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Power Variation Analysis During Transient Thermal Measurement of Semiconductor Packages
Shuhei Fukunaga, Tomoaki Hara, Tsuyoshi Funaki
2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) p. 127-128 2025/04/15 Research paper (international conference proceedings)
Publisher: IEEE
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Analysis of errors in junction temperature estimated by temperature-sensitive electrical parameter for parallel-connected SBDs
Shuhei Fukunaga, Tsuyoshi Funaki
Japanese Journal of Applied Physics 2025/02/01 Research paper (scientific journal)
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A Novel Transient Thermal Characterization System for Power Modules
Shuhei Fukunaga, Tsuyoshi Funaki
IEEE Journal of Emerging and Selected Topics in Power Electronics 2025 Research paper (scientific journal)
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Evaluation of Electrical Model Parameter Changes in SiC Power MOSFETs During Power Cycling Test
Shuhei Fukunaga, Yuki Nakamura, Tsuyoshi Funaki
IEEJ Journal of Industry Applications 2024/11/01 Research paper (scientific journal)
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Analysis of Errors in Junction Temperature Estimated by Temperature-Sensitive Electrical Parameter for Parallel-Connected Power Devices
Shuhei Fukunaga, Tsuyoshi Funaki
Extended Abstracts of the 2024 International Conference on Solid State Devices and Materials 2024/09/03 Research paper (international conference proceedings)
Publisher: The Japan Society of Applied Physics
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Evaluation of Phase Measurement Error in Digital Oscilloscopes
Shuhei Fukunaga, Tsuyoshi Funaki
2024 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) 2024/05/20 Research paper (international conference proceedings)
Publisher: IEEE
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Development of high-speed current switch box for transient thermal characterization of SiC power modules
Shuhei Fukunaga, Tsuyoshi Funaki
CIPS 2024; 13th International Conference on Integrated Power Electronics Systems Vol. 173 p. 145-149 2024/03 Research paper (international conference proceedings)
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Reliable development of an IMS-based SiC power module
Y. Lee, S. Avilès, S. Fukunaga, C. Duchesne, P. Lasserre, A. Castellazzi, T. Funaki
Microelectronics Reliability Vol. 150 2023/11 Research paper (scientific journal)
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Transformerless Power Supply for AC Rail Vehicles
Tsuyoshi Funaki, Shuhei Fukunaga, Takaaki Ibuchi, Tenko Fukuda, Takashi Nakamura, Yuta Yanagisawa
IEEJ Transactions on Industry Applications Vol. 143 No. 9 p. 636-643 2023/09/01 Research paper (scientific journal)
Publisher: Institute of Electrical Engineers of Japan (IEE Japan)
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Effective Thermal Conductivity of Metallic Conductors Considering Thomson Effect
Yutaka Kumano, Shuhei Fukunaga, Tsuyoshi Funaki
Journal of The Japan Institute of Electronics Packaging Vol. 26 No. 3 p. 290-292 2023/05/01 Research paper (scientific journal)
Publisher: Japan Institute of Electronics Packaging
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Issues of Using Unsaturated Heating Time for Transient Thermal Measurement
Tomoaki Hara, Shuhei Fukunaga, Tsuyoshi Funaki
2023 International Conference on Electronics Packaging (ICEP) p. 233-234 2023/04/19 Research paper (international conference proceedings)
Publisher: IEEE
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Binary-weighted Modular Multi-level Digital Active Gate Driver
Hajime Takayama, Shuhei Fukunaga, Takashi Hikihara
2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe 2023 Research paper (international conference proceedings)
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Digital-twin-compatible Optimization of Switching Characteristics for SiC MOSFETs using Genetic Algorithm
Hajime Takayama, Shuhei Fukunaga, Takashi Hikihara
IEEE Journal of Emerging and Selected Topics in Industrial Electronics p. 1-9 2023 Research paper (scientific journal)
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
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Exhaustive search of digitized gate voltage for SiC MOSFETs
Hajime Takayama, Shuhei Fukunaka, Takashi Hikihara
2022 International Symposium on Nonlinear Theory and its Applications (NOLTA 2022) 2022/12
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Slew rate control of switching transient for SiC MOSFET in boost converter using digital active gate driver
Shuhei Fukunaga, Hajime Takayama, Takashi Hikihara
IET Power Electronics Vol. 16 No. 3 p. 472-482 2022/10/18 Research paper (scientific journal)
Publisher: Institution of Engineering and Technology (IET)
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An estimation of load-dependent characteristics of SiC power MOSFETs while active-gate-driving
Hajime Takayama, Shuhei Fukunaga, Takashi Hikihara
International Conference on Silicon Carbide and Related Materials 2022 (ICSCRM 2022) 2022/09 Research paper (international conference proceedings)
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Simulation tool for optimization of digital active gate drive sequence using genetic algorithm
Hajime Takayama, Shuhei Fukunaga, Takashi Hikihara
2022 24th European Conference on Power Electronics and Applications (EPE'22 ECCE Europe) 2022/09 Research paper (international conference proceedings)
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Identification of High Resolution Transient Thermal Network Model for Power Module Packages
Shuhei Fukunaga, Tsuyoshi Funaki
Materials Science Forum Vol. 1062 p. 253-257 2022/05/31 Research paper (scientific journal)
Publisher: Trans Tech Publications, Ltd.
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Development of reliable multi-chip power modules with parallel planar- and trench-gate SiC MOSFETs
Shuhei Fukunaga, Alberto Castellazzi, Tsuyoshi Funaki
2022 IEEE 34th International Symposium on Power Semiconductor Devices and ICs (ISPSD) Vol. 2022-May p. 181-184 2022/05/22 Research paper (international conference proceedings)
Publisher: IEEE
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Difficulty and solution in transient thermal resistance measurement for wide band gap power semiconductor device
Tsuyoshi Funaki, Shuhei Fukunaga, Tomoaki Hara, Takaaki Ibuchi
2022 International Power Electronics Conference (IPEC-Himeji 2022- ECCE Asia) p. 1959-1963 2022/05/15 Research paper (international conference proceedings)
Publisher: IEEE
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A study on digital active gate driving of DC-DC converter for suppressing switching surge voltage
Shuhei Fukunaga, Hajime Takayama, Takashi Hikihara
2022 International Power Electronics Conference (IPEC-Himeji 2022- ECCE Asia) p. 2093-2096 2022/05/15 Research paper (international conference proceedings)
Publisher: IEEE
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Reliable design of SiC MOSFET power modules: experimental characterization for aging prediction
Shuhei Fukunaga, Alberto Castellazzi, Tsuyoshi Funaki
2022 International Power Electronics Conference (IPEC-Himeji 2022- ECCE Asia) Vol. 122 No. 247(SDM2022 64-78) p. 151-156 2022/05/15
Publisher: IEEE
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Temperature Distribution Simulation Model of Bus Bar Used as Heat Conduction Path
Yutaka Kumano, Shuhei Fukunaga, Tsuyoshi Funaki
Journal of The Japan Institute of Electronics Packaging Vol. 25 No. 3 p. 269-271 2022/05/01 Research paper (scientific journal)
Publisher: Japan Institute of Electronics Packaging
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Chip Layout Optimization of SiC Power Modules Based on Multiobjective Electro-Thermal Design Strategy
Shuhei Fukunaga, Tsuyoshi Funaki
IEEJ Journal of Industry Applications Vol. 11 No. 1 p. 157-162 2022/01/01 Research paper (scientific journal)
Publisher: Institute of Electrical Engineers of Japan (IEE Japan)
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Identification of high resolution transient thermal network model for power module packages
Shuhei Fukunaga, Tsuyoshi Funaki
The 13th European Conference on Silicon Carbide and Related Materials (ECSCRM2020-2021) 2021/10 Research paper (international conference proceedings)
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A Study on Switching Surge Voltage Suppression of SiC MOSFET by Digital Active Gate Drive
Shuhei Fukunaga, Hajime Takayama, Takashi Hikihara
2021 IEEE 12th Energy Conversion Congress & Exposition - Asia (ECCE-Asia) p. 1325-1330 2021/05/24 Research paper (international conference proceedings)
Publisher: IEEE
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Switching Trajectory Control of SiC MOSFET Based on I-V Characteristics Using Digital Active Gate Driver
Hajime Takayama, Shuhei Fukunaga, Takashi Hikihara
2021 IEEE 12th Energy Conversion Congress & Exposition - Asia (ECCE-Asia) p. 1338-1343 2021/05/24 Research paper (international conference proceedings)
Publisher: IEEE
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Thermal decouple design of multichip SiC power module with thermal anisotropic graphite
Shuhei Fukunaga, Tsuyoshi Funaki
IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 11 No. 5 p. 778-784 2021/05/17 Research paper (scientific journal)
Publisher: Institute of Electrical and Electronics Engineers ({IEEE})
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2-port Characterization and Modeling of Magnetic Components for 10 MHz Class-E Inverters Design
Shota Seki, Shuhei Fukunaga, Takaaki Ibuchi, Tsuyoshi Funaki
IEEJ Transactions on Fundamentals and Materials Vol. 141 No. 5 p. 317-326 2021/05/01 Research paper (scientific journal)
Publisher: Institute of Electrical Engineers of Japan ({IEE} Japan)
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Transient thermal network model identification for power module packages
Shuhei Fukunaga, Tsuyoshi Funaki
Nonlinear Theory and Its Applications, IEICE Vol. 11 No. 2 p. 157-169 2020/04/01 Research paper (scientific journal)
Publisher: Institute of Electronics, Information and Communications Engineers ({IEICE})
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A study on parasitic inductance and thermal resistance of multi-layered ceramic power module substrate
Tsuyoshi Funaki, Shuhei Fukunaga
International Symposium on Advanced Power Packaging (ISAPP 2019) 2019/10 Research paper (international conference proceedings)
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A reliability assessment on busbar joint with ultrasonic bonding in power module for thermal stress
Shuhei Fukunaga, Tsuyoshi Funaki
International Symposium on Advanced Power Packaging (ISAPP 2019) 2019/10 Research paper (international conference proceedings)
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A study on transient thermal characterization of SWITCH-MOS
Shuhei Fukunaga, Tsuyoshi Funaki, Shinsuke Harada, Yusuke Kobayashi
International Conference on Silicon Carbide and Related Materials 2019 (ICSCRM 2019) 2019/10 Research paper (international conference proceedings)
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An experimental study on dynamic junction temperature estimation of SiC MOSFET with built-in SBD
Shuhei Fukunaga, Tsuyoshi Funaki, Shinsuke Harada, Yusuke Kobayashi
IEICE Electronics Express Vol. 16 No. 17 p. 20190392-20190392 2019/09/10 Research paper (scientific journal)
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A Statistical Study on the Required Sample Number of SiC SBD to Secure Estimated Junction Temperature with K Factor
Shuhei Fukunaga, Tsuyoshi Funaki
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) 2018/09 Research paper (international conference proceedings)
Publisher: IEEE
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An experimental study on estimating dynamic junction temperature of SiC MOSFET
Shuhei Fukunaga, Tsuyoshi Funaki
IEICE Electronics Express Vol. 15 No. 8 p. 20180251-20180251 2018/04/25 Research paper (scientific journal)
Publisher: Institute of Electronics, Information and Communications Engineers ({IEICE})
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A study on the measurement of transient thermal characteristics for multi-layered ceramic substrate
Shuhei Fukunaga, Tsuyoshi Funaki
2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Vol. 2017-January p. 1-4 2017/09 Research paper (international conference proceedings)
Publisher: IEEE
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Switching surge voltage suppression in SiC half-bridge module with double side conducting ceramic substrate and snubber capacitor
Shuhei Fukunaga, Tsuyoshi Funaki
IEICE Electronics Express Vol. 14 No. 11 p. 20170177-20170177 2017/06 Research paper (scientific journal)
Publisher: Institute of Electronics, Information and Communications Engineers (IEICE)
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Difficulties in characterizing transient thermal resistance of SiC MOSFETs
Tsuyoshi Funaki, Shuhei Fukunaga
2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) p. 141-146 2016/09 Research paper (international conference proceedings)
Publisher: IEEE
