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Direct formation of Cu nano-dendritic structure on substrate by dynamic hydrogen bubble template for organic-free sintered Cu-to-Cu bonding
Ji-Hyun Kim, Hiroaki Tatsumi, Hiroshi Nishikawa
Surfaces and Interfaces Vol. 62 p. 106268-106268 2025/04 Research paper (scientific journal)
Publisher: Elsevier BV
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電解めっきポーラス銅/はんだ複合構造を有する接合部の作製
平瀬 加奈, 巽 裕章, 西川 宏
第31回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2025)論文集 Vol. 31 p. 394-395 2025/01/28 Research paper (conference, symposium, etc.)
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Zn添加がSn-Bi系合金の変形挙動に及ぼす影響
川上 夏輝, 巽 裕章, 西川 宏
第31回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2025)論文集 Vol. 31 p. 392-393 2025/01/28 Research paper (conference, symposium, etc.)
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Ag-Cu合金の脱合金化による表面Agナノポーラスシートの作製と接合性評価
内田 弘翔, 巽 裕章, 西川 宏
第31回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2025)論文集 Vol. 31 p. 85-89 2025/01/28 Research paper (conference, symposium, etc.)
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ナノインデンテーション試験を用いたSn-52 mass%In合金におけるクリープ変形挙動の温度依存性
新田 隼也, 巽 裕章, 西川 宏
第31回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2025)論文集 Vol. 31 p. 67-71 2025/01/28 Research paper (conference, symposium, etc.)
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Atomistic behavior of Cu-Cu solid-state bonding in polycrystalline Cu with high-density boundaries
Hiroaki Tatsumi, C.R. Kao, Hiroshi Nishikawa
Materials & Design p. 113576-113576 2024/12 Research paper (scientific journal)
Publisher: Elsevier BV
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Microstructure and Bonding Properties of Transient Liquid-Phase Bonding using Cu-SnAgCu Molded Sheets By High-Pressure Powder Compression
Ichizo Sakamoto, Doojin Jeong, Hiroaki Tatsumi, Hiroshi Nishikawa
Journal of Electronic Materials 2024/11/12 Research paper (scientific journal)
Publisher: Springer Science and Business Media LLC
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Study of the Characteristics and Growth of Tin Whiskers in Orbit
Shinichiro Ichimaru, Tsuyoshi Nakagawa, Norio Nemoto, Katsuaki Suganuma, Hiroaki Tatsumi, Hiroshi Nishikawa
Microelectronics Reliability Vol. 162 2024/10/21 Research paper (scientific journal)
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Thermal decomposition temperature-dependent bonding performance of Ag nanostructures derived from metal–organic decomposition
Chuncheng Wang, Hiroaki Tatsumi, Hiroshi Nishikawa
Journal of Materials Science 2024/10/15 Research paper (scientific journal)
Publisher: Springer Science and Business Media LLC
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Improved thermal shock reliability of Ag paste sintered joint by adjusted coefficient of thermal expansion with Ag-Si atomized particles addition
Wangyun Li, Chuantong Chen, Masahiko Nishijima, Minoru Ueshima, Hiroshi Nishikawa, Katsuaki Suganuma
Materials & Design Vol. 246 p. 113308-113308 2024/10/01 Research paper (scientific journal)
Publisher: Elsevier BV
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Counter-intuitive mechanical performance variation in aged low-temperature interconnections in electronic packaging
Wangyun Li, Lanqing Mo, Feng Chen, Zongbei Dai, Yiqin Xu, Siliang He, Hiroshi Nishikawa
Vacuum Vol. 227 2024/09/01 Research paper (scientific journal)
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Quanifification of Adhesion Strength and Mechanism of Adhesion Degradation between Sputtered SUS304 and Mold Resin in Electromagnetic Wave Shield Packages
Soichi Homma, Daichi Okada, Akihito Sawanobori, Susumu Yamamoto, Hiroshi Nishikawa
Proceeding of the 10th IEEE Electronics System-Integration Technology Conference 2024/09 Research paper (international conference proceedings)
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Effect of minor element addition on mechanical properties and microstructure of Sn-Bi alloys
Hiroshi Nishikawa, Yuki Hirata, Shiqi Zhou, Chih-han Yang, Shih-kang Lin
Proceeding of the 10th IEEE Electronics System-Integration Technology Conference 2024/09 Research paper (international conference proceedings)
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ロータス型ポーラス銅/はんだ複合接合部の熱伝導率評価
平瀬 加奈, 巽 裕章, 西川 宏
第34回マイクロエレクトロニクスシンポジウム(MES2024)論文集 p. 123-126 2024/09 Research paper (conference, symposium, etc.)
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Ni-P/AuめっきによるSn-Bi系合金バンプ継手特性評価
川上 夏輝, 巽 裕章, 西川 宏
第34回マイクロエレクトロニクスシンポジウム(MES2024)論文集 p. 317-320 2024/09 Research paper (conference, symposium, etc.)
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分子動力学法によるCu-Cu接合界面のボイド消失挙動の評価
巽 裕章, C. R. Kao, 西川 宏
第34回マイクロエレクトロニクスシンポジウム(MES2024)論文集 p. 411-412 2024/09 Research paper (conference, symposium, etc.)
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Creep Behavior of Low-temperature Sn-In Solder using Nanoindentation Test
Shunya Nitta, Hiroaki Tatsumi, Hiroshi Nishikawa
Proceedings of IEEE International 3D Systems Integration Conference (3DIC 2024) 2024/09 Research paper (international conference proceedings)
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Study on Thermal Cycling Reliability of Epoxy-Enhanced SAC305 Solder Joint
Peng Zhang, Songbai Xue, Lu Liu, Jianhao Wang, Hiroaki Tatsumi, Hiroshi Nishikawa
Polymers Vol. 16 2024/09 Research paper (scientific journal)
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Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation
Yang Liu, Chuantong Chen, Ye Wang, Zheng Zhang, Ran Liu, Minoru Ueshima, Ichiro Ota, Hiroshi Nishikawa, Masahiko Nishijima, Koji S. Nakayama, Katsuaki Suganuma
Composites Part B: Engineering Vol. 281 p. 111519-111519 2024/07/01 Research paper (scientific journal)
Publisher: Elsevier BV
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Reducing anisotropy of rhombohedral Bi-rich phase for high-performance Ag-alloyed Sn-Bi low-temperature solders
Chih-han Yang, Yu-chen Liu, Hiroshi Nishikawa, Shih-kang Lin
Journal of Materials Research and Technology Vol. 30 p. 16-24 2024/05 Research paper (scientific journal)
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Design of rose thorn biomimetic micro-protrusion for metals and CFRTP easily disassembled joining
Tai Wang, Kiyokazu Yasuda, Hiroshi Nishikawa
Engineering Research Express Vol. 6 No. 2 p. 025512-025512 2024/04/18 Research paper (scientific journal)
Publisher: IOP Publishing
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Effect of Ar and N2 plasma etching on adhesion between mold resin and sputtered Cu in semiconductor electromagnetic shielding
Soichi Homma, Masaya Shima, Yuusuke Takano, Takeshi Watanabe, Masatoshi Fukuda, Takashi Imoto, Hiroshi Nishikawa
Journal of Adhesion Science and Technology Vol. 38 No. 6 p. 815-838 2024/04 Research paper (scientific journal)
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Ag Sintered Joints on ENIG Cu Substrates by an Ag-based Complex
Chuncheng Wang, Hiroaki Tatsumi, Hiroshi Nishikawa
Proceedings of 2024 International Conference on Electronics Packaging (ICEP2024) p. 95-96 2024/04 Research paper (international conference proceedings)
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Low Thermal Resistance Joint using Lotus-type Cu/Solder Composite
Hiroaki Tatsumi, Hiroshi Isono, Kana Hirase, Takuya Ide, Hiroshi Nishikawa
Proceedings of 2024 International Conference on Electronics Packaging (ICEP2024) p. 51-52 2024/04 Research paper (international conference proceedings)
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Joint Strength of Transient Liquid Phase Bonding Using Cu-SAC Molded Sheet
Ichizo Sakamoto, Doojin Jeong, Hiroaki Tatsumi, Hiroshi Nishikawa
Proceedings of 2024 International Conference on Electronics Packaging (ICEP2024) p. 41-42 2024/04 Research paper (international conference proceedings)
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A comparative numerical study of thermos-mechanical behavior among various IMC joints under thermal cycling condition
Xunda Liu, Hiroaki Tatsumi, Hiroshi Nishikawa
Journal of Smart Processing Vol. 13 No. 2 p. 83-89 2024/03 Research paper (scientific journal)
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ダイアタッチに向けたAg-Cu合金の脱合金化によるAgナノポーラスシートの作製
内田 弘翔, 巽 裕章, 西川 宏
第38回エレクトロニクス実装学会春季講演大会論文集 p. 165-166 2024/03 Research paper (conference, symposium, etc.)
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Transparent Liquid Ag-Based Complex for the Facile Preparation of Robust Sintered Ag Joints in Power Devices
Chuncheng Wang, Hiroaki Tatsumi, Liang Xu, Tao Zhao, Pengli Zhu, Rong Sun, Hiroshi Nishikawa
ACS Applied Electronic Materials Vol. 6 p. 1718-1728 2024/02 Research paper (scientific journal)
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ロータス型ポーラス銅・はんだ複合構造を活用した高放熱モジュールの試作評価
巽 裕章, 磯野 浩, 平瀬 加奈, 井手 拓哉, 西川 宏
第30回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2024)論文集 p. 112-113 2024/01 Research paper (conference, symposium, etc.)
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青色半導体レーザを用いた純銅リボンはんだ付中の温度分布と微細組織の評価
貴田 優希, 巽 裕章, 竹中 啓輔, 佐藤 雄二, 塚本 雅裕, 西川 宏
第30回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2024)論文集 p. 49-53 2024/01 Research paper (conference, symposium, etc.)
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Sn-Bi-Zn-In合金の微細組織が変形挙動に及ぼす影響
中脇 啓貴, 巽 裕章, Chih-han Yang, Shih-kang Lin, 西川 宏
第30回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2024)論文集 p. 29-33 2024/01 Research paper (conference, symposium, etc.)
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Quasi-Direct Cu-Si3N4 Bonding using Multi-layered Active Metal Deposition for Power-Module Substrate
Hiroaki Tatsumi, Seongjae Moon, Makoto Takahashi, Takahiro Kozawa, Eiki Tsushima, Hiroshi Nishikawa
Materials and Design Vol. 238 2024/01 Research paper (scientific journal)
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Interfacial reactions between In and Ag during solid liquid interdiffusion process
Xunda Liu, Fupeng Huo, Jianhao Wang, Hiroaki Tatsumi, Zhi Jin, Zhong Chen, Hiroshi Nishikawa
Surfaces and Interfaces Vol. 45 2024/01 Research paper (scientific journal)
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Analysis of microstructures and fractures in Ag-In transient liquid phase bonded joints
Xunda Liu, Hiroaki Tatsumi, Jianhao Wang, Zhi Jin, Zhong Chen, Hiroshi Nishikawa
Materials Science and Engineering: A Vol. 892 2024/01 Research paper (scientific journal)
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Effect of Bi content on the microstructure and mechanical properties of Sn-Bi-Zn-In alloy
Hiroki Nakawaki, Hiroaki Tatsumi, Shunya Nitta, Chih-han Yang, Shih-kang Lin, Hiroshi Nishikawa
QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY Vol. 41 No. 4 2023/12 Research paper (scientific journal)
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Impact of crystalline orientation on Cu-Cu solid-state bonding behavior by molecular dynamics simulations
Hiroaki Tatsumi, C.R. Kao, Hiroshi Nishikawa
Scientific Reports Vol. 13 2023/12 Research paper (scientific journal)
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Thermomechanical Properties of Zeta (Ag3In) Phase
Xunda Liu, Hiroaki Tatsumi, Zhi Jin, Zhong Chen, Hiroshi Nishikawa
Materials Vol. 16 2023/11 Research paper (scientific journal)
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Strength-enhanced Sn-In low-temperature alloy with surface-modified ZrO2 nanoparticle addition
Shunya Nitta, Hiroaki Tatsumi, Hiroshi Nishikawa
Journal of Materials Science: Materials in Electronics Vol. 34 2023/11 Research paper (scientific journal)
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Influence of Isothermal Aging on Microstructure and Shear Property of Novel Epoxy Composite SAC305 Solder Joints
Peng Zhang, Songbai Xue, Lu Liu, Jianhao Wang, Hiroaki Tatsumi, Hiroshi Nishikawa
Polymers Vol. 15 2023/10 Research paper (scientific journal)
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Enhanced reliability for power modules via a new Ag/Si sinter joining strategy
Yang Liu, Chuantong Chen, Koji S. Nakayama, Minoru Ueshima, Takeshi Sakamoto, Naoe Takuya, Hiroshi Nishikawa, Katsuaki Suganuma
Advancing Microelectronics Vol. 2023 No. EMPC p. 242-244 2023/09 Research paper (international conference proceedings)
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Effect of surface microstructure on joints using nanoporous Cu sheet for power devices
Hiroshi Nishikawa, Byungho Park, Mikiko Saito, Jun Mizuno
Proc. of the 24th European Microelectronics Packaging Conference (EMPC2023) 2023/09 Research paper (international conference proceedings)
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Interfacial Behavior Between Mold Resin and Sputtered Film Deposited on Electromagnetic Shield Packages
Soichi Homma, Daichi Okada, Akihito Sawanobori, Susumu Yamamoto, Takashi Imoto, Hiroshi Nishikawa
Journal of Smart Processing Vol. 12 No. 5 p. 291-298 2023/09 Research paper (scientific journal)
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「Sn-In/ZrO2ナノ粒子複合合金金におけるナノ粒子表面の分散性への影響
新田 隼也、巽 裕章、西川 宏
第33回マイクロエレクトロニクスシンポジウム(MES2023)論文集 p. 355-358 2023/09 Research paper (international conference proceedings)
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青色半導体レーザを用いた純銅リボンはんだ付プロセスの短時間化
貴田 優希, 巽 裕章, 竹中 啓輔, 佐藤 雄二, 塚本 雅裕, 西川 宏
第33回マイクロエレクトロニクスシンポジウム(MES2023)論文集 p. 291-294 2023/09 Research paper (international conference proceedings)
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Fabrication and thermo-mechanical properties of Ag9In4 intermetallic compound
Xunda Liu, Hiroaki Tatsumi, Zhi Jin, Zhong Chen, Hiroshi Nishikawa
Intermetallics Vol. 162 2023/08 Research paper (scientific journal)
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Comparative Study of Sn-based Solder Wettability on Aluminum Substrate
Jiahui Li, Hiroaki Tatsumi, Hiroshi Nishikawa
Quarterly Journal of the Japan Welding Society Vol. 41 2023/07 Research paper (scientific journal)
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Thermal conductivity and reliability reinforcement for sintered microscale Ag particle with AlN nanoparticles additive
Jianhao Wang, Shogo Yodo, Hiroaki Tatsumi, Hiroshi Nishikawa
Materials Characterization Vol. 203 2023/07 Research paper (scientific journal)
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Reliability-enhanced microscale Ag sintered joint doped with AlN nanoparticles
Jianhao Wang, Shogo Yodo, Hiroaki Tatsumi, Hiroshi Nishikawa
Materials Letters Vol. 349 2023/07 Research paper (scientific journal)
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A Novel and Cost-Effective Ag/Si Composited Paste With Highly Stable Microstructure Maintaince in Thermal Shock Cycles
Y. Liu, C. Chen, M. Ueshima, T. Sakamoto, T. Naoe, H. Nishikawa, K. Suganuma
Proc. of 2023 International Conference on Electronics Packaging (ICEP) 2023/04/19 Research paper (international conference proceedings)
Publisher: IEEE
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Impact Strength of Sn58Bi and Sn45Bi2.6Zn0.5In Solder Joints after Isothermal Aging
Zhi Jin, Shunsuke Fujiwara, Junichi Takenaka, Koichi Hagio, Hiroshi Nishikawa
Proc. of 2023 International Conference on Electronics Packaging (ICEP2023) 2023/04 Research paper (international conference proceedings)
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Effect of Etching Gas on Adhesion between Mold Resin and Sputtered Stainless Steel Ground Films in Electromagnetic Shield Packages
Soichi Homma, Daiachi Okada, Akihito Sawanobori, Susumu Yamamoto, Takashi Imoto, Hiroshi Nishikawa
Proc. of 2023 International Conference on Electronics Packaging (ICEP2023) 2023/04 Research paper (international conference proceedings)
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How to Enhance Sn-Bi Low-temperature Solder by Alloying
Shih-kang Lin, Chih-han Yang, Yu-chen Liu, Yuki Hirata, Hiroshi Nishikawa
Proc. of 2023 International Conference on Electronics Packaging (ICEP2023) 2023/04 Research paper (international conference proceedings)
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Failure Analysis of Joints Bonded by Ag-In Transient Liquid Phase Process during Shear Test
Xunda Liu, Hiroaki Tatsumi, Zhi Jin, Hiroshi Nishikawa
Proc. of 2023 International Conference on Electronics Packaging (ICEP2023) 2023/04 Research paper (international conference proceedings)
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Significant Consumption of Ni-P Layer in Ni-P/Sn-0.7Cu Solder Joints during Thermomigration
Satoshi Oya, Hiroaki Tatsumi, Hiroshi Nishikawa
Proc. of 2023 International Conference on Electronics Packaging (ICEP2023) 2023/04 Research paper (international conference proceedings)
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Microstructure and Property of Ag Sintered Joint Doping with AlN Nanoparticles
Jianhao Wang, Shogo Yodo, Hiroaki Tatsumi, Hiroshi Nishikawa
Proc. of 2023 International Conference on Electronics Packaging (ICEP2023) 2023/04 Research paper (international conference proceedings)
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Interfacial Intermetallic Compounds of Bi2Te3/Cu Joint using SAC305 Solder and Nano-Ag Paste
Seongwoo Pak, Hiroaki Tatsumi, Jianhao Wang, Hiroshi Nishikawa
Proc. of 2023 International Conference on Electronics Packaging (ICEP2023) 2023/04 Research paper (international conference proceedings)
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The Influence of Bi Content on Joint Properties using Sn-Bi-Zn-In Alloy
Hiroki Nakawaki, Hiroaki Tatsumi, Chih-han Yang, Shih-kang Lin, Hiroshi Nishikawa
Proc. of 2023 International Conference on Electronics Packaging (ICEP2023) 2023/04 Research paper (international conference proceedings)
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Molecular Dynamics Simulation of Cu-Cu Solid-State Bonding under Various Bonding Parameters
Hiroaki Tatsumi, C.R. Kao, Hiroshi Nishikawa
Proc. of 2023 International Conference on Electronics Packaging (ICEP2023) 2023/04 Research paper (international conference proceedings)
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The electromigration study of thin-film structured Sn3.5Ag and Ag using continuous observation and reliability enhancement approach
Zhi Jin, Fupeng Huo, Duy Le Han, Xunda Liu, Hiroaki Tatsumi, Y.C. Chan, Hiroshi Nishikawa
Thin Solid Films Vol. 774 No. 7 2023/04 Research paper (scientific journal)
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Thermomigration suppression in Sn3.5Ag solder joints by hot-end FeCoNiMn alloy
Yu-An Shen, Yun-Xuan Lin, Fan-Yi Ouyang, Hiroshi Nishikawa, Ming-Hung Tsai
Intermetallics Vol. 154 2023/03 Research paper (scientific journal)
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Overview of the JWRI Coupling Internship and its expansion, and a prospect of “JWRI HUST-OU” in Vietnam
KATSUMATA Mihoko, KONDOH Katsuyoshi, NISHIKAWA Hiroshi, TANAKA Manabu
JOURNAL OF THE JAPAN WELDING SOCIETY Vol. 92 No. 1 p. 42-48 2023/01 Research paper (scientific journal)
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銀シートを用いた固相拡散接合の接合強度にシート内残留応力が及ぼす影響
淀 将悟、巽裕章、西川 宏
第29回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 73-74 2023/01 Research paper (conference, symposium, etc.)
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青色半導体レーザ照射条件が純銅リボンのはんだ付継手特性に与える影響
貴田 優希、巽 裕章、佐藤 雄二、塚本 雅裕、西川 宏
第29回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 134-135 2023/01 Research paper (conference, symposium, etc.)
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Sn-Bi-Zn-In合金の機械的特性に及ぼすBi添加量の影響
中脇 啓貴、巽 裕章、Chih-han Yang、Shih-kang Lin、西川 宏
第29回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 132-133 2023/01 Research paper (conference, symposium, etc.)
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銀ナノ粒子ペースト焼結体のエレクトロマイグレーション現象における試験温度の影響
黒田 裕志、巽 裕章、西川 宏
第29回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 90-93 2023/01 Research paper (conference, symposium, etc.)
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Mechanical properties of transient liquid phase bonded joints by using Ag-In sandwich structure
Xunda Liu, Zhi Jin, Hiroaki Tatsumi, Hiroshi Nishikawa
Proc. of 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) p. 71-75 2023/01 Research paper (international conference proceedings)
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次世代パワー半導体デバイスのダイアタッチ向け焼結型接合技術
西川 宏
鉱山 Vol. 75 No. 9 p. 175-183 2022/12
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Development of crack-less and deformation-resistant electroplated Ni/electroless Ni/Pt/Ag metallization layers for Ag-sintered joint during a harsh thermal shock
Yang Liu, Chuantong Chen, Zheng Zhang, Minoru Ueshima, Takeshi Sakamoto, Takuya Naoe, Hiroshi Nishikawa
Materials & Design Vol. 224 2022/12 Research paper (scientific journal)
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Study on the SPCC and CFRTP Hybrid Joint Performance Produced with Additional Nylon-6 Interlayer by Ultrasonic Plastic Welding
Tai Wang, Kiyokazu Yasuda, Hiroshi Nishikawa
Polymers Vol. 14 No. 23 p. 5235-5235 2022/12/01 Research paper (scientific journal)
Publisher: MDPI AG
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Sintered Bonding Process Using Sheet-Like Insert Materials
Hiroshi Nishikawa
Journal of The Japan Institute of Electronics Packaging Vol. 25 No. 7 p. 685-690 2022/11
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Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere
Siliang He, Yu-An Shen, Bifu Xiong, Fupeng Huo, Jiahui Li, Jinguo Ge, Zhiliang Pan, Wangyun Li, Chuan Hu, Hiroshi Nishikawa
Journal of Materials Research and Technology Vol. 21 p. 2352-2362 2022/11 Research paper (scientific journal)
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Contact angle analysis and intermetallic compounds formation between solders and substrates under formic acid atmosphere
Siliang He, Yuhao Bi, Yu-An Shen, Zhikuan Chen, Gao Yue, Chuan Hu, Hiroshi Nishikawa
Journal of Advanced Joining Processes Vol. 6 2022/11 Research paper (scientific journal)
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Novel interface regulation of Sn1.0Ag0.5Cu composite solders reinforced with modified ZrO2: Microstructure and mechanical properties
Fupeng Hou, Zhi Jin, Duy Le Han, Jiahui Li, Keke Zhang, Hiroshi Nishikawa
Journal of Materials Science & Technology Vol. 125 p. 157-170 2022/10 Research paper (scientific journal)
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Effect of low Bi content on mechanical properties of Sn-Bi-Zn-In alloy and its joint with Cu
Hiroshi Nishikawa, Yuki Hirata, Chih-han Yang, Shih-kang Lin
Proc. of the 2022 9th Electonics System-Integration Technology Conference p. 146-1-146-4 2022/09 Research paper (international conference proceedings)
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Anisotropic Highly Conductive Joints utilizing Cu-Solder Microcomposite Structure for High-Temperature Electronics Packaging
Hiroaki Tatsumi, Hiroshi Nishikawa
Materials & Design Vol. 223 2022/09 Research paper (scientific journal)
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Preparation and Evaluation of Sn-In Alloys with Surface-Modified ZrO2 Nanoparticles
Proceedings of the 32nd Microelectronics Symposium (MES2022) p. 199-202 2022/09 Research paper (conference, symposium, etc.)
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Sintered Bonding Process Using Surface Nanostructured Materials for Die Bonding
Hiroshi Nishikawa
Kagaku to Kogyu Vol. 96 No. 8 p. 232-239 2022/08
-
Fabrication of micron-sized protrusions on metal surface for metal/polymer easy-disassembly joining by selective laser melting technology
Tai Wang, Kiyokazu Yasuda, Hiroshi Nishikawa
Materials & Design Vol. 220 2022/08 Research paper (scientific journal)
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Highly efficient soldering of Sn-Ag-Cu solder joints using blue laser
Hiroaki Tatsumi, Seiji Kaneshita, Yuki Kida, Yuji Sato, Masahiro Tsukamoto, Hiroshi Nishikawa
Journal of Manufacturing Processes Vol. 82 p. 700-707 2022/08 Research paper (scientific journal)
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Effect of isothermal aging on properties of In-48Sn and In-Sn-8Cu alloys
Duy Le Han, Hiroaki Tatsumi, Fupeng Huo, Hiroshi Nishikawa
Proc. of 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) p. 2148-2152 2022/07 Research paper (international conference proceedings)
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Solid-State Bonding Behavior between Surface-Nanostructured Cu and Au: A Molecular Dynamics Simulation
Hiroaki Tatsumi, C.R. Kao, Hiroshi Nishikawa
Scientific Reports Vol. 12 2022/07 Research paper (scientific journal)
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Electromigration Comparison Study of Sn, Ag, and Cu Stripes Fabricated by Electron-Beam Physical Vapor Deposition
Zhi Jin, Fupeng Huo, Xunda Liu, Hiroshi Nishikawa
Proc. of 2022 International Conference on Electronics Packaging (ICEP2022) p. 203-204 2022/05 Research paper (international conference proceedings)
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Reliability Evaluation on Ag Sintering Die Attach for SiC Power Modules During Long-term Thermal Aging/cycling
Y. Liu, C. Chen, M. Ueshima, T. Sakamoto, T. Naoe, H. Nishikawa, K. Suganuma
Proc. of 2022 International Conference on Electronics Packaging (ICEP2022) p. 49-50 2022/05 Research paper (international conference proceedings)
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Mechanical Properties of Sn-Bi-Ag low-temperature Pb-free Solders
Chih-han Yang, Yu-chen Liu, Yuki Hirata, Hiroshi Nishikawa, Shih-kang Lin
Proc. of 2022 International Conference on Electronics Packaging (ICEP2022) p. 37-38 2022/05 Research paper (international conference proceedings)
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Adhesion mechanism between mold resin and sputtered copper for electromagnetic wave shield packages
Soichi Homma, Masaya Shima, Yuusuke Takano, Takeshi Watanabe, Kazuhiro Murakami, Masatoshi Fukuda, Takashi Imoto, Hiroshi Nishikawa
Thin Solid Films Vol. 750 2022/05 Research paper (scientific journal)
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Synthesis of Hierarchical Structured Cu-Sn Alloy Mesoparticles and Its Application of Cu-Cu Joint Materials
Toshihiro Kuzuya, Toma Takedachi, Tetsuya Ando, Yasuharu Matsunaga, Ryouya Kobayashi, Yoshihiro Shimotori, Naofumi Nakazato, Hiroshi Nishikawa, Takuya Naoe
Materials Transactions Vol. 63 No. 6 p. 794-799 2022/05 Research paper (scientific journal)
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High-strength Sn-Bi-based low-temperature solders with high toughness designed via high-throughput thermodynamic modelling
Chih-han Yang, Yu-chen Liu, Yuki Hirata, Hiroshi Nishikawa, Shih-kang Lin
Science and Technology of Welding and Joining Vol. 27 No. 7 p. 572-578 2022/05 Research paper (scientific journal)
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Robust shear strength of Cu-Au joint on Au surface-finished Cu disks by solid-state nanoporous Cu bonding
Byungho Park, Mikiko Saito, Jun Mizuno, Hiroshi Nishikawa
Microelectronics Engineering Vol. 260 2022/05 Research paper (scientific journal)
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Novel transient liquid phase bonding method using In-coated Cu sheet for high-temperature die attach
Jianhao Wang, Xunda Liu, Fupeng Huo, Kento Kariya, Noriyuki Masago, Hiroshi Nishikawa
Materials Research Bulletin Vol. 149 2022/05 Research paper (scientific journal)
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Effect of various parameters on the shear strength of solid-state nanoporous Cu bonding in Cu-Cu disks for power device packaging
Byungho Park, Duy Le Han, Mikiko Saito, Jun Mizuno, Hiroshi Nishikawa
Journal of Electronic Materials Vol. 51 No. 7 p. 3851-3862 2022/04 Research paper (scientific journal)
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Effect of Aluminum Clad Cu Wire Bonds on Power Cycle Lifetime for High Current Density Power Module Packages
Fumiyoshi KAWASHIRO, Masaaki YOSHIKAWA, Eitaro MIYAKE, Yoshiki ENDO, Tatsuo TONEDACHI, Hiroshi NISHIKAWA
Journal of Smart Processing Vol. 11 No. 2 p. 71-77 2022/03 Research paper (scientific journal)
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Adhesion Mechanism between Mold Resin and Sputtered Stainless Steel Ground Films for Electromagnetic Wave Shield Packages
Soichi Homma, Yuusuke Takano, Takeshi Watanabe, Kazuhiro Murakami, Masatoshi Fukuda, Takashi Imoto, Hiroshi Nishikawa
Materials Transactions Vol. 63 No. 6 p. 766-775 2022/03 Research paper (scientific journal)
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大阪大学カップリング・インターンシップにおける成果プロセス(プログラムの質的向上を目指して)
寺西 未沙, 勝又 美穂子, 西川 宏, 近藤 勝義, 田中 学
グローバル人材育成教育研究 Vol. 9 No. 2 p. 95-108 2022/03 Research paper (scientific journal)
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大阪大学カップリング・インターンシップ実施中の「参加者の認識の変化調査」に関する結果と考察(プログラム活動の認識変化への影響とは)
勝又 美穂子, 橋本 智恵, 西川 宏, 近藤 勝義
グローバル人材育成教育研究 Vol. 9 No. 2 p. 51-60 2022/03
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Three-dimensional interface and property of SnPb solder joint under extreme thermal shocking
Jianhao Wang, Songbai Xue, Lu Liu, Peng Zhang, Hiroshi Nishikawa
Science and Technology of Welding and Joining Vol. 27 No. 3 p. 186-196 2022/03 Research paper (scientific journal)
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Electrodeposition of nanocrystalline Cu for Cu-Cu direct bonding
Jhih-Jhu Jhana, Kazutoshi Wataya, Hiroshi Nishikawa, Chih-Ming Chen
Journal of the Taiwan Institute of Chemical Engineers Vol. 132 2022/03 Research paper (scientific journal)
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Effect of low Bi content of reliability of Sn-Bi alloy joints before and after thermal aging
Hiroshi Nishikawa, Yuki Hirata, Chih-han Yang, Shih-kang Lin
JOM Vol. Online 2022/02 Research paper (scientific journal)
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Surface modification of Cu electroplated layers for Cu-Sn transient liquid phase bonding
Shao-Yu Hsu, Chih-Ming Chen, Jenn-Ming Song, Hiroshi Nishikawa
Materials Chemistry and Physics Vol. 277 2022/02 Research paper (scientific journal)
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銀ナノペースト焼結体のエレクトロマイグレーション現象評価
黒田 裕志, 金 智, 巽 裕章, 西川 宏
第28回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 313-314 2022/02 Research paper (conference, symposium, etc.)
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ダイアタッチ用表面微細構造Cuシートの提案
綿谷 一駿, 朴 炳浩, 巽 裕章, 西川 宏
第28回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 108-111 2022/02 Research paper (conference, symposium, etc.)
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レーザはんだ付におけるはんだ溶融挙動の観察と継手の特性評価
金下 征司, 佐藤 雄二, 巽 裕章, 塚本 雅裕, 西川 宏
第28回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 84-87 2022/02 Research paper (conference, symposium, etc.)
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Sintered Bonding Process Using Surface Nanostructured Sheet
Hiroshi Nishikawa
Journal of The Surface Finishing Society of Japan Vol. 72 No. 12 p. 679-682 2021/12
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Microstructure evolution and shear strength of Tin-Indium-xCu/Cu joints
Duy Le Han, Yu-An Shen, Fupeng Huo, Hiroshi Nishikawa
Metals Vol. 12 2021/12 Research paper (scientific journal)
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The influence of porosity and pore shape on the thermal conductivity of silver sintered joint for die attach
Yong-Jae Kim, Byung-Ho Park, Soong-Keun Hyun, Hiroshi Nishikawa
Materials Today Communications Vol. 29 2021/12 Research paper (scientific journal)
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Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment
Chin-Hao Tsai, Wei-Chen Huang, Ly May Chew, Wolfgang Schmitt, Jiahui Li, Hiroshi Nishikawa, C.R. Cao
Journal of Materials Research and Technology Vol. 15 p. 4541-4553 2021/11 Research paper (scientific journal)
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Interface design and the strengthening-ductility behavior of tetra-needle-like ZnO whisker reinforced Sn1.0Ag0.5Cu composite solders prepared with ultrasonic agitation
Fupeng Hou, Zhi Jin, Duy Le Han, Keke Zhang, Hiroshi Nishikawa
Materials & Design Vol. 210 2021/11 Research paper (scientific journal)
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300℃高温放置によるマイクロサイズ銀粒子焼結層の微細組織変化
淀 将悟, 霍 福?, 西川 宏
第31回マイクロエレクトロニクスシンポジウム (MES2021) p. 159-162 2021/09 Research paper (conference, symposium, etc.)
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Fabrication of NiO/ZrO2 nanocomposites using ball milling-pyrolysis method
Fupeng Hou, Yu-An Shen, Siliang He, Keke Zhang, Hiroshi Nishikawa
Vacuum Vol. 191 2021/09 Research paper (scientific journal)
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マイクロエレクトロニクス実装分野で求められる新たなマイクロ接合技術
西川 宏
生産と技術 Vol. 73 No. 4 p. 15-17 2021/09
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Large-area and low-cost Cu-Cu bonding with cold spray deposition, oxidation and reduction processes under low-temperature conditions
Juncai Hou, Qiumei Zhang, Siliang He, Jingru Bian, Jinting Jiu, Chengxin Li, Hiroshi Nishikawa
Journal of Materials Science: Materials in Electronics Vol. 32 p. 20461-20473 2021/08 Research paper (scientific journal)
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Fabrication and characterization of nanoporous copper through chemical dealloying of cold-rolled Mn-Cu alloy
Byungho Park, Duy Le Han, Mikiko Saito, Jun Mizuno, Hiroshi Nishikawa
Journal of Porous Materials Vol. On line 2021/07 Research paper (scientific journal)
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The reliability of ENIG joint bonded by In-coated Cu sheet
Hiroshi Nishikawa, Jianhao Wang, Kento Kariya, Noriyuki Masago
Proc. of 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) p. 520-525 2021/06 Research paper (international conference proceedings)
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The effect of solid-state nanoporous Cu bonding for power device
Byungho Park, Duy Le Han, Mikiko Saito, Jun Mizuno, Hiroshi Nishikawa
Proc. of 2021 International Conference on Electronics Packaging (ICEP2021) p. 159-160 2021/05 Research paper (international conference proceedings)
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Effect of 4.0 mass% Cu addition on microstructure and mechanical properties of In-48Sn alloy
Duy Le Han, Byungho Park, Hiroshi Nishikawa
Proc. of 2021 International Conference on Electronics Packaging (ICEP2021) p. 139-140 2021/05 Research paper (international conference proceedings)
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Surface modification of tetra-needle like ZnO (T-ZnO) and characterization of interface between Sn1.0Ag0.5Cu and NiO decorated T-ZnO
Fupeng Hou, Keke Zhang, Hiroshi Nishikawa
Proc. of 2021 International Conference on Electronics Packaging (ICEP2021) p. 133-134 2021/05 Research paper (international conference proceedings)
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The voids growth path on Sn-Ag thin film under high current density
Zhi Jin, Yu-An Shen, Yang Zuo, S. H. Mannan, Hiroshi Nishikawa
Proc. of 2021 International Conference on Electronics Packaging (ICEP2021) p. 115-116 2021/05 Research paper (international conference proceedings)
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Improvements in mechanical properties of Sn-Bi alloys with addition of Zn and In
Yuki Hirata, Chih-han Yang, Shih-kang Lin, Hiroshi Nishikawa
Materials Science and Engineering: A Vol. 813 2021/05 Research paper (scientific journal)
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Observation of Void Formation Patterns in SnAg Films undergoing Electromigration and Simulation using Random Walk Methods
Zhi Jin, Yu-An Shen, Yang Zuo, Y. C. Chan, S. H. Mannan, Hiroshi Nishikawa
Scientific Reports Vol. 11 2021/04 Research paper (scientific journal)
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大阪大学カップリング・インターンシップにおけるキャリア教育的効果について(実践型短期海外インターンシップ成果報告書からの分析)
寺西 未沙、勝又 美穂子、西川 宏、近藤 勝義、田中 学
グローバル人材育成教育研究 Vol. 8 No. 2 p. 1-12 2021/03 Research paper (scientific journal)
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文理・異文化融合課題解決型グローバル人材育成プログラムが参加学生の進路検討に与える効果(カップリング・インターンシップ参加学生の進路追跡調査より)
橋本 智恵、勝又 美穂子、西川 宏、近藤 勝義
グローバル人材育成教育研究 Vol. 8 No. 2 p. 45-53 2021/03
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Sn-Bi-Zn-In合金を用いた接合部の特性評価
平田 侑希, Chih-han YANG, Shin-kang LIN, 西川 宏
第27回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 27 p. 298-301 2021/02 Research paper (conference, symposium, etc.)
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青色半導体レーザを用いたレーザはんだ付継手の界面評価
金下 征司, 佐藤 雄二, 塚本 雅裕, 西川 宏
第27回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 320-321 2021/02 Research paper (conference, symposium, etc.)
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Cu-Zn合金の腐食を利用したCu微細構造による接合プロセスの検討
綿谷 一駿, 朴 炳浩, 西川 宏
第27回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 229-230 2021/02 Research paper (conference, symposium, etc.)
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Effect of Cu addition on the microstructure and mechanical properties of In-Sn-based low-temperature alloy
Duy Le Han, Yu-An Shen, Siliang He, Hiroshi Nishikawa
Materials Science and Engineering: A Vol. 804 2021/02 Research paper (scientific journal)
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Electromigration Behavior of Silver Thin Film Fabricated by Electron-Beam Physical Vapor Deposition
Zhi Jin, Yu-An Shen, Fupeng Huo, Y. C. Chan, Hiroshi Nishikawa
Journal of Materials Science Vol. 56 p. 9769-9779 2021/02 Research paper (scientific journal)
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Investigation of FeCoNiCu properties: thermal stability, corrosion behavior, wettability with Sn-3.0Ag-0.5Cu and interlayer formation of multi-element intermetallic compound
Yu-An Shen, Han-Ming Hsieh, Shih-Hsun Chen, Jiahui Li, Sheng-Wen Chen, Hiroshi Nishikawa
Applied Surface Science Vol. 546 2021/01 Research paper (scientific journal)
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Microstructures analysis and quantitative strengthening evaluation of powder metallurgy Ti-Fe binary extruded alloys with (α+β)-dual-phase
Junko Umeda, Takayuki Tanaka, Takuma Teramae, Shota Kariya, Junji Fujita, Hiroshi Nishikawa, Yoji Shibutani, Jianghua Shen, Katsuyoshi Kondoh
Materials Science and Engineering: A Vol. 803 2021/01 Research paper (scientific journal)
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レーザはんだ付の特徴
西川 宏
UYEMURA TECHNICAL REPORTS Vol. 80 p. 3-10 2020/11
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Sintered joint using micro-sized Ag particles for high-temeprature application
Hiroshi Nishikawa
Journal of Smart Processing Vol. 9 No. 6 p. 259-263 2020/11
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Effects of minor element addition on mechanical properties of Sn-Bi alloy
Yuki Hirata, Chih-han Yang, Shih-kang Lin, Hiroshi Nishikawa
Proc. of 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference 2020/10 Research paper (international conference proceedings)
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Mechanical and microstructural enhancements of Ag microparticle-sintered joint by ultrasonic vibration
Runhua Gao, Yu-An Shen, Jiahui Li, Siliang He, Hiroshi Nishikawa
Journal of Materials Science: Materials in Electronics Vol. 31 p. 21711-21722 2020/10 Research paper (scientific journal)
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Effect of surface potential distribution on corrosion behavior of Cu/Al interface in Cu wire bonding applications
Omid Mokhtari, Hiroshi Nishikawa
Microelectronics Reliability Vol. 113 2020/09 Research paper (scientific journal)
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Textile-based Passive Sensor for Air Humidity
Han He, Xiaochen Chen, Zahangir Khan, Lauri Sydanheimo, Leena Ukkonen, Jiahui Li, Hiroshi Nishikawa, Johanna Virkki
Proc. of 8th Electronics System-Integration Technology Conference p. 7-9 2020/09 Research paper (international conference proceedings)
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Effect of High-temperature Storage at 300 ℃ on Sintered Layer using Micro-sized Ag Particles for High-temperature Packaging Technology
Hiroshi Nishikawa, Sota Yamano
Proc. of 8th Electronics System-Integration Technology Conference p. 126-129 2020/09 Research paper (international conference proceedings)
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Metal Deposition Using Solutions on High-Density and Well-Aligned CNTs
Mikiko Saito, Hiroyuki Kuwae, Jun Mizuno, Wataru Norimatsu, Michiko Kusunoki, Hiroshi Nishikawa
Proc. of 8th Electronics System-Integration Technology Conference p. 43-47 2020/09 Research paper (international conference proceedings)
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Isolation and Characterization of Facultative-Anaerobic Antimonate-Reducing Bacteria
Ziran Yang, Hisaaki Hosokawa, Takuya Sadakane, Masashi Kuroda, Daisuke Inoue, Hiroshi Nishikawa, Michihiko Ike
Microorganisms Vol. 8 No. 9 p. 1435-1435 2020/09 Research paper (scientific journal)
Publisher: MDPI AG
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Interfacial Transformation of Preoxidized Cu Microparticles in a Formic-Acid Atmosphere for Pressureless Cu-Cu Bonding
Runhua Gao, Siliang He, Jiahui Li, Yu-An Shen, Hiroshi Nishikawa
Journal of Materials Science: Materials in Electronics Vol. 31 p. 14635-14644 2020/08 Research paper (scientific journal)
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Sintered Micro-Silver Paste Doped with Indium for Die Attachment Applications of Power ICs
Chin-Hao Tsai, Wei-Chen Huang, C. Robert Kao, Ly May Chew, Wolfgang Schmitt, Hiroshi Nishikawa
Proc. of 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) p. 1430-1435 2020/05 Research paper (international conference proceedings)
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Microstructure and mechanical properties of the In-48Sn-xAg low-temperature alloy
Duy Le Han, Yu-An Shen, Sanghun Jin, Hiroshi Nishikawa
Journal of Materials Science Vol. 55 p. 10824-10832 2020/04 Research paper (scientific journal)
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Fabrication of Nanoporous Cu Sheet and Application to Bonding for High-Temperature Applications
Shunichi Koga, Hiroshi Nishikawa, Mikiko Saito, Jun Mizuno
Journal of Electronic Materials Vol. 49 No. 3 p. 2151-2158 2020/03 Research paper (scientific journal)
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Wettability, interfacial reactions, and impact strength of Sn-3.0Ag-0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere
Siliang He, Runhua Gao, Yu-An Shen, Jiahui Li, Hiroshi Nishikawa
Journal of Materials Science Vol. 55 No. 7 p. 3107-3117 2020/03 Research paper (scientific journal)
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はんだ/基板材料間のガルバニック腐食特性への金属間化合物の影響
井上 健司, 西川 宏
第26回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 26 p. 381-382 2020/01 Research paper (conference, symposium, etc.)
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In, Znの微量添加によるSn-Bi合金の機械的特性改善
平田 侑希, 周 士祺, 楊 智涵, 林 士剛, 西川 宏
第26回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 26 p. 379-380 2020/01 Research paper (conference, symposium, etc.)
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外部電極形状がSnウィスカの成長に及ぼす影響
斎藤 彰, 西川 宏
第26回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 26 p. 199-204 2020/01 Research paper (conference, symposium, etc.)
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基板材料がSn-Ag-Cuはんだ接合部の熱疲労特性に与える影響
森下 真衣, 楢崎 邦男, 麻 寧緒, 西川 宏
第26回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 26 p. 65-68 2020/01 Research paper (conference, symposium, etc.)
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パワーサイクル試験におけるダイボンド部の劣化挙動
金黒 秀平, 佐々木 喜七, 西川 宏
第26回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 26 p. 51-54 2020/01 Research paper (conference, symposium, etc.)
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In-situ observation of fluxless soldering of Sn-3.0Ag-0.5Cu/Cu under a formic acid atmosphere
Siliang He, Runhua Gao, Jiahui Li, Yu-An Shen, Hiroshi Nishikawa
Materials Chemistry and Physics Vol. 239 2020/01 Research paper (scientific journal)
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Effect of Zn addition on interfacial reactions and mechanical properties between eutectic Sn58Bi solder and ENIG substrate
Shiqi Zhou, Siliang He, Hiroshi Nishikawa
Journal of Nanoscience and Nanotechnology Vol. 20 No. 1 p. 106-112 2020/01 Research paper (scientific journal)
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Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology
Yu-An Shen, Shiqi Zhou, Jiahui Li, Chih-han Yang, Sijie Huang, Shih-kang Lin, Hiroshi Nishikawa
Materials & Design Vol. 183 2019/12 Research paper (scientific journal)
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Novel polarity effect on intermetallic compound thickness changes during electromigration in Cu/Sn-3.0Ag-0.5Cu/Cu solder joints
Zhi Jin, Yu-An Shen, Siliang He, Shiqi Zhou, Y. C. Chan, Hiroshi Nishikawa
Journal of Applied Physics Vol. 126 No. 18 2019/11 Research paper (scientific journal)
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Biosynthesis of bismuth selenide nanoparticles using chalcogen-metabolizing bacteria
Masashi Kuroda, Soshi Suda, Mamoru Sato, Hiroyuki Ayano, Yuji Ohishi, Hiroshi Nishikawa, Satoshi Soda, Michihiko Ike
Applied Microbiology and Biotechnology Vol. 103 p. 8853-8861 2019/10 Research paper (scientific journal)
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有限要素法を用いた熱疲労特性に与えるSn-Ag-Cuはんだ接合部形状の影響評価
森下 真衣, 麻 寧緒, 楢崎 邦男, 西川 宏
第29回マイクロエレクトロニクスシンポジウム論文集 p. 135-138 2019/09 Research paper (other academic)
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Auナノポーラスシートを用いた接合部のパワーサイクル試験における長期信頼性評価
金黒 秀平, 佐々木 喜七, 西川 宏
第29回マイクロエレクトロニクスシンポジウム論文集 p. 19-22 2019/09 Research paper (other academic)
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高温環境下でのAg焼結層組織変化の定量評価
山野 聡太, 眞砂 紀之, 苅谷 健人, 西川 宏
第29回マイクロエレクトロニクスシンポジウム論文集 p. 187-188 2019/09 Research paper (other academic)
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Effect of bonding temperature on shear strength of joints using micro-sized Ag particles for high temperature packaing technokigy
Hiroshi Nishikawa, Myong-Hooh Roh, Akira Fujita, Nobuo Kamada
Proc. of 22nd Microelectronics and Packaging Conference (EMPC) p. MT-12-1-MT-12-4 2019/09 Research paper (international conference proceedings)
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Tin Whisker Growth Mechanism on Tin Plating of MLCCs Mounted with Sn-3.5Ag-8In-0.5Bi Solder in 30deg C 60%RH
Akira Saito, Hiroshi Nishikawa
Proc. of 22nd Microelectronics and Packaging Conference (EMPC) p. R&Q-02-1-R&Q-02-4 2019/09 Research paper (international conference proceedings)
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Interfacial reaction behavior and mechanical properties of pure aluminum and magnesium alloy dissimilar materials fabricated by hot press and heat treatment
Junko Umeda, Katsuyoshi Kondoh, Hiroyuki Sannomiya, Tachai Luangvaranunt, Makoto Takahashi, Hiroshi Nishikawa
Materials Characterization Vol. 157 2019/08 Research paper (scientific journal)
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Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate
Junghwan Bang, Dong-Yuri Yu, Yong-Ho Ko, Jun-Hyuk Son, Hiroshi Nishikawa, Chang-Woo Lee
Microelectronics Reliability Vol. 99 p. 62-73 2019/08 Research paper (scientific journal)
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Effect of copper over-pad metallization on reliability of aluminum wire bonds
Fumiyoshi Kawashiro, Kentaro Takao, Tatsuya Kobayashi, Masaaki Yoshikawa, Eitaro Miyake, Toshiki Endo, Tatsuo Tonedachi, Hiroshi Nishikawa
Microelectronics Reliability Vol. 99 p. 168-176 2019/08 Research paper (scientific journal)
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Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging
Yu-An Shen, Chun Ming Lin, Jiahui Li, Runhua Gao, Hiroshi Nishikawa
Scientific Reports Vol. 9 2019/07 Research paper (scientific journal)
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Bonding strength of Cu/Cu joints using sintering process of micro-sized Cu particles for high-temperature application
Hiroshi Nishikawa, Xiangdong Liu
Proc. of IMAPS High Temperature Electronics Network (HiTEN 2019) p. 85-90 2019/07 Research paper (international conference proceedings)
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Microstructure and mechanical properties of Sn-1.0Ag-0.5Cu solder with minor Zn additions
Y. M. Leong, A. S. M. A. Haseeb, Hiroshi Nishikawa, Omid Mokhtari
Journal of Materials Science: Materials in Electoronics Vol. 30 No. 13 p. 11914-11922 2019/07 Research paper (scientific journal)
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Preferred Orientation of Bi and Effect of Sn-Bi Microstructure on Mechanical and Thermomechanical Properties in Eutectic Sn-Bi Alloy
Yu-An Shen, Shiqi Zhou, Sijie Huang, Hiroshi Nishikawa
Materialia Vol. 6 2019/06 Research paper (scientific journal)
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The newly developed Sn-Bi-Zn alloy with a low melting point, improved ductility, and high ultimate tensile strength
Shiqi Zhou, Chih-han Yang, Yu-An Shen, Shih-kang Lin, Hiroshi Nishikawa
Materialia Vol. 6 2019/06 Research paper (scientific journal)
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Microstructure and Property Changes in Cu/Sn-58Bi/Cu Solder Joints during Thermomigration
Yu-An Shen, Shiqi Zhou, Jiahui Li, K. N. Tu, Hiroshi Nishikawa
Proceeding of 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) p. 2003-2008 2019/05 Research paper (international conference proceedings)
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Effects of In and Zn Double Addition on Eutectic Sn-58Bi Alloy
Shiqi Zhou, Yu-An Shen, Hiroshi Nishikawa, Tiffani Uresti, Vasanth C. Shunmugasamy, Bilal Mansoor
Proceeding of 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) p. 1081-1086 2019/05 Research paper (international conference proceedings)
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Effects of In Content on the Microstructure and Mechanical Properties of In-Bi Alloys During Isothermal Aging
Sanghun Jin, Omid Mokhtari, Shutetsu Kanayama, Hiroshi Nishikawa
Metals Vol. 9 No. 5 2019/05 Research paper (scientific journal)
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Bonding strength of Cu-to-Cu joints using Cu cold spray deposition by an oxidation and reduction process for power device package
Juncai Hou, Chengxin Li, Sijie Huang, Hiroshi Nishikawa
Proc. of 2019 International Conference of Electronics Packaging (ICEP) p. 432-436 2019/04 Research paper (international conference proceedings)
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Development of Sn-Bi-In-Ga quaternary low-temperature solders
Chih-han Yang, Shiqi Zhou, Shih-kang Lin, Hiroshi Nishikawa
Proc. of 2019 International Conference of Electronics Packaging (ICEP) p. 367-369 2019/04 Research paper (international conference proceedings)
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The study of Sn-45Bi-2.6Zn alloy before and after thermal aging
Shiqi Zhou, Chih-han Yang, Yu-An Shen, Shih-kang Lin, Hiroshi Nishikawa
Proc. of 2019 International Conference of Electronics Packaging (ICEP) p. 333-336 2019/04 Research paper (international conference proceedings)
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A Cu-Cu Bonding Method Using Preoxidized Cu Microparticles under Formic Acid Atmosphere
Runhua Gao, Jiahui Li, Yu-An Shen, Hiroshi Nishikawa
Proc. of 2019 International Conference of Electronics Packaging (ICEP) p. 159-162 2019/04 Research paper (international conference proceedings)
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Improved mechanical properties induced by In and In & Zn double additions to eutectic Sn58Bi alloy
Shiqi Zhou, Yu-An Shen, Tiffani Uresti, Vasanth C.Shunmugasamy, Bilal Mansoor, Hiroshi Nishikawa
Journal of Materials Science: Materials in Electoronics Vol. 30 No. 8 p. 7423-7434 2019/04 Research paper (scientific journal)
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Effect of Substrates on Fracture Mechanism and Process Optimization of Oxidation-Reduction Bonding with Copper Microparticles
Runhua Gao, Siliang He, Yu-An Shen, Hiroshi Nishikawa
Journal of Electronic Materials Vol. 48 No. 4 p. 2263-2271 2019/04 Research paper (scientific journal)
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Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder
Yu-An Shen, Chun-Ming Lin, Jiahui Li, Siliang He, Hiroshi Nishikawa
Scientific Reports Vol. 9 p. 3658-3658 2019/03 Research paper (scientific journal)
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銅ナノ粒子を利用した焼結接合技術
西川 宏
金属 Vol. 89 No. 3 p. 8-12 2019/03
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Thermomigration Induced Microstructure and Property Changes in Sn-58Bi Solders
Yu-An Shen, Shiqi Zhou, Jiahui Li, K.N. Tu, Hiroshi Nishikawa
Materials & Design Vol. 166 2019/03 Research paper (scientific journal)
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Effect of Substrates on Fracture Mechanism and Process Optimization of Oxidation-Reduction Bonding with Copper Microparticles
Runhua Gao, Siliang He, Yu-An Shen, Hiroshi Nishikawa
Journal of Electronic Materials p. PDF Available-PDF Available 2019/02 Research paper (scientific journal)
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A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders
Chih-han Yang, Shiqi Zhou, Shih-kang Lin, Hiroshi Nishikawa
Materials Vol. 12 No. 4 2019/02 Research paper (scientific journal)
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パワーサイクル試験におけるダイボンド部劣化状況の熱抵抗測定による評価
金黒 秀平, 佐々木 喜七, 西川 宏
第25回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 397-398 2019/01 Research paper (other academic)
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Sn-Ag-Inはんだ実装品におけるSnウィスカ成長メカニズム
斎藤 彰, 西川 宏
第25回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 261-266 2019/01 Research paper (other academic)
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Cuナノポーラスシートを用いた接合部の劣化挙動の解明
古賀 俊一, 齋藤 美紀子, 水野 潤, 西川 宏
第25回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 73-76 2019/01 Research paper (other academic)
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銅及び銅合金の溶接技術(3)
西川 宏
Jitsu・Ten 実務&展望 Vol. 52 No. 1 p. 17-21 2019/01
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Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy
Shiqi Zhou, Chih-han Yang, Shih-kang Lin, Abdulaziz Nasser AlHazaa, Omid Mokhtari, Xiangdong Liu, Hiroshi Nishikawa
Materials Science and Engineering: A Vol. 744 p. 560-569 2019/01 Research paper (scientific journal)
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Development of Multiple Laser Beam Irradiation Method for Precision Laser Cladding of Metal
Kohei Asano, Masahiro Tsukamoto, Yoshinori Funada, Yu Sakon, Kento Morimoto, Yuji Sato, Shin-ichiro Masuno, Takahiro Hara, Hiroshi Nishikawa
The Review of Laser Engineering Vol. 46 No. 10 p. 604-613 2018/10 Research paper (scientific journal)
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Low Temperature Flip Chip Bonding Using Squeegee-Embedded Au Nanoporous Bump Activated by VUV/O3 Treatment
Weixin Fu, Tatsushi Kaneda, Akiko Okada, Kaori Matsunaga, Shuichi Shoji, Mikiko Saito, Hiroshi Nishikawa, Jun Mizuno
Journal of Electronic Materials Vol. 47 No. 10 p. 5952-5958 2018/10 Research paper (scientific journal)
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Microstructure and mechanical properties of indium-bismuth alloys for low melting-temperature solder
Sanghun Jin, Min-Su Kim, Shutetsu Kaneyama, Hiroshi Nishikawa
Journal of Materials Science: Materials in Electoronics Vol. 29 No. 19 p. 19460-19468 2018/10 Research paper (scientific journal)
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Enhancement of nano-silver chip attachment by using transient liquid phase reaction with indium
C. A. Yang, S. Yang, X. Liu, H. Nishikawa, C. R. Kao
Journal of Alloys and Compounds Vol. 762 p. 586-597 2018/09/25 Research paper (scientific journal)
Publisher: Elsevier Ltd
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異種金属を用いたナノポーラス構造による界面形成現象の比較
古賀 俊一, 齋藤 美紀子, 水野 潤, 西川 宏
第28回マイクロエレクトロニクスシンポジウム論文集 p. 273-276 2018/09 Research paper (other academic)
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銅及び銅合金の溶接技術(2)
西川 宏
Jitsu・Ten 実務&展望 Vol. 51 No. 5 p. 22-27 2018/09
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Textile-Integrated Stretchable Structures for Wearable Wireless Platforms
Han He, Xiaochen Chen, Omid Mokhtari, Hiroshi Nishikawa, Leena Ukkonen, Johanna Virkki
Proc. of 7th Electronics System-Integration Technology Conference p. INTS3A-6:1-INTS3A-6:4 2018/09 Research paper (international conference proceedings)
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Interfacial Reaction of Sn-Ag-Cu-Ni Solder/Cu Joints by Laser Process
Hiroshi Nishikawa, Ryo Matsunobu
Proc. of 7th Electronics System-Integration Technology Conference p. INTS2A-4:1-INTS2A-4:4 2018/09 Research paper (international conference proceedings)
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Control for Au-Ag Nanoporous Structure by Electrodeposition and Dealloying
Mikiko Saito, Jun Mizuno, Shunichi Koga, Hiroshi Nishikawa
Proc. of 7th Electronics System-Integration Technology Conference p. MAT1-1:1-MAT1-1:4 2018/09 Research paper (international conference proceedings)
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Shear properties of In-Bi alloy joints with Cu substrates during thermal aging
Sanghun Jin, Min-Su Kim, Shutetsu Kaneyama, Hiroshi Nishikawa
Microelectronics Reliability Vol. 88-90 p. 795-800 2018/09 Research paper (scientific journal)
-
銅及び銅合金の溶接技術
西川 宏
Jitsu・Ten 実務&展望 Vol. 51 No. 4 p. 20-25 2018/07
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Improvement in the mechanical properties of eutectic Sn58Bi alloy by 0.5 and 1 wt% Zn addition before and after thermal aging
Shiqi Zhou, Omid Mokhtari, Muhammad Ghufan Rafique, Vasanth C. Shunmugasamy, Bilal Mansoor, Hiroshi Nishikawa
Journal of Alloy and Compounds Vol. 765 p. 1243-1252 2018/07 Research paper (scientific journal)
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Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition
Junghwan Bang, Dong-Yurl Yu, Ming Yang, Yong-Ho Ko, Jeong-Won Yoon, Hiroshi Nishikawa, Chang-Woo Lee
Metals Vol. 8 No. 8 p. 586:1-586:11 2018/07 Research paper (scientific journal)
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Materials Merging Mechanism of Microfluidic Electroless Interconnection Process
S. Yang, H. T. Hung, P. Y. Wu, Y. W. Wang, H. Nishikawa, C. R. Kao
Journal of The Electrochemical Society Vol. 165 No. 7 p. D273-D281 2018/07 Research paper (scientific journal)
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Mechanical properties of Sn-Bi-In-Ga low melting temperature solder alloys
Chih-Han Yang, Shiqi Zhou, Hiroshi Nishikawa, Shih-Kang Lin
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018 p. 409-410 2018/06/06 Research paper (international conference proceedings)
Publisher: Institute of Electrical and Electronics Engineers Inc.
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Microstructural characterization of Ni-based self-fluxing alloy after selective surface-engineering using diode laser
Eun-Joon Chun, Changkyoo Park, Hiroshi Nishikawa, Min-Su Kim
Applied Surface Science Vol. 442 p. 726-735 2018/06/01 Research paper (scientific journal)
Publisher: Elsevier B.V.
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High Reliability Sintered Silver-Indium Bonding with Anti-Oxidation Property for High Temperature Application
Chun An Yang, C. Robert Kao, Hiroshi Nishikawa, Chin C. Lee
Proc. of 2018 IEEE 70th Electronic Components and Technology Conference p. 1993-1999 2018/05 Research paper (international conference proceedings)
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Improvement of Mechanical Properties of Zn-Added Sn58Bi Alloy by Zn Segregation on the Sn-Bi Phase Boundaries During Thermal Aging
Shiqi Zhou, Omid Mokhtari, Hiroshi Nishikawa
Proc. of 2018 IEEE 69th Electronic Components and Technology Conference p. 1899-1905 2018/05 Research paper (international conference proceedings)
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Development of Low-Temperature, Pressureless Copper-to-Copper Bonding by Microfluidic Electroless Interconnection Process
Sean Yang, Han-Tan Hung, Hiroshi Nishikawa, C. Robert Kao
Proc. of 2018 IEEE 68th Electronic Components and Technology Conference p. 308-313 2018/05 Research paper (international conference proceedings)
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Low temperature bonding with high shear strength using micro-sized Ag particle paste for power electronic packaging
Myong-Hoon Roh, Hiroshi Nishikawa, Seiichiro Tsutsumi, Naruhiko Nishiwaki, Keiichi Ito, Koji Ishikawa, Akihiro Katsuya, Nobuo Kamada, Mutsuo Saito
Journal of Materials Science: Materials in Electronics Vol. 29 No. 5 p. 3800-3807 2018/03/01 Research paper (scientific journal)
Publisher: Springer New York LLC
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Laser-assisted selective fusing of thermal sprayed Ni-based self-fluxing alloys by using high-power diode lasers
Eun-Joon Chun, Min-Su Kim, Hiroshi Nishikawa, Changkyoo Park, Jeong Suh
OPTICS AND LASER TECHNOLOGY Vol. 100 p. 317-324 2018/03 Research paper (scientific journal)
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Transient liquid phase bonding of magnesium alloy AZ31 using Cu coatings and Cu coatings with Sn interlayers
Abdulaziz Nasser AlHazaa, Muhammad Ali Shar, Anas Mahmoud Atieh, Hiroshi Nishikawa
Metals Vol. 8 No. 1 p. 1-10 2018/01/16 Research paper (scientific journal)
Publisher: MDPI AG
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Lead-free high temperature bonding processes for next generation power module packaging
Min-Su KIM, Hiroshi NISHIKAWA
Journal of Smart Processing -for Materials, Environment & Energy- Vol. 7 No. 1 p. 28-31 2018/01
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Characterization of moderately halotolerant selenate-And tellurite-reducing bacteria isolated from brackish areas in Osaka
Satoshi Soda, Wenbo Ma, Masashi Kuroda, Hiroshi Nishikawa, Yuanyuan Zhang, Michihiko Ike
Bioscience, Biotechnology and Biochemistry Vol. 82 No. 1 p. 173-181 2018 Research paper (scientific journal)
Publisher: Japan Society for Bioscience Biotechnology and Agrochemistry
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Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution
Jan-Ervin C. Guerrero, Drexel H. Camacho, Omid Mokhtari, Hiroshi Nishikawa
International Journal of Corrosion Vol. 2018 2018 Research paper (scientific journal)
Publisher: Hindawi Limited
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Effect of surface potential distribution on corrosion behavior of SnAgCu solder/Cu substrate interface
Omid Mokhtari, Hiroshi Nishikawanisik
Solid State Phenomena Vol. 273 p. 77-82 2018 Research paper (international conference proceedings)
Publisher: Trans Tech Publications Ltd
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Effect of indium on deformation of binary In-Bi alloys
Sanghun Jin, Min-su Kim, Shutetsu Kanayama, Hiroshi Nishikawa
Proc. of 19th Electronics Packaging Technology Conference p. 181:1-181:5 2017/12 Research paper (international conference proceedings)
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Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint
Junghwan Bang, Dong-Yurl Yu, Yong-Ho Ko, Min-Su Kim, Hiroshi Nishikawa, Chang-Woo Lee
JOURNAL OF ALLOYS AND COMPOUNDS Vol. 728 p. 992-1001 2017/12 Research paper (scientific journal)
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Transmission Electron Microscopy Investigation on the Oxidation Behavior of Electroless Ni/Immersion Au Surface Finish at 250 degrees C
Min-Su Kim, Hiroshi Nishikawa
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY Vol. 17 No. 11 p. 8522-8527 2017/11 Research paper (scientific journal)
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Suppression of void formation at the interface in laser soldering
Ryo matsunobu, Hiroshi nishikawa
Proc. of the 12th International Microsystems, Packaging, Assembly and Circuits Technology p. 338-341 2017/10 Research paper (international conference proceedings)
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Impact strength of Sn-Ag-Cu/Cu solder bumps formed by an induction heating method
Yujian Zhang, Siliang He, Hiroshi Nishikawa
Proc. of the 12th International Microsystems, Packaging, Assembly and Circuits Technology p. 159-162 2017/10 Research paper (international conference proceedings)
-
The evaluation of mechanical properties of Sn58BiXTi solder by tensile test
Shiqi Zhou, Xiangdong Liu, Omid Mokhtari, Hiroshi Nishikawa
18th International Conference on Electronic Packaging Technology, ICEPT 2017 p. 703-707 2017/09/19 Research paper (international conference proceedings)
Publisher: Institute of Electrical and Electronics Engineers Inc.
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Thermal stability of low-temperature sintered joint using Sn-coated Cu particles during isothermal aging at 250 A degrees C
Xiangdong Liu, Shiqi Zhou, Hiroshi Nishikawa
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS Vol. 28 No. 17 p. 12606-12616 2017/09 Research paper (scientific journal)
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Influence of ENIG defects on shear strength of pressureless Ag nanoparticle sintered joint under isothermal aging
Min-Su Kim, Hiroshi Nishikawa
MICROELECTRONICS RELIABILITY Vol. 76 p. 420-425 2017/09 Research paper (scientific journal)
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Effect of bonding conding conditions on shear strength of joints at 200°C using Sn-coated Cu Particle
Hiroshi Nishikawa, Xiangdong Liu, Siliang He
Proc. of The 18th International Coference on Electronic Pacaging Technology p. 181:1-181:4 2017/09 Research paper (international conference proceedings)
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Development of Die Attachment Technology for Power IC Module by Introducing Indium into Sintered Nano-Silver Joint
C. A. Yang, C. Robert Kao, H. Nishikawa
Proceedings - Electronic Components and Technology Conference p. 1974-1980 2017/08/01 Research paper (international conference proceedings)
Publisher: Institute of Electrical and Electronics Engineers Inc.
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Brazing Graphite to Aluminum Nitride for Thermal Dissipation Purpose
Tsung-Te Chou, Wei-Hsing Tuan, Hiroshi Nishikawa, Biing-Jyh Weng
ADVANCED ENGINEERING MATERIALS Vol. 19 No. 7 p. 1-10 2017/07 Research paper (scientific journal)
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Effect of isothermal aging at 250 C on shear strength of joints using Sn-Coated Cu particle paste for high-temperature application
Hiroshi Nishikawa, Xiangdong Liu, Siliang He
Proceeding of IMPAS International Conference on High Temparature Electronics Network (HiTEN 2017) Vol. 2017 No. HiTen p. 202-206 2017/07 Research paper (international conference proceedings)
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マイクロ接合をめぐる最近の動向-マイクロ接合研究委員会-
廣瀬 明夫, 福本 信次, 西川 宏, 佐野 智一
溶接学会誌 Vol. 86 No. 5 p. 382-392 2017/05
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Effect of temperature and substrate on shear strength of the joints formed by sintering of micro-sized Ag particle paste without pressure
Myong-Hoon Roh, Hiroshi Nishikawa, Seiichiro Tsutsumi, Naruhiko Nishiwaki, Keiichi Ito, Koji Ishikawa, Akihiro Katsuya, Nobuo Kamada, Mutsuo Saito
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS Vol. 28 No. 10 p. 7292-7301 2017/05 Research paper (scientific journal)
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Pressureless sintering bonding using hybrid microscale Cu particle paste on ENIG, pure Cu and pre-oxidized Cu substrate by an oxidation-reduction process
Xiangdong Liu, Hiroshi Nishikawa
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS Vol. 28 No. 7 p. 5554-5561 2017/04 Research paper (scientific journal)
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Interfacial reaction, ball shear strength and fracture surface analysis of lead-free solder joints prepared using cobalt nanoparticle doped flux
G. K. Sujan, A. S. M. A. Haseeb, Hiroshi Nishikawa, M. A. Amalina
JOURNAL OF ALLOYS AND COMPOUNDS Vol. 695 p. 981-990 2017/02 Research paper (scientific journal)
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Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach
Xiangdong Liu, Siliang He, Hiroshi Nishikawa
JOURNAL OF ALLOYS AND COMPOUNDS Vol. 695 p. 2165-2172 2017/02 Research paper (scientific journal)
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ナノポーラス金接合に向けた真空紫外光による表面前処理
金田 建志, 岡田 愛姫子, 付 偉欣, 庄子 習一, 齋藤 美紀子, 西川 宏, 水野 潤
第23回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 23 p. 429-432 2017/01 Research paper (conference, symposium, etc.)
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Effect of substrate metallization on the impact strength of Sn-Ag-Cu solder bumps fabricated in a formic acid atmosphere
Siliang He, Hiroshi Nishikawa
2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP) p. 381-385 2017 Research paper (international conference proceedings)
-
Effect of Au surface finish on Ni addition solder/substrate interface using a laser soldering process
Ryo Matsunobu, Hiroshi Nishikawa
Vol. 23 p. 463-464 2017/01 Research paper (other academic)
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Formation of Solder Bumps on Electroless Ni/Au Plating Using Formic Acid Atmosphere
Siliang HE, Hiroshi Nishikawa
Vol. 23 p. 77-78 2017/01 Research paper (other academic)
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Effect of Bonding Temperature on the Joining of Ti-6Al-4V Alloy Using Cu Coatings and Sn Interlayers
Abdulaziz N. AlHazaa, Sultan H. AlGharbi, Hiroshi Nishikawa
JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE Vol. 26 No. 1 p. 407-417 2017/01 Research paper (scientific journal)
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Formation and growth of intermetallic compound at Sn-Ag-Cu-Ni/Cu interface using laser soldering
Ryo Matsunobu, Hiroshi Nishikawa
Vol. 26 p. 95-98 2016/09 Research paper (other academic)
Publisher:
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A comparative study between formic acid atmosphere and liquid flux in reflow
Siliang He, Hiroshi Nishikawa
p. 107-110 2016/09 Research paper (other academic)
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Interfacial Reaction between Sn-Ag-Cu-Mg solder and ENIG substrate
Hiroshi Nishikawa, Abdulaziz N. Alhazaa, Siliang He, Abdulhakim A. Almajid, Mahmoud S. Soliman
Key Engineering Materials Vol. 706 p. 2016-2019 2016/07 Research paper (scientific journal)
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Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging
Xiangdong Liu, Hiroshi Nishikawa
SCRIPTA MATERIALIA Vol. 120 p. 80-84 2016/07 Research paper (scientific journal)
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Effect of Isothermal Aging at 250 °C on Shear Strength of Joints Using Au Nanoporous Nonding for Die Attach
Hiroshi Nishikawa, Kaori Matsunaga, Min-Su Kim, Mikiko Saito, Jun Mizuno
Proc. of IMAPS International Conference and Exhibition on High Temperature Electronics (HiTEC2016) p. 143-147 2016/05 Research paper (international conference proceedings)
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Transient liquid phase bonding of Sn-Bi solder with added Cu particles
Omid Mokhtari, Hiroshi Nishikawa
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS Vol. 27 No. 5 p. 4232-4244 2016/05 Research paper (scientific journal)
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The shear strength of transient liquid phase bonded Sn-Bi solder joint with added Cu particles
Omid Mokhtari, Hiroshi Nishikawa
ADVANCED POWDER TECHNOLOGY Vol. 27 No. 3 p. 1000-1005 2016/05 Research paper (scientific journal)
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Effect of magnetic flux density on Sn crystallographic orientation in a solder joint system
Kimihiro Yamanaka, Hiroshi Nishikawa, Hirohisa Taguchi, Miyuki Harada, Koichi Ochi
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS Vol. 27 No. 4 p. 3710-3714 2016/04 Research paper (scientific journal)
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Microstructural Change of Ag Nanoporous Bonding Joint During Thermal Storage Test
Min-Su KIM, Hiroshi NISHIKAWA
22nd Symposium on "Microjoining and Asswmbly Technology in Electronics" p. 101-104 2016/02 Research paper (other academic)
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Cu/Cu Bonding Using a Au Nanoporous Sheet by Electrochemical Corrosion
Kaori MATSUNAGA, Min-Su KIM, Hiroshi NISHIKAWA, Mikiko SAITO, Jun MIZUNO
22nd Symposium on "Microjoining and Assembly Technology in Electronics" p. 89-92 2016/02 Research paper (other academic)
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Correlation between microstructure and mechanical properties of Sn-Bi-X solders
Omid Mokhtari, Hiroshi Nishikawa
Materials Science and Engineering A Vol. 651 p. 831-839 2016/01/10 Research paper (scientific journal)
Publisher: Elsevier Ltd
-
マイクロ接合研究委員会
福本 信次, 岩田 剛治, 西川 宏, 廣瀬 明夫
溶接学会誌 Vol. 85 No. 1 p. 137-140 2016
Publisher: 一般社団法人 溶接学会
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Bonding Process Using Microscale Ag Particle Paste for Die Attach
H. Nishikawa, X. Liu, X. Wang, A. Fujita, N. Kamada, M. Saito
2016 6TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC) p. sp4p8:1-sp4p8:4 2016 Research paper (international conference proceedings)
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Effect of Zn Addition on Interfacial Reactions Between Sn-Bi Solder and Cu Substrate
Omid Mokhtari, Shiqi Zhou, Y. C. Chan, Hiroshi Nishikawa
MATERIALS TRANSACTIONS Vol. 57 No. 8 p. 1272-1276 2016 Research paper (scientific journal)
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Pressureless Bonding by Micro-Sized Silver Particle Paste for High-Temperature Electronic Packaging
Myong-Hoon Roh, Hiroshi Nishikawa, Seiichiro Tsutsumi, Naruhiko Nishiwaki, Keiichi Ito, Koji Ishikawa, Akihiro Katsuya, Nobuo Kamada, Mutsuo Saito
MATERIALS TRANSACTIONS Vol. 57 No. 7 p. 1209-1214 2016 Research paper (scientific journal)
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Reliability of Ag Nanoporous Bonding Joint for High Temperature Die Attach under Temperature Cycling
Min-Su Kim, Kaori Matsunaga, Yong-Ho Ko, Chang-Woo Lee, Hiroshi Nishikawa
MATERIALS TRANSACTIONS Vol. 57 No. 7 p. 1192-1196 2016 Research paper (scientific journal)
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Improved Joint Strength with Sintering Bonding Using Microscale Cu Particles by an Oxidation-reduction Process
Xiangdong Liu, Hiroshi Nishikawa
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) p. 455-460 2016 Research paper (international conference proceedings)
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Bonding process without pressure using a chestnut-burr-like particle paste for power electronics
Myong-Hoon Roh, Hiroshi Nishikawa, Seiichiro Tsutsumi, Naruhiko Nishiwaki, Keiichi Ito, Koji Ishikawa, Akihiro Katsuya, Nobuo Kamada, Mutsuo Saito
2016 International Conference on Electronics Packaging (ICEP) p. 391-394 2016 Research paper (international conference proceedings)
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Investigation of connecting techniques for high temperature application on power modules
Fumiyoshi Kawashiro, Yoshiki Endo, Tatsuo Tonedachi, Hiroshi Nishikawa
2016 International Conference on Electronics Packaging (ICEP) p. 378-381 2016 Research paper (international conference proceedings)
-
Low temperature bonding using microscale Cu particles coated with thin Sn layers at 200 degrees C
Xiangdong Liu, Siliang He, Hiroshi Nishikawa
2016 International Conference on Electronics Packaging (ICEP) p. 306-309 2016 Research paper (international conference proceedings)
-
Correlation between microstructure and mechanical properties of Sn-Bi-X solders
Omid Mokhtari, Hiroshi Nishikawa
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING Vol. 651 p. 831-839 2016/01 Research paper (scientific journal)
-
Thermally stable Cu3Sn/Cu composite joint for high-temperature power device
Xiangdong Liu, Siliang He, Hiroshi Nishikawa
SCRIPTA MATERIALIA Vol. 110 p. 101-104 2016/01 Research paper (scientific journal)
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Effects of Indium Content on the Tensile Properties of Sn-Bi-In Solder
MOKHTARI Omid, NISHIKAWA Hiroshi
Trans. JWRI Vol. 44 No. 2 p. 19-22 2015/12 Research paper (bulletin of university, research institution)
Publisher: Joining and Welding Research Institute, Osaka University
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Microscale Ag particle paste for sintered joints in high-power devices
Hiroshi Nishikawa, Xiangdong Liu, Xianfan Wang, Akira Fujita, Nobuo Kamada, Mutsuo Saito
MATERIALS LETTERS Vol. 161 p. 231-233 2015/12 Research paper (scientific journal)
-
Microstructure of Transient Liquid Phase Sintering Joint by Sn-Coated Cu Particles for High Temperature Packaging
Xiangdong Liu, Hiroshi Nishikawa
IMAPS2015 p. 000449-000452 2015/10 Research paper (international conference proceedings)
-
Effect of porous copper on the properties of electrically conductive adhesives
Li-Ngee Ho, Hiroshi Nishikawa
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS Vol. 26 No. 10 p. 7771-7779 2015/10 Research paper (scientific journal)
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Effects of bonding temperature on microstructure, fracture behavior and joint strength of Ag nanoporous bonding for high temperature die attach
Min-Su Kim, Hiroshi Nishikawa
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING Vol. 645 p. 264-272 2015/10 Research paper (scientific journal)
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High temperature reliability of joints using a Au nanoporous sheet
Kaori MATSUNAGA, Min-Su KIM, Hiroshi NISHIKAWA, Mikiko SAITO, Jun MIZUNO
Vol. 25 p. 147-150 2015/09 Research paper (other academic)
Publisher:
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Effect of Constant Temperature and Humidity Aging on Long-term Reliability of Electrically Conductive Adhesives with Different Ag Fillers
J. TAJIMA, H. NISHIKAWA
Vol. 25 p. 91-94 2015/09 Research paper (other academic)
Publisher:
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エレクトロニクス分野におけるマイクロ接合・実装技術動向
西川 宏
溶接学会誌 Vol. 84 No. 5 p. 388-390 2015/07
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Bonding strength of Cu/Cu joints using micro-sized Ag particle paste for high-temperature application
H. Nishikawa, X. Liu, X. Wang, A. Fujita, N. Kamada, M. Saito
Proceedings of International Conference on High Temperature Electronics Network(HiTEN 2015) p. 68-72 2015/07 Research paper (international conference proceedings)
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Ball Shear Strength and Fracture Modes of Lead-Free Solder Joints Prepared Using Nickel Nanoparticle Doped Flux
G. K. Sujan, A. S. M. A. Haseeb, M. A. Amalina, Hiroshi Nishikawa
ELECTRONIC MATERIALS LETTERS Vol. 11 No. 3 p. 452-456 2015/05 Research paper (scientific journal)
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Reliability of copper wire bonds on a novel over-pad metallization
Fumiyoshi Kawashiro, Satoshi Itoh, Takehiko Maeda, Tetsuya Hirose, Akira Yajima, Takaki Etoh, Hiroshi Nishikawa
JAPANESE JOURNAL OF APPLIED PHYSICS Vol. 54 No. 5 p. 05EC01-1-05EC01-8 2015/05 Research paper (scientific journal)
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Shear strength of Cu-to-Cu joints using mixed Ag particle paste
Hiroshi Nishikawa, Keiichi Niwa
Quarterly J. Japan Welding Soc. Vol. 33 No. 2 p. 75s-78s 2015/04 Research paper (scientific journal)
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ダイボンディング用のAuナノポーラスシートの作製
松永 香織, Min-Su Kim, 西川 宏, 齋藤 美紀子, 水野 潤
第21回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 427-428 2015/02 Research paper (other academic)
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はんだバンプ微細化による接合強度の長期信頼性への影響
宇治野 真, 西川 宏
第21回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 391-394 2015/02 Research paper (other academic)
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Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn-Ag Cu solder on a Cu Pad
Hiroshi Nishikawa, Noriya Iwata
Journal of Materials Processing Technology Vol. 215 p. 6-11 2015 Research paper (scientific journal)
Publisher: Elsevier Ltd
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Effect of Isothermal Aging on Microstructure and Joint Strength of Ag Nanoporous Bonding for High Temperature Die Attach
Min-Su Kim, Hiroshi Nishikawa
2015 10TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT) p. 104-106 2015 Research paper (international conference proceedings)
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Impact strength of Sn-58mass%Bi/Cu joints by laser process
Hiroshi Nishikawa, Sinya Kubota
2015 EUROPEAN MICROELECTRONICS PACKAGING CONFERENCE (EMPC) p. P_B04_1-P_B04_4 2015 Research paper (international conference proceedings)
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Improvement of Joint Reliability of Sn-Ag-Cu Solder Bumps on Cu by a Laser Process
Hiroshi Nishikawa, Noriya Iwata
MATERIALS TRANSACTIONS Vol. 56 No. 7 p. 1025-1029 2015 Research paper (scientific journal)
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Improved Low Temperature Gold-Gold Bonding Using Nanoporous Powder Bump Using Vacuum Ultraviolet Irradiation Pre-treatment
Tatsushi Kaneda, Jun Mizuno, Akiko Okada, Kaori Matsunaga, Shuichi Shoji, Mikiko Saito, Hiroshi Nishikawa
2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) p. 473-477 2015 Research paper (international conference proceedings)
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Effect of Au nanoporous structure on bonding strength
Kaori Matsunaga, Min-Su Kim, Hiroshi Nishikawa, Mikiko Saito, Jun Mizuno
2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) p. 830-833 2015 Research paper (international conference proceedings)
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Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn-Ag Cu solder on a Cu Pad
Hiroshi Nishikawa, Noriya Iwata
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY Vol. 215 p. 6-11 2015/01 Research paper (scientific journal)
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Effect of thermal aging on microstructure of Sn-Bi-In solder joint
MOKHTARI Omid, NISHIKAWA Hiroshi
Trans. JWRI Vol. 43 No. 2 p. 21-25 2014/12 Research paper (bulletin of university, research institution)
Publisher: Joining and Welding Research Institute, Osaka University
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Investigation of Formation and Growth Behavior of Cu/Al Intermetallic Compounds during Isothermal Aging
Omid Mokhtari, Min-Su Kim, Hiroshi Nishikawa, Fumiyoshi Kawashiro, Satoshi Itoh, Takehiko Maeda, Tetsuya Hirose, Takaki Eto
Transactions of The Japan Institute of Electronics Packaging Vol. 7 No. 1 p. 1-7 2014/12 Research paper (scientific journal)
Publisher: The Japan Institute of Electronics Packaging
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Silver nanoporous sheet for solid-state die attach in power device packaging
Min-Su Kim, Hiroshi Nishikawaa
SCRIPTA MATERIALIA Vol. 92 p. 43-46 2014/12 Research paper (scientific journal)
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Nano-porous structure control under electrodeposition and dealloying conditions for low-temperature bonding
Mikiko Saito, Kaori Matsunaga, Jun Mizuno, Hroshi Nishikawa
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014 p. S8P4-1-S8P4-4 2014/11/18 Research paper (international conference proceedings)
Publisher: Institute of Electrical and Electronics Engineers Inc.
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Relationship between bonding conditions and strength for joints using a Au nanoporous sheet
Kaori Matsunaga, Min-Su Kim, Hiroshi Nishikawa, Mikiko Saito, Jun Mizuno
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014 2014/11/18 Research paper (international conference proceedings)
Publisher: Institute of Electrical and Electronics Engineers Inc.
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Thermal stability of electroless nickel/immersion gold surface finish for direct bond copper
Min-Su Kim, Hiroshi Nishikawa
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014 2014/11/18 Research paper (international conference proceedings)
Publisher: Institute of Electrical and Electronics Engineers Inc.
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Effects of in and Ni addition on microstructure of Sn-58Bi solder joint
Omid Mokhtari, Hiroshi Nishikawa
Journal of Electronic Materials Vol. 43 No. 11 p. 4158-4170 2014/11/01 Research paper (scientific journal)
Publisher: Springer New York LLC
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Effects of In and Ni Addition on Microstructure of Sn-58Bi Solder Joint
Omid Mokhtari, Hiroshi Nishikawa
JOURNAL OF ELECTRONIC MATERIALS Vol. 43 No. 11 p. 4158-4170 2014/11 Research paper (scientific journal)
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はんだ接合部微細化によるはんだ/Cu 界面への影響
宇治野 真, 西川 宏
MES 2014 エレクトロニクス実装学会 秋季大会 論文集 p. 291-294 2014/09 Research paper (other academic)
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Au ナノポーラス接合の接合材表面構造と接合強度の関係
松永 香織, Min-Su Kim, 西川 宏, 齋藤 美紀子, 水野 潤
MES 2014 エレクトロニクス実装学会 秋季大会 論文集 p. 179-182 2014/09 Research paper (other academic)
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Copper-Filled Electrically Conductive Adhesives with Enhanced Shear Strength
Li-Ngee Ho, Hiroshi Nishikawa
JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE Vol. 23 No. 9 p. 3371-3378 2014/09 Research paper (scientific journal)
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Impact strength of Sn-3.0Ag-0.5Cu solder bumps during isothermal aging
JianXin Wang, Hiroshi Nishikawa
MICROELECTRONICS RELIABILITY Vol. 54 No. 8 p. 1583-1591 2014/08 Research paper (scientific journal)
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Effects of Joining Conditions on Cu/Cu Joint Using Chestnut-burr-like Micro-sized Ag Particles
Hiroshi NISHIKAWA, Xianfan WANG, Akira FUJITA, Nobuo KAMADA, Mutsuo SAITO
Journal of Smart Processing Vol. 3 No. 4 p. 239-246 2014/07 Research paper (scientific journal)
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The Melting-point Increase of Sn-Bi Solder Joint by Cu Particles Addition
Omid Mokhtari, Hiroshi Nishikawa
High Temperature Electronics(HiTEC 2014) Conference Proceedings 2014/05 Research paper (international conference proceedings)
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様々なサイズ・形状の銀フィラーを混合した導電性接着剤の熱伝導性
小島 慎也, 西川 宏
第20回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 20 p. 395-396 2014/02 Research paper (other academic)
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レーザ加熱したはんだバンプの接合信頼性への微細化の影響
宇治野 真, 西川 宏
第20回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 20 p. 381-382 2014/02 Research paper (other academic)
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いがぐり状マイクロサイズAg粒子を用いたCu/Cu接合プロセスの検討
西川 宏, 王 暁帆, 藤田 晶, 鎌田 信雄, 齋藤 六雄
第20回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 20 p. 153-156 2014/02 Research paper (other academic)
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Sn-Biはんだ継手の衝撃強度や接合界面に及ぼすレーザ照射条件の影響
窪田 慎也, 西川 宏
第20回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 20 p. 47-50 2014/02 Research paper (other academic)
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Microstructural change of Ag nanoporous bonding joint and interdiffusion of Cu/Ag during thermal aging
Min-Su Kim, Hiroshi Nishikawa
2014 4TH IEEE INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) p. 42-42 2014 Research paper (international conference proceedings)
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LOW-TEMPERATURE GOLD-GOLD BONDING USING SELECTIVE FORMATION OF NANOPOROUS POWDERS FOR BUMP INTERCONNECTS
Hayata Mimatsu, Jun Mizuno, Takashi Kasahara, Mikiko Saito, Shuichi Shoji, Hiroshi Nishikawa
2014 IEEE 27TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS) p. 1131-1134 2014 Research paper (international conference proceedings)
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Microstructure of lead-free solder bumps using laser reflow soldering
Hiroshi Nishikawa, Noriya Iwata, Shinya Kubota
INTERNATIONAL SYMPOSIUM ON INTERFACIAL JOINING AND SURFACE TECHNOLOGY (IJST2013) Vol. 61 No. 012038 p. 1-4 2014 Research paper (international conference proceedings)
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Effect of joining conditions on the joint strength of Ag nanoporous bonding
Min-Su Kim, Hiroshi Nishikawa
2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP) p. 521-525 2014 Research paper (international conference proceedings)
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Effect of isothermal aging on the growth behavior of Cu/Al intermetallic compounds
Omid Mokhtari, Min-Su Kim, Hiroshi Nishikawa, Fumiyoshi Kawashiro, Satoshi Itou, Takehiko Maeda, Tetsuya Hirose, Takaki Eto
2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP) p. 144-147 2014 Research paper (international conference proceedings)
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Properties of Cu Filled Electrically Conductive Adhesive (ECA) Affected by Viscosity of the ECA Paste
HO Li-Ngee, NISHIKAWA Hiroshi
Trans. JWRI Vol. 42 No. 2 p. 25-28 2013/12 Research paper (bulletin of university, research institution)
Publisher: Joining and Welding Research Institute, Osaka University
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Explanation of impact load curve in ball impact test in relation to thermal aging
Tomoya Daito, Hiroshi Nishikawa, Tadashi Takemoto, Takashi Matsunami
MICROELECTRONICS RELIABILITY Vol. 53 No. 12 p. 2005-2011 2013/12 Research paper (scientific journal)
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Properties of phenolic-based Ag-filled conductive adhesive affected by different coupling agents
Li-Ngee Ho, Teng Fei Wu, Hiroshi Nishikawa
Journal of Adhesion Vol. 89 No. 11 p. 847-858 2013/11/02 Research paper (scientific journal)
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Fabrication of nanoporous silver and microstructural change during dealloying of melt-spun Al-20 at.%Ag in hydrochloric acid
Min-Su Kim, Hiroshi Nishikawa
JOURNAL OF MATERIALS SCIENCE Vol. 48 No. 16 p. 5645-5652 2013/08 Research paper (scientific journal)
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Evaluation of mechanical property of Sn-Bi solder joint with Cu pad using a miniature impact test
H. Nishikawa, T. Yamamoto
Proceedings of the 7th Asia Pacific IIW International Congress 2013 p. 168-171 2013/07 Research paper (international conference proceedings)
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A Review of Welding in Japan -Micro Joining-
Hiroshi Nishikawa
Vol. 82 No. 5 p. 392-394 2013/07
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Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives
Li-Ngee Ho, Hiroshi Nishikawa
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS Vol. 24 No. 6 p. 2077-2081 2013/06 Research paper (scientific journal)
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Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste
Tomohiro Yamakawa, Tadashi Takemoto, Masayoshi Shimoda, Hiroshi Nishikawa, Kunio Shiokawa, Nobuto Terada
JOURNAL OF ELECTRONIC MATERIALS Vol. 42 No. 6 p. 1260-1267 2013/06 Research paper (scientific journal)
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Low-Temperature Au-Au Bonding Using Nanoporous Au-Ag Sheets
Hayata Mimatsu, Jun Mizuno, Takashi Kasahara, Mikiko Saito, Hiroshi Nishikawa, Shuichi Shoji
JAPANESE JOURNAL OF APPLIED PHYSICS Vol. 52 No. 5 p. 050204-1-050204-3 2013/05 Research paper (scientific journal)
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Joint strength of Cu-to-Cu joint using Cu nanoparticle paste
H. Nishikawa, T. Hirano, N. Terada
Proc. of International Conference on Electronics Packaging (ICEP 2013) p. 200-203 2013/04 Research paper (international conference proceedings)
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レーザ加熱によるSn-Bi/Cu接合部の衝撃強度向上
窪田 慎也, 西川 宏
第19回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 19 p. 477-478 2013/01 Research paper (other academic)
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各種因子が導電性接着剤の耐イオンマイグレーション性に与える影響
植田 城央, 西川 宏
第19回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 19 p. 167-170 2013/01 Research paper (other academic)
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混合Agペーストを用いたCu/Cu接合における接合層と接合強度の関係
丹羽 恵一, 西川 宏
第19回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 19 p. 79-82 2013/01 Research paper (other academic)
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Contact angle between Sn-Ag-Cu solder and electroplated Cu-based Bulk Metallic Glass
H. Nishikawa, T. Naoi, M. Saito, J. Mizuno, M. Fukuhara
PROCEEDINGS OF THE 1ST INTERNATIONAL JOINT SYMPOSIUM ON JOINING AND WELDING p. 553-556 2013 Research paper (international conference proceedings)
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Copper Filled Polyurethane Based Electrically Conductive Adhesive with Improved Mechanical Strength
Li-Ngee Ho, Hiroshi Nishikawa
2013 EUROPEAN MICROELECTRONICS PACKAGING CONFERENCE (EMPC) p. ThA3-3:1-ThA3-3:4 2013 Research paper (international conference proceedings)
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Joint strength of Cu-to-Cu joint using mixed Ag particle paste
H. Nishikawa, K. Niwa
2013 EUROPEAN MICROELECTRONICS PACKAGING CONFERENCE (EMPC) p. ThA2-4:1-ThA2-4:4 2013 Research paper (international conference proceedings)
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Coarsening of Bi phase and intermetallic layer thickness in Sn-58Bi-X (X=In and Ni) solder joint
Omid Mokhtari, Hiroshi Nishikawa
2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) p. 250-253 2013 Research paper (international conference proceedings)
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Properties of Porous Copper Filled Electrically Conductive Adhesives
Li-Ngee Ho, Hiroshi Nishikawa
2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) p. 221-+ 2013 Research paper (international conference proceedings)
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Effects of Ag Content on the Mechanical Properties of Bi-Ag Alloys Substitutable for Pb based Solder
SHIMODA Masayoshi, YAMAKAWA Tomohiro, SHIOKAWA Kunio, NISHIKAWA Hiroshi, TAKEMOTO Tadashi
Trans. JWRI Vol. 41 No. 2 p. 51-54 2012/12 Research paper (bulletin of university, research institution)
Publisher: Joining and Welding Research Institute, Osaka University
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Surfactant-Free Synthesis of Copper Particles for Electrically Conductive Adhesive Applications
Li-Ngee Ho, Hiroshi Nishikawa
JOURNAL OF ELECTRONIC MATERIALS Vol. 41 No. 9 p. 2527-2532 2012/09 Research paper (scientific journal)
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Evaluation of Electrical Resistivity of Electrically Conductive Adhesives Filled with Cu Alloy Fillers Under Various Conditions
Vol. 51 No. 1 p. 279-283 2012/08 Research paper (scientific journal)
Publisher:
-
Evaluation of Bondability of Cu-to-Cu Joints using Cu nanoparticle Paste
Vol. 51 No. 1 p. 275-278 2012/08 Research paper (scientific journal)
Publisher:
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Bi-Ag合金を用いた銅継手の延性改善
下田 将義, 山川 智弘, 塩川 国夫, 西川 宏, 竹本 正
銅と銅合金 Vol. 51 No. 1 p. 271-274 2012/08 Research paper (scientific journal)
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高温はんだ代替Cuナノ粒子ペーストの接合性に及ぼす接合条件の影響
西川 宏, 平野 智章, 竹本 正, 寺田 信人
第22回マイクロエレクトロニクスシンポジウム論文集 p. 115-116 2012/07 Research paper (other academic)
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Effect of Silane Coupling Agents on the Properties of Copper Filled Electrically Conductive Adhesive
Li-Ngee Ho, Hiroshi Nishikawa
Proceedings of 2012 international Conference on Microelectronics, Optoelectronics and Nanoelectronics p. N004-1-N004-4 2012/07 Research paper (international conference proceedings)
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Impact Strength of Sn-Ag-Cu Solder Joints in Electroless Ni-P/Au Plating in Laser Reflow Soldering
NISHIKAWA Hiroshi, IWATA Noriya, TAKEMOTO Tadashi
Trans. JWRI Vol. 41 No. 1 p. 33-36 2012/06 Research paper (bulletin of university, research institution)
Publisher: Joining and Welding Research Institute, Osaka University
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Effect of Interfacial Reaction Layer Thickness on Fracture Morphology and Impact Resistance of Sn-Ag-Cu Solder Bump Joint
DAITO Tomoya, NISHIKAWA Hiroshi, TAKEMOTO Tadashi
Journal of Smart Processing Vol. 1 No. 3 p. 143-148 2012/06 Research paper (scientific journal)
Publisher: Smart Processing Society for Materials, Environment & Energy (High Temperature Society of Japan)
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Effect of isothermal Aging on Sn-Ag-Cu solder joints on electroless Ni-P/Au plating by laser reflow soldering
H. Nishikawa, N. Iwata, T. Takemoto
roc. 5th International Brazing and Soldering Conference (IBSC 2012) p. 1-4 2012/04 Research paper (international conference proceedings)
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導電性接着剤の導電フィラーと導電性
西川 宏
スマートプロセス学会誌 Vol. 1 No. 3 p. 138-142 2012/04
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鉛フリーはんだの進歩と新規はんだ代替接合材料の新たな潮流
西川 宏
溶接学会誌 Vol. 81 No. 1 p. 45-57 2012/01
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Effcts of Sintering Structure of Ag on Bonding Strength in Pressureless Bonding using Ag Nanoparticle Paste
Keiichi Niwa, Hiroshi Nishikawa, Nobuto Terada
18th Symposium on "Microjoining and Assembly Technology in Electronics" Vol. 18 p. 463-464 2012/01 Research paper (other academic)
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Effect of Conductive Filler on Electrochemical Migration Property of Electrically Conductive Adhesive
Kunio Ueda, Hiroshi Nishikawa
18th Symposium on "Microjoining and Assembly Technology in Electronics" Vol. 18 p. 443-444 2012/01 Research paper (other academic)
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Evaluation of Joint Reliability for Sn-Bi Solder/Cu by Solder Bump Impact Test
Terumasa Yamamoto, Hiroshi Nishikawa
18th Symposium on "Microjoining and Assembly Technology in Electronics" Vol. 18 p. 95-98 2012/01 Research paper (other academic)
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Effect of Surface Finish on Impact Resistance of Sn-3.0Ag-0.5Cu Solder Joints
Tomoya Daito, Hiroshi Nishikawa, Tadashi Takemoto, Takashi Matsunami
18th Symposium on "Microjoining and Assembly Technology in Electronics" Vol. 18 p. 79-84 2012/01 Research paper (other academic)
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Using Nano-Porous Au-Ag Sheets as a Joint Layer for Low-Temperature Au-Au Bonding
Hayata Mimatsu, Jun Mizuno, Takashi Kasahara, Mikiko Saito, Hiroshi Nishikawa, Shuichi Shoji
2012 2ND IEEE CPMT SYMPOSIUM JAPAN p. 277-280 2012 Research paper (international conference proceedings)
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Evaluation of Plasma Ion Beam Sputtered TiN/TiAlN Multilayers on Steel for Bio Implant Applications
Balasubramanian Subramanian, Takahashi Makoto, Nishikawa Hiroshi, Kobayashi Akira, Guruswamy Brindha
Transactions of JWRI Vol. 40 No. 2 p. 55-58 2011/12 Research paper (bulletin of university, research institution)
Publisher: Joining and Welding Research Institute, Osaka University
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Bonding process of Cu/Cu joint using Cu nanoparticle paste
Takemoto Tadashi, Nishikawa Hiroshi, Hirano Tomoaki
Transactions of JWRI Vol. 40 No. 2 p. 33-36 2011/12 Research paper (bulletin of university, research institution)
Publisher: Joining and Welding Research Institute, Osaka University
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Impact reliability of micro-joints soldered with Sn-Ag-Cu solder using laser process
H. Nishikawa, N. Iwata, T. Takemoto
Proceedings of Sino-Japanese Workshop on Welding Thermo-Physics p. 12-1-12-4 2011/11 Research paper (international conference proceedings)
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Enhancement of solderability of Cu60Zr30Ti10 bulk metallic glass by dealloying in hydrofluoric acid solution
T. Naoi, H. Nishikawa, T. Takemoto, H. Abe, M. Fukuhara, A. Inoue
Quarterly J. Japan Welding Soc. Vol. 39 No. 2 p. 293-295 2011/08 Research paper (scientific journal)
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Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder/Co-P Plating and Ni-Co-P Plating
T. Daito, H. Nishikawa, T. Takemoto, T. Matsunami
Quarterly J. Japan Welding Soc. Vol. 39 No. 2 p. 224-225 2011/08 Research paper (scientific journal)
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Enhancement of solderability of Cu60Zr30Ti10 bulk metallic glass by dealloying in hydrofluoric acid solution
T. Naoi, H. Nishikawa, T. Takemoto, H. Abe, M. Fukuhara, A. Inoue
Quarterly J. Japan Welding Soc. Vol. 39 No. 2 p. 293-295 2011/08 Research paper (scientific journal)
-
Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder/Co-P Plating and Ni-Co-P Plating
T. Daito, H. Nishikawa, T. Takemoto, T. Matsunami
Quarterly J. Japan Welding Soc. Vol. 39 No. 2 p. 224-225 2011/08 Research paper (scientific journal)
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Solderability of metallic glass
Hiroshi Nishikawa, Tadashi Takemoto
Welding International Vol. 25 No. 7 p. 505-508 2011/07 Research paper (scientific journal)
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エレクトロニクス分野におけるマイクロ接合・実装技術動向
西川 宏
溶接学会誌 Vol. 80 No. 5 p. 458-460 2011/07
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Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives
Li-Ngee Ho, Teng Fei Wu, Hiroshi Nishikawa, Tadashi Takemoto, Koichi Miyake, Masakazu Fujita, Koyu Ota
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS Vol. 22 No. 7 p. 735-740 2011/07 Research paper (scientific journal)
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Effect of different copper fillers on the electrical resistivity of conductive adhesives
Li-Ngee Ho, Hiroshi Nishikawa, Tadashi Takemoto
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS Vol. 22 No. 5 p. 538-544 2011/05 Research paper (scientific journal)
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Effect of Laser Irradiation Conditions on Bonding Characteristics of Lead-free Solder Joints by Laser Soldering
N. Iwata, H. Nishikawa, T. Takemoto
Proc. of International Conference on Electronics Packaging p. 881-884 2011/04 Research paper (international conference proceedings)
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Effects of Joining Conditions on Joint Strength of Cu/Cu Joint Using Cu Nanoparticle Paste
Hiroshi Nishikawa, Tomoaki Hirano, Tadashi Takemoto, Nobuhito Terada
The Open Surface Science Journal Vol. 3 p. 60-64 2011/04 Research paper (scientific journal)
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Effects of Joining Conditions on Joint Strength of Cu/Cu Joint Using Cu Nanoparticle Paste
Hiroshi Nishikawa, Tomoaki Hirano, Tadashi Takemoto, Nobuhito Terada
The Open Surface Science Journal Vol. 3 p. 60-64 2011/04 Research paper (scientific journal)
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レーザはんだ付されたSn-3Ag-0.5Cuはんだ継手の接合性評価
岩田 典也, 西川 宏, 竹本 正
第17回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 17 p. 299-302 2011/02 Research paper (other academic)
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Cuナノ粒子継手の接合性に及ぼす雰囲気の影響
平野 智章, 西川 宏, 竹本 正, 寺田 信人
第17回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 17 p. 95-98 2011/02 Research paper (other academic)
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Effect of heating method on microstructure of Sn-3.0Ag-0.5Cu solder on Cu substrate
H. Nishikawa, N. Iwata, T. Takemoto
EMPC-2011: 18TH EUROPEAN MICROELECTRONICS & PACKAGING CONFERENCE p. 221-224 2011 Research paper (international conference proceedings)
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Evaluation of Absorbed Impact Energy of Sn-3.0Ag-0.5Cu (-xCo) Solder Joints with Co-P Plating Using a Ball Impact Test
Tomoya Daito, Hiroshi Nishikawa, Tadashi Takemoto, Takashi Matsunami
Transactions of The Japan Institute of Electronics Packaging Vol. 3 No. 1 p. 18-23 2010/12 Research paper (scientific journal)
Publisher: The Japan Institute of Electronics Packaging
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Enhancement of solderability of Cu60Zr30Ti10 bulk metallic glass by dealloying in hydrofluoric acid solution
Takehiro Naoi, Hiroshi Nishikawa, Tadashi Takemoto, Hiroya Abe, Mikio Fukuhra, Akihisa Inoue
Trans. JWRI Vol. 39 No. 2 p. 293-295 2010/12 Research paper (bulletin of university, research institution)
Publisher: Joining and Welding Research Institute, Osaka University
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Interfacial reaction between Sn-3.0Ag-0.5Cu solder/Co-P plating and Ni-Co-P plating
Tomoya Daito, Hiroshi Nisikawa, Tadashi Takemoto, Takashi Matsunami
Trans. JWRI Vol. 39 No. 2 p. 224-225 2010/12 Research paper (bulletin of university, research institution)
Publisher: Joining and Welding Research Institute, Osaka University
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High-Temperature Resistant Intermetallic Compound Joints for Si Chips and Cu Substrates
Toshihide Takahashi, Shuichi Komatsu, Hiroshi Nishikawa, Tadashi Takemoto
JOURNAL OF ELECTRONIC MATERIALS Vol. 39 No. 10 p. 2274-2280 2010/10 Research paper (scientific journal)
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Effects of Silver Coating Covered with Copper Filler on Electrical Resistivity of Electrically Conductive Adhesives
Hiroshi Nishikawa, Saya Mikami, Koichi Miyake, Akira Aoki, Tadashi Takemoto
MATERIALS TRANSACTIONS Vol. 51 No. 10 p. 1785-1789 2010/10 Research paper (scientific journal)
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Conductive Filler for Technical Advantages of Conductive Adhessives
H. Nishikawa
Journal of the Japan Welding Society Vol. 79 No. 6 p. 550-555 2010/09
Publisher: JAPAN WELDING SOCIETY
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Grain Morphology and Mechanical Property of Intermetallic Compound at Interface Between Co Added Solder and Cu
H. Nishikawa, Feng Gao, A, Komatsu, T. Takemoto
Journal of the JRICu Vol. 49 No. 1 p. 120-124 2010/08 Research paper (scientific journal)
Publisher:
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Improvement of High-Temperature Performance of Zn-Sn Solder Joint
Toshihide Takahashi, Shuichi Komatsu, Hiroshi Nishikawa, Tadashi Takemoto
JOURNAL OF ELECTRONIC MATERIALS Vol. 39 No. 8 p. 1241-1247 2010/08 Research paper (scientific journal)
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Impact Test of Sn-3.0Ag-0.5Cu (-xCo) Solder with Co-P Plating
T. Daito, H. Nishikawa, T. Takemoto, T. Matsunami
Proc. International Conference on Electronics Packaging 2010 (ICEP 2010) p. 796-799 2010/04 Research paper (international conference proceedings)
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Mechanism of Damage of Flow Soldering Bath by Molten Lead-free Solder and its Prevention Methods
H. Nishikawa, L.. N. Ho, T.Takemoto, Y. Kashiwagi, M. Yamamoto, M. Nakamoto
Proc. 16th Symposium on Microjoining and Assembly Technology in Electronics Vol. 16 p. 115-118 2010/02 Research paper (other academic)
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High-temperatureresistant Lead-free Joint with Thin Film Joining
T. Takahashi, S. Suenaga, S. Komatsu, H. Nishikawa, T. Takemoto
Proc. 16th Symposium on Microjoining and Assembly Technology in Electronics Vol. 16 p. 171-176 2010/02 Research paper (other academic)
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Thin film joining for high-temperature performance of power semi-conductor devices
Toshihide Takahashi, Shuichi Komatsu, Hiroshi Nishikawa, Tadashi Takemoto
MICROELECTRONICS RELIABILITY Vol. 50 No. 2 p. 220-227 2010/02 Research paper (scientific journal)
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LOW TEMPERATURE BONDING OF BULK METALLIC GLASS USING AN ULTRASONIC PROCESS
Hiroshi Nishikawa, Krit WongPiromsarn, Hiroya Abe, Tadashi Takemoto, Masao Kubo, Yoshiharu Sanagawa, Takamasa Sakai, Mikio Fukuhara, Akihisa Inoue
CHARACTERIZATION AND CONTROL OF INTERFACES FOR HIGH QUALITY ADVANCED MATERIALS III Vol. 219 p. 29-+ 2010 Research paper (international conference proceedings)
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Electrical Properties of Pre-Alloyed Cu-P Containing Electrically Conductive Adhesive
Li-Ngee Ho, Teng Fei Wu, Hiroshi Nishikawa, Tadashi Takemoto
JOURNAL OF ADHESION Vol. 86 No. 8 p. 805-813 2010 Research paper (scientific journal)
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LOW TEMPERATURE BONDING OF BULK METALLIC GLASS USING AN ULTRASONIC PROCESS
Hiroshi Nishikawa, Krit WongPiromsarn, Hiroya Abe, Tadashi Takemoto, Masao Kubo, Yoshiharu Sanagawa, Takamasa Sakai, Mikio Fukuhara, Akihisa Inoue
CHARACTERIZATION AND CONTROL OF INTERFACES FOR HIGH QUALITY ADVANCED MATERIALS III Vol. 219 p. 29-+ 2010 Research paper (international conference proceedings)
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Effects of Trace Elements in Copper Fillers on the Electrical Properties of Conductive Adhesives
Li-Ngee Ho, Hiroshi Nishikawa, Naohide Natsume, Tadashi Takemoto, Koichi Miyake, Masakazu Fujita, Koyu Ota
JOURNAL OF ELECTRONIC MATERIALS Vol. 39 No. 1 p. 115-123 2010/01 Research paper (scientific journal)
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Erosion Behavior and Interfacial Reaction of Stainless Steels in Molten Lead-free Solder
NISHIKAWA Hiroshi, KANG Songai, TAKEMOTO Tadash
Trans. JWRI Vol. 38 No. 2 p. 53-56 2009/12 Research paper (bulletin of university, research institution)
Publisher: Joining and Welding Research Institute, Osaka University
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Estimation Method for Liquidus Temperature of Lead-Free Solder Using Differential Scanning Calorimetry Profiles
Hiroshi Nishikawa, Yoshihito Hamada, Tadashi Takemoto
JOURNAL OF ELECTRONIC MATERIALS Vol. 38 No. 12 p. 2610-2616 2009/12 Research paper (scientific journal)
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Effect of elements Ni and Co on morphology and type of IMC at Sn-3Ag-0.5Cu solder joint interface
Gong-Ge Meng, Tadashi Takemoto, Hiroshi Nishikawa
Journal of Harbin Institute of Technology (New Series) Vol. 16 No. 5 p. 648-651 2009/10 Research paper (scientific journal)
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Improved wettability of Sn-based solder over the Cu60Zr30Ti10 bulk metallic glass surface
A. Imai, M. Katayama, S. Maruyama, H. Nishikawa, T. Wada, H. Kimura, M. Fukuhara, T. Takemoto, A. Inoue, Y. Matsumoto
JOURNAL OF MATERIALS RESEARCH Vol. 24 No. 9 p. 2931-2934 2009/09 Research paper (scientific journal)
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導電性接着剤の高性能化
西川 宏, 竹本 正
科学と工業 2009/08
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Solderability of Bulk Metallic Glasses Using Lead-Free Solders
Hiroshi Nishikawa, Krit WongPiromsarn, Hiroya Abe, Tadashi Takemoto, Mikio Fukuhara, Akihisa Inoue
MATERIALS TRANSACTIONS Vol. 50 No. 6 p. 1326-1329 2009/06 Research paper (scientific journal)
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Dealloying of Cu-Zr-Ti Bulk Metallic Glass in Hydrofluoric Acid Solution
Hiroya Abe, Kazuyoshi Sato, Hiroshi Nishikawa, Tadashi Takemoto, Mikio Fukuhara, Akihisa Inoue
MATERIALS TRANSACTIONS Vol. 50 No. 6 p. 1255-1258 2009/06 Research paper (scientific journal)
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Solderability of Metallic Glass
H. Nishikawa, T. Takemoto
Journal of the Japan Welding Society Vol. 78 No. 2 p. 31-34 2009/03
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Interaction behavior between the additives and Sn in Sn-3.0Ag-0.5Cu-based solder alloys and the relevant joint solderability
Fangjie Cheng, Feng Gao, Hiroshi Nishikawa, Tadashi Takemoto
JOURNAL OF ALLOYS AND COMPOUNDS Vol. 472 No. 1-2 p. 530-534 2009/03 Research paper (scientific journal)
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Mechanical properties versus temperature relation of individual phases in Sn-3.0Ag-0.5Cu lead-free solder alloy
Feng Gao, Hiroshi Nishikawa, Tadashi Takemoto, Jianmin Qu
MICROELECTRONICS RELIABILITY Vol. 49 No. 3 p. 296-302 2009/03 Research paper (scientific journal)
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Enhancement of Au Dissolution by Microorganisms Using an Accelerating Cathode Reaction
Yoshito Kita, Hiroshi Nishikawa, Michihiko Ike, Tadashi Takemoto
METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE Vol. 40 No. 1 p. 39-44 2009/02 Research paper (scientific journal)
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Amorphous/crystalline transition of copper at room-temperature
M. Fukuhara, H. Abe, H. Nishikawa, T. Takemoto, G. Xie, A. Inoue
CHEMICAL PHYSICS LETTERS Vol. 469 No. 4-6 p. 289-292 2009/02 Research paper (scientific journal)
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Fluxless joining of aluminium alloy to steel by laser irradiation method
Tadashi Takemoto, Sachio Kimura, Yousuke Kawahito, Hiroshi Nishikawa, Seiji Katayama
Welding International Vol. 23 No. 5 p. 316-322 2009 Research paper (scientific journal)
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Reduction of damage of soldering iron tip by addition of co and Ni To Sn-Ag-Cu lead-free solder
Tadashi Takemoto, Ken-Ichi Tomitsuka, Toshio Tooyama, Hiroshi Nishikawa
Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society Vol. 27 No. 2 p. 209s-213s 2009 Research paper (scientific journal)
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Measurement of erosion of stainless steel by molten lead-free solder using micro-focus X-ray CT system
Hiroshi Nishikawa, Songai Kang, Tadashi Takemoto
Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society Vol. 27 No. 2 p. 214s-218s 2009 Research paper (scientific journal)
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Characteristics of Electrically Conductive Adhesives filled with Copper nanoparticles with Organic Layer
L-N. Ho, H. Nishikawa, T. Takemoto, Y. Kashiwagi, M. Yamamoto, M. Nakamoto
2009 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE (EMPC 2009), VOLS 1 AND 2 p. 443-+ 2009 Research paper (international conference proceedings)
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Effect of Some Factors on Erosion of Stainless Steel by Molten Lead-free Solder
H.Nishikawa, K.Sabase, T.Takemoto
Proc. 15th Symposium on Microjoining and Assembly Technology in Electronics Vol. 15 p. 387-390 2009/01 Research paper (other academic)
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Mechanism of Damage of Flow Soldering Bath by Molten Lead-free Solder and its Prevention Methods
T.Takemoto, H.Nishikawa, K. Serizawa, K.Yamamoto
Proc. 15th Symposium on Microjoining and Assembly Technology in Electronics Vol. 15 p. 383-386 2009/01 Research paper (other academic)
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Fluxless Joining of Aluminum Alloy to Steel by Laser Irradaiation Method
Tadashi Takemoto, Sachio Kimura, Yousuke Kawahito, Hiroshi Nishikawa, Seiji Katayama
Journal of Light Metal Welding & Construction Vol. 46 No. 7 p. 300-308 2008/07 Research paper (scientific journal)
Publisher: Japan Light Metal Welding Association
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Effect of Ni or Co addition to Sn-Ag solder on microstructure and joint strength at interface
Hiroshi Nishikawa, Akira Komatsu, Tadashi Takemoto
MATERIALS TRANSACTIONS Vol. 49 No. 7 p. 1518-1523 2008/07 Research paper (scientific journal)
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Estimation of the thermal fatigue resistance and creep properties of the Co/Ni-bearing SAC305 lead-free solders by the strain rate change tensile test
Fangjie Cheng, Hiroshi Nishikawa, Tadashi Takemoto
MATERIALS TRANSACTIONS Vol. 49 No. 7 p. 1503-1507 2008/07 Research paper (scientific journal)
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Characterization of Co-Sn intermetallic compounds in Sn-3.0Ag-0.5Cu-0.5Co lead-free solder alloy
Feng Gao, Fangjie Cheng, Hiroshi Nishikawa, Tadashi Takemoto
MATERIALS LETTERS Vol. 62 No. 16 p. 2257-2259 2008/06 Research paper (scientific journal)
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Microstructural and mechanical properties of Sn-Ag-Cu lead-free solders with minor addition of Ni and/or Co
Fangjie Cheng, Hiroshi Nishikawa, Tadashi Takemoto
JOURNAL OF MATERIALS SCIENCE Vol. 43 No. 10 p. 3643-3648 2008/05 Research paper (scientific journal)
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Microstructural and Mechanical Properties of the SAC305 Solder Doped with Co and Ni Minor Elements
F-J Cheng, H. Nishikawa, T. Takemoto
Smart Processing Technology Vol. 2 p. 305-312 2008/03 Research paper (scientific journal)
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Electrical Conductivity of Conductive Adhesives with low melting point metal
H. Nishikawa, K. Tsuji, N. Terada, T. Takemoto
Smart Processing Technology Vol. 2 p. 115-118 2008/03 Research paper (scientific journal)
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The creep deformation characterization of Sn-3.5Ag lead-free solder alloy
F. Gao, H. Nishikawa, T. Takemoto
Smart Processing Technology Vol. 2 p. 123-126 2008/03 Research paper (scientific journal)
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Laser Joining of 6061 Aluminum Alloy and Steel using Zn Filler Metal
T. Takemoto, S. Kimura, Y. Kawahito, H. Nishikawa
Smart Processing Technology Vol. 2 p. 127-130 2008/03 Research paper (scientific journal)
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Microstructural and Mechanical Behavior of Plasma Sprayed YSZ Coating on Ni Super Alloy during Hot Corrosion
Abbas Afrasiabi, Mohsen Saremi, Akira Kobayashi, Hiroshi Nishikawa
Smart Processing Technology Vol. 2 p. 41-44 2008/03 Research paper (scientific journal)
Publisher:
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Improvement of Electrical Conductivity for Cu Filled Conductive Adhesives
H. Nishikawa, K. Tsuji, N. Terada, T. Takemoto
Proc. 14th Symposium on Microjoining and Assembly Technology in Electronics Vol. 14 p. 169-172 2008/02 Research paper (other academic)
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Wetting characteristics of Sn-Ag-Cu solder on Pd-based metallic glass
Hiroshi Nishikawa, Krit WongPiromsarn, Hiroya Abe, Tadashi Takernoto, Mikio Fukuhara, Takeshi Wada, Akihisa Inoue
MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS Vol. 148 No. 1-3 p. 124-127 2008/02 Research paper (scientific journal)
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Electrical Property of Conductive Adhesives Using Silver-coated Copper Filler
Hiroshi Nishikawa, Saya Mikami, Nobuto Terada, Koich Miyake, Akira Aoki, Tadashi Takemoto
ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS p. 825-+ 2008 Research paper (international conference proceedings)
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Temperature dependence of mechanical properties of individual phases in Sn-3.0Ag-0.5Cu lead-free solder alloy
Feng Gao, Hiroshi Nishikawa, Tadashi Takemoto, Jianmin Qu
58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS p. 466-+ 2008 Research paper (international conference proceedings)
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Effects of isothermal aging on the microstructure and tensile behavior of Sn-3.0Ag-0.5Cu-0.2Co solder
Fangjie Cheng, Hiroshi Nishikawa, Tadashi Takemoto
ADVANCED WELDING AND MICRO JOINING / PACKAGING FOR THE 21ST CENTURY Vol. 580-582 p. 239-242 2008 Research paper (international conference proceedings)
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Interfacial reaction of electroless Ni-P plating with Sn-3.5Ag (-Co) solder
Hiroshi Nishikawa, Akira Komatsu, Tadashi Takemoto
ADVANCED WELDING AND MICRO JOINING / PACKAGING FOR THE 21ST CENTURY Vol. 580-582 p. 243-246 2008 Research paper (international conference proceedings)
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Micromechanical responses of Sn-3.5Ag-xCo lead-free solders by nanoindentation
Feng Gao, Hiroshi Nishikawa, Tadashi Takemoto
ADVANCED WELDING AND MICRO JOINING / PACKAGING FOR THE 21ST CENTURY Vol. 580-582 p. 209-212 2008 Research paper (international conference proceedings)
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Additive effect of Kirkendall void formation in Sn-3.5Ag solder joints on common substrates
Feng Gao, Hiroshi Nishikawa, Tadashi Takemoto
JOURNAL OF ELECTRONIC MATERIALS Vol. 37 No. 1 p. 45-50 2008/01 Research paper (scientific journal)
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Intermetallics evolution in Sn-3.5Ag based lead-free solder matrix on an OSPCu finish
Feng Gao, Hiroshi Nishikawa, Tadashi Takemoto
JOURNAL OF ELECTRONIC MATERIALS Vol. 36 No. 12 p. 1630-1634 2007/12 Research paper (scientific journal)
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Effects of Co Addition on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu Solder Alloy
CHENG Fangjie, NISHIKAWA Hiroshi, TAKEMOTO Tadashi
Trans. JWRI Vol. 36 No. 1 p. 53-56 2007/09 Research paper (bulletin of university, research institution)
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Morphology and pull strength of Sn-Ag(-Co) solder joint with copper pad
Hiroshi Nishikawa, Akira Komatsu, Tadashi Takemoto
JOURNAL OF ELECTRONIC MATERIALS Vol. 36 No. 9 p. 1137-1143 2007/09 Research paper (scientific journal)
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Correlations between IMC thickness and three factors in Sn-3Ag-0.5Cu alloy system
Gong-ge MENG, T. Takemoto, H. Nishikawa
Transactions of Nonferrous Metals Society of China (English Edition) Vol. 17 No. 4 p. 686-690 2007/08 Research paper (scientific journal)
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Effective Electrode Work Functions in Helium Gas Tungsten Arc During Operation
Shinichi Tashiro, Hiroshi Nishikawa, Manabu Tanaka
PLASMA PROCESSES AND POLYMERS Vol. 4 p. S995-S998 2007/04 Research paper (scientific journal)
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Evaluation of Sn-3.5Ag based solder joint by ball impact test
H. Nishikawa, K. Miki, T. Takemoto
Proc. IPC/JEDEC Global Conference on Lead Free Reliability and Reliability Testing for RoHS Lead Free Electronics p. 0.417361111111111-0.420833333333333 2007/04 Research paper (international conference proceedings)
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The Microstructure Characterization of Sn-Ag-Cu Solder with Small Amount of Co Addition
F. CHENG, H.Nishikawa, T.Takemoto
Proc. 13th Symposium on Microjoining and Assembly Technology in Electronics p. 193-196 2007/02 Research paper (other academic)
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Wettability between Pd-based Metallic Glass and Lead-free Solder
H. Nishikawa, W. P. Krit, H.Abe, T.Takemoto, M.Hukuhara, T.Wada, A.Inoue
Proc. 13th Symposium on Microjoining and Assembly Technology in Electronics p. 179-182 2007/02 Research paper (other academic)
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Suppression of Damage of Soldering Iron Tip by using of Co, Ni Added Flux Cored Solder Wire
T.Takemoto, K. Tomitsuka, H.Nishikawa
Proc. 13th Symposium on Microjoining and Assembly Technology in Electronics Vol. 13 p. 263-266 2007/02 Research paper (other academic)
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Effective electrode work functions in argon gas tungsten arc during operation
M. Tanaka, S. Tashiro, H. Nishikawa, M. Ushio
SURFACE & COATINGS TECHNOLOGY Vol. 201 No. 9-11 p. 5383-5386 2007/02 Research paper (scientific journal)
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Effect of aging conditions on impact strength of Sn-3.5 based solder joint
Hiroshi Nishikawa, Kousuke Miki, Tadashi Takemoto
2007 9TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2 Vol. 9 p. 553-+ 2007 Research paper (international conference proceedings)
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MEASUREMENTS OF CATHODE SURFACE TEMPERATURE OF PLASMA TORCH
Shinichi Tashiro, Hiroshi Nishikawa, Manabu Tanaka
CHARACTERIZATION AND CONTROL OF INTERFACES FOR HIGH QUALITY ADVANCED MATERIALS II Vol. 198 p. 395-400 2007 Research paper (international conference proceedings)
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TOPOLOGY ANALYSIS OF THE CU3SN PHASE IN ELECTRONIC INTERCONNECTIONS
Feng Gao, Hiroshi Nishikawa, Tadashi Takemoto
CHARACTERIZATION AND CONTROL OF INTERFACES FOR HIGH QUALITY ADVANCED MATERIALS II Vol. 198 p. 401-406 2007 Research paper (international conference proceedings)
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A TREATMENT OF CARBONACEOUS WASTE CONTAINING METALS BY STEAM PLASMA
Hiroshi Nisikawa, Sumihiro Higuchi, Manabu Tanaka, Tadashi Takemoto
CHARACTERIZATION AND CONTROL OF INTERFACES FOR HIGH QUALITY ADVANCED MATERIALS II Vol. 198 p. 353-+ 2007 Research paper (international conference proceedings)
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Nano-scale mechanical responses of sn-ag based lead-free solders
Feng Gao, Hiroshi Nishikawa, Tadashi Takemoto
57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS p. 205-+ 2007 Research paper (international conference proceedings)
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Effective electrode work functions in helium gas tungsten arc during operation
Shinichi Tashiro, Hiroshi Nishikawa, Manabu Tanaka
Plasma Processes and Polymers Vol. 4 No. 1 p. S995-S998 2007 Research paper (international conference proceedings)
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Morphology and growth pattern transition of intermetallic compounds between Cu and Sn-3.5Ag containing a small amount of additives
Feng Gao, Tadashi Takemoto, Hiroshi Nishikawa
JOURNAL OF ELECTRONIC MATERIALS Vol. 35 No. 12 p. 2081-2087 2006/12 Research paper (scientific journal)
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Joint Strength between Sn-Ag Based Lead-free Solder and Cu Pad by Ball Shear Test
H.Nishikawa, A. Komatsu, T. Takemoto
Transactions of JWRI Vol. 35 No. 2 p. 53-56 2006/12 Research paper (bulletin of university, research institution)
Publisher: Joining and Welding Research Institute, Osaka University
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Estimation of the micromechanical characteristics of Sn-3.5Ag-0.1Co lead-free solder
F. Gao, H. Nishikawa, T. Takemoto
Proc. EcoDesign 2006 Asia Pacific Symposium p. 81-85 2006/12 Research paper (international conference proceedings)
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Erosion Protective Design for Lead-free Wave Soldering Bath
T. Takemoto, H. Nishikawa, F. Gao
Proc. EcoDesign 2006 Asia Pacific Symposium p. 77-80 2006/12 Research paper (international conference proceedings)
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Decomposition of residual cyanide by bacteria used for Au bioleaching
Y. KITA, H. OKAMOTO, H. NISHIKAWA, T. TAKEMOTO
Environmental Conservation Engineering Vol. 35 No. 12 p. 908-915 2006/12 Research paper (scientific journal)
Publisher: Society of Environmental Conservation Engineering
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A New Sorting Process of Aluminum Scraps Using Surface Morphology after Laser Irradiation
H. Nishikawa, K. Seo, S. Katayama, T. Takemoto
Going Green CARE INNOVATION 2006 p. 2.2.3:1-2.2.3:4 2006/11 Research paper (international conference proceedings)
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Gasification Process for Carbonized Waste by Hybrid Steam Plasma
H.Nishikawa, M.Ibe, M. Tanaka, T.Takemoto, M.Ushio
J. the Japan Society of Waste Management Experts Vol. 17 No. 6 p. 396-403 2006/11 Research paper (scientific journal)
Publisher: Japan Society of Material Cycles and Waste Management
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低融点金属とフラックスを添加したCuペーストの開発
細谷一雄, 寺田信人, 松葉 頼重, 竹本 正, 西川 宏
第16回マイクロエレクトロニクスシンポジウム論文集 p. 131-134 2006/10 Research paper (other academic)
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Effective Electrode Work Functions in Helium Gas Tungsten Arc during Operation
Shinichi Tashiro, Hiroshi Nishikawa, Manabu Tanaka
Tenth International Conference on Plasma Surface Engineering p. 543-543 2006/09 Research paper (international conference proceedings)
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Effect of DC steam plasma on gasifying carbonized waste
Hiroshi Nishikawa, Masaaki Ibe, Manabu Tanaka, Tadashi Takemoto, Masao Ushio
VACUUM Vol. 80 No. 11-12 p. 1311-1315 2006/09 Research paper (scientific journal)
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Effect of Additional Element on Interfacial Reaction and Shear Strength between Lead-free Solder and Copper
H.Nishikawa, A.Komatsu, T.Takemoto
J. JRICu Vol. 45 No. 1 p. 217-222 2006/08 Research paper (scientific journal)
Publisher:
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Effects of cyanide and dissolved oxygen concentration on biological Au recovery
Yoshito Kita, Hiroshi Nishikawa, Tadashi Takemoto
JOURNAL OF BIOTECHNOLOGY Vol. 124 No. 3 p. 545-551 2006/07 Research paper (scientific journal)
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Interaction Behavior on the Additives Redistribution during Lead-free Soldering Process
F.Gao, T.Takemoto, H.Nishikawa, A.Komatsu
Smart Processing Technology Vol. 1 p. 199-202 2006/06 Research paper (scientific journal)
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Prevention of Dissolution of Plated iron in Molten Lead-free Solder by Adding Minor Element to Solder
H.Nishikawa, A.Komatsu, T.Uetani, T.Takemoto
Smart Processing Technology Vol. 1 p. 195-198 2006/06 Research paper (scientific journal)
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Microstructure and mechanical properties evolution of intermetallics between Cu and Sn-3.5Ag solder doped by Ni-Co additives
F. Gao, T. Takemoto, H. Nishikawa, A. Komatsu
JOURNAL OF ELECTRONIC MATERIALS Vol. 35 No. 5 p. 905-911 2006/05 Research paper (scientific journal)
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Microstructure of interface between Sn-Cu solder with Ni and Cu plate
Hiroshi Nishikawa, Jin Yu Piao, Tadashi Takemoto
JOURNAL OF THE JAPAN INSTITUTE OF METALS Vol. 70 No. 5 p. 427-433 2006/05 Research paper (scientific journal)
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Interfacial reaction between Sn-0.7Cu (-Ni) solder and Cu substrate
H Nishikawa, JY Piao, T Takemoto
JOURNAL OF ELECTRONIC MATERIALS Vol. 35 No. 5 p. 1127-1132 2006/05 Research paper (scientific journal)
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Effect of Co Addition to Sn-Ag Solder on Interfacial Reaction and Joint Strength of Solder with Cu
H.nishikawa, A.Komatsu, T.Takemoto
TMS2006 135th Annual Meeting & Exhibition 2006/03 Research paper (other academic)
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Morphology and Growth Pattern Transition of IMCs between Cu and Sn3.5Ag Containing Small Amount of Additives
F.Gao, T.Takemoto, H.Nishikawa
TMS2006 135th Annual Meeting & Exhibition 2006/03 Research paper (other academic)
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Effects of Co and Ni addition on reactive diffusion between Sn-3.5Ag solder and Cu during soldering and annealing
F Gao, T Takemoto, H Nishikawa
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING Vol. 420 No. 1-2 p. 39-46 2006/03 Research paper (scientific journal)
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Microstructure and Mechanical Characteristics of Cu6Sn5-based Intermentallics Containing Additives
H.Nishikawa, F.Gao, T.Takemoto
Proc. the 12th Symposium on Microjoining and Assembly Technology in Electronics Vol. 12 p. 73-76 2006/02 Research paper (scientific journal)
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プラズマトーチにおける作動中タングステン陰極の仕事関数の測定
田代真一, 西川 宏, 田中 学
シンポジウム講演資料 2006/02 Research paper (other academic)
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The contrasting and statistics of spreading area data in soldering wettability
Gongge Meng, Tadashi Takemoto, Hiroshi Nishikawa
ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS p. 423-+ 2006 Research paper (international conference proceedings)
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Phase stability assessment and microstructure modification at lead-free solder joint
F. Gao, H. Nishikawa, T. Takemoto
ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS p. 738-+ 2006 Research paper (international conference proceedings)
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Application of Nd : YAG laser to aluminum alloy sorting
H Nishikawa, K Seo, S Katayama, T Takemoto
MATERIALS TRANSACTIONS Vol. 46 No. 12 p. 2641-2646 2005/12 Research paper (scientific journal)
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Degradation Mechanism on Joint of Betweens Ag-Epoxy Conductive Adhesive and Sn/Ni Plating Chip by Reliability Test
Woo-Ju Jeong, H.Nishikawa, S.Okumi, D. Itou, T. Takemoto
J. Adhesion Soc. Japan Vol. 41 No. 12 p. 490-497 2005/12 Research paper (scientific journal)
Publisher: The Adhesion Society of Japan
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Microstructure Characterization of Cu6Sn5-based Intermetallic Compounds at Solder Matrix and Relevant Solder Joints
G.Feng, H.Nishikawa, T.Takemoto
TRANSACTIONS OF JWRI Vol. 34 No. 2 p. 57-61 2005/12 Research paper (bulletin of university, research institution)
Publisher: Joining and Welding Research Institute, Osaka University
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Interfacial reaction between Sn-Ag-Co solder and metals
H Nishikawa, A Komatsu, T Takemoto
MATERIALS TRANSACTIONS Vol. 46 No. 11 p. 2394-2399 2005/11 Research paper (scientific journal)
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Electrical characteristics of a new class of conductive adhesive
WJ Jeong, H Nishikawa, D Itou, T Takemoto
MATERIALS TRANSACTIONS Vol. 46 No. 10 p. 2276-2281 2005/10 Research paper (scientific journal)
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Heat Input Properties of Hollow Cathode Arc as a Welding Heat Source
H.Nishikawa, S.Shobako, M.Ohta, T.Ohji
Journal of Physics D: Applied Physics Vol. 38 No. 18 p. 405-410 2005/09 Research paper (scientific journal)
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Effect of Irradiation Conditions on Aluminium Alloy Sorting by Using Nd:YAG Laser
H.Nishikawa, K.Seo, S.Katayama, T.Takemoto
Advances in Ecomaterials Vol. 1 p. 135-141 2005/07 Research paper (international conference proceedings)
Publisher: STALLION PRESS
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Microstructure of Sn-Ag-Co Solder Reacted with Cu substrate
H.Nishikawa, A.Komatsu, T.Takemoto
Proc. 3rd International Conference on Lead Free Electronics p. 0.959027778-0.961111111 2005/06 Research paper (international conference proceedings)
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Effect of solvent evaporation and shrink on conductivity of conductive adhesive
WJ Jeong, H Nishikawa, H Gotoh, T Takemoto
MATERIALS TRANSACTIONS Vol. 46 No. 3 p. 704-708 2005/03 Research paper (scientific journal)
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Additive Alloying Effects on the Generation of Intermetallic Compounds Between Sn-Ag-Ni-Co Solders and Cu
F.Gao, T.Takemoto, H.Nishikawa, A.Komatsu
TMS 2005, 135th Annual Meeting & Exhibition 2005/02 Research paper (other academic)
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Effect of Co Addition to Sn-Ag Solder on Interfacial Reaction
H. NISHIKAWA, A. KOMATSU, K. UETANI, T. TAKEMOTO
Proc. the 11th Symposium on Microjoining and Assembly Technology in Electronics Vol. 11 p. 129-132 2005/02 Research paper (scientific journal)
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Solderability and Microstructure of Various Iron-base Substrates
K. KIFUNE, T. TAKEMOTO, H. NISHIKAWA, N. FUJITA, K. UETANI, N. SEKIMORI
Proc. 11th Symposium on Microjoining and Assembly Technology in Electronics, Vol. 11(2005), 125-128 Vol. 11 p. 125-128 2005/02 Research paper (scientific journal)
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Growth Rate of Intermetallic Compounds at Sn-3.0Ag-0.5Cu/Cu Interface
T. TAKEMOTO, Y. KAMATA, H. NISHIKAWA, T. IIDA
Proc. 11th Symposium on Microjoining and Assembly Technology in Electronics, Vol. 11(2005), 111-114 Vol. 11 p. 111-114 2005/02 Research paper (scientific journal)
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Recycle of Valuable Metals in Waste Printed Wiring Board using Bacteria
Y. KITA, H. NISHIKAWA, M. IKE, T. TAKEMOTO
Proc. the 11th Symposium on Microjoining and Assembly Technology in Electronics Vol. 11 p. 87-89 2005/02 Research paper (scientific journal)
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Low environmentally impact recovery of gold using cyanide producing bacteria
Yosbito Kita, Hiroshi Nishikawa, Michibiko Ike, Tadashi Takemoto
FOURTH INTERNATIONAL SYMPOSIUM ON ENVIRONMENTALLY CONSCIOUS DESIGN AND INVERSE MANUFACTURING, PROCEEDINGS p. 935-938 2005 Research paper (international conference proceedings)
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Dissolution of Gold from Printed Wiring Board using Bacteria having Cyanide Generation and Decomposition Ability
Y. KITA, H. NISHIKAWA, M. IKE, T. TAKEMOTO
Proc. EcoDesign 2004 Japan Symposium p. 198-201 2004/12 Research paper (other academic)
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The Overview of IMS Project EFSOT Japan 2003
M.Okamoto, K.Serizawa, H.Satoh, M.Chiba, K.Omae, E.Hirao, N.Itsubo, A.Inaba, T.Takemoto, H.Nishikawa
Proc. The Sixth International Conference on EcoBalance p. 1-4 2004/11 Research paper (international conference proceedings)
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Effect of Grain Size on Reaction between Pb-free Solder and Plated Iron
H.Nishikawa, T.Takemoto, T.Uetani, N.Sekimori
Proc. PSEA '04, 502, 405-410 2004/11 Research paper (other academic)
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Improvement of Bond Characteristics of Conductive Adhesives by Curing Condition
W. J. JEONG, K. TSUJI, H. SAKAI, H. NISHIKAWA, H. GOTOH, T. TAKEMOTO
Proc. PSEA'04 Vol. 2 2004/11 Research paper (international conference proceedings)
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Topological Modification of IMC between Cu substrate and Sn-3.5Ag Solder with Addition Co participation
F.GAO, T.TAKEMOTO, H.NISHIKAWA, A.KOMATSU
Proc. 7th International Conference on Lead Free Electronic Components and Assemblies 2004/10 Research paper (international conference proceedings)
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Effect of Ni Addition on Interfacial Reaction Between Sn-Cu Solder and Cu Base Metal
H.Nisikawa, J.Y.Piao, T.Takemoto
Proc.Internationl Conference on Joining of Advanced and Specialty Materials VII 2004/10 Research paper (international conference proceedings)
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Damage Control of Soldering Iron Tip for Lead-free Solder
H.Nishikawa, T.Takemoto, T.Uetani
Proc.Internationl Conference on Joining of Advanced and Specialty Materials VII 2004/10 Research paper (international conference proceedings)
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Review of IMS Project EFSOT Japan 2003
M.Okamoto, K.Serizawa, S.satoh, M.Chiba, K.Omae, E.Hirano, S.Nakamoto, N.Itsubo, A.Inaba, T.Takemoto, H.Nishikawa
Proc. 2nd International Conference on Lead Free Electronics p. 40:1-40:9 2004/06 Research paper (international conference proceedings)
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Reduction of Damage of Soldering Iron Tip by Molten Lead Free Solders
H.Nishikawa, T.Takemoto, T.Uetani, N.Sekimori
2nd International Conference on Lead Free Electronics p. 37:1-37:5 2004/06 Research paper (international conference proceedings)
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Effect of Ni Concentration on Reaction between Sn-Cu-Ni soler and Cu base metal
H.Nishikawa, J.Y.Piao, T.Takemoto
2nd International Conference on Lead Free Electronics p. 27:1-27:4 2004/06 Research paper (international conference proceedings)
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Damage of Stainless Steels by Contact with Molten Pb-free Solder and Cu base metal
H.Nishikawa, Y.Kamata, T.Iida, T.Takemoto
2nd International Conference on Lead Free Electronics p. 15:1-15:4 2004/06 Research paper (international conference proceedings)
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Heat Input Energy to Anode for Hollow Cathode Arc
Nishikawa,H, Shobako,S, Ohta,M, Ohji,T
Proc. 4th Int. Conf. of Physical and Numerical Simulation of Materials 2004/05 Research paper (international conference proceedings)
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A treatment of carbonaceous wastes using thermal plasma with steam
H Nishikawa, M Ibe, M Tanaka, M Ushio, T Takemoto, K Tanaka, N Tanahashi, T Ito
VACUUM Vol. 73 No. 3-4 p. 589-593 2004/04 Research paper (scientific journal)
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Effect of iron plating conditions on reaction in molten lead-free solder
H Nishikawa, T Takemoto, K Kifune, T Uetani, N Sekimori
MATERIALS TRANSACTIONS Vol. 45 No. 3 p. 741-746 2004/03 Research paper (scientific journal)
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Simple Removal Method of Copper from Cu-enriched Flow Soldering Bath
T.Takemoto, T.Takahashi, H.Nishikawa
Proc. 10th Symposium on Microjoining and Assembly Technology in Electronics, 10, 257-260 2004/02 Research paper (scientific journal)
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Interrelation between Electrical Resistance and Shear Strength for Conductive Adhesive
H.Nishikawa, W-J.Jeong, K.Tsuji, H.Sakai, T.Takemoto, H.Gotoh
Proc. 10th Symposium on Microjoining and Assembly Technology in Electronics, 10, 179-182 2004/02 Research paper (scientific journal)
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Damages of Soldering Iron by Lead-Free Solder and Its Improvement
T.UETANI, M. YAMAZAKI, T. TAKEMOTO, H. NISIKAWA, K.Kifune
Proc. 10th Symposium on Microjoining and Assembly Technology in Electronics, 10,25-28 2004/02 Research paper (scientific journal)
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Effect of minor elements on interfacial reaction between lead-free solders and Cu
Preprints of the National Meeting of JWS Vol. 2004 p. 51-51 2004
Publisher: JAPAN WELDING SOCIETY
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Gold recovery from printed wiring board using bioleaching
Y Kita, H Nishikawa, T Takemoto
Electronics Goes Green 2004 (Plus): Driving Forces for Future Electronics, Proceedings p. 653-656 2004 Research paper (international conference proceedings)
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Simple removal method of enriched copper from lead-free soldering bath
H Nishikawa, T Takemoto, T Takahashi
Electronics Goes Green 2004 (Plus): Driving Forces for Future Electronics, Proceedings p. 373-378 2004 Research paper (international conference proceedings)
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A Heat Treatment of Carbonaceous Residues by Thermal Plasma with Steam
H.Nishikawa, M.Ibe, M.Tanaka, M.Ushio, T.Takemoto, K.Tanaka, N.Tanahashi, T.Itou
Advances in Applied Plasma Science, 399-402 2003/09 Research paper (international conference proceedings)
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Charactriscics of Conductive Adhive for High Conductivity in Electronics Packaging
W-J.Jeong, H.Nishikawa, T.Tadashi, H.Gotoh
2003 Internatinal Conference on Electronics Packaging (ICEP) Proceedings, 386-389 2003/04
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鉛フリーはんだ付用こて先チップの損傷抑制
西川 宏, 竹本 正, 上谷 孝司, 木船 弘一
溶接学会全国大会講演概要 Vol. 2003 p. 500-500 2003
Publisher: 一般社団法人 溶接学会
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Reduction of copper content from dip-type lead-free soldering bath
T Takemoto, T Takahashi, H Nishikawa
2003 3RD INTERNATIONAL SYMPOSIUM ON ENVIRONMENTALLY CONSCIOUS DESIGN AND INVERSE MANUFACTURING - ECODESIGN '03 p. 838-842 2003 Research paper (international conference proceedings)
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A basic study toward automated sorting of aluminum scraps
H Nishikawa, K Hiroe, S Katayama, T Takemoto
2003 3RD INTERNATIONAL SYMPOSIUM ON ENVIRONMENTALLY CONSCIOUS DESIGN AND INVERSE MANUFACTURING - ECODESIGN '03 p. 510-514 2003 Research paper (international conference proceedings)
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Fundamental Characteristics of the Hollow Cathode Arc as Welding Heat Source
Nishikawa,H, Ohji,T, Takemoto,T
Trans. JWRI, 32, 1, 63-66 2003/01 Research paper (scientific journal)
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Characteristics of Hollow Cathode Arc Plasma as a Heat Source
Hiroshi Nishikawa, Toshikazu Maruyama, Takayoshi Ohji
IEEJ Trans. FM, Vol.123, No.1, 2003 2003/01 Research paper (scientific journal)
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Scavening of Copper from Lead-free Flow Soldering Bath
T.Takahashi, T.Takemoto, H.Nishikawa
Proc. EcoDesign 2002 Japan Symposium, 128-131 2002/12 Research paper (other academic)
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Characteristics of Hollow Cathode Arc as Heat Source -Application of Hollow Cathode Arc to Welding of Aluminum Alloy-
Nishikawa Hiroshi, Kosaka kei, Ohji Takayoshi
Journal of High Temperature Society. Vol. 28 No. 6 p. 344-350 2002/11 Research paper (scientific journal)
Publisher:
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Characteristics of hollow cathode arc as welding heat source: arc characteristics and melting properties
H Nishikawa, K Yoshida, T Ohji, Y Suita, K Masubuchi
SCIENCE AND TECHNOLOGY OF WELDING AND JOINING Vol. 7 No. 5 p. 280-285 2002/10 Research paper (scientific journal)
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Effect of Gravity on Arc Welding Phenomenon -Development of Welding Technology in Space-
Fukushima Komaki, Nishikawa Hiroshi, Ohji Takayoshi
2002/01 Research paper (other academic)
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Fundamental characteristics of hollow cathode arc welding
Kazuhiro Yoshida, Hiroshi Nishikawa, Takayoshi Ohji, Yoshikazu Suita, Koichi Masubuchi
Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society Vol. 20 No. 1 p. 47-52 2002 Research paper (scientific journal)
Publisher: Japan Welding Society
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Characteristics of HCA as a heat source under low pressure condition
Hiroshi Nishikawa, Kazuhiro Yoshida, Toshikazu Maruyama, Takayoshi Ohji e
T. IEE Japan Vol. 122 No. 1 p. 79-86 2002/01 Research paper (scientific journal)
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Characteristics of Hollow Cathode Arc as a Welding Heat Source -Penetration Mechanism by HCA method-
Hiroshi Nishikawa, Toshikazu Maruyama, Kazuhiro Yoshida, Takayoshi Ohji, Yoshikazu Suita(Takamatsu National College of Technology, Koichi Masubuchi(Massachusetts, Institute of Technology
2001/11 Research paper (other academic)
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Characteristics of Hollow Cathode Arc as a welding heat source -Ignition process and melting property-
H.Nishikawa, K.Yoshida, T.Maruyama, T.Ohji, Y.Suita(Takamatsu National College of Technology, K.Masubuchi(Massachusetts, Institute of Technology
2001/05 Research paper (other academic)
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Welding in Space --- New Frontier
Hiroshi Nishikawa, Takayoshi Ohji
2001/01
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Gas hollow tungsten are characteristics under simulated space environment
H Nishikawa, K Yoshida, T Maruyama, T Ohji, Y Suita, K Masubuchi
SCIENCE AND TECHNOLOGY OF WELDING AND JOINING Vol. 6 No. 1 p. 12-16 2001 Research paper (scientific journal)
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Gas Hollow Tungsten Arc Characteristics Under Simulated Spce Environment
Hiroshi Nishikawa, Kazuhiro Yoshida, Toshikazu Maruyama, Takayoshi Ohji, Yoshikazu Suita, Takamatsu National, College of Technology, Koichi Masubuchi, Massachusetts Institute of Technology
2000/07 Research paper (other academic)
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Characteristics of HCA as a heat source under low pressure condition
Hiroshi Nishikawa, Kazuhiro Yoshida, Toshikazu Maruyama, Takayoshi Ohji, Yoshikazu Suita, Takamatsu National, College of Technology, Koichi Masubuchi(Massachusetts, Institute of Technology
Vol. 122 No. 1 p. 79-86 2000/06 Research paper (other academic)
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Hollow Electrode GHTA Experiments under Simulated Space Environments in a Flying Laboratory
Koichi Masubuchi(Massachusetts, Institute of Technology, Yoshikazu Suita, Takamatsu National, College of Technology, Noboru Terajima, Takamatsu National, College of Technology, Yoshiyuki Tsukuda, Takamatsu National College of Technology, Teppei Kohno, Takamatsu National, College of Technology, Takayoshi Ohji, Hiroshi Nishikawa
2000/05 Research paper (other academic)
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Fundamental characteristics of GHTA under low pressure
Hiroshi Nishikawa, Kazuhiro Yoshida, Takayoshi Ohji, Yoshikazu Suita, Yoshiyuki Tsukuda, Noboru Terajima, Takashi Hatta, Tettpei Kohno, Kenji Kawata, Rikiya Inokuma, Koichi Masubuchi
Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society Vol. 18 No. 2 p. 272-279 2000 Research paper (scientific journal)
Publisher: Japan Welding Soc
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GHTA welding experiments under simulated space environment in flying laboratory
Yoshikazu Suita, Yoshiyuki Tsukuda, Noboru Terajima, Takashi Hatta, Teppei Kohno, Rikiya Inokuma, Kenji Kawata, Takayoshi Ohji, Hiroshi Nishikawa, Kazuhiro Yoshida, Koichi Masubuchi
Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society Vol. 18 No. 2 p. 228-235 2000 Research paper (scientific journal)
Publisher: Japan Welding Soc
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GHTA Welding Experiments under Simulated Space Environment by Parabolic Flight
Yoshikazu Suita, Takamatsu National, College of Technology, Noboru Terajima, Takamatsu National, College of Technology, Yoshiyuki Tsukuda, Takamatsu National College of Technology, Teppei Kohno, Takamatsu National, College of Technology, Rikiya Inokuma, Takamatsu National, College of Technology, Takashi Hatta, Takamatsu National, College of Technology, Kenji Kawada, Takamatsu National, College of Technology, Takayoshi Ohji, Hiroshi Nishikawa, Kazuhiro Yoshida, Koichi Masubuchi, Massachusetts Institute of Technology
2000/01 Research paper (other academic)
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Model Analysis of Circumferential GTA Welding of Pipes
Fumikazu Miyasaka, Tomoyuki Yokogawa, Takeshi Masutani, Hiroshi Nishikawa, Takayoshi Ohji, Yoshinori Hirata
Vol. 16 No. 4 p. 471-478 1998/11 Research paper (scientific journal)