顔写真

PHOTO

Iwata Yoshiharu
岩田 剛治
Iwata Yoshiharu
岩田 剛治
Graduate School of Engineering Division of Materials and Manufacturing Science, Associate Professor

Research History 12

  1. 2011/04 - Present
    大阪大学 大学院工学研究科 マテリアル生産科学専攻 准教授

  2. 2007/04 - 2008/04
    大阪大学 先端科学イノベーションセンター 准教授

  3. 2005/03 - 2007/04
    Osaka University, Center for Advanced Science and Innovation, Associate Professor (lecture)

  4. 2004/04 - 2005/03
    Osaka University, Center for Advanced Science and Innovatio,n Research Associate

  5. 2002/08/01 - 2004/03/31
    Osaka University Cooperative Research Center for Advanced Science and Technology Research Assistant

  6. 2002 - 2004
    Research Associate, Collaborative Research Center

  7. 1997/04 - 2002/07
    大阪大学 大学院工学研究科 生産科学専攻 助手

  8. 1997 - 2002
    Research Associate, Graduate School of Eng.,

  9. 1994/04 - 1997/03
    Osaka University, Enginering Department, Assistant Professor

  10. 1994 - 1996
    Research Associate, Faculty of Eng., Osaka

  11. 2004 -
    - Center for Advanced Science and Innovation, Osaka Univ.

  12. for Advanced Sience and Technology, Osaka Univ.

Education 3

  1. Osaka University Graduate School, Division of Engineering

    1992/04 - 1994/03

  2. Osaka University

    1990/04 - 1992/03

  3. Osaka University Faculty of Engineering

    1986/04 - 1990/03

Committee Memberships 19

  1. 日本機械学会 生産システム部門 表彰委員会 幹事 Academic society

    2024/04 - Present

  2. 日本機械学会 生産システム部門 代議員 Academic society

    2024/04 - Present

  3. 日本学術振興会 産学協力委員会 R026先端計測技術の将来設計委員会 Academic society

    2024/03 - Present

  4. エレクトロニクス実装学会 MES 論文委員会 副委員長 Academic society

    2023/04 - Present

  5. 日本機械学会 設計工学システム部門 総務委員会 委員 Academic society

    2023/04 - Present

  6. 日本機械学会 設計工学システム部門 産学連携活性化委員会 委員長 Academic society

    2023/04 - Present

  7. スマートプロセス学会 エレクトロニクス生産科学部会 電子デバイス実装研究委員会 幹事 Academic society

    2012/04 - Present

  8. スマートプロセス学会 Mate 実行委員会 委員 Academic society

    1995/04 - Present

  9. 溶接学会 マイクロ接合研究委員会 幹事 Academic society

    1994 - Present

  10. AI活用型システム創成委員会 会計幹事 Academic society

    2020/10 - 2024/03

  11. スマートプロセス学会 Mate 総務委員会 委員長

    2020/04 - 2024/03

  12. スマートプロセス学会 エレクトロニクス生産科学部会 企画委員 Academic society

    2012/04 - 2024/03

  13. 日本機械学会 設計工学システム部門 産学連携活性化委員会 幹事 Academic society

    2022/04 - 2023/03

  14. 日本機械学会 設計工学・システム部門 産学連携活性化委員会 幹事 Academic society

    2021/04 - 2023/03

  15. 日本機械学会 関西設計工学研究会 委員 Academic society

    2003/09 - 2021/03

  16. 日本学術振興会 第177委員会幹事

    2005 - 2020

  17. 溶接学会 若手会員の会 運営委員 Academic society

    1994/04 - 2007/03

  18. 国際高等研究所 特別研究員

    2002 - 2004

  19. スマートプロセス学会 エレクトロニクス生産科学部会 幹事 Academic society

    2024/04 -

Professional Memberships 7

  1. スマートプロセス学会

  2. The Japan Society of Mechanical Enginners

  3. IEEE

  4. Japan Institute of Electronics Packaging

  5. The Institute of Electronics Information and Communication Engineers

  6. The Japan Society of Applied Physics

  7. Japan Welding Society

Research Areas 6

  1. Manufacturing technology (mechanical, electrical/electronic, chemical engineering) / Control and systems engineering /

  2. Nanotechnology/Materials / Nano/micro-systems /

  3. Nanotechnology/Materials / Material fabrication and microstructure control /

  4. Manufacturing technology (mechanical, electrical/electronic, chemical engineering) / Electronic devices and equipment /

  5. Manufacturing technology (mechanical, electrical/electronic, chemical engineering) / Machine elements and tribology /

  6. Manufacturing technology (mechanical, electrical/electronic, chemical engineering) / Design engineering /

Awards 6

  1. 優秀講演論文表彰

    岩田剛治 一般社団法人 日本機械学会 生産システム部門 2020/03

  2. Best Paper Award of ICEP 2010

    Haruhiko Miyagawa, Ryohei Satoh, Yoshiharu Iwata, Eiji Morinaga, Shingo Kamo International Conference on Electronics Packaging 2011/04

  3. 社団法人 日本機会学会 設計工学・システム部門 優秀発表表彰

    岩田 剛治 社団法人 日本機会学会 設計工学・システム部門 2006/11

  4. JWS Promising Aword for paper of the Year

    Yoshiharu Iwata Japanse Welding Society 1994/04

  5. 93 MES Out Standing technical paper award

    Shuji Nakata, Masahito Ijyuin, Yoshiharu Iwata Society for Hybrid Microelectronics 1993/06

  6. Telecom Social Science Prize for Student

    Yoshiharu Iwata The Telecomunications advancement Foundation 1993/03

Papers 182

  1. Sequential approximate multi-objective optimization with small data using Integration Nural Network approximator

    Tomoki Takao, Yoshiharu Iwata, Hidefumi Wakamatsu, Masato Taki, Shimgo Iwasaki, Takashi Yoshiya

    WCSMO-16 Abstract Compilation p. 10-10 2025/05

  2. Investigation of Methods for Expanding the Application of Integration Neural Network and Their Appropriate Structures

    Yoshiharu Iwata, Hidefumi Wakamtsu

    2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) p. 1-4 2025/04/06 Research paper (international conference proceedings)

    Publisher: IEEE
  3. Balancing Accuracy and Data Reduction Using Record of Additional Data in Sequential Approximate Optimization

    Kaito Toyoshima, Tomoki Takao, Yoshiharu Iwata, Hidefumi Wakamatsu

    2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) p. 1-8 2025/04/06 Research paper (international conference proceedings)

    Publisher: IEEE
  4. Dynamic behavior analysis of copper wire for predicting defects in the winding process of a motor coil

    Masato NAGANO, Taichi HIROSAWA, Hidefumi WAKAMATSU, Yoshiharu IWATA, Hironori SUZUKI, Takumi NAKAUE, Takahiro TANAKA

    Transactions of the JSME (in Japanese) Vol. 91 No. 944 p. 24-00200 2025/02 Research paper (scientific journal)

    Publisher: Japan Society of Mechanical Engineers
  5. Theoretical Research of Tactile Shape Sensor for Complex Surfaces Based on Fiber-Optic Distributed Sensors

    Zeyu Long, Hidefumi Wakamatsu, Yoshiharu Iwata

    2025 IEEE/SICE International Symposium on System Integration (SII) p. 639-644 2025/01/21 Research paper (international conference proceedings)

    Publisher: IEEE
  6. Dynamic Behavior Analysis of Copper Wire for Motor Coil Manufacturing

    Masato Nagano, Hidefumi Wakamatsu, Yoshiharu Iwata, Hironori Suzuki, Takumi Nakaue, Takahiro Tanaka

    2025 IEEE/SICE International Symposium on System Integration (SII) p. 393-398 2025/01/21 Research paper (international conference proceedings)

    Publisher: IEEE
  7. Dynamic knitting simulation for predicting defects of knitted fabrics

    Kazuki Hayano, Hidefumi Wakamatsu, Yoshiharu Iwata, Yuya Yamada

    2025 IEEE/SICE International Symposium on System Integration (SII) p. 823-828 2025/01/21 Research paper (international conference proceedings)

    Publisher: IEEE
  8. Balancing Accuracy and Data Reduction Using Record of Additional Data in Sequential Approximate Optimization

    Proceedings of Symposium on Microjoining and Assembly Technology in Electronics 30th Vol. 30 p. 299-304 2025/01 Research paper (conference, symposium, etc.)

  9. Confirmation of driving principle by weight analysis of Integration Neural Network and extension of deductive approximator

    Yoshiharu IWATA, Hidefumi WAKAMATSU

    Journal of Advanced Mechanical Design, Systems, and Manufacturing Vol. 18 No. 7 2024/11 Research paper (scientific journal)

  10. Remote Shape Prediction of Submarine Cables Using Fiber-Optic Distributed Sensors

    Zeyu Long, Hidefumi Wakamatsu, Yoshiharu Iwata

    2024 IEEE/SICE International Symposium on System Integration, SII 2024 p. 333-338 2024 Research paper (international conference proceedings)

  11. Simplifying Hyperparameter Derivation for Integration Neural Networks Using Information Criterion

    Yoshiharu Iwata, Hidefumi Wakamatsu

    2024 IEEE/SICE International Symposium on System Integration, SII 2024 p. 453-457 2024 Research paper (international conference proceedings)

  12. Qualitative Analysis and Exploration of a Novel Mechanism: Twisted String and Spiral Hose Mechanism

    Zeyu Long, Hidefumi Wakamatsu, Yoshiharu Iwata

    2024 IEEE 7th International Conference on Soft Robotics, RoboSoft 2024 p. 438-443 2024 Research paper (international conference proceedings)

  13. Power Device Structure Optimization by Sequential Approximation Optimization Method

    Tomoki Takao, Yoshiharu Iwata, Hidefumi Wakamatsu

    2024 International Conference on Electronics Packaging, ICEP 2024 p. 169-170 2024 Research paper (international conference proceedings)

    Publisher: IEEE
  14. Dynamic Behavior Analysis of Copper Wire for Motor Coil Manufacturing

    Taichi HIROSAWA, Hidefumi WAKAMATSU, Yoshiharu IWATA, Hironori SUZUKI, Atsushi SAKAUE

    30th Symposium on “Microjoining and Assembly Technology in Electronics” Vol. 30 p. 267-272 2024/01 Research paper (conference, symposium, etc.)

  15. Reducing Training Data in Sequential Approximate Optimization

    Tomoki TAKAO, Yoshiharu IWATA, Hidefumi WAKAMATSU

    30th Symposium on “Microjoining and Assembly Technology in Electronics” Vol. 30 p. 257-262 2024/01 Research paper (conference, symposium, etc.)

  16. Verification of generality from weight analysis of Integration Neural Network approximators

    IWATA Yoshiharu, WAKAMATSU Hidefumi

    QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY Vol. 41 No. 4 p. 371-378 2023/12 Research paper (scientific journal)

  17. Fundamental Study on the Hierarchical Multi-Objective Optimization Method

    Yoshiharu IWATA, Satoshi TERADA, Takumi TOMOMOTO, Hidenori MURATA, Ryohei SATOH

    Journal of Smart Processing Vol. 12 No. 6 p. 336-343 2023/11/10 Research paper (scientific journal)

    Publisher: Sumart Processing Society for Minerals, Environment and Energy
  18. Hierarchical optimization of product system using reinforcement learning

    Yoshiharu IWATA, Haruhi KAJISAKI, Koji FUJISHIRO, Hidefumi WAKAMATSU, Tomoki TAKAO

    Transactions of the Institute of Systems, Control and Information Engineers Vol. 38 No. 6 p. 251-259 2023/08 Research paper (scientific journal)

  19. Simulation approximators using linear and nonlinear integration neural networks

    Yoshiharu IWATA, Kouji FUJISHIRO, Hidefumi WAKAMATSU

    Transactions of the Institute of Systems, Control and Information Engineers Vol. 38 No. 6 p. 243-250 2023/08 Research paper (scientific journal)

  20. Shape Prediction of Knitted Stitches Using Machine Learning Toward Wearing Simulation of Knitted Clothes

    Hidefumi Wakamatsu, Hikaru Nara, Yoshiharu Iwata

    Transactions of the Institute of Systems, Control and Information Engineers Vol. 36 No. 3 p. 72-80 2023/03/15 Research paper (scientific journal)

    Publisher: The Institute of Systems, Control and Information Engineers
  21. Reduction of overlearning and higher accuracy in multiple regression analysis using integration neural network

    Yoshiharu Iwata, Hidefumi Wakamatsu

    Manufacturing Systems Division Conference 2 2023/03 Research paper (conference, symposium, etc.)

  22. Effect of Proper Learning Rate for Integration Neural Network Approximators

    岩田剛治, 若松栄史

    マイクロエレクトロニクスシンポジウム論文集 Vol. 33rd 2023

  23. Cause Prediction of Product Defects Using Event Causality

    若松栄史, 波多野樹, 森永英二, 岩田剛治

    スマートプロセス学会誌 Vol. 12 No. 6 2023

  24. Novel Biomimetic Mechanism Inspired by Snake: Twisted String and Spiral Hose Mechanism

    Zeyu Long, Hidefumi Wakamatsu, Yoshiharu Iwata

    2023 IEEE International Conference on Robotics and Biomimetics, ROBIO 2023 2023 Research paper (international conference proceedings)

  25. Simulation of Dynamic Deformation of a Belt-Shaped Object toward Design of its Tying Tool

    Takaharu Momosaki, Hidefumi Wakamatsu, Yoshiharu Iwata

    Proceedings of the 2023 IEEE/SICE International Symposium on System Integration p. 223-228 2023/01 Research paper (international conference proceedings)

  26. Reduction of training computation by network optimization of Integration Neural Network approximator

    Yoshiharu IWATA, Hidefumi WAKAMATSU

    Proceedings of the 2023 IEEE/SICE International Symposium on System Integration p. 424-428 2023/01 Research paper (international conference proceedings)

  27. Simulation of Dynamic Deformation of a Belt-Like String Toward Design of a Binding Tool of Wire Harness

    Vol. 29 p. 247-252 2023/01 Research paper (conference, symposium, etc.)

  28. Structural Optimization of Simulation Approximator by Integration Neural Network

    Symposium on Microjoining and Assembly Technology in Electronics 29th Vol. 29 p. 253-257 2023/01 Research paper (conference, symposium, etc.)

  29. Fundamental Study on Multi-Agent Optimization Using Reinforcement Learning

    OPTIS2022 2022/11 Research paper (conference, symposium, etc.)

  30. 時間を考慮した定性的状態表現に基づく製品の不具合予測に関する研究

    若松 栄史, 岩田 剛治

    第32回設計工学・システム部門講演会講演論文集 2022/09/20 Research paper (other academic)

  31. Research on simulation approximators using linear and nonlinear coupled NN

    2022/09/20 Research paper (other academic)

  32. A Method of Predicting Performance of A Developable Surface for Its Design Efficiency

    Kotaro Yoshida, Hidefumi Wakamatsu, Takaharu Momosaki, Yoshiharu Iwata, Takahiro Kubo

    Proceedings of the 2022 International Symposium on Flexible Automation p. 36-41 2022/07/03 Research paper (international conference proceedings)

  33. Hierarchize Optimization of Product Systems Using Reinforcement Learning

    Haruhi Kajisaki, Yoshiharu Iwata, Koji Fujishiro, Hidefumi Wakamatsu

    Proceedings of the 2022 International Symposium on Flexible Automation p. 24-31 2022/07/03 Research paper (international conference proceedings)

  34. SHAPE PREDICTION OF KNITTED STITCHES USING MACHINE LEARNING TOWARD WEARING SIMULATION OF KNITTED CLOTHES

    Hikaru Nara, Hidefumi Wakamatsu, Yoshiharu Iwata

    Proceedings of the 2022 International Symposium on Flexible Automation p. 18-23 2022/07/03 Research paper (international conference proceedings)

  35. Simulation Approximators Using Linear and Nonlinear Integrated Neural Network

    Yoshiharu Iwata, Hidefumi Wakamatsu, Kouji Fujishiro

    Proceedings of the 2022 International Symposium on Flexible Automation p. 98-103 2022/07/03 Research paper (international conference proceedings)

  36. A Basic Study of Deductive and Inductive Knowledge Fusion Simulation Approximators

    岩田剛治, 藤城晃之, 峯田龍志, 川村俊貴, 若松栄史

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 28th 2022 Research paper (conference, symposium, etc.)

  37. Simulation of Bending Deformation of a Multi-Pair Cable

    若松栄史, 岩田剛治

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 28th 2022 Research paper (conference, symposium, etc.)

  38. Guide Part Design of a Tying Tool for a Wire Harness Considering Its Disassembly for String Extraction

    Hidefumi Wakamatsu, Tomoya Tanaka, Yoshiharu Iwata

    2022 IEEE/SICE INTERNATIONAL SYMPOSIUM ON SYSTEM INTEGRATION (SII 2022) p. 1-6 2022 Research paper (international conference proceedings)

  39. A modification method in the design process of a developable surface

    吉田皓太郎, 若松栄史, 岩田剛治

    システム制御情報学会研究発表講演会講演論文集(CD-ROM) Vol. 65 p. 325-328 2021/05 Research paper (conference, symposium, etc.)

    Publisher:
  40. Shape prediction of braided structure for strength analysis of tubular CFRP

    若松栄史, 成田周平, 岩田剛治

    日本繊維機械学会年次大会研究発表論文集・講演要旨集 Vol. 74th 2021 Research paper (other academic)

  41. A method to optimize the shape of the brassiere cup at the detailed design stage

    百崎敬晴, 吉田皓太郎, 若松栄史, 岩田剛治

    日本繊維機械学会年次大会研究発表論文集・講演要旨集 Vol. 74th 2021 Research paper (other academic)

  42. 航空機用ワイヤーハーネス結束工具のための分割を考慮した型の設計

    田中智也, 若松栄史, 岩田剛治

    日本ロボット学会学術講演会予稿集(CD-ROM) Vol. 39th 2021 Research paper (other academic)

  43. Design Support of function of brassiere cup using gaussian process regression

    YOSHIDA Kotaro, WAKAMATSU Hidefumi, IWATA Yoshiharu, KUBO Takahiro

    Transactions of the JSME (in Japanese) Vol. 87 No. 903 p. 21-00201-21-00201 2021 Research paper (scientific journal)

    Publisher: The Japan Society of Mechanical Engineers
  44. Hybrid neural network of analysis to increase the accuracy of the approximator

    MINETA Ryushi, FUJISHIRO Koji, IWATA Yoshiharu, WAKAMATU Hidefumi

    The Proceedings of Design & Systems Conference Vol. 2021.31 2021 Research paper (other academic)

    Publisher: The Japan Society of Mechanical Engineers
  45. A Study on Improving Accuracy of Analytical Approximators by Machine Learning with Active Learning

    KAWAMURA Toshiki, MINETA Ryushi, YOSHIDA Kotaro, IWATA Yoshiharu, WAKAMATU Hidefumi

    The Proceedings of Design & Systems Conference Vol. 2021.31 2021 Research paper (other academic)

    Publisher: The Japan Society of Mechanical Engineers
  46. Cause Prediction of Product Defects Using Event Causality

    WAKAMATSU Hidefumi, HATANO Itsuki, MORINAGA Eiji, IWATA Yoshiharu

    The Proceedings of Design & Systems Conference Vol. 2021.31 2021 Research paper (other academic)

    Publisher: The Japan Society of Mechanical Engineers
  47. Efficiency of Fast Approximation Analysis by Simulation and Machine Learning Using Active Learning

    MINETA Ryushi, IWATA Yoshiharu, WAKAMATU Hidefumi, MATSUMOTO Yuya, KAWAMURA Toshiki

    The Proceedings of Manufacturing Systems Division Conference Vol. 2021 2021

    Publisher: The Japan Society of Mechanical Engineers
  48. 機械学習による製品特徴抽出の因果情報抽出による高精度化

    植田俊太, 岩田剛治, 峯田龍志

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 26th 2020

  49. Development for super fine mounting technology to realize 3D LSI

    岩田剛治

    生産と技術 Vol. 72 No. 2 p. 37-41 2020 Research paper (other academic)

    Publisher:
  50. Failure Causal Group Extraction Method Using Defect Causal Information in Product Feature Prediction

    Iwata Yoshiharu, Ueda Shunta, Mineta Ryushi

    The Proceedings of Manufacturing Systems Division Conference Vol. 2020 2020

    Publisher: The Japan Society of Mechanical Engineers
  51. Efficiency of Fast Approximation Analysis Method by Machine Learning Using Active Learning

    MINETA Ryushi, IWATA Yosiharu, WAKAMATSU Hidefumi, MATSUMOTO Yuya, KAWAMURA Toshiki

    The Proceedings of Design & Systems Conference Vol. 2020.30 2020 Research paper (other academic)

    Publisher: The Japan Society of Mechanical Engineers
  52. 大規模システムにおけるシステムモデル分割に基づく階層型多目的最適化手法に関する研究

    岩田剛治, 寺田識史, 寺田識史

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 25th 2019 Research paper (other academic)

  53. A Study on Defective Feature Evaluation Method Using Decision Tree Analysis and Neural Network

    IWATA Yosiharu, UEDA Shunta, MINETA Ryuuji

    The Proceedings of Manufacturing Systems Division Conference Vol. 2019 2019

    Publisher: The Japan Society of Mechanical Engineers
  54. Improvement of product evaluation by defective grouping based on causal relationship

    UEDA Shunta, IWATA Yosiharu, MINETA Ryushi

    The Proceedings of Design & Systems Conference Vol. 2019.29 2019

    Publisher: The Japan Society of Mechanical Engineers
  55. Automated Dividing Method for Hierarchical Optimizationand Application to 3DLSI Rough Design

    Satoshi TERADA, Yoshiharu IWATA, Hidenori MURATA, Ken KAWAMURA

    Journal of Smart Processing Vol. 7 No. 3 p. 106-112 2019/01 Research paper (scientific journal)

    Publisher: スマートプロセス学会
  56. System Design Area, Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University

    Iwata Yoshiharu

    Journal of The Japan Institute of Electronics Packaging Vol. 21 No. 6 p. 606-606 2018/09/01

    Publisher: The Japan Institute of Electronics Packaging
  57. Proposal of Product System Modeling Methodology in SDSI-Cubic Method

    Ken Kawamura, Hidenori Murata, Takeshi Sakamoto, Ryohei Satoh, Yoshiharu Iwata, Eiji Arai, Kazuya Okamoto

    Journal of The Japan Institute of Electronics Packaging Vol. 21 No. 2 p. 143-154 2018/03 Research paper (scientific journal)

    Publisher: エレクトロニクス実装学会
  58. システムモデルを用いた階層型最適化問題への自動分割と3DLSI概略設計への適用

    寺田識史, 寺田識史, 岩田剛治, 村田秀則, 河村憲, 河村憲

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 24th 2018

  59. Automated Dividing Method for Hierarchical Optimizationand Application to 3DLSI Rough Design

    寺田識史, 寺田識史, 岩田剛治, 村田秀則, 河村憲, 河村憲

    スマートプロセス学会誌 Vol. 7 No. 3 2018

  60. システムモデルからの階層構造抽出に応じた階層型多目的最適化手法

    岩田剛治, 寺田識史

    日本機械学会設計工学・システム部門講演会論文集(CD-ROM) Vol. 28th 2018

  61. The 177th Committee on System Design and lntegration, University-Industry Cooperative Research Committee, The Japan Society for the Promotion of Science

    Aoyama Kazuhiro, Iwata Yoshiharu, Nomaguchi Yutaka, Koga Tsuyoshi, Morinaga Eiji

    SYSTEMS, CONTROL AND INFORMATION Vol. 61 No. 11 p. 471-472 2017/11

    Publisher: THE INSTITUTE OF SYSTEMS, CONTROL AND INFORMATION ENGINEERS
  62. システムデザインのための製品システムの形状情報統合モデリングに関する研究

    河村憲, 村田秀則, 坂本武志, 佐藤了平, 岩田剛治, 荒井栄司, 岡本和也

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 23rd 2017

  63. Decomposition of Optimization Method Based on Production-system Model

    TERADA Satoshi, IWATA Yoshiharu, MURATA Hidenori, KAWAMURA Ken

    The Proceedings of Design & Systems Conference Vol. 2017.27 2017

    Publisher: The Japan Society of Mechanical Engineers
  64. Product System Modeling Method with shape information for System Design

    KAWAMURA Ken, MURATA Hidenori, SAKAMOTO Takeshi, SATOH Ryohei, IWATA Yoshiharu, ARA Eiji, OKAMOTO Kazuya

    The Proceedings of Manufacturing Systems Division Conference Vol. 2017 2017

    Publisher: The Japan Society of Mechanical Engineers
  65. Study on Ag/Sn multilayer thin film bonding for 3D stacked semiconductor

    Kiyoto Yoneta, Ryohei Satoh, Yoshiharu Iwata, Takumi Shigemoto, Koichiro Atsumi, Kazuya Okamoto, Yoshinori Hirata

    Welding International Vol. 30 No. 12 p. 919-926 2016/08 Research paper (scientific journal)

    Publisher: Taylor and Francis Ltd.
  66. ソフトウェアを考慮した次世代システムLSIの概略設計に関する研究

    寺田識史, 岩田剛治, 佐藤了平, 村田秀則, 河村憲

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 22nd 2016

  67. 製品・製造統合モデルによるパッケージ構造適正化に関する研究

    岩田剛治, 村岡秀則, 渥美幸一郎, 佐藤了平

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 22nd 2016

  68. 3DIC実現に向けたSn/Ag薄膜を用いた超低温低加圧接合に関する研究

    岩田剛治, 成田尚希, 重本拓巳, 米田聖人, 佐藤了平

    スマートプロセス学会総合学術講演会講演概要 Vol. 2016 2016

  69. Cu direct bonding for 3DIC with Sn-Ag thin film

    IWATA YOSHIHARU, NARITA NAOKI, SHIGEMOTO TAKUMI, YONETA KIYOTO, SATOH RYOHEI

    Preprints of the National Meeting of JWS Vol. 2016f No. 99 p. 298-299 2016

    Publisher: JAPAN WELDING SOCIETY
  70. マイクロ接合研究委員会

    福本 信次, 岩田 剛治, 西川 宏, 廣瀬 明夫

    溶接学会誌 Vol. 85 No. 1 p. 137-140 2016

    Publisher: 一般社団法人 溶接学会
  71. Bonding condition design methodology using Sn-Ag thin film for 3DIC

    Yoshiharu Iwata, Naoki Narita, Takumi Shigemoto, Kiyoto Yoneta, Takahiro Yamamoto, Ryohei Satoh

    2016 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP) p. 278-281 2016 Research paper (international conference proceedings)

  72. 次世代3D-LSIにむけたAg-Sn多層薄膜による低温低加圧接合プロセスとその適正化に関する研究

    重本拓巳, 米田聖人, 山本崇裕, 山本崇裕, 佐藤了平, 岩田剛治

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 21st 2015

  73. 2208 Basic study on cooperation method of system model and analysis model using the shape model

    KAWAMURA Ken, KOBAYASHI Syuji, IWATA Yoshiharu, MURATA Hidenori, SATOH Ryohei

    The Proceedings of Design & Systems Conference Vol. 2015.25 p. _2208-1_-_2208-10_ 2015

    Publisher: The Japan Society of Mechanical Engineers
  74. 3102 Proper 3D system LSI design with physical and economical performance evaluation

    MURATA Hidenori, IWATA Yoshiharu, SATOH Ryohei, KAWAMURA Ken, TAYA Atsushi

    The Proceedings of Design & Systems Conference Vol. 2015.25 p. _3102-1_-_3102-8_ 2015

    Publisher: The Japan Society of Mechanical Engineers
  75. 2515 Fundamental Investigation of Hierarchical Optimization Method for Large-scaled System

    TERADA Satoshi, IWATA Yoshiharu, SATOH Ryohei, MURATA Hidenori, KAWAMURA Ken

    The Proceedings of Design & Systems Conference Vol. 2015.25 p. _2515-1_-_2515-9_ 2015

    Publisher: The Japan Society of Mechanical Engineers
  76. Current and Challenges of 3D Jisso

    IWATA Yoshiharu

    Journal of Smart Processing Vol. 4 No. 1 p. 51-54 2015

    Publisher: Smart Processing Society for Materials, Environment & Energy (High Temperature Society of Japan)
  77. Low temperature, low pressure Sn-Ag bonding for next generation LSI

    IWATA YOSHIHARU, SHIGEMOTO TAKUMI, YONETA KIYOTO, YAMAMOTO TAKAHIRO, SATOH RYOHEI

    Preprints of the National Meeting of JWS Vol. 2015f No. 97 p. 72-73 2015

    Publisher: JAPAN WELDING SOCIETY
  78. Practical Optimization Flow using a New System Design Methodology

    Ken Kawamura, Hidenori Murata, Yoshiharu Iwata, Ryohei Satoh, Kazuya Okamoto

    Transactions of The Japan Institute of Electronics Packaging Vol. 8 No. 1 p. 118-126 2015 Research paper (scientific journal)

  79. Proper Design of System LSI Using System Design Method SDSI-Cubic

    Hidenori Murata, Yoshiharu Iwata, Atsushi Taya, Ryohei Satoh, Eiji Morinaga, Kazuya Okamoto, Keiji Kudo, Kazuhiro Aoyama, Tsuyoshi Koga

    Journal of Japan Institute of Electronics Packaging Vol. 17 No. 7 p. 529-541 2014/11 Research paper (scientific journal)

    Publisher: Japan Institute of Electronics Packaging
  80. 三次元LSIのためのAg-Sn系多層薄膜を用いた低温低圧接合プロセスに関する研究

    重本拓巳, 佐藤了平, 岩田剛治, 米田聖人, 金崎亮太

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 20th 2014

  81. 全固体二次電池のシステムデザイン手法に関する研究

    岸田航平, 岩浅達哉, 佐藤了平, 岩田剛治

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 20th 2014

  82. システムの形状と非機能要求のモデル化に関する基礎的検討

    河村憲, 岩田剛治, 村田秀則, 佐藤了平, 坂本武志

    日本機械学会設計工学・システム部門講演会論文集(CD-ROM) Vol. 24th 2014

  83. 1207 Basic study on the modeling of non-functional requirements and the shape of the system

    KAWAMURA Ken, IWATA Yoshiharu, MURATA Hidenori, SATOH Ryohei, SAKAMOTO Takeshi

    The Proceedings of Design & Systems Conference Vol. 2014.24 p. _1207-1_-_1207-8_ 2014

    Publisher: The Japan Society of Mechanical Engineers
  84. Study of Extreme Low Temperature and Load Solid-Phase Sn-Ag System Bonding Mechanism for 3D ICs

    Kiyoto Yoneta, Ryohei Sato, Yoshiharu Iwata, Koichiro Atsumi, Kazuya Okamoto, Yukihiro Satio, Takumi Shigemoto

    2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) p. 2227-2230 2014 Research paper (international conference proceedings)

  85. Study on Ag/Sn multilayer thin film bonding for 3D stacked semiconductor

    Kiyoto Yoneta, Ryohei Satoh, Yoshiharu Iwata, Takumi Shigemoto, Koichiro Atsumi, Kazuya Okamoto, Yoshinori Hirata

    Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society Vol. 32 No. 3 p. 201-206 2014 Research paper (scientific journal)

    Publisher: Japan Welding Society
  86. Research on the Automatic Optimization Algorithm on System Design using the System Definition

    Hidenori Murata, Yoshiharu Iwata, Ryohei Satoh, Eiji Morinaga, Kazuya Okamoto, Kazuhiro Aoyama, Tsuyoshi Koga

    Journal of Smart Processing - for Materials, Environment & Energy - Vol. 3 No. 1 p. 67-75 2014/01 Research paper (scientific journal)

    Publisher: Smart Processing Society for Materials, Environment & Energy (High Temperature Society of Japan)
  87. Flexible control of the microstructure and mechanical properties of friction stir welded Ti-6Al-4V joints

    K. Kitamura, H. Fujii, Y. Iwata, Y. S. Sun, Y. Morisada

    Materials and Design Vol. 46 p. 348-354 2013/04 Research paper (scientific journal)

  88. System Design of Semiconductor Device for 4G Mobile Phone by Using SDSI-Cubic Method

    IWATA Yoshiharu

    Journal of Smart Processing Vol. 2 No. 1 p. 3-11 2013/01/20

    Publisher: Smart Processing Society for Materials, Environment & Energy (High Temperature Society of Japan)
  89. 温度階層を考慮した次世代三次元LSI用液体金属充填方式における適正充填材設計

    金崎亮太, 芝池良衛, 佐藤了平, 岩田剛治

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 19th 2013

  90. 次世代3D-SiP用低温積層接続方式に関する研究

    米田聖人, 佐藤了平, 岩田剛治, 渥美幸一郎, 岡本和也

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 19th 2013

  91. 2209 Research on Modeling Method in consideration of Automatic Execution of the hard soft optimization for Embedded System using SDSI-Cubic

    The Proceedings of Design & Systems Conference Vol. 2013.23 p. _2209-1_-_2209-10_ 2013

    Publisher: The Japan Society of Mechanical Engineers
  92. Study of Low Load and Temperature, High Heat-Resistant Solid-Phase Sn-Ag Bonding with Formation of Ag3Sn Intermetallic Compound Via Nanoscale Thin Film Control for Wafer-Level 3D-Stacking for 3D LSI

    Kiyoto Yoneta, Ryohei Sato, Yoshiharu Iwata, Koichiro Atsumi, Kazuya Okamoto, Yukihiro Sato

    2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) p. 2381-2384 2013 Research paper (international conference proceedings)

  93. A Design Method for Thin Film Patterning Process via Lift-Off Technique

    Eiji Morinaga, Yutaka Matsuura, Hidefumi Wakamatsu, Ryohei Satoh, Koji Nakagawa, Yoshiharu Iwata, Eiji Arai

    Emerging Technology in Precision Engineering XIV Vol. 523-524 p. 787-792 2012/11 Research paper (scientific journal)

  94. Method for Film Thickness Calculation and Resist Profile Design in Thin Film Patterning via Lift-off Process

    Eiji Morinaga, Ryohei Satoh, Koji Nakagawa, Haruhiko Miyagawa, Yutaka Matsuura, Reo Usui, Eiji Arai, Yoshiharu Iwata

    Quarterly Journal of The Japan Welding Society Vol. 30 No. 3 p. 244-253 2012/10 Research paper (scientific journal)

  95. Study on High Heat Proof Multilayer Ag Reflective Films for Optical Devices

    Haruhiko Miyagawa, Ryohei Satoh, Yoshiharu Iwata, Eiji Morinaga, Kiyoto Yoneta, Shingo Kamo, Akihiro Kuroda, Koichi Yokota

    Quarterly Journal of the Japan Welding Society Vol. 30 No. 1 p. 94-99 2012/03 Research paper (scientific journal)

    Publisher: JAPAN WELDING SOCIETY
  96. 次世代3D-SiP用温度階層接続方式に関する研究

    佐藤幸博, 佐藤了平, 岩田剛治, 森永英二, 岡雄一, 米田聖人, 太田敏彦

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 18th 2012

  97. 第一原理計算を用いたSnO2系透明電極の電子状態解析と低抵抗化に関する研究

    米田聖人, 佐藤了平, 岩田剛冶, 礒野貴充, 宮川春彦, 寺田ルリ子

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 18th 2012

  98. 次世代3D-SiP用低温低加圧Sn-Ag系接続方式に関する研究

    米田聖人, 佐藤了平, 岩田剛治, 渥美幸一郎, 岡本和也

    スマートプロセス学会総合学術講演会講演概要 Vol. 2012 2012

  99. 3204 Research on system design technique framework SDSI-Cubic : Automatic construction of system design workflow

    MURATA Hidenori, IWATA Yoshiharu, SATOH Ryohei, MORINAGA Eiji, AOYAMA Kazuhiro, Koga Tsuyoshi

    The Proceedings of Design & Systems Conference Vol. 2012.22 p. _3204-1_-_3204-5_ 2012

    Publisher: The Japan Society of Mechanical Engineers
  100. 3202 Design Process Planning considering Product Function and Physical Structure for calculation of Multi-Domain solution

    NAKANO Takamasa, KOGA Tuyoshi, Iwata Yoshiharu, Aoyama Kazuhiro

    The Proceedings of Design & Systems Conference Vol. 2012.22 p. _3202-1_-_3202-10_ 2012

    Publisher: The Japan Society of Mechanical Engineers
  101. Study of Low Temperature and High Heat-Resistant Fluxless Bonding via Nanoscale Thin Film Control toward Wafer-Level Multiple Chip Stacking for 3D LSI

    Eiji Morinaga, Yuichi Oka, Hiroaki Nishimori, Haruhiko Miyagawa, Ryohei Satoh, Yoshiharu Iwata, Ryota Kanezaki

    2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) p. 14-19 2012 Research paper (international conference proceedings)

  102. Ag系反射膜用高耐熱薄膜保護層に関する研究

    宮川春彦, 佐藤了平, 岩田剛治, 森永英二, 加茂真吾

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 17th 2011

  103. SnO2系透明電極のエピタキシャル成長を利用した低抵抗化に関する研究

    米田聖人, 佐藤了平, 岩田剛治, 礒野貴充, 寺田ルリ子, 宮川春彦

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 17th 2011

  104. 2213 Research on Modeling Method for System Design

    Murata Hidenori, Iwata Yoshiharu, Taya Atsushi, Satoh Ryohei

    The Proceedings of Design & Systems Conference Vol. 2011.21 p. 260-264 2011

    Publisher: The Japan Society of Mechanical Engineers
  105. Study on TSV with New Filling Method and Alloy for Advanced 3D-SiP

    Akihiro Tsukada, Ryohei Sato, Shigenobu Sekine, Ryuji Kimura, Keijiroh Kishi, Yukihiro Sato, Yoshiharu Iwata, Hidenori Murata

    2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) p. 1981-1986 2011 Research paper (international conference proceedings)

  106. リフトオフ法を用いたパターン薄膜形成プロセスの一設計手法

    森永 英二, 松浦 豊, 若松 栄史, 佐藤 了平, 中川 浩司, 岩田 剛治, 荒井 栄司

    精密工学会学術講演会講演論文集 Vol. 2011 p. 59-60 2011

    Publisher: 公益社団法人 精密工学会
  107. High heat proofing nano-layered film Cu Wiring by crystal grain growth control

    Haruhiko Miyagawa, Ryohei Satoh, Yoshiharu Iwata, Eiji Morinaga, Koji Nakagawa

    Transactions of The Japan Institute of Electronics Packaging Vol. 3 No. 1 p. 68-72 2010/12 Research paper (scientific journal)

    Publisher: The Japan Institute of Electronics Packaging
  108. Fluxless bonding of Ni-P/Cu plated Al alloy and Cu alloy with lead-free Sn-Cu foil

    Ikuo Shohji, Shinji Koyama, Itaru Oshiro, Hideaki Nara, Yoshiharu Iwata

    Materials Transactions Vol. 51 No. 10 p. 1753-1758 2010/09 Research paper (scientific journal)

  109. System Design Method for System LSI on Next Generation Mobile Phone

    Iwata Yoshiharu, Yasumura Takanari, Murata Hidenori, Satoh Ryohei

    Preprints of the National Meeting of JWS Vol. 87 No. 87 p. 336-337 2010/08/18

    Publisher: JAPAN WELDING SOCIETY
  110. Study on low temperature and high heat-resistant bonding via nanoscale thin film control toward wafer-level bonding for 3D LSI

    MORINAGA E., OKA Y., MIYAGAWA H., SATOH R., IWATA Y.

    Preprints of the National Meeting of JWS Vol. 87 No. 87 p. 332-333 2010/08/18

    Publisher: JAPAN WELDING SOCIETY
  111. Cathodoluminescence Microcharacterization of Radiative Recombination Centers in Lifetime-Controlled Insulated Gate Bipolar Transistors

    Ryuichi Sugie, Takeshi Mitani, Masanobu Yoshikawa, Yoshiharu Iwata, Ryohei Satoh

    JAPANESE JOURNAL OF APPLIED PHYSICS Vol. 49 No. 4 2010/04 Research paper (scientific journal)

  112. Ni系電鋳金型用適正薄膜構成に関する研究

    塚田晃弘, 加茂真吾, 佐藤了平, 岩田剛治, 太田敏彦, 片野公也

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 16th(CD-ROM) 2010

  113. 次世代3次元LSI用超多点ナノ薄膜制御接続方式に関する研究

    岡雄一, 佐藤了平, 森永英二, 西森宏明, 岩渕寿章, 浅見博, 岩田剛治

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 16th(CD-ROM) 2010

  114. Cu系高耐熱ナノ多層薄膜配線の適正構造に関する研究

    宮川春彦, 佐藤了平, 岩田剛治, 森永英二, 中川浩司

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 16th(CD-ROM) 2010

  115. Study on thermal proof of SnO<inf>2</inf> protection thin film for ultra high reflective film Ag system

    H. Miyagawa, R. Satoh, Y. Iwata, E. Morinaga, S. Kamo

    43rd International Symposium on Microelectronics 2010, IMAPS 2010 p. 458-461 2010 Research paper (international conference proceedings)

  116. 1205 Fundamental Investigation on Multi Layered Multi Objective Optimization Method for System Design

    Iwata Yoshiharu, Yasumura Takanari, Murata Hidenori, Satoh Ryohei

    The Proceedings of Design & Systems Conference Vol. 2010.20 p. _1205-1_-_1205-5_ 2010

    Publisher: The Japan Society of Mechanical Engineers
  117. Basic Study on Micro-Bonding Method with Temperature Hierarchy for 3D-SiP

    Sato Yukihiro, Satoh Ryohei, Iwata Yoshiharu, Miyagawa Haruhiko, Murata Hidenori

    Preprints of the National Meeting of JWS Vol. 2010f No. 87 p. 160-160 2010

    Publisher: JAPAN WELDING SOCIETY
  118. Study on frequency dependency of on-resistance and pulse-loss calculation of MOSFETs for switch mode power supply

    Hideho Yamamura, Ryohei Sato, Yoshiharu Iwata

    IEEJ Transactions on Industry Applications Vol. 130 No. 5 p. 6-631 2010 Research paper (scientific journal)

    Publisher: The Institute of Electrical Engineers of Japan
  119. Method of Process Parameter Identification and Resist Profile Design for Thin-Film Pattern Formation

    Eiji MORINAGA, Yutaka MATSUURA, Ryohei SATOH, Kouji NAKAGAWA, Reo USUI, Yoshiharu IWATA, Hidefumi WAKAMATSU, Eiji ARAI

    Service Robotics and Mechatronics Vol. 323--328 p. 323-+ 2009/12 Research paper (scientific journal)

  120. 携帯電話用システムLSIの適正構成に関するシステムデザイン手法の基礎的検討—Basic study on system design method for proper system LSI packaging in mobile phone—次世代電子機器における先端実装技術と環境調和型実装技術論文特集

    岩田 剛治, 多屋 淳志, 佐藤 了平

    電子情報通信学会論文誌. C, エレクトロニクス = The IEICE transactions on electronics. C / 電子情報通信学会 編 Vol. 92 No. 11 p. 688-694 2009/11

    Publisher: 一般社団法人電子情報通信学会
  121. Design Solution Improvement for Electrical-Thermal Collaaborated Design by Using Multi-Agenet Theory - Outline Layout Design Automation by Collaboration between Thermal Layout and Circuit Layout -

    Yoshiharu Iwata, Shintaro Hayashi, Ryohei Satoh, Kozo Fujimoto

    Vol. Vol. J92-C No. 11 pp. 695-702 No. 11 p. 695-702 2009/11 Research paper (scientific journal)

    Publisher:
  122. Basic Study on System Design Method for Proper System LSI Pakcaging in Mobile Phone

    Yoshiharu Iwata, Atsushi Taya, Ryohei Satoh, Kazuya Okamoto, Keiji Kudo

    The IEICE transactions on electronics C Vol. Vol.J92-C No.11 pp.688-694 No. 11 p. 688-694 2009/11 Research paper (scientific journal)

    Publisher: The Institute of Electronics, Information and Communication Engineers
  123. A high-throughput and fine patterning process for SnO2-Based thin films using YAG Laser

    Reo Usui, Ryohei Satoh, Yu Mihara, Yoshiharu Iwata, Eiji Morinaga, Takamitsu Isono

    Journal of Japan Institute of Electronics Packaging Vol. 12 No. 4 p. 313-319 2009/07 Research paper (scientific journal)

    Publisher: The Japan Institute of Electronics Packaging
  124. YAGレーザを用いたSnO2系導電薄膜の高速加工とその加工メカニズムに関する研究

    臼井玲大, 佐藤了平, 岩田剛治, 森永英二, 寺田ルリ子, 三原雄, 礒野貴充, 杉江隆一

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 15th 2009

  125. 結晶粒成長制御によるCu系高耐熱ナノ多層薄膜配線形成に関する研究

    宮川春彦, 佐藤了平, 岩田剛治, 森永英二, 中川浩司

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 15th 2009

  126. 3D-SiPの適正構成予測手法に関する研究

    多屋淳志, 岩田剛治, 佐藤了平, 森永英二, 村田秀則, 岡本和也, 工藤啓治

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 15th 2009

  127. ものづくりデジタルデザインの現状と新SD・SI手法開発状況及び今後の展開-次世代システムLSIのシステムデザインでの例-

    岩田剛治

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 15th 2009

  128. 2123 Fundamental Study of System Design Method at Next Generation Semi-Conductor Device

    Taya Atsushi, Iwata Yoshiharu, Satoh Ryohei, Morinaga Eiji, Murata Hidenori, Okamoto Kazuya, Kudo Keiji

    The Proceedings of Design & Systems Conference Vol. 2009.19 p. 328-333 2009

    Publisher: The Japan Society of Mechanical Engineers
  129. Research on a Method to Derive an Ideal 3DSiP

    Atsushi Taya, Yoshiharu Iwata, Ryohei Satoh, Hidenori Murata, Eiji Morinaga, Keiji Kudo, Kazuya Okamoto

    2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4 p. 2075-+ 2009 Research paper (international conference proceedings)

  130. Mechanism and rapid process of YAG laser process on SnO 2 system thin films

    Reo USUI, Ryohei SATOH, Yu MIHARA, Yoshiharu IWATA, Eiji MORINAGA, Takamitsu ISONO

    QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY Vol. 27 No. 1 p. 48-54 2009/01 Research paper (scientific journal)

    Publisher: 溶接学会
  131. 携帯電話用システムLSIの適正構成に関するシステムデザイン手法の基礎的検討

    岩田剛治, 多屋淳志, 佐藤了平, 岡本和也, 工藤啓治

    電子情報通信学会論文誌 C Vol. Vol.J92-C No.11 pp.688-694 No. 11 2009

  132. Genetic diversity and relationship analysis of peanut germplasm using SSR markers

    Yoshiki Naito, Shigeru Suzuki, Yoshiharu Iwata, Tsutomu Kuboyama

    BREEDING SCIENCE Vol. 58 No. 3 p. 293-300 2008/09 Research paper (scientific journal)

  133. 次世代携帯電話のThermal Management手法に関する研究

    並河愛子, 佐藤了平, 岩田剛治, 多屋淳志

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 14th 2008

  134. 結晶性向上によるSnO2系透明薄膜電極の低抵抗化

    三原雄, 佐藤了平, 臼井玲大, 岩田剛治, 森永英二, 礒野貴充

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 14th 2008

  135. 次世代ディスプレイ用高耐熱ナノ多層薄膜配線形成に関する研究

    宮川春彦, 佐藤了平, 岩田剛治, 森永英二, 中川浩司

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 14th 2008

  136. YAGレーザによるSnO2系薄膜微細加工技術に関する研究

    臼井玲大, 佐藤了平, 三原雄, 岩田剛治, 森永英二

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 14th 2008

  137. 多層薄膜を用いた低温超微細接合のための基礎研究

    西森宏明, 佐藤了平, 森永英二, 岩田剛治

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 14th 2008

  138. リフトオフ法による薄膜パターン形成に向けた膜厚分布計算手法に関する研究

    森永英二, 佐藤了平, 中川浩司, 岩田剛治, 荒井栄司, 松浦豊, 臼井玲大

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 14th 2008

  139. 111 Thermal-Circuit Collaboration Layout Design Method for Electronics Device

    Iwata Yoshiharu

    The Proceedings of Conference of Kansai Branch Vol. 2008.83 2008

    Publisher: The Japan Society of Mechanical Engineers
  140. Mechanism and advanced application of rapid laser processing on SnO2 thin films for FPD manufacture

    Reo Usui, Yu Mihara, Eiji Morinaga, Yoshiharu Iwata, Ryohei Satoh

    2008 SID INTERNATIONAL SYMPOSIUM, DIGEST OF TECHNICAL PAPERS, VOL XXXIX, BOOKS I-III Vol. 39 No. 1 p. 740-+ 2008 Research paper (international conference proceedings)

  141. Development of Ag alloy thin film with both high reflectance and adhesion for high density opt-electronic module

    Akihiro Kuroda, Ryohei Satoh, Yoshiharu Iwata, Koichi Yokota, Kozo Fujimoto, Shogo Ura, Kenji Kintaka

    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES Vol. 30 No. 2 p. 302-308 2007/06 Research paper (scientific journal)

  142. エッチングレス方式による次世代ディスプレイ用ナノ多層薄膜パターン形成方法に関する研究

    森永英二, 佐藤了平, 中川浩司, 宮川春彦, 岩田剛治

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 13th 2007

  143. 多層構造を持つ電子システムのためのモジュール型高速熱解析手法

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    Symposium on Microjoining and Assembly Technology in Electronics Vol. 13th 2007

  144. 環境にやさしい次世代ディスプレイ用配線構成に関する研究

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    Symposium on Microjoining and Assembly Technology in Electronics Vol. 13th 2007

  145. レーザを用いたドライプロセスによる薄膜微細加工技術による研究

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    Symposium on Microjoining and Assembly Technology in Electronics Vol. 13th 2007

  146. ディスプレイ用低抵抗SnO2薄膜形成に関する研究

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    Symposium on Microjoining and Assembly Technology in Electronics Vol. 13th 2007

  147. Ta-doped SnO2 thin films for PDP

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  148. Research on next-generation manufacturing method of plasma display panels via lift-off process

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    2007 SID INTERNATIONAL SYMPOSIUM, DIGEST OF TECHNICAL PAPERS, VOL XXXVIII, BOOKS I AND II Vol. 38 No. 1 p. 1705-+ 2007 Research paper (international conference proceedings)

  149. Advanced application of direct laser process on SnO2 thin films for FPDs

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  150. Research on YAG Laser process on SnO_2-system thin films for PDFs

    USUI Reo, NAKAGAWA Koji, SATOH Ryohei, IWATA Yoshiharu, MORINAGA Eiji, TAKAKI Satoru, ISONO Takamitsu, MIHARA Yuu

    Preprints of the National Meeting of JWS Vol. 79 No. 79 p. 290-291 2006/09/01

    Publisher: JAPAN WELDING SOCIETY
  151. An efficient thermal design method based on noundary condition modeling

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    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES Vol. 29 No. 3 p. 594-603 2006/09 Research paper (scientific journal)

  152. Development of Au Reflection Film with High Adhesion for High Density Optical Interconnection between LSI Chips

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    The Proceedings of Design & Systems Conference Vol. 2006.16 p. 154-157 2006

    Publisher: The Japan Society of Mechanical Engineers
  154. High-Speed Outline Thermal Analysis Method on Modularized Model : Outline Layout Design Automation by Collaboration between Thermal Layout and Circuit Layout

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    Publisher: The Institute of Electronics, Information and Communication Engineers
  155. Collaborated Design between Thermal Design and Circuit Design Based on Boundary Conditions between Modules : Outline Layout Design Automation by Collaboration between Thermal Layout and Circuit Layout

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    Publisher: The Institute of Electronics, Information and Communication Engineers
  156. Study on Thermal Durability of Ag Reflection Thin Film for Next Generation Opt-Electronic System

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  158. 2004 Trend of Welding & Joining in Japan2004 Review of Welding in Japan -Micor Joining-

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    Publisher: 溶接学会
  159. C-6-13 Thermal-Circuit Collaboration Layout Design Method for Electronics System

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    Publisher: The Institute of Electronics, Information and Communication Engineers
  160. 3107 Seamless High Accuracy Analysis Method to FOA for adapting the FOA Results

    Iwata Yoshiharu, Hayashi Shintaro, Satoh Ryohei, Fujimoto Kozo

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    Publisher: The Japan Society of Mechanical Engineers
  161. First Order Deign by Integration of Analysis and Optimization Method (1st Report, First Order Analysis by Focusing to the Boundary Conditions at Dividing the Module)

    IWATA Yoshiharu, HAYASHI Shintaro, YAMAMOTO Shuhei, SATOH Ryohei, FUJIMOTO Kozo

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  162. 2304 Evaluation Method of Measures in Feedback Design

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    The Proceedings of Design & Systems Conference Vol. 2005.15 p. 328-331 2005

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  163. 技術経営における最適化手法を用いた新事業性評価システムに関する研究(<ホットイシュー>科学技術システムからリサーチ・イノベーション・システムへ(1))

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    年次学術大会講演要旨集 Vol. 19 p. 610-613 2004/10/15

    Publisher: 研究・技術計画学会
  164. First Order Design by Fusion of Analysis and Optimum Method at Thermal Layout Design of Electronics System

    Iwata Yoshiharu, Hayashi Shintaro, Satoh Ryohei, Fujimoto Kozo

    The Proceedings of Design & Systems Conference Vol. 2004.14 p. 63-66 2004

    Publisher: The Japan Society of Mechanical Engineers
  165. マイクロ接合

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    溶接学会誌 = Journal of the Japan Welding Society Vol. 72 No. 5 p. 377-379 2003/07/05

    Publisher: 社団法人溶接学会
  166. 2004 Trend of Welding in Japan

    Yoshiharu Iwata, Yoshiharu Kariya

    Jouranl of the japan welding society 2003/07

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  167. カテゴリー間距離を考慮したニューラルネットワークによる品質検査

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    Symposium on Microjoining and Assembly Technology in Electronics Vol. 8th 2002

  168. マクロ/ミクロ統合位置決めシステム構築のための基礎的検討

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  169. Study of Formation Mechanism of Wetting Front Structure of Solder

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  171. Detecting 3-D position of micro defect used by infrared thermal imaging with laser irradiation.

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    Symposium on Microjoining and Assembly Technology in Electronics Vol. 6th 2000

  172. Detecting Defect on TAB Joints by Infrared Thermal Imaging with Laser Irradiation

    イワタ ヨシハル, ナカジマ ダイ, フジモト コウゾウ

    QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY Vol. 16 No. 3 p. 332-339 1998/08 Research paper (scientific journal)

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  173. WELNETメーリングリストのシステム変更のお知らせ

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  174. WELNET-MLにおける最近の話題とMLにおけるFAQ119

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  175. Detection Algorithm of Interface Including Defect on Multi Joint Interface in Intelligent Detection System of Micro Defect.

    岩田剛治, 山本哲也, 仲田周次

    Symposium on Microjoining and Assembly Technology in Electronics Vol. 1st 1995

  176. Identification Algorithm of the Defect Size and Position in Intelligent Detection System of Micro Defect.

    山本哲也, 岩田剛治, 仲田周次

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  177. Detection Process on the Degree of Fillet Formation at Heel in the Soldered Joint of Gull Wing Type -Detection Process on the Defect in the Micro Joints by Infrated Thermal Imaging with Laser Irradiation (3rd report)-

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    Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society Vol. 12 No. 3 p. 451-456 1994/08 Research paper (scientific journal)

    Publisher: (社)溶接学会
  178. Optimal Detection Condition and Minimum Defect Size for Detection by Computer Simulation -Detection Process on the Defect in the Micro Joints by Infrared Thermal Imaging with Laser Irradiation(2nd report)-

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  179. Possibility on the Detection of the Defects in Micro Joints -Detection Process on the Defect in the Micro Joints by Infrared Thermal Imaging with Laser Iradiation(1st report)-

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  180. Inspection Process on the Micro Joints by Infrared Thermal Imaging with Laser Irradiation. (3rd Report). Influence of Fillet Formation on the Surface Temperature Distribution at the Lead of Gull Wing Type.

    岩田剛治, 仲田周次

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  181. Inspecting Process and it’s Application on the Micro defect of Joints by Infrared Thermal Imaging with Laser Irradiation.

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    マイクロエレクトロニクスシンポジウム論文集 Vol. 5th 1993

  182. Parameter Extraction of Second Degree Curve from \theta-\rho Hough Plane

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  45. マルチチップパッケージの熱・回路協調概略自動レイアウト設計手法

    Proceedings of 11th Symposium on Micro-joining and Assembly Technology in Electronics, Vol.11, pp.457-460 Vol. Vol.11, pp.457-460/, 2005

  46. プロセスイノベーションを含む事業性評価法に関 する研究 -技術経営における新事業性評価システムに関する研究(第2報)-

    Proceedings of 11th Symposium on Micro-joining and Assembly Technology in Electronics, Vol.11, pp.445-450 Vol. Vol.11, pp.445-450/, 2005

  47. Basic Study of Proper Circuit Line Structure for Advanced System in Package

    安田尚平, 岩田剛治, 佐藤了平

    電子情報通信学会技術研究報告 Vol. Vol.11, pp.451-456/, No. 267(ICD2005 95-105) 2005

  48. Outline design method with accuracy mixed analysis itechnique for electronics device layout

    Y Iwata, S Hyashi, R Satoh, K Fujimoto

    APPLICATIONS OF DIGITAL TECHNIQUES IN INDUSTRIAL DESIGN ENGINEERING-CAID&CD&apos; 2005 Vol. p.258-263 p. 258-263 2005

  49. Circuit-thermal collaboration design method for outline design stage of mobile terminal

    Yoshiharu Iwata, Shintaro Hayashi, Ryohei Satoh, Kozo Fujimoto

    ADVANCES IN ELECTRONIC PACKAGING 2005, PTS A-C Vol. CD p. 225-231 2005

  50. Research on direct laser patterning of thin films for flat-panel display

    Proc. of the 24th International Conference on Applications of Lasers & Electro-Optics Vol. pp. 13-19 2005

  51. Development of high-Speed Thermal Management Method for Electronic Package with Heat Spreader

    Proceedings of 2005 International Conference on Electronics Packaging Vol. p.295-300 2005

  52. A minimum specification of air-cooling with layout design by efficient optimization scheme for outline design stage

    Y Iwata, S Hyashi, R Satoh, K Fujimoto

    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems Vol. p.384-389 p. 384-389 2005

  53. Fusion of Analysis and Optimum method at Thermal Layout Design of Electronics System

    Yoshiharu IWATA, Shintaro HAYASHI, Ryohei Satoh, Kozo Fujimoto

    OPTIS2004, pp.239-244 Vol. 2004 No. 6 p. 239-244 2004/12

    Publisher: 機械学会
  54. A High-Speed Algorithm for Thermal Layout Design with Novel Thermal Management Method

    Shintaro HAYASHI, Yoshiharu IWATA, Ryohei Satoh, Kozo Fujimoto

    7th VLSI Packaging Workshop of Japan Technical Digest 2004/11

    Publisher: IEEE
  55. A Preface (Technical Information : Special Issue for Young Members)

    MORI Hiroaki, IWATA Yoshiharu

    Journal of the Japan Welding Society Vol. 73 No. 3 p. 146-146 2004/04/05

    Publisher: Japan Welding Society
  56. Selection of Tutorial Data Under Consideration of Distance between Elements in Carrying Out Visual Inspection by Neural Network

    Naoki Moriya, Kunio Ota, Naoki Misonou, Yoshiharu Iwata, Kozo Fujimoto

    10th Symposium on Microjoining and Assembly Technology in Electronics,2004, Vol.10, pp.449-454 Vol. Vol.10, pp.449-454/, 2004/02

    Publisher: (社)溶接学会
  57. Modularized Thermal Design Method for High Speed Circuit Layout

    Shintaro Hayashi, Yoshiharu Iwata, Shuhei Yamamoto, Kozo Fujimoto, Ryohei Satoh

    10th Symposium on Microjoining and Assembly Technology in Electronics,2004, Vol.10, pp.443-448 Vol. Vo.10, pp.443-448/, 2004/02

    Publisher: (社)溶接学会
  58. Evaluation System of Business Possibility for Next Generation LCD TV by Optimization Method

    Munehiko Sugitani, Ryohei Satoh, Yoshiharu Iwata

    10th Symposium on Microjoining and Assembly Technology in Electronics,2004, Vol.10, pp.437-442 Vol. Vol.10, pp.437-442/, 2004/02

    Publisher: (社)溶接学会
  59. Development of Ag Alloy Thin Film with Both High Reflectance and Adhesion for High Density Opto-Electronic Module

    Akihiro Kuroda, Ryohei Satoh, Yoshiharu Iwata, Koichi Yokota, Kozo Fujimoto, Shogo Ura, Kenji Kintaka

    10th Symposium on Microjoining and Assembly Technology in Electronics,2004, Vol.10, pp.369-374 Vol. Vol.10, pp.369-374/, 2004/02

    Publisher: (社)溶接学会
  60. 電子システムの熱レイアウト設計における解析手法と最適化手法の融合

    第6回最適化シンポジウム講演論文集, pp.239-244 Vol. pp.239-244 2004

  61. A High-Speed Algorithm for Thermal Layout Design with Novel Thermal Management Method

    7th VLSI Packaging Workshop of Japan Technical Digest 2004

  62. Development of Au Reflection Film with High Adhesion for Optical Interconnection between LSI Chips

    Koichi YOKOTA, Ryohei SATOH, Yoshiharu IWATA, Kozo FUJIMOTO, Shogo URA, Kenji KINTAKA

    2003 Proceedings 36th International Symposium on Microelectronics, pp.756-761 Vol. 5288 p. 756-761 2003/11

  63. Outline Design Assist Method for Electronics System Thermal Layout by Using Modularized Thermal Simulator

    Yoshiharu IWATA, Shintaro HAYASHI, Shuhei YAMAMOTO, Ryohei SATO, Kozo FUJIMOTO

    Proceedings of 2003 International Conference on Electronics Packaging, pp.238-243 Vol. 238-243 2003/04

    Publisher: (社)エレクトロニクス実装学会
  64. Design Assistance Method of Outline Thermal Layout Design by Modularized Design Method

    Iwata Yoshiharu, Yamamoto Shuhei, Hayashi Shintarou, Satoh Ryohei, Fujimoto Kozo

    Proceedings of the IEICE General Conference Vol. 2003 No. 2 p. 15-15 2003/03/03

    Publisher: The Institute of Electronics, Information and Communication Engineers
  65. Development of Au Alloy Thin Film with both high reflectance and Adhesion for High Density Opto-Electronic Module

    Koichi Yokota, Ryohei Satoh, Yoshiharu Iwata, Kozo Fujimoto, Shogo Ura, Kenji Kintaka

    9th Symposium on Microjoining and Assembly Technology in Electronics, Vol.9, pp.476-472 Vol. 9th p. 467-472 2003/02

    Publisher: (社)溶接学会
  66. Modularized Outline Circuit Simulation and Design Assist for High Speed System

    Yoshiharu IWATA, Shintaro HAYASHI, Takanori AKETA, Kozo FUJIMOTO, Ryohei SATOH

    9th Symposium on Microjoining and Assembly Technology in Electronics, Vol.9, pp.421-426 Vol. 421-426 2003/02

    Publisher: (社)溶接学会
  67. Thermal Design Assist Method for Outline Board Layout Design by Modularized Thermal Analysis Method

    Shuhei YAMAMOTO, Yoshiharu IWATA, Shintaro HAYASHI, Kozo FUJIMOTO, Ryohei SATOH

    9th Symposium on Microjoining and Assembly Technology in Electronics, Vol.9, pp.415-420 Vol. 415-420 2003/02

    Publisher: (社)溶接学会
  68. Outline Board Layout Design Concept by Collaboration between Thermal and Circuit Design

    Yoshiharu IWATA, Shuhei YAMAMOTO, Junji TANAKA, Shintaro HAYASHI, Kozo FUJIMOTO, Ryohei SATOH

    9th Symposium on Microjoining and Assembly Technology in Electronics, Vol.9, pp.409-414 Vol. 409-414 2003/02

    Publisher: (社)溶接学会
  69. Development of Au reflection film with high adhesion for optical interconnection between LSI chips

    K Yokota, R Satoh, Y Iwata, K Fujimoto, S Ura, K Kintaka

    2003 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS Vol. 5288 p. 756-761 2003

  70. モジュール型概略回路解析・設計支援手法の構築

    第9回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム Vol. pp.421-426 2003

  71. モジュール型基板レイアウト概略熱設計支援手法の構築

    第9回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム Vol. 415-420 2003

  72. 熱設計・回路設計協調による概略レイアウト設計手法の基礎的検討

    第9回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム Vol. pp.409-414 2003

  73. 高密度回路実装における光伝送用Au系反射薄膜の開発

    第9回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム Vol. pp.476-472 2003

  74. Development of Au reflection film with high adhesion for optical interconnection between LSI chips

    K Yokota, R Satoh, Y Iwata, K Fujimoto, S Ura, K Kintaka

    2003 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS Vol. 5288 p. 756-761 2003

  75. Development of Au reflection film with high adhesion for optical interconnection between LSI chips

    K Yokota, R Satoh, Y Iwata, K Fujimoto, S Ura, K Kintaka

    2003 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS Vol. 5288 p. 756-761 2003

  76. Development of Au system thin film with both high reflection coefficient and adhesion on high-density circuit

    Proceedings of 9th Symposium on Micro-joining and Assembly Technology in Electronics Vol. 466-472 2003

  77. Conceptual Simulator for Thermal Design of High Density Electronics System

    Yoshiharu IWATA, Shuhei YAMAMOTO, Shintaro HAYASHI, Kozo FUJIMOTO

    The sixth VLSI Packaging Workshop of Japan Technical Digest, pp.179-182 Vol. pp.179-182 2002/11

    Publisher: IEEE CPMT
  78. PBC Thermal Conceptual Simulator Considering Thermal Effects of Circuit

    Iwata Yoshiharu, Yamamoto Shuhei, Hayashi Shintarou, Fujimoto Kozo

    Proceedings of the Society Conference of IEICE Vol. 2002 No. 2 p. 19-19 2002/08/20

    Publisher: The Institute of Electronics, Information and Communication Engineers
  79. Design Support for PCB Thermal Layout Using Conceptual Thermal Simulator

    Iwata Yoshiharu, Hayashi Shintarou, Yamamoto Shuhei, Fujimoto Kozo

    Pre-Prints of the National Meeting of JWS Vol. 70 No. 70 p. 136-137 2002/03/24

    Publisher: Japan Welding Society
  80. Conceptual Thermal Design System for PCB Collaboration Design Between Thermal and Electrical

    Iwata Yoshiharu, Hayashi Shintarou, Yamamoto Shuhei, Fujimoto Kozo

    Proceedings of the IEICE General Conference Vol. 2002 p. 45-45 2002/03/07

    Publisher: The Institute of Electronics, Information and Communication Engineers
  81. Collaboration Method Between Thermal and Electrical Design for PCB Layout Design

    Iwata Yoshiharu, Tanaka Junji, Yamamoto Syuhei, Fujimoto kozo

    Pre-Prints of the National Meeting of JWS Vol. 69 No. 69 p. 242-243 2001/09/10

    Publisher: Japan Welding Society
  82. Collaboration Method of Modulized Thermal Design for PCB Layout Design

    Iwata Yoshiharu, Yamamoto Syuhei, Tanaka Junji, Fujimoto kozo

    Pre-Prints of the National Meeting of JWS Vol. 69 No. 69 p. 244-245 2001/09/10

    Publisher: Japan Welding Society
  83. Collaboration Method Between Thermal and Electrical Design for PWB Layout Design

    Iwata Yoshiharu, Tanaka Junji, Yamamoto Shuhei, Fujimoto Kozo

    Proceedings of the Society Conference of IEICE Vol. 2001 p. 32-32 2001/08/29

    Publisher: The Institute of Electronics, Information and Communication Engineers
  84. 広がり試験におけるソルダのぬれ拡がり先端部の生成メカニズムに関する検討

    イワタ ヨシハル, フジモト コウゾウ

    マイクロエレクトロニクスシンポジウム論文集 Vol. 9th No. 9 p. 181-184 1999/10/29

    Publisher: エレクトロニクス実装学会
  85. 広がり試験によるSn-Pbソルダの広がり現象の観察と,ぬれ先端構造

    イワタ ヨシハル, フジモト コウゾウ

    マイクロエレクトロニクスシンポジウム論文集 Vol. 9th No. 9 p. 173-176 1999/10/29

    Publisher: エレクトロニクス実装学会
  86. Investigation of Insulator Coating Process in Ultramicroelectrode Fabrication for Micro Characterization

    IWATA Yoshiharu, FURUKUBO Eiichi, FUJIMOTO Kozo, NAKATA Shuji

    Pre-Prints of the National Meeting of JWS Vol. 60 No. 60 p. 118-119 1997/03/15

    Publisher: Japan Welding Society
  87. 3.2 PC98,DOS/V でインターネットメールを出す方法(3. 若手リレー編集 : コンピュータ・ネットワークの利用, 実践編)

    岩田 剛治

    溶接学会誌 Vol. 65 No. 3 p. 250-251 1996/04/05

    Publisher: 社団法人溶接学会
  88. Influence of Fillet Formation on the Surface Temperature Distribution at the Lead of Gull Wing Type : Inspection Process on the Micro Joints bu Infrared Thermal Imaging with Laser Irradiation, (3rd report)

    IWATA Yoshiharu, NAKATA Shuji

    Pre-Prints of the National Meeting of JWS No. 53 p. 204-205 1993/08/31

    Publisher: Japan Welding Society
  89. Posibility of Detection Process on the Defect at the Solder Joints of Chip Cpmponent by Infrared Thermal Imaging with Laser Irradiation

    IWATA Yoshiharu, YAMADA Tomoo, NAKATA Shuji

    Pre-Prints of the National Meeting of JWS No. 53 p. 202-203 1993/08/31

    Publisher: Japan Welding Society
  90. Possibility of Detecting the Micro-defects at TAB Bonds by Infrared Thermal Imaging Process

    Nakata Shuji, Iwata Yoshiharu, Nakajima Dai

    Pre-Prints of the National Meeting of JWS No. 51 p. 196-197 1992/09/01

    Publisher: Japan Welding Society
  91. Fundamental Investigation on Detecting the Micro-Defects in Microsoldering Joint : Inspection Process on the Micro Joints by Infrared Thermal Imaging with Laser Irradiation (1st. report)

    NAKATA Syuji, IJYUIN Masahito, IWATA Yoshiharu

    Pre-Prints of the National Meeting of JWS No. 51 p. 192-193 1992/09/01

    Publisher: Japan Welding Society
  92. On the Micro Defect Size Capable For Detecting in Micro Bonding Joints. : Inspection Process on the Micro Joints by Infrared Thermal Imaging with Laser Irradiation. (2nd report)

    Nakata Shuji, Iwata Yoshiharu

    Pre-Prints of the National Meeting of JWS No. 51 p. 194-195 1992/09/01

    Publisher: Japan Welding Society

Publications 2

  1. マイクロ接合・実装技術

    マイクロ接合, 実装技術編集委員会

    産業技術サービスセンター 2012/07 Scholarly book

    ISBN: 9784915957888

  2. Design Structure Matrix Methods and Applications

    Steven D.Eppinger, etc

    THE MIT PRESS 2012/05 Scholarly book

Presentations 151

  1. A method for determining additional training data in sequential approximate multi- objective optimization

    Tomoki TAKAO, Yoshiharu IWATA, Hidefumi WAKAMATSU, Masato TAKI, Shingo IWASAKI, Takashi YOSHIYA, Yoshihiko KANDA

    OPTIS2024 2024/10/26

  2. 逐次近似最適化による少量学習データでの多目的最適化手法

    高尾 知樹, 岩田 剛治, 若松 栄史, 滝 雅人, 岩崎 真悟, 吉谷 崇志

    日本機械学会 第34回設計工学・システム部門講演会 2024/09/20

  3. Fundamental Considerations for System Design Framework

    Ryosuke Nakano, Yoshiharu Iwata, Hidefumi Wakamatsu

    2024/09/19

  4. Construction of surrogate models of 3D Finite Element Method by Generalization of Integration Neural Networks

    Yoshiharu IWATA, Tomoki TAKAO, Hidefumi WAKAMATSU

    34th Micro Eelectronics Symposium 2024 2024/09/13

  5. Design Optimization and Visualization of the Scope of Influence on Requirement Changes Using Systems Modeling Language

    Ryosuke Nakano, Yoshiharu Iwata, Hidefumi Wakamatsu

    2024 International Symposium on Flexible Automation 2024/07/23

  6. Dynamic Behavior Analysis of Yarns During Knitting Process of Fabrics

    Kazuki Hayano, Hidefumi Wakamatsu, Yoshiharu Iwata, Yuya Yamada

    2024 International Symposium on Flexible Automation 2024/07/23

  7. Deformed Shape Prediction of Knitted Fabrics at the Stitch Level Based on Deep Learning

    Hidefumi Wakamatsu, Hikaru Nara, Yoshiharu Iwata

    2024 International Symposium on Flexible Automation 2024/07/23

  8. Power Device Structure Optimization by Sequential Approximation Optimization Method

    Tomoki Takao, Yoshiharu Iwata, Hidefumi Wakamatsu

    International Conference on Electronic Packaging 2024 2024/04/18

  9. Qualitative Analysis and Exploration of a Novel Mechanism: Twisted String and Spiral Hose Mechanism

    Zeyu Long, Hidefumi Wakamatsu, Yoshiharu Iwata

    2024 IEEE 7th International Conference on Soft Robotics 2024/04

  10. モーターコイル製造のための銅線の動的挙動解析

    廣澤 太一, 若松 栄史, 岩田 剛治

    生産システム部門研究発表講演会 2024 2024/03/05

  11. SysML を用いた設計の最適化と要求変更 に対する影響範囲の可視化

    中野 涼介, 岩田 剛治, 若松 栄史

    生産システム部門研究発表講演会 2024 2024/03/04

  12. マルチフィデリティ・マルチスケール手法を用い たニット着装シミュレータ―非接触部を持つモ デルへの拡張―

    北野 勇吹, 岩田 剛治, 若松 栄史

    生産システム部門研究発表講演会 2024 2024/03/04

  13. Remote Shape Prediction of Submarine Cables Using Fiber-Optic Distributed Sensors

    Zeyu Long, Hidefumi Wakamatsu, Yoshiharu Iwata

    Proceedings of The 2024 IEEE/SICE International Symposium on System Integration 2024/01/09

  14. Simplifying Hyperparameter Derivation for Integration Neural Networks Using Information Criterion

    Yoshiharu IWATA, Hidefumi WAKAMATSU

    Proceedings of The 2024 IEEE/SICE International Symposium on System Integration 2024/01/09

  15. Novel Biomimetic Mechanism Inspired by Snake: Twisted String and Spiral Hose Mechanism

    Zeyu Long, Hidefumi Wakamatsu, Yoshiharu Iwata

    IEEE International Conference on Robotics and Biomimetics 2023/12

  16. A New Mechanism for Soft Robot: Twisted String and Spiral Hose Mechanism

    2023/09/13

  17. Modeling of Stitches with Two Ply Yarn

    Hidefumi Wakamatsu, Yoshiharu Iwata, Yuya Yamada

    50 th Textile Research Symposium 2023/09/07

  18. インテグレーションニューラルネットワーク近似器の適正学習率の効果

    岩田剛治, 若松栄史

    第33回マイクロエレクトロニクスシンポジウム 2023/09/07

  19. Deformation Simulation of Knitted Fabric at the Stitch Level Using Machine Learning

    Hikaru Nara, Hidefumi Wakamatsu, Yoshiharu Iwata

    50 th Textile Research Symposium 2023/09/07

  20. インテグレーションニューラルネットワーク近似器の線形近似器部と非線形近似器部の分担率の適正化効果に関する考察

    岩田剛治, 若松栄史

    日本機械学会 2023年度 年次大会 2023/09/05

  21. Investigation on Verification of the Integration Neural Networks Theory by Weight Analysis Based on Weierstrass' Approximation Theorem

    Yoshiharu Iwata, Hidefumi Wakamatsu

    International Conference on Design and Concurrent Engineering 2023 & Manufacturing Systems Conference 2023/09/02

  22. 『有限要素法シミュレーションの 近似器構築における演繹的・帰納的知識融合

    岩田剛治

    溶接学会 第142回マイクロ接合研究委員会 2023/07/05

  23. Fundamental Study on Hierarchical Multi-Objective Optimization Method

    YOSHIHARU IWATA, SATOSHI TERADA, TAKUMI TOMOMOTO, RYOUHEI SATOH

    International Conference on Design and Concurrent Engineering 2021 & Manufacturing Systems Conference 2021 2021/09/04

  24. シミュレーションと機械学習の組み合 わせによる高速近似解析手法構築の能 動学習を用いた効率化に関する研究

    峯田 龍志, 岩田剛, 治, 若松 栄史, 松本 侑哉, 川村 俊貴

    生産システム部門研究発表講演会 2021 2021/03/09

  25. 機械学習を用いた高速近似解析手法構築における能動学習による効率化に関する研究

    峯田龍志, 岩田剛治, 若松栄史, 川村俊貴

    第27回「エレクトロニクスにおけるマイクロ接合・実装技術」シンポジウム 2021/02/02

  26. A modification method in the design process of a developable surface

    吉田皓太郎, 若松栄史, 岩田剛治

    システム制御情報学会研究発表講演会講演論文集(CD-ROM) 2021

  27. Efficiency of Fast Approximation Analysis by Simulation and Machine Learning Using Active Learning

    峯田龍志, 岩田剛治, 若松栄史, 松本侑哉, 川村俊貴

    日本機械学会生産システム部門研究発表講演会講演論文集(CD-ROM) 2021

  28. A method to optimize the shape of the brassiere cup at the detailed design stage

    百崎敬晴, 吉田皓太郎, 若松栄史, 岩田剛治

    日本繊維機械学会年次大会研究発表論文集・講演要旨集 2021

  29. Shape prediction of braided structure for strength analysis of tubular CFRP

    若松栄史, 成田周平, 岩田剛治

    日本繊維機械学会年次大会研究発表論文集・講演要旨集 2021

  30. 機械学習を用いた高速近似解析手法構築における能動学習による効率化に関する研究

    峯田 龍志, 岩田 剛治, 若松 栄史, 松本 侑哉, 川村 俊貴

    日本機械学会 第30回設計工学・システム部門講演会 2020/11/27

  31. 製品の特長予測における不良因果情報併用による不良因果グループ抽出手法

    岩田 剛治, 植田 俊太, 峯田 龍志

    生産システム部門研究発表講演会2020 2020/03/26

  32. 機械学習による製品特徴抽出の因果情報抽出による高精度化

    植田俊太, 峯田龍志, 岩田剛治

    第26回「エレクトロニクスにおけるマイクロ接合・実装技術」シンポジウム 2020/01/29

  33. 決定木分析を用いた不良品群からの不良パターン抽出による特徴評価精度向上

    峯田 龍志, 植田 俊太, 岩田 剛治

    日本機械学会 第29回設計工学・システム部門講演会 2019/09/27

  34. 不良品の因果関係に基づくグループ化による製品評価精度向上に関する研究

    植田 俊太, 岩田 剛治, 峯田 龍志

    日本機械学会 第29回設計工学・システム部門講演会 2019/09/27

  35. 決定木分析による前処理によるニューラルネットワークを用いた製品検査の精度向上に関 する研究

    岩田 剛治, 植田 俊太, 峯田 龍志

    生産システム部門研究発表講演会2019 2019/03/12

  36. Low Temperature Low Pressure Solid State Joining by Diffusion Control Using Ag/Sn Thin Film for 3DIC

    Yoshiharu Iwata

    2019/03

  37. 決定木分析とニューラルネットワークを用いた不良品特徴評価手法の精度向上に関する研究

    植田 俊太, 岩田 剛治

    日本機械学会 第28回設計工学・システム部門講演会 2018/11/06

  38. Product System Modeling Method with shape information for System Design

    KAWAMURA Ken, MURATA Hidenori, SAKAMOTO Takeshi, SATOH Ryohei, IWATA Yoshiharu, ARA Eiji, OKAMOTO Kazuya

    The Proceedings of Manufacturing Systems Division Conference 2017/03

  39. Product System Modeling Methodology for System Design

    Ken Kawamura, Hidenori Murata, Takeshi Sakamoto, Ryohei Satoh, Yoshiharu Iwata, Eiji Arai, Kazuya Okamoto

    2017/01

  40. Bonding condition design methodology using Sn-Ag thin film for 3DIC

    Yoshiharu Iwata, Naoki Narita, Takumi Shigemoto, Kiyoto Yoneta, Takahiro Yamamoto, Ryohei Satoh

    2016 International Conference on Electronics Packaging (ICEP) 2016

  41. 2208 Basic study on cooperation method of system model and analysis model using the shape model

    KAWAMURA Ken, KOBAYASHI Syuji, IWATA Yoshiharu, MURATA Hidenori, SATOH Ryohei

    2015/09/23

  42. 3102 Proper 3D system LSI design with physical and economical performance evaluation

    MURATA Hidenori, IWATA Yoshiharu, SATOH Ryohei, KAWAMURA Ken, TAYA Atsushi

    2015/09/23

  43. 2515 Fundamental Investigation of Hierarchical Optimization Method for Large-scaled System

    TERADA Satoshi, IWATA Yoshiharu, SATOH Ryohei, MURATA Hidenori, KAWAMURA Ken

    2015/09/23

  44. 1207 Basic study on the modeling of non-functional requirements and the shape of the system

    KAWAMURA Ken, IWATA Yoshiharu, MURATA Hidenori, SATOH Ryohei, SAKAMOTO Takeshi

    2014/09/17

  45. Study of Extreme Low Temperature and Load Solid-Phase Sn-Ag System Bonding Mechanism for 3D ICs

    Kiyoto Yoneta, Ryohei Sato, Yoshiharu Iwata, Koichiro Atsumi, Kazuya Okamoto, Yukihiro Satio, Takumi Shigemoto

    2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 2014

  46. 2209 Research on Modeling Method in consideration of Automatic Execution of the hard soft optimization for Embedded System using SDSI-Cubic

    2013/10/23

  47. Automated Construction of System Design Work-flow in SDSI-Cubic

    Hidenori Murata, Yoshiharu Iwata, Ryohei Satoh, Eiji Morinaga, Kazuhiro Aoyama, Tsuyoshi Koga

    The 7th Asia-Pacific Council on Systems Engineering Conference 2013/08

  48. Applying new system design method (SDSI-Cubic) to a design of Handy Smart Becquerel Counter

    Ken Kawamura, Touma Matsusima, Akie Kikuchi, Hidenori Murata, Yoshiharu Iwata, Ryohei Satoh

    Asia-Pacific Council on Systems Engineering Conference 2013/08

  49. Study of low load and temperature, high heat-resistant solid-phase Sn-Ag bonding with formation of Ag3Sn intermetallic compound via nanoscale thin film control for wafer-level 3D-stacking for 3D LSI

    Kiyoto Yoneta, Ryohei Sato, Yoshiharu Iwata, Koichiro Atsumi, Kazuya Okamoto, Yukihiro Sato

    Proceedings - Electronic Components and Technology Conference 2013

  50. 3205 Research on system design technique framework SDSI-Cubic : Automatic construction of optimization problem according to systems design workflow

    Murata Hidenori, Iwata Yoshiharu, SATOH Ryohei, MORINAGA Eiji

    2012/09/26

  51. 3202 Design Process Planning considering Product Function and Physical Structure for calculation of Multi-Domain solution

    NAKANO Takamasa, KOGA Tuyoshi, Iwata Yoshiharu, Aoyama Kazuhiro

    2012/09/26

  52. 3204 Research on system design technique framework SDSI-Cubic : Automatic construction of system design workflow

    MURATA Hidenori, IWATA Yoshiharu, SATOH Ryohei, MORINAGA Eiji, AOYAMA Kazuhiro, Koga Tsuyoshi

    2012/09/26

  53. Research on System Design Technique Framework SDSI-Cubic ---Automatic Construction of System Design Workflow---

    Hidenori Murata, Yoshiharu Iwata, Ryohei Satoh, Eiji Morinaga, Kazuhiro Aoyama, Tsuyoshi Koga

    2012/09

  54. Research on System Design Technique Framework SDSI-Cubic ---Automatic Construction of Optimization Problem According to System Design Workflow---

    Hidenori Murata, Yoshiharu Iwata, Ryohei Satoh, Eiji Morinaga

    2012/09

  55. 次世代3D-SiP用温度階層接続方式に関する研究

    佐藤幸博, 佐藤了平, 岩田剛治, 森永英二, 米田聖人, 岡 雄一

    Proceedings of the 18th Symposium on "Microjoining and Assembly Technology in Electronics" 2012/02

  56. 第一原理計算を用いたSnO2系透明電極の電子状態解析に関する研究

    米田聖人, 佐藤了平, 岩田剛治, 礒野貴充, 宮川春彦

    Proceedings of the 18th Symposium on "Microjoining and Assembly Technology in Electronics" 2012/02

  57. 2213 Research on Modeling Method for System Design

    Murata Hidenori, Iwata Yoshiharu, Taya Atsushi, Satoh Ryohei

    2011/10/21

  58. A design method of thin film pattern formation process via lift-off method

    Eiji Morinaga, Yutaka Matsuura, Hidefumi Wakamatsu, Ryohei Satoh, Koji Nakagawa, Yoshiharu Iwata, Eiji Arai

    2011/09

  59. Study on TSV with new filling method and alloy for advanced 3D-SiP

    Akihiro Tsukada, Ryohei Sato, Shigenobu Sekine, Ryuji Kimura, Keijiroh Kishi, Yukihiro Sato, Yoshiharu Iwata, Hidenori Murata

    Proceedings - Electronic Components and Technology Conference 2011/06

  60. Study on high heat proof protection thin film for Ag reflective films for LEDs

    Proceedings of International Conference on Electronics Packaging 2011 2011

  61. Study on high heatproof protective thin layer for Ag system reflective film

    Proceedings of the 17th Symposium on "Microjoining and Assembly Technology in Electronics" 2011

  62. System Model Visualization Method for 3D-SiP

    International Conference on Electronics Packaging 2011

  63. 次世代システムLSIの階層型最適化手法に関する研究

    Proceedings of the 17th Symposium on "Microjoining and Assembly Technology in Electronics" 2011

  64. Ag系反射膜用高耐熱薄膜保護層に関する研究

    Proceedings of the 17th Symposium on "Microjoining and Assembly Technology in Electronics" 2011

  65. 1205 Fundamental Investigation on Multi Layered Multi Objective Optimization Method for System Design

    Iwata Yoshiharu, Yasumura Takanari, Murata Hidenori, Satoh Ryohei

    2010/10/27

  66. System Design Method for System LSI on Next Generation Mobile Phone

    2010/08/18

  67. Basic Study on Micro-Bonding Method with Temperature Hierarchy for 3D-SiP

    SATO Yukihiro, SATOH Ryohei, IWATA Yoshiharu, MIYAGAWA Haruhiko, MURATA Hidenori

    2010/08/18

  68. Study on system design-system integration method for system LSI structure

    Proc. of the 16th Symposium on "Microjoining and Assembly Technology in Electronics" 2010

  69. The proper structure of nano multi-layered film Cu system wiring

    Proc. of the 16th Symposium on "Microjoining and Assembly Technology in Electronics" 2010

  70. SDSI-Cubic手法によるシステムLSIのシステムデザインに関する研究

    第9回最適化シンポジウム2010 2010

  71. Study on thermal proof of SnO2 protection thin film for ultra high reflective film Ag system

    Proceedings of the International Microelectronics and Packaging Society 2010

  72. ナノ薄膜制御による3次元LSI用超多点低温高耐熱接合方式の検討

    溶接学会全国大会講演概要ー第87集ー 2010

  73. Study on system design / system integration method for system LSI

    Proceedings of International Conference on Electronics Packaging 2010 2010

  74. High heat proofing nano-layered film Cu Wiring by crystal grain growth control

    Proceedings of International Conference on Electronics Packaging 2010 2010

  75. 次世代システムLSIのシステムデザイン・インテグレーション手法に関する研究

    Proc. of the 16th Symposium on "Microjoining and Assembly Technology in Electronics" 2010

  76. 次世代3次元LSI用超多点ナノ薄膜制御接続方式に関する研究

    Proc. of the 16th Symposium on "Microjoining and Assembly Technology in Electronics" 2010

  77. Cu系高耐熱ナノ多層薄膜配線の適正構造に関する研究

    Proc. of the 16th Symposium on "Microjoining and Assembly Technology in Electronics" 2010

  78. システムデザイン・インテグレーション手法と 次世代半導体デバイスのシステムデザインへの適用

    岩田剛治

    システム制御情報学会 UFA研究分科会 第10回研究例会 2009/12

  79. Fundamental Study of System Design Method at Next Generation Semi-Conductor Device

    Atsushi Taya, Yoshiharu Iwata, Ryohei Satoh, Eiji Morinaga, Hidenori Murata, Kazuya Okamoto, Keiji Kudo

    2009/10

  80. Research on a method to derive an ideal 3DSiP

    Taya, A, Iwata, Y, Satoh, R, Murata, H, Morinaga, E, Kudo, K, Okamoto, K

    Proc. IEEE 59th Electrical Components and Technology Conference 2009/05

  81. ものづくりデジタルデザインの現状と新SD・SI手法開発状況及び今後の展開 -次世代システムLSIのシステムデザインでの例-

    Proc. of the 15th Symposium on Microjoining and Assembly Technology in Electronics 2009

  82. YAGレーザを用いたSnO2系導電薄膜の高速加工とその加工メカニズムに関する研究

    Proc. of the 15h Symposium on Microjoining and Assembly Technology in Electronics 2009

  83. 結晶粒成長制御によるCu系高耐熱ナノ多層薄膜配線形成に関する研究

    Proc. of the 15th Symposium on Microjoining and Assembly Technology in Electronics 2009

  84. 3D-SiPの適正構成予測手法に関する研究

    Proc. of the 15th Symposium on Microjoining and Assembly Technology in Electronics 2009

  85. Multi-agent Optimization Method for Thermal-Circuit Collaboration Design

    Design Engineering Workshop 2009 2009

  86. Research on a Method to Derive an Ideal 3DSiP

    Atsushi Taya, Yoshiharu Iwata, Ryohei Satoh, Hidenori Murata, Eiji Morinaga, Keiji Kudo, Kazuya Okamoto

    2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4 2009

  87. システムデザイン・インテグレーション手法と次世代半導体デバイスにおけるケーススタディ

    溶接学会 第93回マイクロ接合研究委員会 2009

  88. システムデザイン・インテグレーション手法と次世代半導体デバイスのシステムデザインへの適用

    システム制御情報学会 UFA研究分科会 第10回研究例会 2009

  89. Mechanism and Advanced Application of Rapid Laser Processing on SnO2 Thin Films for FPD Manufacture

    Reo Usui, Yu Mihara, Eiji Morinaga, Yoshiharu Iwata, Ryohei Satoh

    Society for Information Display 2008 International Symposium Digest of Technical Papers 2008/05

  90. 111 Thermal-Circuit Collaboration Layout Design Method for Electronics Device

    Iwata Yoshiharu

    2008/03/14

  91. 電子デバイスの熱・回路協調レイアウト設計手法

    関西支部第83期定時総会講演会講演路文集 2008

  92. 多層薄膜を用いた低温超微細接合のための基礎研究

    Proc. of the 14th Symposium on Microjoining and Assembly Technology in Electronics 2008

  93. 結晶性向上によるSnO2系透明薄膜電極の低抵抗化

    Proc. of the 14th Symposium on Microjoining and Assembly Technology in Electronics 2008

  94. 次世代ディスプレイ用高耐熱ナノ多層薄膜配線形成に関する研究

    Proc. of the 14th Symposium on Microjoining and Assembly Technology in Electronics 2008

  95. リフトオフ法による薄膜パターン形成に向けた膜厚分布計算手法に関する研究

    Proc. of the 14th Symposium on Microjoining and Assembly Technology in Electronics 2008

  96. YAGレーザによるSnO2系薄膜微細加工技術に関する研究

    Proc. of the 14th Symposium on Microjoining and Assembly Technology in Electronics 2008

  97. 次世代携帯電話のThermal Management手法に関する研究

    Proceedings of 14th Symposium on Micro-joining and Assembly Technology in Electronics 2008

  98. The Thermal-Circuit High-Speed Collaboration Layout Design for an Electronic System with Multi-Agent Method

    Shintaro Hayashi, Yoshiharu Iwata, Ryohei Satoh, Kozo Fujimoto

    Proceedings of The ASME 2007 Inter PACK Conference 2007/07

  99. ハイエンドSiPで必須になるグローバル配線の配線密度限の検討

    岩田剛治, 佐藤了平, 森永英二, 橋本美希

    関西ワークショップ2007 2007/07

  100. Advanced application of direct laser process on SnO2 thin films for FPDs

    Reo Usui, Yu Mihara, Ryohei Satoh, Eiji Morinaga, Yoshiharu Iwata

    Society for Information Display 2007 International Symposium Digest of Technical Papers 2007/05

  101. Research on next-generation manufacturing method of plasma display panels via lift-off process

    Eiji Morinaga, Ryohei Satoh, Kouji Nakagawa, Haruhiko Miyagawa, Reo Usui, Yoshiharu Iwata

    Society for Information Display 2007 International Symposium Digest of Technical Papers 2007/05

  102. Ta-doped SnO2 thin films for PDP

    Yu Mihara, Ryohei Satoh, Reo Usui, Eiji Morinaga, Yoshiharu Iwata

    Society for Information Display 2007 International Symposium Digest of Technical Papers 2007/05

  103. Modularized high-speed thermal analysis for multi-layered electronic system

    Shintaro HAYASHI, Yoshiharu IWATA, Ryohei SATOH, Kozo FUJIMOTO

    2007/02

  104. Research on Environmentally-friendly Wiring Structure for Next Generation Display

    Akiko NAMIKAWA, Ryohei SATOH, Yoshiharu IWATA, Eiji MORINAGA, Koji NAKAGAWA

    2007/02

  105. Research on Non Etching Formation of Nanoscale Multilayer Thin-Film Patterns for the Next-Generation Display

    Eiji MORINAGA, Ryohei SATOH, Kouji NAKAGAWA, Haruhiko MIYAGAWA, Yoshiharu IWATA

    2007/02

  106. Advanced Application of Direct Laser Process on SnO2 Thin Films

    Reo USUI, Ryohei SATOH, Yu MIHARA, Eiji MORINAGA, Yoshiharu IWATA

    2007/02

  107. Highly Conductive SnO2 Thin Film for Flat Panel Display

    Yu MIHARA, Ryohei SATOH, Reo USUI, Eiji MORINAGA, Yoshiharu IWATA

    2007/02

  108. The thermal-circuit high-speed collaboration layout design for an electronic system with multi-agent method

    Shintaro Hayashi, Yoshiharu Iwata, Ryohei Satoh, Kozo Fujimoto

    IPACK 2007: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2007, VOL 2 2007

  109. Advanced application of direct laser process on SnO2 thin films for FPDs

    Reo Usui, Yu Mihara, Ryohei Satoh, Yu Mihara, Eiji Morinaga, Yoshiharu Iwata

    2007 SID INTERNATIONAL SYMPOSIUM, DIGEST OF TECHNICAL PAPERS, VOL XXXVIII, BOOKS I AND II 2007

  110. The Thermal-Circuit Collaboration Layout Design of an Electronic System by the Intelligent Sub Design Module

    Shintaro Hayashi, Yoshiharu Iwata, Ryohei Satoh, Kozo Fujimoto

    2006/12

  111. システムデザインに向けた熱・回路協調概略レイアウト設計と多目的最適化

    岩田 剛治

    日本学術振興会 システムデザイン・インテグレーション第177委員会(第7回) 研究会資料 2006/12

  112. High Density Proper Global Wiring Structure and its Optimization for Next Generation SiP

    Yoshiharu Iwata, Ryohei Satoh, Eiji Morinaga, Miki Hashimoto

    2006/10

  113. YAGレーザを用いたFPD用SnO2系透明導電薄膜の微細加工に関する研究

    臼井 玲大, 中川 浩司, 佐藤 了平, 岩田 剛治, 森永 英二, 高木 悟, 礒野 貴充, 三原 雄

    溶接学会全国大会講演概要 2006/09

  114. Basic Study of Proper Global Wiring Structure for Advanced System in Package

    Yoshiharu Iwata, Shouhei Yasuda, Ryohei Satoh, Eiji Morinaga

    Proc. IEEE 56th Electrical Components and Technology Conference 2006/05

  115. THERMAL ANALYSIS METHOD OF SEAMLESS TRANSITION METAMODELFROM ROUGH TO HIGH ACCURACY

    Yoshiharu Iwata, Shintaro Hayashi, Ryohei Satoh, Kozo Fujimoto

    Proc. The 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems 2006/05

  116. Design solution improvement for electrical-thermal collaboration design by using multi-agent theory

    Shintaro Hayashi, Yoshiharu Iwata, Kozo Fujimoto, Ryohei Satoh

    2006/02

  117. Development of High Heatproof Nano-Thin Film System for Electrode of Next Generation Flat Panel Display

    Koji NAKAGAWA, Ryohei SATOH, Yoshiharu IWATA, Reo Usui, Eiji Morinaga, Aiko Namikawa

    2006/02

  118. Research on Direct Laser Patterning on Thin Films

    Reo USUI, Ryohei SATOH, Yoshiharu IWATA, Koji NAKAGAWA, Eiji MORINAGA, Satoru TAKAKI

    2006/02

  119. Fundamental Investigation of Proper Global Wire Structure for Next Generation SiP 2nd report

    Yoshiharu IWATA, Ryohei SATOH, Eiji MORINAGA, Miki HASHIMOTO

    2006/02

  120. 電子回路システムの熱・回路協調レイアウト設計のサブ設計モジュールの知能化

    第7回最適化シンポジウム講演論文集 2006

  121. 次世代SiP(System in Package)に向けた高密度適正グローバル配線構造とその最適化

    第16回マイクロエレクトロニクスシンポジウム論文集 MES2006 2006

  122. Basic study of proper global wiring structure for advanced system in package

    Yoshiharu Iwata, Shouhei Yasuda, Ryohei Satoh, Eiji Morinaga

    56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS 2006

  123. Thermal analysis method of seamless transition metamodel from rough to high accuracy

    Yoshiharu Iwata, Shintaro Hayashi, Ryohei Satoh, Kozo Fujimoto

    2006 PROCEEDINGS 10TH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONICS SYSTEMS, VOLS 1 AND 2 2006

  124. マルチエージェント理論の導入による電子システムの熱・回路協調概略部品配置設計の解品質向上

    Proceedings of 12th Symposium on Micro-joining and Assembly Technology in Electronics 2006

  125. 次世代SiPに向けた適正グローバル配線構造の基礎的検討第2報

    Proceedings of 12th Symposium on Micro-joining and Assembly Technology in Electronics 2006

  126. レーザを用いたドライプロセスによる微細薄膜回路パターン形成技術に関する研究

    Proceedings of 12th Symposium on Micro-joining and Assembly Technology in Electronics 2006

  127. 次世代ディスプレイ用電極の高耐熱ナノ薄膜システムの開発

    Proceedings of 12th Symposium on Micro-joining and Assembly Technology in Electronics 2006

  128. Evaluation Method of Measures in Feedback Design

    Akira Tsumaya, Daisuke Murakami, Yoshiharu Iwata, Hidefumi Wakamatsu, Eiji Arai

    2005/10

  129. 2F15 技術経営における最適化手法を用いた新事業性評価システムに関する研究(<ホットイシュー>科学技術システムからリサーチ・イノベーション・システムへ(1))

    杉谷 宗彦, 佐藤 了平, 岩田 剛治

    年次学術大会講演要旨集 2004/10/15

  130. Conceptual Simulator for Thermal Design of High Density Electronics System

    Yoshiharu IWATA, Shuhei YAMAMOTO, Shintaro HAYASHI, Kozo FUJIMOTO

    The sixth VLSI Packaging Workshop of Japan Technical Digest, pp.179-182 2002/11

  131. Conceptual Simulator for Thermal Design of High Speed and High Density Electronics System

    Yoshiharu IWATA, Shuhei YAMAMOTO, Shintaro HAYASHI, Kozo FUJIMOTO

    Proceedings of 2002 International Conference on Electronics Packaging, pp.301-306 2002/04

  132. Design Support for PCB Thermal Layout Using Conceptual Thermal Simulator

    Iwata Yoshiharu, Hayashi Shintarou, Yamamoto Shuhei, Fujimoto Kozo

    Pre-Prints of the National Meeting of JWS 2002/03/24

  133. Conceptual Thermal Design System for PCB Collaboration Design Between Thermal and Electrical

    Iwata Yoshiharu, Hayashi Shintarou, Yamamoto Shuhei, Fujimoto Kozo

    Proceedings of the IEICE General Conference 2002/03/07

  134. Quality Inspection by Neural Network Under Consideration of Distace between Categories

    Katsuki URANO, Naoki MORIYA, Yoshiharu IWATA, Kozo FUJIMOTO, Shuji NAKATA

    8th Symposium on Microjoining and Assembly Technology in Electronics, Vol.8, pp.531-536 2002/01

  135. Detection of 3D Position Information of Internal Defects in Micro-Joining Parts by Infrared Thermal Imaging

    Yoshiharu IWATA, Daigo KOBAYASHI, Kozo FUJIMOTO, Shuji NAKATA

    Proceedings of "Seventh International Welding Symposium", p.1321-1326 2001/11

  136. Collaboration Method of Modulized Thermal Design for PCB Layout Design

    Iwata Yoshiharu, Yamamoto Syuhei, Tanaka Junji, Fujimoto kozo

    Pre-Prints of the National Meeting of JWS 2001/09/10

  137. Collaboration Method Between Thermal and Electrical Design for PCB Layout Design

    Iwata Yoshiharu, Tanaka Junji, Yamamoto Syuhei, Fujimoto kozo

    Pre-Prints of the National Meeting of JWS 2001/09/10

  138. Collaboration Method Between Thermal and Electrical Design for PWB Layout Design

    Iwata Yoshiharu, Tanaka Junji, Yamamoto Shuhei, Fujimoto Kozo

    Proceedings of the Society Conference of IEICE 2001/08/29

  139. Construction of Positioning System of Micro and Macro Fusion

    Tomohiro Ueda, Kurachika Kondo, Yoshiharu Iwata, Kozo Fujimoto, Shuji Nakata

    7th Symposium on Microjoining and Assembly Technology in Electronics, Vol.7, pp.313-318 2001/02

  140. Detecting 3-D Position of Micro Defect used by Infrared Thermal Imaging with Laser Irradiation

    Daigo Kobayashi, Yoshiharu Iwata, Kozo Fujimoto, Shuji Nakata

    6th Symposium on Microjoining and Assembly Technology in Electronics, Vol.6, pp.91-96 2000/02

  141. Investigation of Formation Mechanism of Wetting Front of Solder on Spreading Test

    Mitsuhiko Ueda, Jeongkwan Kim, Yoshiharu Iwata, Kozo Fujimoto, Shuji Nakata

    MES'99 1999/10

  142. Observation of Spreading Phenomena of Sn-Pb Solder and the Structure of Wetting Front on Spreading Test

    Jeongkwan Kim, Mitsuhiko Ueda, Yoshiharu Iwata, Kozo Fujimoto, Shuji Nakata

    1999/10

  143. Investigation of Insulator Coating Process in Ultramicroelectrode Fabrication for Micro Characterization

    IWATA Yoshiharu, FURUKUBO Eiichi, FUJIMOTO Kozo, NAKATA Shuji

    Pre-Prints of the National Meeting of JWS 1997/03/15

  144. Identification Algorithm of Defect Size and Position in Inteligent Detection System of Micro Defect

    Tetsuya Yamamoto, Yoshiharu Iwata, Shuji Nakata

    Proceedings of 1st Symposium on "Microjoining and Assembly Technology in Electronics" 1995/02

  145. Detection Algorithm of Interface Including Defect on Multi Joint Interface in Intelligent Detection System of Micro Defect

    Yoshiharu Iwata, Tetsuya Yamamoto, Shuji Nakata

    Proceedings of 1st Symposium on "Microjoining and Assembly Technology in Electronics" 1995/02

  146. Optimal Condition and Detectable Limit of the Defect Size for the Detection of the Micro Defect by Infrared Thermal Image Process

    Yoshiharu IWATA, Shuji NAKATA

    Proceedings of the 8th International Microelectronics Conference, 388-392 1994/04

  147. Detection on the Defects at the Soldered Joints in the QFP of Gull Wing type

    Yoshiharu IWATA, Shuji NAKATA

    Proceedings of 1st Eupropean conference on Electronic Packaging Tecnology,39-42 1994/02

  148. Posibility of Detection Process on the Defect at the Solder Joints of Chip Cpmponent by Infrared Thermal Imaging with Laser Irradiation

    IWATA Yoshiharu, YAMADA Tomoo, NAKATA Shuji

    Pre-Prints of the National Meeting of JWS 1993/08/31

  149. Influence of Fillet Formation on the Surface Temperature Distribution at the Lead of Gull Wing Type : Inspection Process on the Micro Joints bu Infrared Thermal Imaging with Laser Irradiation, (3rd report)

    IWATA Yoshiharu, NAKATA Shuji

    Pre-Prints of the National Meeting of JWS 1993/08/31

  150. Inspection Process and it's Application on the Micro defect of Joints by Infrared Thermal Imaging with Laser Irradiation

    Shuji NAKATA, Masato IJUIN, YoshiharuIWATA

    1993/06

  151. Possibility of Detecting the Micro-defects at TAB Bonds by Infrared Thermal Imaging Process

    Nakata Shuji, Iwata Yoshiharu, Nakajima Dai

    Pre-Prints of the National Meeting of JWS 1992/09/01

Works 5

  1. 次世代ディスプレイ用誘電体材料・プロセスの開発

    2003 - 2005

  2. 革新的設計・生産方式の開発と次世代光・電子融合システムの創成

    2002 - 2004

  3. 次世代電子デバイス用高機能薄膜材料の開発

    2005 -

  4. 局所-全体統合熱解析システム

    2005 -

  5. 革新的設計・生産方式の開発と次世代光・電子融合システムの創成

    2004 -

Industrial Property Rights 22

  1. 合金材料、回路基板、電子デバイス及びその製造方法

    佐藤 了平, 関根 重信, 関根 由莉奈, 岩田 剛治, 佐藤 幸博, 塚田 晃弘

    特許第5667467号

    出願日:2011/02/18

    登録日:2014/12/19

  2. 設計ワークフロー構築装置、設計ワークフロー構築方法、設計システム、設計方法、設計ワークフロー構築プログラムおよびそれを記録したコンピュータ読み取り可能な記録媒体

    岩田剛治, 佐藤了平, 工藤啓治, 多屋淳志, 岡本和也, 村田秀則, 渥美幸一郎, 荒井栄司, 森永英二

    5170598

    出願日:2010/02

    登録日:2013/01

  3. プラズマディスプレイパネルおよびその製造方法

    佐藤 了平, 森永 英二, 岩田 剛治, 宮川 春彦, 壬生 隆

    4892730

    出願日:2006/12

    登録日:2012/01

  4. パターン形成方法および電子回路

    佐藤 了平, 岩田 剛治, 中川 浩司, 田中 健治, 高木 悟

    特許第4329817号

    出願日:2005/12/20

    登録日:2009/06/26

  5. パターン形成方法、およびこれにより製造される電子回路

    佐藤 了平, 岩田 剛治, 中川 浩司, 田中 健治, 高木 悟

    特許第4289396号

    出願日:2005/12/20

    登録日:2009/04/10

  6. 熱解析方法、熱設計支援方法、プログラム、記録媒体、熱解析を行う装置、熱設計支援を行う装置

    岩田 剛治, 藤本 公三, 林 真太郎, 山本 修平, 佐藤 了平, 川合 有

    特許第4005002号

    出願日:2003/08/05

    登録日:2007/08/31

  7. プラズマディスプレイ基板用、電極および/またはブラックストライプの製造方法

    佐藤 了平, 岩田 剛治, 中川 浩司, 田中 健治, 高木 悟

    WO2006-035565

    出願日:2005/08/29

  8. パターン形成方法、およびこれにより製造される電子回路、並びにこれを用いた電子機器

    佐藤 了平, 岩田 剛治, 中川 浩司, 臼井 玲大

    WO2005-045911

    出願日:2004/11/09

  9. 電極付き基板

    佐藤 了平, 岩田 剛治, 宮川 春彦, 瀬戸 要, 藤原 晃男, 赤尾 安彦

    出願日:2012/06/12

  10. 導電層付き基板

    佐藤 了平, 岩田 剛治, 宮川 春彦, 牛 光耀, 藤原 晃男, 亀田 祐人, 岸 政洋, 瀬戸 要

    出願日:2011/09/29

  11. 膜加工方法

    佐藤 了平, 岩田 剛治, 宮川 春彦, 牛 光耀

    出願日:2011/08/11

  12. 電子回路装置およびその製造方法

    佐藤 了平, 岩田 剛治, 太田 敏彦, 佐藤 幸博, 岡本 和也, 渥美 幸一郎

    出願日:2012/01/30

  13. 平面照明装置

    佐藤 了平, 阿部 勝男, 岩田 剛治, 木村 吉秀, 渋谷 幸一

    出願日:2011/02/16

  14. 電子デバイス及びその製造方法

    佐藤 了平, 関根 重信, 岩田 剛治, 佐藤 幸博, 関根 由莉奈, 木村 竜司

    出願日:2010/11/22

  15. 電子デバイスの製造方法

    佐藤 了平, 関根 重信, 岩田 剛治, 佐藤 幸博, 関根 由莉奈, 木村 竜司

    出願日:2010/02/15

  16. 電子部品、電子回路装置、および電子部品の製造方法

    佐藤 了平, 岩田 剛治, 加茂 真吾, 宮川 春彦

    出願日:2010/02/15

  17. プラズマディスプレイパネルおよびその製造方法

    佐藤了平, 岩田剛治, 森永英二, 宮川春彦, 壬生隆, 阿部勝男, 太田敏彦

    出願日:2008/06

  18. 電子回路装置とその製造方法

    佐藤 了平, 盆子原 學, 岩田 剛治, 安田 尚平

    出願日:2005/08/02

  19. 多変数構造の変数解析方法,熱設計支援方法

    岩田剛治, 藤本公三, 林真太郎, 山本修平

    特開2004-192606

    出願日:2003/08

  20. 薄膜パターン形成装置及び電子回路装置

    佐藤 了平, 岩田 剛治, 横田 耕一

    特願2003-028879

    出願日:2003/02

  21. 位置決めマーカおよび位置決め装置

    上田智宏, 近藤庫睦, 岩田剛治, 藤本公三, 仲田週次

    特開2002-340756

    出願日:2001/05

  22. 微細構造物中の欠陥を検出する方法

    岩田剛治, 小林大吾

    特開2002-048743

    出願日:2000/08

Academic Activities 13

  1. 10th International Conference on Design and Concurrent Engineering

    The Japan Society of Mechanical Engineer,

    2021/05/15 - Present

  2. 社団法人 溶接学会 マイクロ接合研究委員会(幹事)

    1994/04 - Present

  3. 独立行政法人 日本学術振興会(第177委員会幹事)

    2005/05 - 2020/03/31

  4. (財)国際高等研究所(特別研究員)

    2002/04 - 2004/03

  5. 第19回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム

    溶接学会 マイクロ接合研究委員会

    2013/02 -

  6. 第18回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム

    溶接学会 マイクロ接合研究委員会

    2012/02 -

  7. 第17回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム

    溶接学会 マイクロ接合研究委員会

    2011/02 -

  8. 第16回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム

    溶接学会 マイクロ接合研究委員会

    2010/02 -

  9. 第15回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム

    溶接学会 マイクロ接合研究委員会

    2009/02 -

  10. 大阪大学 知的財産本部・先端科学イノベーションセンター発足記念式典・FRCとの共同記念シンポジウム

    大阪大学 先端科学イノベーションセンター FRC

    2004/06 -

  11. 第10回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム

    (社)溶接学会 マイクロ接合研究委員会

    2004/02 -

  12. 第9回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム

    (社)溶接学会 マイクロ接合研究委員会

    2003/02 -

  13. 第8回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム

    (社)溶接学会 マイクロ接合研究委員会

    2002/01 -

Institutional Repository 1

Content Published in the University of Osaka Institutional Repository (OUKA)
  1. レーザー照射型熱画像法によるマイクロ欠陥検出プロセスに関する研究

    Iwata Yoshiharu