Joint Using Cu Cored Sn-3.5Ag Solder, Journal of Japan Institute of Electronics Packaging, Vol. 4, No. 3, p. 192-199, 2001
  • Application of Sn and Ag Multi Plated Cu Core Pb Free Solder Ball to BGA Package, Vol. p.119-124, 2001
  • CuコアSn-3.5Agはんだを用いたBGA接合部組織とせん断強度, エレクトロニクス実装学会誌, Vol. Vol.4 No.3 p.192-199, 2001
  • BGAパッケージへのSn,Ag多層めっきを施したCuコアPbフリーはんだボールの適用, Proc. 7th Sympo. on Microjoining and Assembly Technologies for Electronics, 2001, Yokohama Japan, p.119-124, Vol. p.119-124, 2001
  • Fabrication of a thick layer of Al_3Ti/TiB_2 composite by reactiv pulsed electric current sintering : (Report 1) Influence of TiB_2 addition, SHIBUTANI Tomohide,MATSUBARA Toshio,UENISHI Keisuke,KOBAYASHI Kojiro, Pre-Prints of the National Meeting of JWS, Japan Welding Society, No. 67, p. 512-513, 2000/09/05
  • fabrication of a thick layer of Al_3Ti/TiB_2 composite by reactive-pulsed electric current sintering : (Report 2)Addition of elemental B for in-situ TiB_2 formation, MATSUBARA Toshio,SHIBUTANI Tomohide,UENISHI Keisuke,KOBAYASHI Kojiro, Pre-Prints of the National Meeting of JWS, Japan Welding Society, No. 67, p. 514-515, 2000/09/05
  • Effect of Cu Addition to Su-Pb or Sn-Ag Solder on BGA Joint Microstrusture, Saeki T.,Kohara Y.,Uenishi K.,Kobayashi K.F.,Shoji I.,Yamamoto M., Pre-Prints of the National Meeting of JWS, Japan Welding Society, No. 67, p. 154-155, 2000/09/05
  • Dissimilar joing of Ti-Ni shape memory alloy to stainless steel by brazing, Seki Masanori,Yamamoto Hiroki,Uenishi Keisuke,Kobayashi Kojiro, Pre-Prints of the National Meeting of JWS, Japan Welding Society, No. 67, p. 228-229, 2000/09/05
  • Brazing of Ti-Ni shape memory alloy with stainless steel, M Seki,H Yamamoto,M Nojiri,K Uenishi,KF Kobayashi, JOURNAL OF THE JAPAN INSTITUTE OF METALS, JAPAN INST METALS, Vol. 64, No. 8, p. 632-640, 2000/08
  • Fabrication of a thick surface layer of Al3Ti on Ti substrate by reactive-pulsed electric current sintering, T Matsubara,T Shibutani,K Uenishi,KF Kobayashi, INTERMETALLICS, ELSEVIER SCI LTD, Vol. 8, No. 7, p. 815-822, 2000/07
  • 日本における溶接の展望（1999年）～圧接および固相接合（拡散接合、熱間圧接・冷間圧接、その他）, 上西啓介, 溶接学会誌、69巻、5号、p.28-31, 日本溶接学会, 2000/05
  • Microstructure and strength of BGA joint using Cu cored Sn-Ag solder, Uenishi K.,Saeki T.,Kohara Y.,Kobayashi K.F.,Shoji I.,Yamamoto M., Pre-Prints of the National Meeting of JWS, Japan Welding Society, No. 66, p. 162-163, 2000/03/13
  • Effect of Cu Core on BGA Joint Microstructure Using Sn-Ag Solder, Toshio Saeki,Keisuke Uenishi,F.Kobayashi,Ikuo Shoji,Masaharu Yamamoto, 2000/02
  • Brazing of α+βTi alloys with Ti-based Amorphous Filler Metal, YAMAMOTO Hiroki,Ito Hirotake,Uenishi Keisuke,F.Kobayasi Kojiro, Pre-Prints of the National Meeting of JWS, Japan Welding Society, No. 65, p. 126-127, 1999/09/21
  • Fabrication of Al_3Ti thick layer on Ti substrate by pulse electric current sintering-combustion synthesis, MATSUBARA Toshio,SHIBUTANI Tomohide,UENISHI Keisuke,F.KOBAYASHI Kojiro, Pre-Prints of the National Meeting of JWS, Japan Welding Society, No. 65, p. 588-589, 1999/09/21
  • Effect of Cu Cored Ball in Solder Ball on Strength of BGA Joint : Joint with Electro Plated Pad, Kiyono Shinya,Saeki Toshio,Uenishi Keisuke,F.Kobayashi Kojiro,Shohji Ikuo,Yamamoto Masaharu, Pre-Prints of the National Meeting of JWS, Japan Welding Society, No. 65, p. 330-331, 1999/09/21
  • Effect of Cu cored Ball in Solder Ball on Strength of Joint : Joint with Electroless Plated Pad, Kiyono Shinya,Fujii Toshio,Saeki Toshio,Uenishi Keisuke,F.Kobayashi Kojiro,Shohji Ikuo,Yamamoto Masaharu, Pre-Prints of the National Meeting of JWS, Japan Welding Society, No. 65, p. 332-333, 1999/09/21
  • Formation of Ultra-fine Intermetallic Compound Ti_3Al Layer by Low Pressure Plasma Spraying, UENISHI Keisuke,MURASE Minoru,INOUE Tetsushi,F.KOBAYASHI Kojiro, Pre-Prints of the National Meeting of JWS, Japan Welding Society, No. 65, p. 412-413, 1999/09/21
  • III 溶接及び切断機器と施工法 III-2 圧接及び固相接合 2.拡散接合 3.熱間圧接・冷間圧接 4.摩擦圧接 5.その他, 上西 啓介, 溶接学会誌 = Journal of the Japan Welding Society, Vol. 68, No. 5, p. 371-374, 1999/07/05
  • 日本における溶接の展望（1998年）～圧接および固相接合（拡散接合、熱間圧接・冷間圧接、摩擦圧接、その他）, 上西啓介, 溶接学会誌, 68巻, 5号, p.25-28, 日本溶接学会, 1999/05
  • Influence of Initial Particle Size on Surface Modified Layer Fabricated by SHS Reaction., Matsubara Toshio,Uenishi Keisuke,Kobayashi F. Kojiro, Pre-Prints of the National Meeting of JWS, Japan Welding Society, No. 64, p. 254-255, 1999/03/23
  • Synthesis of Bulk Amorphous by Using Solid State Amorphization of Mechanically Alloyed Al-Cr Powders., UENISHI Keisuke,KOBAYASHI F Kojiro, Pre-Prints of the National Meeting of JWS, Japan Welding Society, No. 64, p. 120-121, 1999/03/23
  • Microstructure and Mechanical Properties of BGA Joint with Cu Cared Solder Ball, Shinya Kiyono,Keisuke Uenishi,Kojiro F. Kobayashi,Ikuo Shoji,Masaharu Yamamoto, 1999/02
  • Microstructure and Mechanical Propertiy of Al Based MMC Friction Joints., UENISHI Keisuke,KOBAYASHI F Kojiro,Bendzsak G. B.,North T. H., Pre-Prints of the National Meeting of JWS, Japan Welding Society, No. 63, p. 334-335, 1998/09/10
  • トロント大学留学記 : 新しいものに向かって, 上西 啓介, 溶接学会誌, 社団法人溶接学会, Vol. 66, No. 8, p. 630-630, 1997/12/05
  • トロント大学留学記, 上西啓介, 溶接学会誌, 66巻, 8号, p.65, 日本溶接学会, Vol. 89, No. 4, p. 149-151, 1997/08
  • Combustion synthesis of Al3Ti coatings on Cu substarate, Morino Shinya,Fujiwara Shinichi,Uenishi Keisuke,Kobayashi Kojiro F., Pre-Prints of the National Meeting of JWS, Japan Welding Society, No. 59, p. 250-251, 1996/09/05
  • Low Pressure Plasma Spraying of Mechanically Alloyed TiAl Powders on Al Substrate, Murase Minoru,Hata Hiroaki,Uenishi Keisuke,Kobayashi Kojiro F., Pre-Prints of the National Meeting of JWS, Japan Welding Society, No. 58, p. 268-269, 1996/03/15
  • 燃焼合成法による球状黒鉛鋳鉄基板へのNiAlおよびNi_3Alコーティング膜の生成, 池永 明,川本 信,後藤 佳行,新田 康寛,小林 紘二郎,上西 啓介, 鋳物 : 講演大会講演概要集, Vol. 127, p. 84-84, 1995/10/01
  • Wear Properties of Al3Ti/TiB2,TiC Composite Layers Formed on Aluminum by Laser, UENISHI K.,Nashiro M.,Kiyono T.,Kobayashi K.F., Pre-Prints of the National Meeting of JWS, Japan Welding Society, No. 56, p. 248-249, 1995/03/12
  • アルミニウム基材上への金属間化合物Al3Tiのレ-ザクラッディング, 上西 啓介,小林 紘二郎, 軽金属溶接, 軽金属溶接構造協会, Vol. 31, No. 4, p. p153-157, 1993/04
  • Formation of Al_3Ti Based Composite Layer on Al Surface by Laser Cladding, Uenishi K.,Sugimoto A.,Adachi M.,Kobayashi K.F, Pre-Prints of the National Meeting of JWS, Japan Welding Society, No. 52, p. 116-117, 1993/03/15
  • Disbonding of High Temperature Superconductive Thick Film : Forming of High Temperature Superconductive Thick Film on Metal Substrate, Katsutani R.,Matsui K.,Tagami M.,Nakanishi Y.,Uenishi K.,Kobayashi K., Pre-Prints of the National Meeting of JWS, Japan Welding Society, No. 51, p. 198-199, 1992/09/01
  • Bonding of Intermetallic Compound TiAl Using SHS Process, SUMI Hiroyuki,YAMAMOTO Masahiro,WATANABE Kazunori,UENISHI Keisuke,F.KOBAYASHI Kojiro, Pre-Prints of the National Meeting of JWS, Japan Welding Society, No. 50, p. 168-169, 1992/03/15
  • Joining of SiC/Ti-6Al-4V FRM, Fukumoto Shinji,Kotoh Masahiro,Uenishi Keisuke,Hirose Akio,Kobayashi Kojiro, Pre-Prints of the National Meeting of JWS, Japan Welding Society, No. 49, p. 402-403, 1991/08/25
  • Application of CIP treatment for forming of Y_1Ba_2Cu_3O_<7-y> superconductor thick film on metal, Katsutani R.,Matsui K.,Nakanishi Y.,Uenishi K.,Kobayashi K., Pre-Prints of the National Meeting of JWS, Japan Welding Society, No. 49, p. 416-417, 1991/08/25
  • Laser Surface Alloying of Aluminium, Uenishi Keisuke,Sugimoto Akiyoshi,Kabayashi Kojiro, Pre-Prints of the National Meeting of JWS, Japan Welding Society, No. 48, p. 94-95, 1991/03/10

Publications

  • うまくやれる工学のアクティブラーニングOJE, 大阪大学工学研究科ビジネスエンジニアリング専攻,米谷淳, 2016/03
  • 導電・絶縁材料の電気および熱伝導特性制御, 井上正博, 2013/02
  • マイクロ接合・実装技術, 藤本公三,上西啓介,荘司郁夫,西川宏,福本信次, 2012/07
  • Microjoining and nanojoining, Norman Zhou, Woodhead Publishing Limited, 2008/03

Industrial Property Rights

  • 金属基材上への高温超電導厚膜形成方法
  • 電子部品の電極構造
  • はんだめっきボールおよびそれを用いた半導体接続構造の製造方法
  • 圧電セラミックス及び電気-機械変換素子の製造法
  • 内燃機関用シリンダヘッドおよびシリンダヘッドのバルブシートの肉盛り方法
  • 電子部品用パッケージおよびその製造方法並びに電子部品用パッケージの蓋材

Awards

  • Japan Open Innovation Prize, Japan Cabinet Office, 2020/02
  • 工学教育賞, 松村暢彦,倉敷哲生,森裕章,若本和仁,池田順治,上西啓介,大村悦二,加賀有津子,山本孝夫, 日本工学教育協会, 2013/08
  • 業績賞, 大阪大学工学研究科ビジネスエンジニアリング専攻, 日本工学教育協会, 2008/08
  • 日本工学教育協会 工学・工業教育研究講演会 ポスター発表賞, 2007
  • シンポジウムMES2006優秀論文賞, 2007
  • シンポジウムMES2004優秀論文賞, 2005
  • 日本金属学会奨励賞, 1996

Social Activities

  • 大阪府立勝山高等学校・わかば高校 学校協議会委員, 大阪府立勝山高等学校・わかば高校, 2014/04/01 - 2022/03/31
  • 学び教育フォーラム, -

Committee Memberships

  • プロジェクトマネジメント学会 関西支部, 支部長, 2024/03 - Present
  • 電子情報通信学会, 規格調査会 標準化教育検討委員会 国際標準化教育検討ワーキンググループ委員, 2023/09 - Present
  • 日本経営システム学会, 理事, 2023/05 - Present
  • 日本溶接協会, マイクロソルダリング教育委員会委員, 2017/04 - Present
  • プロジェクトマネジメント学会, 関西支部 副支部長, 2020/04 - 2024/02
  • Japan Association for Management Systems, Executive Director, 2019/05 - 2023/04
  • プロジェクトマネジメント学会, 関西支部幹事, 2011 - 2020/03
  • エレクトロニクス実装学会, 関西支部長, 2009/04 - 2011/03
  • エレクトロニクス実装学会, 常任理事, 2008/05 - 2010/04
  • エレクトロニクス実装学会, 理事, 2007/05 - 2008/04
  • 日本金属学会, 会誌・欧文誌編集委員会委員, 2010 -
  • 溶接学会, マイクロ接合研究委員会幹事, 2009 -