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Nishikawa Hiroshi
西川 宏
Nishikawa Hiroshi
西川 宏
Joining and Welding Research Institute, Professor

keyword Green electronics,Nano-& Micro-joining

Research History 5

  1. 2018/04 - Present
    Osaka University Joining and Welding Research Institute Professor

  2. 2007/04 - 2018/03
    Osaka University Joining and Welding Research Institute

  3. 2006/08 - 2007/03
    Osaka University Joining and Welding Research Institute

  4. 2005/01 - 2006/07
    Osaka University Joining and Welding Research Institute Assistant Professor

  5. 2002/04 - 2004/12
    Osaka University Graduate School of Engineering Assistant Professor

Education 3

  1. 大阪大学大学院 工学研究科 知能・機能創成工学専攻 博士後期課程

    1999/04 - 2002/03

  2. 大阪大学大学院 工学研究科 知能・機能創成工学専攻 博士前期課程

    1997/04 - 1999/03

  3. Osaka University School of Engineering

    1993/04 - 1997/03

Professional Memberships 8

  1. IEEE

  2. TMS

  3. スマートプロセス学会

  4. 日本接着学会

  5. 日本機械学会

  6. 日本金属学会

  7. エレクトロニクス実装学会

  8. 溶接学会

Research Areas 4

  1. Manufacturing technology (mechanical, electrical/electronic, chemical engineering) / Manufacturing and production engineering /

  2. Manufacturing technology (mechanical, electrical/electronic, chemical engineering) / Electronic devices and equipment /

  3. Nanotechnology/Materials / Material fabrication and microstructure control /

  4. Nanotechnology/Materials / Composite materials and interfaces /

Awards 19

  1. Mate2024優秀論文賞

    中脇 啓貴, 巽 裕章, Chih-han Yang, Shih-kang Lin, 西川 宏 (一社)スマートプロセス学会 エレクトロニクス生産科学部会、(一社)溶接学会 マイクロ接合研究委員会 2024/01

  2. 論文賞

    西川 宏 (一社)スマートプロセス学会 2023/11

  3. 2021年度 論文賞

    寺西 未沙, 勝又 美穂子, 西川 宏, 近藤 勝義, 田中 学 グローバル人材育成教育学会 2022/03

  4. 大阪大学賞 大学運営部門

    西川 宏 大阪大学 2019/11

  5. 業績賞(論文賞)

    塚本 雅裕, 舟田 義則, 左今 佑, 森本 健斗, 佐藤 雄二, 升野 振一郎, 原 隆裕, 西川 宏, 浅野 孝平 (一社)レーザー学会 2019/05

  6. 67th ECTC Best Interactive Session Paper

    Hiroshi Nishikawa IEEE Electronics Packaging Society 2018/05

  7. Best Student Paper Award, 3rd Place

    Shiqi Zhou, Xiangdong Liu, Omid Mokhtari, Hiroshi Nishikawa Chinese Institute of Electronics, China 2017/08

  8. MES2014ベストペーパー賞

    山中 公博, 田口 博久, 西川 宏, 原田 美由紀 (一社)エレクトロニクス実装学会 2015/09

  9. Osaka University Presidential Awards for Encouragement

    Hiroshi Nishikawa Osaka University 2015/07

  10. 大阪大学総長奨励賞

    西川 宏 大阪大学 2014/07

  11. Outstanding Poster Paper Award

    Li-Ngee Ho, Hiroshi Nishikawa EMAP/ISMP 2013 2013/10

  12. IEC 1906 Award

    Hiroshi Nishikawa The International Electrotechnical Commission 2013/06

  13. Best Poster Presentation

    H. Nishikawa, T. Naoi, M. Saito, J. Mizuno, M. Fukuhara The 3rd International Symposium on Advanced Materials Development and Integration of Novel Structural Metallic and Inorganic Materials (AMDI-3) 2012/11

  14. 第27回軽金属溶接論文賞

    竹本 正, 川人 洋介, 西川 宏, 片山 聖二 (社)軽金属溶接構造協会 2009/05

  15. Best Poster Award, IWJC-Korea 2007

    Feng Gao, Hiroshi Nishikawa, Tadashi Takemoto Korean Welding and Joining Society 2007/05

  16. 研究発表賞

    西川 宏 (社)溶接学会 2007/04

  17. 研究奨励賞

    西川 宏 (社)エレクトロニクス実装学会 2006/03

  18. 研究発表優秀賞

    西川 宏 (社)軽金属学会関西支部 2005/01

  19. Lead-free Solder Award 2004

    Hiroshi Nishikawa soldertec global 2005/01

Papers 500

  1. Direct formation of Cu nano-dendritic structure on substrate by dynamic hydrogen bubble template for organic-free sintered Cu-to-Cu bonding

    Ji-Hyun Kim, Hiroaki Tatsumi, Hiroshi Nishikawa

    Surfaces and Interfaces Vol. 62 p. 106268-106268 2025/04 Research paper (scientific journal)

    Publisher: Elsevier BV
  2. 電解めっきポーラス銅/はんだ複合構造を有する接合部の作製

    平瀬 加奈, 巽 裕章, 西川 宏

    第31回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2025)論文集 Vol. 31 p. 394-395 2025/01/28 Research paper (conference, symposium, etc.)

  3. Zn添加がSn-Bi系合金の変形挙動に及ぼす影響

    川上 夏輝, 巽 裕章, 西川 宏

    第31回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2025)論文集 Vol. 31 p. 392-393 2025/01/28 Research paper (conference, symposium, etc.)

  4. Ag-Cu合金の脱合金化による表面Agナノポーラスシートの作製と接合性評価

    内田 弘翔, 巽 裕章, 西川 宏

    第31回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2025)論文集 Vol. 31 p. 85-89 2025/01/28 Research paper (conference, symposium, etc.)

  5. ナノインデンテーション試験を用いたSn-52 mass%In合金におけるクリープ変形挙動の温度依存性

    新田 隼也, 巽 裕章, 西川 宏

    第31回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2025)論文集 Vol. 31 p. 67-71 2025/01/28 Research paper (conference, symposium, etc.)

  6. Atomistic behavior of Cu-Cu solid-state bonding in polycrystalline Cu with high-density boundaries

    Hiroaki Tatsumi, C.R. Kao, Hiroshi Nishikawa

    Materials & Design p. 113576-113576 2024/12 Research paper (scientific journal)

    Publisher: Elsevier BV
  7. Microstructure and Bonding Properties of Transient Liquid-Phase Bonding using Cu-SnAgCu Molded Sheets By High-Pressure Powder Compression

    Ichizo Sakamoto, Doojin Jeong, Hiroaki Tatsumi, Hiroshi Nishikawa

    Journal of Electronic Materials 2024/11/12 Research paper (scientific journal)

    Publisher: Springer Science and Business Media LLC
  8. Study of the Characteristics and Growth of Tin Whiskers in Orbit

    Shinichiro Ichimaru, Tsuyoshi Nakagawa, Norio Nemoto, Katsuaki Suganuma, Hiroaki Tatsumi, Hiroshi Nishikawa

    Microelectronics Reliability Vol. 162 2024/10/21 Research paper (scientific journal)

  9. Thermal decomposition temperature-dependent bonding performance of Ag nanostructures derived from metal–organic decomposition

    Chuncheng Wang, Hiroaki Tatsumi, Hiroshi Nishikawa

    Journal of Materials Science 2024/10/15 Research paper (scientific journal)

    Publisher: Springer Science and Business Media LLC
  10. Improved thermal shock reliability of Ag paste sintered joint by adjusted coefficient of thermal expansion with Ag-Si atomized particles addition

    Wangyun Li, Chuantong Chen, Masahiko Nishijima, Minoru Ueshima, Hiroshi Nishikawa, Katsuaki Suganuma

    Materials & Design Vol. 246 p. 113308-113308 2024/10/01 Research paper (scientific journal)

    Publisher: Elsevier BV
  11. Counter-intuitive mechanical performance variation in aged low-temperature interconnections in electronic packaging

    Wangyun Li, Lanqing Mo, Feng Chen, Zongbei Dai, Yiqin Xu, Siliang He, Hiroshi Nishikawa

    Vacuum Vol. 227 2024/09/01 Research paper (scientific journal)

  12. Quanifification of Adhesion Strength and Mechanism of Adhesion Degradation between Sputtered SUS304 and Mold Resin in Electromagnetic Wave Shield Packages

    Soichi Homma, Daichi Okada, Akihito Sawanobori, Susumu Yamamoto, Hiroshi Nishikawa

    Proceeding of the 10th IEEE Electronics System-Integration Technology Conference 2024/09 Research paper (international conference proceedings)

  13. Effect of minor element addition on mechanical properties and microstructure of Sn-Bi alloys

    Hiroshi Nishikawa, Yuki Hirata, Shiqi Zhou, Chih-han Yang, Shih-kang Lin

    Proceeding of the 10th IEEE Electronics System-Integration Technology Conference 2024/09 Research paper (international conference proceedings)

  14. ロータス型ポーラス銅/はんだ複合接合部の熱伝導率評価

    平瀬 加奈, 巽 裕章, 西川 宏

    第34回マイクロエレクトロニクスシンポジウム(MES2024)論文集 p. 123-126 2024/09 Research paper (conference, symposium, etc.)

  15. Ni-P/AuめっきによるSn-Bi系合金バンプ継手特性評価

    川上 夏輝, 巽 裕章, 西川 宏

    第34回マイクロエレクトロニクスシンポジウム(MES2024)論文集 p. 317-320 2024/09 Research paper (conference, symposium, etc.)

  16. 分子動力学法によるCu-Cu接合界面のボイド消失挙動の評価

    巽 裕章, C. R. Kao, 西川 宏

    第34回マイクロエレクトロニクスシンポジウム(MES2024)論文集 p. 411-412 2024/09 Research paper (conference, symposium, etc.)

  17. Creep Behavior of Low-temperature Sn-In Solder using Nanoindentation Test

    Shunya Nitta, Hiroaki Tatsumi, Hiroshi Nishikawa

    Proceedings of IEEE International 3D Systems Integration Conference (3DIC 2024) 2024/09 Research paper (international conference proceedings)

  18. Study on Thermal Cycling Reliability of Epoxy-Enhanced SAC305 Solder Joint

    Peng Zhang, Songbai Xue, Lu Liu, Jianhao Wang, Hiroaki Tatsumi, Hiroshi Nishikawa

    Polymers Vol. 16 2024/09 Research paper (scientific journal)

  19. Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation

    Yang Liu, Chuantong Chen, Ye Wang, Zheng Zhang, Ran Liu, Minoru Ueshima, Ichiro Ota, Hiroshi Nishikawa, Masahiko Nishijima, Koji S. Nakayama, Katsuaki Suganuma

    Composites Part B: Engineering Vol. 281 p. 111519-111519 2024/07/01 Research paper (scientific journal)

    Publisher: Elsevier BV
  20. Reducing anisotropy of rhombohedral Bi-rich phase for high-performance Ag-alloyed Sn-Bi low-temperature solders

    Chih-han Yang, Yu-chen Liu, Hiroshi Nishikawa, Shih-kang Lin

    Journal of Materials Research and Technology Vol. 30 p. 16-24 2024/05 Research paper (scientific journal)

  21. Design of rose thorn biomimetic micro-protrusion for metals and CFRTP easily disassembled joining

    Tai Wang, Kiyokazu Yasuda, Hiroshi Nishikawa

    Engineering Research Express Vol. 6 No. 2 p. 025512-025512 2024/04/18 Research paper (scientific journal)

    Publisher: IOP Publishing
  22. Effect of Ar and N2 plasma etching on adhesion between mold resin and sputtered Cu in semiconductor electromagnetic shielding

    Soichi Homma, Masaya Shima, Yuusuke Takano, Takeshi Watanabe, Masatoshi Fukuda, Takashi Imoto, Hiroshi Nishikawa

    Journal of Adhesion Science and Technology Vol. 38 No. 6 p. 815-838 2024/04 Research paper (scientific journal)

  23. Ag Sintered Joints on ENIG Cu Substrates by an Ag-based Complex

    Chuncheng Wang, Hiroaki Tatsumi, Hiroshi Nishikawa

    Proceedings of 2024 International Conference on Electronics Packaging (ICEP2024) p. 95-96 2024/04 Research paper (international conference proceedings)

  24. Low Thermal Resistance Joint using Lotus-type Cu/Solder Composite

    Hiroaki Tatsumi, Hiroshi Isono, Kana Hirase, Takuya Ide, Hiroshi Nishikawa

    Proceedings of 2024 International Conference on Electronics Packaging (ICEP2024) p. 51-52 2024/04 Research paper (international conference proceedings)

  25. Joint Strength of Transient Liquid Phase Bonding Using Cu-SAC Molded Sheet

    Ichizo Sakamoto, Doojin Jeong, Hiroaki Tatsumi, Hiroshi Nishikawa

    Proceedings of 2024 International Conference on Electronics Packaging (ICEP2024) p. 41-42 2024/04 Research paper (international conference proceedings)

  26. A comparative numerical study of thermos-mechanical behavior among various IMC joints under thermal cycling condition

    Xunda Liu, Hiroaki Tatsumi, Hiroshi Nishikawa

    Journal of Smart Processing Vol. 13 No. 2 p. 83-89 2024/03 Research paper (scientific journal)

  27. ダイアタッチに向けたAg-Cu合金の脱合金化によるAgナノポーラスシートの作製

    内田 弘翔, 巽 裕章, 西川 宏

    第38回エレクトロニクス実装学会春季講演大会論文集 p. 165-166 2024/03 Research paper (conference, symposium, etc.)

  28. Transparent Liquid Ag-Based Complex for the Facile Preparation of Robust Sintered Ag Joints in Power Devices

    Chuncheng Wang, Hiroaki Tatsumi, Liang Xu, Tao Zhao, Pengli Zhu, Rong Sun, Hiroshi Nishikawa

    ACS Applied Electronic Materials Vol. 6 p. 1718-1728 2024/02 Research paper (scientific journal)

  29. ロータス型ポーラス銅・はんだ複合構造を活用した高放熱モジュールの試作評価

    巽 裕章, 磯野 浩, 平瀬 加奈, 井手 拓哉, 西川 宏

    第30回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2024)論文集 p. 112-113 2024/01 Research paper (conference, symposium, etc.)

  30. 青色半導体レーザを用いた純銅リボンはんだ付中の温度分布と微細組織の評価

    貴田 優希, 巽 裕章, 竹中 啓輔, 佐藤 雄二, 塚本 雅裕, 西川 宏

    第30回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2024)論文集 p. 49-53 2024/01 Research paper (conference, symposium, etc.)

  31. Sn-Bi-Zn-In合金の微細組織が変形挙動に及ぼす影響

    中脇 啓貴, 巽 裕章, Chih-han Yang, Shih-kang Lin, 西川 宏

    第30回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2024)論文集 p. 29-33 2024/01 Research paper (conference, symposium, etc.)

  32. Quasi-Direct Cu-Si3N4 Bonding using Multi-layered Active Metal Deposition for Power-Module Substrate

    Hiroaki Tatsumi, Seongjae Moon, Makoto Takahashi, Takahiro Kozawa, Eiki Tsushima, Hiroshi Nishikawa

    Materials and Design Vol. 238 2024/01 Research paper (scientific journal)

  33. Interfacial reactions between In and Ag during solid liquid interdiffusion process

    Xunda Liu, Fupeng Huo, Jianhao Wang, Hiroaki Tatsumi, Zhi Jin, Zhong Chen, Hiroshi Nishikawa

    Surfaces and Interfaces Vol. 45 2024/01 Research paper (scientific journal)

  34. Analysis of microstructures and fractures in Ag-In transient liquid phase bonded joints

    Xunda Liu, Hiroaki Tatsumi, Jianhao Wang, Zhi Jin, Zhong Chen, Hiroshi Nishikawa

    Materials Science and Engineering: A Vol. 892 2024/01 Research paper (scientific journal)

  35. Effect of Bi content on the microstructure and mechanical properties of Sn-Bi-Zn-In alloy

    Hiroki Nakawaki, Hiroaki Tatsumi, Shunya Nitta, Chih-han Yang, Shih-kang Lin, Hiroshi Nishikawa

    QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY Vol. 41 No. 4 2023/12 Research paper (scientific journal)

  36. Impact of crystalline orientation on Cu-Cu solid-state bonding behavior by molecular dynamics simulations

    Hiroaki Tatsumi, C.R. Kao, Hiroshi Nishikawa

    Scientific Reports Vol. 13 2023/12 Research paper (scientific journal)

  37. Thermomechanical Properties of Zeta (Ag3In) Phase

    Xunda Liu, Hiroaki Tatsumi, Zhi Jin, Zhong Chen, Hiroshi Nishikawa

    Materials Vol. 16 2023/11 Research paper (scientific journal)

  38. Strength-enhanced Sn-In low-temperature alloy with surface-modified ZrO2 nanoparticle addition

    Shunya Nitta, Hiroaki Tatsumi, Hiroshi Nishikawa

    Journal of Materials Science: Materials in Electronics Vol. 34 2023/11 Research paper (scientific journal)

  39. Influence of Isothermal Aging on Microstructure and Shear Property of Novel Epoxy Composite SAC305 Solder Joints

    Peng Zhang, Songbai Xue, Lu Liu, Jianhao Wang, Hiroaki Tatsumi, Hiroshi Nishikawa

    Polymers Vol. 15 2023/10 Research paper (scientific journal)

  40. Enhanced reliability for power modules via a new Ag/Si sinter joining strategy

    Yang Liu, Chuantong Chen, Koji S. Nakayama, Minoru Ueshima, Takeshi Sakamoto, Naoe Takuya, Hiroshi Nishikawa, Katsuaki Suganuma

    Advancing Microelectronics Vol. 2023 No. EMPC p. 242-244 2023/09 Research paper (international conference proceedings)

  41. Effect of surface microstructure on joints using nanoporous Cu sheet for power devices

    Hiroshi Nishikawa, Byungho Park, Mikiko Saito, Jun Mizuno

    Proc. of the 24th European Microelectronics Packaging Conference (EMPC2023) 2023/09 Research paper (international conference proceedings)

  42. Interfacial Behavior Between Mold Resin and Sputtered Film Deposited on Electromagnetic Shield Packages

    Soichi Homma, Daichi Okada, Akihito Sawanobori, Susumu Yamamoto, Takashi Imoto, Hiroshi Nishikawa

    Journal of Smart Processing Vol. 12 No. 5 p. 291-298 2023/09 Research paper (scientific journal)

  43. 「Sn-In/ZrO2ナノ粒子複合合金金におけるナノ粒子表面の分散性への影響

    新田 隼也、巽 裕章、西川 宏

    第33回マイクロエレクトロニクスシンポジウム(MES2023)論文集 p. 355-358 2023/09 Research paper (international conference proceedings)

  44. 青色半導体レーザを用いた純銅リボンはんだ付プロセスの短時間化

    貴田 優希, 巽 裕章, 竹中 啓輔, 佐藤 雄二, 塚本 雅裕, 西川 宏

    第33回マイクロエレクトロニクスシンポジウム(MES2023)論文集 p. 291-294 2023/09 Research paper (international conference proceedings)

  45. Fabrication and thermo-mechanical properties of Ag9In4 intermetallic compound

    Xunda Liu, Hiroaki Tatsumi, Zhi Jin, Zhong Chen, Hiroshi Nishikawa

    Intermetallics Vol. 162 2023/08 Research paper (scientific journal)

  46. Comparative Study of Sn-based Solder Wettability on Aluminum Substrate

    Jiahui Li, Hiroaki Tatsumi, Hiroshi Nishikawa

    Quarterly Journal of the Japan Welding Society Vol. 41 2023/07 Research paper (scientific journal)

  47. Thermal conductivity and reliability reinforcement for sintered microscale Ag particle with AlN nanoparticles additive

    Jianhao Wang, Shogo Yodo, Hiroaki Tatsumi, Hiroshi Nishikawa

    Materials Characterization Vol. 203 2023/07 Research paper (scientific journal)

  48. Reliability-enhanced microscale Ag sintered joint doped with AlN nanoparticles

    Jianhao Wang, Shogo Yodo, Hiroaki Tatsumi, Hiroshi Nishikawa

    Materials Letters Vol. 349 2023/07 Research paper (scientific journal)

  49. A Novel and Cost-Effective Ag/Si Composited Paste With Highly Stable Microstructure Maintaince in Thermal Shock Cycles

    Y. Liu, C. Chen, M. Ueshima, T. Sakamoto, T. Naoe, H. Nishikawa, K. Suganuma

    Proc. of 2023 International Conference on Electronics Packaging (ICEP) 2023/04/19 Research paper (international conference proceedings)

    Publisher: IEEE
  50. Impact Strength of Sn58Bi and Sn45Bi2.6Zn0.5In Solder Joints after Isothermal Aging

    Zhi Jin, Shunsuke Fujiwara, Junichi Takenaka, Koichi Hagio, Hiroshi Nishikawa

    Proc. of 2023 International Conference on Electronics Packaging (ICEP2023) 2023/04 Research paper (international conference proceedings)

  51. Effect of Etching Gas on Adhesion between Mold Resin and Sputtered Stainless Steel Ground Films in Electromagnetic Shield Packages

    Soichi Homma, Daiachi Okada, Akihito Sawanobori, Susumu Yamamoto, Takashi Imoto, Hiroshi Nishikawa

    Proc. of 2023 International Conference on Electronics Packaging (ICEP2023) 2023/04 Research paper (international conference proceedings)

  52. How to Enhance Sn-Bi Low-temperature Solder by Alloying

    Shih-kang Lin, Chih-han Yang, Yu-chen Liu, Yuki Hirata, Hiroshi Nishikawa

    Proc. of 2023 International Conference on Electronics Packaging (ICEP2023) 2023/04 Research paper (international conference proceedings)

  53. Failure Analysis of Joints Bonded by Ag-In Transient Liquid Phase Process during Shear Test

    Xunda Liu, Hiroaki Tatsumi, Zhi Jin, Hiroshi Nishikawa

    Proc. of 2023 International Conference on Electronics Packaging (ICEP2023) 2023/04 Research paper (international conference proceedings)

  54. Significant Consumption of Ni-P Layer in Ni-P/Sn-0.7Cu Solder Joints during Thermomigration

    Satoshi Oya, Hiroaki Tatsumi, Hiroshi Nishikawa

    Proc. of 2023 International Conference on Electronics Packaging (ICEP2023) 2023/04 Research paper (international conference proceedings)

  55. Microstructure and Property of Ag Sintered Joint Doping with AlN Nanoparticles

    Jianhao Wang, Shogo Yodo, Hiroaki Tatsumi, Hiroshi Nishikawa

    Proc. of 2023 International Conference on Electronics Packaging (ICEP2023) 2023/04 Research paper (international conference proceedings)

  56. Interfacial Intermetallic Compounds of Bi2Te3/Cu Joint using SAC305 Solder and Nano-Ag Paste

    Seongwoo Pak, Hiroaki Tatsumi, Jianhao Wang, Hiroshi Nishikawa

    Proc. of 2023 International Conference on Electronics Packaging (ICEP2023) 2023/04 Research paper (international conference proceedings)

  57. The Influence of Bi Content on Joint Properties using Sn-Bi-Zn-In Alloy

    Hiroki Nakawaki, Hiroaki Tatsumi, Chih-han Yang, Shih-kang Lin, Hiroshi Nishikawa

    Proc. of 2023 International Conference on Electronics Packaging (ICEP2023) 2023/04 Research paper (international conference proceedings)

  58. Molecular Dynamics Simulation of Cu-Cu Solid-State Bonding under Various Bonding Parameters

    Hiroaki Tatsumi, C.R. Kao, Hiroshi Nishikawa

    Proc. of 2023 International Conference on Electronics Packaging (ICEP2023) 2023/04 Research paper (international conference proceedings)

  59. The electromigration study of thin-film structured Sn3.5Ag and Ag using continuous observation and reliability enhancement approach

    Zhi Jin, Fupeng Huo, Duy Le Han, Xunda Liu, Hiroaki Tatsumi, Y.C. Chan, Hiroshi Nishikawa

    Thin Solid Films Vol. 774 No. 7 2023/04 Research paper (scientific journal)

  60. Thermomigration suppression in Sn3.5Ag solder joints by hot-end FeCoNiMn alloy

    Yu-An Shen, Yun-Xuan Lin, Fan-Yi Ouyang, Hiroshi Nishikawa, Ming-Hung Tsai

    Intermetallics Vol. 154 2023/03 Research paper (scientific journal)

  61. Overview of the JWRI Coupling Internship and its expansion, and a prospect of “JWRI HUST-OU” in Vietnam

    KATSUMATA Mihoko, KONDOH Katsuyoshi, NISHIKAWA Hiroshi, TANAKA Manabu

    JOURNAL OF THE JAPAN WELDING SOCIETY Vol. 92 No. 1 p. 42-48 2023/01 Research paper (scientific journal)

  62. 銀シートを用いた固相拡散接合の接合強度にシート内残留応力が及ぼす影響

    淀 将悟、巽裕章、西川 宏

    第29回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 73-74 2023/01 Research paper (conference, symposium, etc.)

  63. 青色半導体レーザ照射条件が純銅リボンのはんだ付継手特性に与える影響

    貴田 優希、巽 裕章、佐藤 雄二、塚本 雅裕、西川 宏

    第29回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 134-135 2023/01 Research paper (conference, symposium, etc.)

  64. Sn-Bi-Zn-In合金の機械的特性に及ぼすBi添加量の影響

    中脇 啓貴、巽 裕章、Chih-han Yang、Shih-kang Lin、西川 宏

    第29回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 132-133 2023/01 Research paper (conference, symposium, etc.)

  65. 銀ナノ粒子ペースト焼結体のエレクトロマイグレーション現象における試験温度の影響

    黒田 裕志、巽 裕章、西川 宏

    第29回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 90-93 2023/01 Research paper (conference, symposium, etc.)

  66. Mechanical properties of transient liquid phase bonded joints by using Ag-In sandwich structure

    Xunda Liu, Zhi Jin, Hiroaki Tatsumi, Hiroshi Nishikawa

    Proc. of 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) p. 71-75 2023/01 Research paper (international conference proceedings)

  67. 次世代パワー半導体デバイスのダイアタッチ向け焼結型接合技術

    西川 宏

    鉱山 Vol. 75 No. 9 p. 175-183 2022/12

  68. Development of crack-less and deformation-resistant electroplated Ni/electroless Ni/Pt/Ag metallization layers for Ag-sintered joint during a harsh thermal shock

    Yang Liu, Chuantong Chen, Zheng Zhang, Minoru Ueshima, Takeshi Sakamoto, Takuya Naoe, Hiroshi Nishikawa

    Materials & Design Vol. 224 2022/12 Research paper (scientific journal)

  69. Study on the SPCC and CFRTP Hybrid Joint Performance Produced with Additional Nylon-6 Interlayer by Ultrasonic Plastic Welding

    Tai Wang, Kiyokazu Yasuda, Hiroshi Nishikawa

    Polymers Vol. 14 No. 23 p. 5235-5235 2022/12/01 Research paper (scientific journal)

    Publisher: MDPI AG
  70. Sintered Bonding Process Using Sheet-Like Insert Materials

    Hiroshi Nishikawa

    Journal of The Japan Institute of Electronics Packaging Vol. 25 No. 7 p. 685-690 2022/11

  71. Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere

    Siliang He, Yu-An Shen, Bifu Xiong, Fupeng Huo, Jiahui Li, Jinguo Ge, Zhiliang Pan, Wangyun Li, Chuan Hu, Hiroshi Nishikawa

    Journal of Materials Research and Technology Vol. 21 p. 2352-2362 2022/11 Research paper (scientific journal)

  72. Contact angle analysis and intermetallic compounds formation between solders and substrates under formic acid atmosphere

    Siliang He, Yuhao Bi, Yu-An Shen, Zhikuan Chen, Gao Yue, Chuan Hu, Hiroshi Nishikawa

    Journal of Advanced Joining Processes Vol. 6 2022/11 Research paper (scientific journal)

  73. Novel interface regulation of Sn1.0Ag0.5Cu composite solders reinforced with modified ZrO2: Microstructure and mechanical properties

    Fupeng Hou, Zhi Jin, Duy Le Han, Jiahui Li, Keke Zhang, Hiroshi Nishikawa

    Journal of Materials Science & Technology Vol. 125 p. 157-170 2022/10 Research paper (scientific journal)

  74. Effect of low Bi content on mechanical properties of Sn-Bi-Zn-In alloy and its joint with Cu

    Hiroshi Nishikawa, Yuki Hirata, Chih-han Yang, Shih-kang Lin

    Proc. of the 2022 9th Electonics System-Integration Technology Conference p. 146-1-146-4 2022/09 Research paper (international conference proceedings)

  75. Anisotropic Highly Conductive Joints utilizing Cu-Solder Microcomposite Structure for High-Temperature Electronics Packaging

    Hiroaki Tatsumi, Hiroshi Nishikawa

    Materials & Design Vol. 223 2022/09 Research paper (scientific journal)

  76. Preparation and Evaluation of Sn-In Alloys with Surface-Modified ZrO2 Nanoparticles

    Proceedings of the 32nd Microelectronics Symposium (MES2022) p. 199-202 2022/09 Research paper (conference, symposium, etc.)

  77. Sintered Bonding Process Using Surface Nanostructured Materials for Die Bonding

    Hiroshi Nishikawa

    Kagaku to Kogyu Vol. 96 No. 8 p. 232-239 2022/08

  78. Fabrication of micron-sized protrusions on metal surface for metal/polymer easy-disassembly joining by selective laser melting technology

    Tai Wang, Kiyokazu Yasuda, Hiroshi Nishikawa

    Materials & Design Vol. 220 2022/08 Research paper (scientific journal)

  79. Highly efficient soldering of Sn-Ag-Cu solder joints using blue laser

    Hiroaki Tatsumi, Seiji Kaneshita, Yuki Kida, Yuji Sato, Masahiro Tsukamoto, Hiroshi Nishikawa

    Journal of Manufacturing Processes Vol. 82 p. 700-707 2022/08 Research paper (scientific journal)

  80. Effect of isothermal aging on properties of In-48Sn and In-Sn-8Cu alloys

    Duy Le Han, Hiroaki Tatsumi, Fupeng Huo, Hiroshi Nishikawa

    Proc. of 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) p. 2148-2152 2022/07 Research paper (international conference proceedings)

  81. Solid-State Bonding Behavior between Surface-Nanostructured Cu and Au: A Molecular Dynamics Simulation

    Hiroaki Tatsumi, C.R. Kao, Hiroshi Nishikawa

    Scientific Reports Vol. 12 2022/07 Research paper (scientific journal)

  82. Electromigration Comparison Study of Sn, Ag, and Cu Stripes Fabricated by Electron-Beam Physical Vapor Deposition

    Zhi Jin, Fupeng Huo, Xunda Liu, Hiroshi Nishikawa

    Proc. of 2022 International Conference on Electronics Packaging (ICEP2022) p. 203-204 2022/05 Research paper (international conference proceedings)

  83. Reliability Evaluation on Ag Sintering Die Attach for SiC Power Modules During Long-term Thermal Aging/cycling

    Y. Liu, C. Chen, M. Ueshima, T. Sakamoto, T. Naoe, H. Nishikawa, K. Suganuma

    Proc. of 2022 International Conference on Electronics Packaging (ICEP2022) p. 49-50 2022/05 Research paper (international conference proceedings)

  84. Mechanical Properties of Sn-Bi-Ag low-temperature Pb-free Solders

    Chih-han Yang, Yu-chen Liu, Yuki Hirata, Hiroshi Nishikawa, Shih-kang Lin

    Proc. of 2022 International Conference on Electronics Packaging (ICEP2022) p. 37-38 2022/05 Research paper (international conference proceedings)

  85. Adhesion mechanism between mold resin and sputtered copper for electromagnetic wave shield packages

    Soichi Homma, Masaya Shima, Yuusuke Takano, Takeshi Watanabe, Kazuhiro Murakami, Masatoshi Fukuda, Takashi Imoto, Hiroshi Nishikawa

    Thin Solid Films Vol. 750 2022/05 Research paper (scientific journal)

  86. Synthesis of Hierarchical Structured Cu-Sn Alloy Mesoparticles and Its Application of Cu-Cu Joint Materials

    Toshihiro Kuzuya, Toma Takedachi, Tetsuya Ando, Yasuharu Matsunaga, Ryouya Kobayashi, Yoshihiro Shimotori, Naofumi Nakazato, Hiroshi Nishikawa, Takuya Naoe

    Materials Transactions Vol. 63 No. 6 p. 794-799 2022/05 Research paper (scientific journal)

  87. High-strength Sn-Bi-based low-temperature solders with high toughness designed via high-throughput thermodynamic modelling

    Chih-han Yang, Yu-chen Liu, Yuki Hirata, Hiroshi Nishikawa, Shih-kang Lin

    Science and Technology of Welding and Joining Vol. 27 No. 7 p. 572-578 2022/05 Research paper (scientific journal)

  88. Robust shear strength of Cu-Au joint on Au surface-finished Cu disks by solid-state nanoporous Cu bonding

    Byungho Park, Mikiko Saito, Jun Mizuno, Hiroshi Nishikawa

    Microelectronics Engineering Vol. 260 2022/05 Research paper (scientific journal)

  89. Novel transient liquid phase bonding method using In-coated Cu sheet for high-temperature die attach

    Jianhao Wang, Xunda Liu, Fupeng Huo, Kento Kariya, Noriyuki Masago, Hiroshi Nishikawa

    Materials Research Bulletin Vol. 149 2022/05 Research paper (scientific journal)

  90. Effect of various parameters on the shear strength of solid-state nanoporous Cu bonding in Cu-Cu disks for power device packaging

    Byungho Park, Duy Le Han, Mikiko Saito, Jun Mizuno, Hiroshi Nishikawa

    Journal of Electronic Materials Vol. 51 No. 7 p. 3851-3862 2022/04 Research paper (scientific journal)

  91. Effect of Aluminum Clad Cu Wire Bonds on Power Cycle Lifetime for High Current Density Power Module Packages

    Fumiyoshi KAWASHIRO, Masaaki YOSHIKAWA, Eitaro MIYAKE, Yoshiki ENDO, Tatsuo TONEDACHI, Hiroshi NISHIKAWA

    Journal of Smart Processing Vol. 11 No. 2 p. 71-77 2022/03 Research paper (scientific journal)

  92. Adhesion Mechanism between Mold Resin and Sputtered Stainless Steel Ground Films for Electromagnetic Wave Shield Packages

    Soichi Homma, Yuusuke Takano, Takeshi Watanabe, Kazuhiro Murakami, Masatoshi Fukuda, Takashi Imoto, Hiroshi Nishikawa

    Materials Transactions Vol. 63 No. 6 p. 766-775 2022/03 Research paper (scientific journal)

  93. 大阪大学カップリング・インターンシップにおける成果プロセス(プログラムの質的向上を目指して)

    寺西 未沙, 勝又 美穂子, 西川 宏, 近藤 勝義, 田中 学

    グローバル人材育成教育研究 Vol. 9 No. 2 p. 95-108 2022/03 Research paper (scientific journal)

  94. 大阪大学カップリング・インターンシップ実施中の「参加者の認識の変化調査」に関する結果と考察(プログラム活動の認識変化への影響とは)

    勝又 美穂子, 橋本 智恵, 西川 宏, 近藤 勝義

    グローバル人材育成教育研究 Vol. 9 No. 2 p. 51-60 2022/03

  95. Three-dimensional interface and property of SnPb solder joint under extreme thermal shocking

    Jianhao Wang, Songbai Xue, Lu Liu, Peng Zhang, Hiroshi Nishikawa

    Science and Technology of Welding and Joining Vol. 27 No. 3 p. 186-196 2022/03 Research paper (scientific journal)

  96. Electrodeposition of nanocrystalline Cu for Cu-Cu direct bonding

    Jhih-Jhu Jhana, Kazutoshi Wataya, Hiroshi Nishikawa, Chih-Ming Chen

    Journal of the Taiwan Institute of Chemical Engineers Vol. 132 2022/03 Research paper (scientific journal)

  97. Effect of low Bi content of reliability of Sn-Bi alloy joints before and after thermal aging

    Hiroshi Nishikawa, Yuki Hirata, Chih-han Yang, Shih-kang Lin

    JOM Vol. Online 2022/02 Research paper (scientific journal)

  98. Surface modification of Cu electroplated layers for Cu-Sn transient liquid phase bonding

    Shao-Yu Hsu, Chih-Ming Chen, Jenn-Ming Song, Hiroshi Nishikawa

    Materials Chemistry and Physics Vol. 277 2022/02 Research paper (scientific journal)

  99. 銀ナノペースト焼結体のエレクトロマイグレーション現象評価

    黒田 裕志, 金 智, 巽 裕章, 西川 宏

    第28回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 313-314 2022/02 Research paper (conference, symposium, etc.)

  100. ダイアタッチ用表面微細構造Cuシートの提案

    綿谷 一駿, 朴 炳浩, 巽 裕章, 西川 宏

    第28回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 108-111 2022/02 Research paper (conference, symposium, etc.)

  101. レーザはんだ付におけるはんだ溶融挙動の観察と継手の特性評価

    金下 征司, 佐藤 雄二, 巽 裕章, 塚本 雅裕, 西川 宏

    第28回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 84-87 2022/02 Research paper (conference, symposium, etc.)

  102. Sintered Bonding Process Using Surface Nanostructured Sheet

    Hiroshi Nishikawa

    Journal of The Surface Finishing Society of Japan Vol. 72 No. 12 p. 679-682 2021/12

  103. Microstructure evolution and shear strength of Tin-Indium-xCu/Cu joints

    Duy Le Han, Yu-An Shen, Fupeng Huo, Hiroshi Nishikawa

    Metals Vol. 12 2021/12 Research paper (scientific journal)

  104. The influence of porosity and pore shape on the thermal conductivity of silver sintered joint for die attach

    Yong-Jae Kim, Byung-Ho Park, Soong-Keun Hyun, Hiroshi Nishikawa

    Materials Today Communications Vol. 29 2021/12 Research paper (scientific journal)

  105. Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment

    Chin-Hao Tsai, Wei-Chen Huang, Ly May Chew, Wolfgang Schmitt, Jiahui Li, Hiroshi Nishikawa, C.R. Cao

    Journal of Materials Research and Technology Vol. 15 p. 4541-4553 2021/11 Research paper (scientific journal)

  106. Interface design and the strengthening-ductility behavior of tetra-needle-like ZnO whisker reinforced Sn1.0Ag0.5Cu composite solders prepared with ultrasonic agitation

    Fupeng Hou, Zhi Jin, Duy Le Han, Keke Zhang, Hiroshi Nishikawa

    Materials & Design Vol. 210 2021/11 Research paper (scientific journal)

  107. 300℃高温放置によるマイクロサイズ銀粒子焼結層の微細組織変化

    淀 将悟, 霍 福?, 西川 宏

    第31回マイクロエレクトロニクスシンポジウム (MES2021) p. 159-162 2021/09 Research paper (conference, symposium, etc.)

  108. Fabrication of NiO/ZrO2 nanocomposites using ball milling-pyrolysis method

    Fupeng Hou, Yu-An Shen, Siliang He, Keke Zhang, Hiroshi Nishikawa

    Vacuum Vol. 191 2021/09 Research paper (scientific journal)

  109. マイクロエレクトロニクス実装分野で求められる新たなマイクロ接合技術

    西川 宏

    生産と技術 Vol. 73 No. 4 p. 15-17 2021/09

  110. Large-area and low-cost Cu-Cu bonding with cold spray deposition, oxidation and reduction processes under low-temperature conditions

    Juncai Hou, Qiumei Zhang, Siliang He, Jingru Bian, Jinting Jiu, Chengxin Li, Hiroshi Nishikawa

    Journal of Materials Science: Materials in Electronics Vol. 32 p. 20461-20473 2021/08 Research paper (scientific journal)

  111. Fabrication and characterization of nanoporous copper through chemical dealloying of cold-rolled Mn-Cu alloy

    Byungho Park, Duy Le Han, Mikiko Saito, Jun Mizuno, Hiroshi Nishikawa

    Journal of Porous Materials Vol. On line 2021/07 Research paper (scientific journal)

  112. The reliability of ENIG joint bonded by In-coated Cu sheet

    Hiroshi Nishikawa, Jianhao Wang, Kento Kariya, Noriyuki Masago

    Proc. of 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) p. 520-525 2021/06 Research paper (international conference proceedings)

  113. The effect of solid-state nanoporous Cu bonding for power device

    Byungho Park, Duy Le Han, Mikiko Saito, Jun Mizuno, Hiroshi Nishikawa

    Proc. of 2021 International Conference on Electronics Packaging (ICEP2021) p. 159-160 2021/05 Research paper (international conference proceedings)

  114. Effect of 4.0 mass% Cu addition on microstructure and mechanical properties of In-48Sn alloy

    Duy Le Han, Byungho Park, Hiroshi Nishikawa

    Proc. of 2021 International Conference on Electronics Packaging (ICEP2021) p. 139-140 2021/05 Research paper (international conference proceedings)

  115. Surface modification of tetra-needle like ZnO (T-ZnO) and characterization of interface between Sn1.0Ag0.5Cu and NiO decorated T-ZnO

    Fupeng Hou, Keke Zhang, Hiroshi Nishikawa

    Proc. of 2021 International Conference on Electronics Packaging (ICEP2021) p. 133-134 2021/05 Research paper (international conference proceedings)

  116. The voids growth path on Sn-Ag thin film under high current density

    Zhi Jin, Yu-An Shen, Yang Zuo, S. H. Mannan, Hiroshi Nishikawa

    Proc. of 2021 International Conference on Electronics Packaging (ICEP2021) p. 115-116 2021/05 Research paper (international conference proceedings)

  117. Improvements in mechanical properties of Sn-Bi alloys with addition of Zn and In

    Yuki Hirata, Chih-han Yang, Shih-kang Lin, Hiroshi Nishikawa

    Materials Science and Engineering: A Vol. 813 2021/05 Research paper (scientific journal)

  118. Observation of Void Formation Patterns in SnAg Films undergoing Electromigration and Simulation using Random Walk Methods

    Zhi Jin, Yu-An Shen, Yang Zuo, Y. C. Chan, S. H. Mannan, Hiroshi Nishikawa

    Scientific Reports Vol. 11 2021/04 Research paper (scientific journal)

  119. 大阪大学カップリング・インターンシップにおけるキャリア教育的効果について(実践型短期海外インターンシップ成果報告書からの分析)

    寺西 未沙、勝又 美穂子、西川 宏、近藤 勝義、田中 学

    グローバル人材育成教育研究 Vol. 8 No. 2 p. 1-12 2021/03 Research paper (scientific journal)

  120. 文理・異文化融合課題解決型グローバル人材育成プログラムが参加学生の進路検討に与える効果(カップリング・インターンシップ参加学生の進路追跡調査より)

    橋本 智恵、勝又 美穂子、西川 宏、近藤 勝義

    グローバル人材育成教育研究 Vol. 8 No. 2 p. 45-53 2021/03

  121. Sn-Bi-Zn-In合金を用いた接合部の特性評価

    平田 侑希, Chih-han YANG, Shin-kang LIN, 西川 宏

    第27回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 27 p. 298-301 2021/02 Research paper (conference, symposium, etc.)

  122. 青色半導体レーザを用いたレーザはんだ付継手の界面評価

    金下 征司, 佐藤 雄二, 塚本 雅裕, 西川 宏

    第27回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 320-321 2021/02 Research paper (conference, symposium, etc.)

  123. Cu-Zn合金の腐食を利用したCu微細構造による接合プロセスの検討

    綿谷 一駿, 朴 炳浩, 西川 宏

    第27回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 229-230 2021/02 Research paper (conference, symposium, etc.)

  124. Effect of Cu addition on the microstructure and mechanical properties of In-Sn-based low-temperature alloy

    Duy Le Han, Yu-An Shen, Siliang He, Hiroshi Nishikawa

    Materials Science and Engineering: A Vol. 804 2021/02 Research paper (scientific journal)

  125. Electromigration Behavior of Silver Thin Film Fabricated by Electron-Beam Physical Vapor Deposition

    Zhi Jin, Yu-An Shen, Fupeng Huo, Y. C. Chan, Hiroshi Nishikawa

    Journal of Materials Science Vol. 56 p. 9769-9779 2021/02 Research paper (scientific journal)

  126. Investigation of FeCoNiCu properties: thermal stability, corrosion behavior, wettability with Sn-3.0Ag-0.5Cu and interlayer formation of multi-element intermetallic compound

    Yu-An Shen, Han-Ming Hsieh, Shih-Hsun Chen, Jiahui Li, Sheng-Wen Chen, Hiroshi Nishikawa

    Applied Surface Science Vol. 546 2021/01 Research paper (scientific journal)

  127. Microstructures analysis and quantitative strengthening evaluation of powder metallurgy Ti-Fe binary extruded alloys with (α+β)-dual-phase

    Junko Umeda, Takayuki Tanaka, Takuma Teramae, Shota Kariya, Junji Fujita, Hiroshi Nishikawa, Yoji Shibutani, Jianghua Shen, Katsuyoshi Kondoh

    Materials Science and Engineering: A Vol. 803 2021/01 Research paper (scientific journal)

  128. レーザはんだ付の特徴

    西川 宏

    UYEMURA TECHNICAL REPORTS Vol. 80 p. 3-10 2020/11

  129. Sintered joint using micro-sized Ag particles for high-temeprature application

    Hiroshi Nishikawa

    Journal of Smart Processing Vol. 9 No. 6 p. 259-263 2020/11

  130. Effects of minor element addition on mechanical properties of Sn-Bi alloy

    Yuki Hirata, Chih-han Yang, Shih-kang Lin, Hiroshi Nishikawa

    Proc. of 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference 2020/10 Research paper (international conference proceedings)

  131. Mechanical and microstructural enhancements of Ag microparticle-sintered joint by ultrasonic vibration

    Runhua Gao, Yu-An Shen, Jiahui Li, Siliang He, Hiroshi Nishikawa

    Journal of Materials Science: Materials in Electronics Vol. 31 p. 21711-21722 2020/10 Research paper (scientific journal)

  132. Effect of surface potential distribution on corrosion behavior of Cu/Al interface in Cu wire bonding applications

    Omid Mokhtari, Hiroshi Nishikawa

    Microelectronics Reliability Vol. 113 2020/09 Research paper (scientific journal)

  133. Textile-based Passive Sensor for Air Humidity

    Han He, Xiaochen Chen, Zahangir Khan, Lauri Sydanheimo, Leena Ukkonen, Jiahui Li, Hiroshi Nishikawa, Johanna Virkki

    Proc. of 8th Electronics System-Integration Technology Conference p. 7-9 2020/09 Research paper (international conference proceedings)

  134. Effect of High-temperature Storage at 300 ℃ on Sintered Layer using Micro-sized Ag Particles for High-temperature Packaging Technology

    Hiroshi Nishikawa, Sota Yamano

    Proc. of 8th Electronics System-Integration Technology Conference p. 126-129 2020/09 Research paper (international conference proceedings)

  135. Metal Deposition Using Solutions on High-Density and Well-Aligned CNTs

    Mikiko Saito, Hiroyuki Kuwae, Jun Mizuno, Wataru Norimatsu, Michiko Kusunoki, Hiroshi Nishikawa

    Proc. of 8th Electronics System-Integration Technology Conference p. 43-47 2020/09 Research paper (international conference proceedings)

  136. Isolation and Characterization of Facultative-Anaerobic Antimonate-Reducing Bacteria

    Ziran Yang, Hisaaki Hosokawa, Takuya Sadakane, Masashi Kuroda, Daisuke Inoue, Hiroshi Nishikawa, Michihiko Ike

    Microorganisms Vol. 8 No. 9 p. 1435-1435 2020/09 Research paper (scientific journal)

    Publisher: MDPI AG
  137. Interfacial Transformation of Preoxidized Cu Microparticles in a Formic-Acid Atmosphere for Pressureless Cu-Cu Bonding

    Runhua Gao, Siliang He, Jiahui Li, Yu-An Shen, Hiroshi Nishikawa

    Journal of Materials Science: Materials in Electronics Vol. 31 p. 14635-14644 2020/08 Research paper (scientific journal)

  138. Sintered Micro-Silver Paste Doped with Indium for Die Attachment Applications of Power ICs

    Chin-Hao Tsai, Wei-Chen Huang, C. Robert Kao, Ly May Chew, Wolfgang Schmitt, Hiroshi Nishikawa

    Proc. of 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) p. 1430-1435 2020/05 Research paper (international conference proceedings)

  139. Microstructure and mechanical properties of the In-48Sn-xAg low-temperature alloy

    Duy Le Han, Yu-An Shen, Sanghun Jin, Hiroshi Nishikawa

    Journal of Materials Science Vol. 55 p. 10824-10832 2020/04 Research paper (scientific journal)

  140. Fabrication of Nanoporous Cu Sheet and Application to Bonding for High-Temperature Applications

    Shunichi Koga, Hiroshi Nishikawa, Mikiko Saito, Jun Mizuno

    Journal of Electronic Materials Vol. 49 No. 3 p. 2151-2158 2020/03 Research paper (scientific journal)

  141. Wettability, interfacial reactions, and impact strength of Sn-3.0Ag-0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere

    Siliang He, Runhua Gao, Yu-An Shen, Jiahui Li, Hiroshi Nishikawa

    Journal of Materials Science Vol. 55 No. 7 p. 3107-3117 2020/03 Research paper (scientific journal)

  142. はんだ/基板材料間のガルバニック腐食特性への金属間化合物の影響

    井上 健司, 西川 宏

    第26回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 26 p. 381-382 2020/01 Research paper (conference, symposium, etc.)

  143. In, Znの微量添加によるSn-Bi合金の機械的特性改善

    平田 侑希, 周 士祺, 楊 智涵, 林 士剛, 西川 宏

    第26回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 26 p. 379-380 2020/01 Research paper (conference, symposium, etc.)

  144. 外部電極形状がSnウィスカの成長に及ぼす影響

    斎藤 彰, 西川 宏

    第26回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 26 p. 199-204 2020/01 Research paper (conference, symposium, etc.)

  145. 基板材料がSn-Ag-Cuはんだ接合部の熱疲労特性に与える影響

    森下 真衣, 楢崎 邦男, 麻 寧緒, 西川 宏

    第26回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 26 p. 65-68 2020/01 Research paper (conference, symposium, etc.)

  146. パワーサイクル試験におけるダイボンド部の劣化挙動

    金黒 秀平, 佐々木 喜七, 西川 宏

    第26回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 26 p. 51-54 2020/01 Research paper (conference, symposium, etc.)

  147. In-situ observation of fluxless soldering of Sn-3.0Ag-0.5Cu/Cu under a formic acid atmosphere

    Siliang He, Runhua Gao, Jiahui Li, Yu-An Shen, Hiroshi Nishikawa

    Materials Chemistry and Physics Vol. 239 2020/01 Research paper (scientific journal)

  148. Effect of Zn addition on interfacial reactions and mechanical properties between eutectic Sn58Bi solder and ENIG substrate

    Shiqi Zhou, Siliang He, Hiroshi Nishikawa

    Journal of Nanoscience and Nanotechnology Vol. 20 No. 1 p. 106-112 2020/01 Research paper (scientific journal)

  149. Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology

    Yu-An Shen, Shiqi Zhou, Jiahui Li, Chih-han Yang, Sijie Huang, Shih-kang Lin, Hiroshi Nishikawa

    Materials & Design Vol. 183 2019/12 Research paper (scientific journal)

  150. Novel polarity effect on intermetallic compound thickness changes during electromigration in Cu/Sn-3.0Ag-0.5Cu/Cu solder joints

    Zhi Jin, Yu-An Shen, Siliang He, Shiqi Zhou, Y. C. Chan, Hiroshi Nishikawa

    Journal of Applied Physics Vol. 126 No. 18 2019/11 Research paper (scientific journal)

  151. Biosynthesis of bismuth selenide nanoparticles using chalcogen-metabolizing bacteria

    Masashi Kuroda, Soshi Suda, Mamoru Sato, Hiroyuki Ayano, Yuji Ohishi, Hiroshi Nishikawa, Satoshi Soda, Michihiko Ike

    Applied Microbiology and Biotechnology Vol. 103 p. 8853-8861 2019/10 Research paper (scientific journal)

  152. 有限要素法を用いた熱疲労特性に与えるSn-Ag-Cuはんだ接合部形状の影響評価

    森下 真衣, 麻 寧緒, 楢崎 邦男, 西川 宏

    第29回マイクロエレクトロニクスシンポジウム論文集 p. 135-138 2019/09 Research paper (other academic)

  153. Auナノポーラスシートを用いた接合部のパワーサイクル試験における長期信頼性評価

    金黒 秀平, 佐々木 喜七, 西川 宏

    第29回マイクロエレクトロニクスシンポジウム論文集 p. 19-22 2019/09 Research paper (other academic)

  154. 高温環境下でのAg焼結層組織変化の定量評価

    山野 聡太, 眞砂 紀之, 苅谷 健人, 西川 宏

    第29回マイクロエレクトロニクスシンポジウム論文集 p. 187-188 2019/09 Research paper (other academic)

  155. Effect of bonding temperature on shear strength of joints using micro-sized Ag particles for high temperature packaing technokigy

    Hiroshi Nishikawa, Myong-Hooh Roh, Akira Fujita, Nobuo Kamada

    Proc. of 22nd Microelectronics and Packaging Conference (EMPC) p. MT-12-1-MT-12-4 2019/09 Research paper (international conference proceedings)

  156. Tin Whisker Growth Mechanism on Tin Plating of MLCCs Mounted with Sn-3.5Ag-8In-0.5Bi Solder in 30deg C 60%RH

    Akira Saito, Hiroshi Nishikawa

    Proc. of 22nd Microelectronics and Packaging Conference (EMPC) p. R&Q-02-1-R&Q-02-4 2019/09 Research paper (international conference proceedings)

  157. Interfacial reaction behavior and mechanical properties of pure aluminum and magnesium alloy dissimilar materials fabricated by hot press and heat treatment

    Junko Umeda, Katsuyoshi Kondoh, Hiroyuki Sannomiya, Tachai Luangvaranunt, Makoto Takahashi, Hiroshi Nishikawa

    Materials Characterization Vol. 157 2019/08 Research paper (scientific journal)

  158. Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate

    Junghwan Bang, Dong-Yuri Yu, Yong-Ho Ko, Jun-Hyuk Son, Hiroshi Nishikawa, Chang-Woo Lee

    Microelectronics Reliability Vol. 99 p. 62-73 2019/08 Research paper (scientific journal)

  159. Effect of copper over-pad metallization on reliability of aluminum wire bonds

    Fumiyoshi Kawashiro, Kentaro Takao, Tatsuya Kobayashi, Masaaki Yoshikawa, Eitaro Miyake, Toshiki Endo, Tatsuo Tonedachi, Hiroshi Nishikawa

    Microelectronics Reliability Vol. 99 p. 168-176 2019/08 Research paper (scientific journal)

  160. Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging

    Yu-An Shen, Chun Ming Lin, Jiahui Li, Runhua Gao, Hiroshi Nishikawa

    Scientific Reports Vol. 9 2019/07 Research paper (scientific journal)

  161. Bonding strength of Cu/Cu joints using sintering process of micro-sized Cu particles for high-temperature application

    Hiroshi Nishikawa, Xiangdong Liu

    Proc. of IMAPS High Temperature Electronics Network (HiTEN 2019) p. 85-90 2019/07 Research paper (international conference proceedings)

  162. Microstructure and mechanical properties of Sn-1.0Ag-0.5Cu solder with minor Zn additions

    Y. M. Leong, A. S. M. A. Haseeb, Hiroshi Nishikawa, Omid Mokhtari

    Journal of Materials Science: Materials in Electoronics Vol. 30 No. 13 p. 11914-11922 2019/07 Research paper (scientific journal)

  163. Preferred Orientation of Bi and Effect of Sn-Bi Microstructure on Mechanical and Thermomechanical Properties in Eutectic Sn-Bi Alloy

    Yu-An Shen, Shiqi Zhou, Sijie Huang, Hiroshi Nishikawa

    Materialia Vol. 6 2019/06 Research paper (scientific journal)

  164. The newly developed Sn-Bi-Zn alloy with a low melting point, improved ductility, and high ultimate tensile strength

    Shiqi Zhou, Chih-han Yang, Yu-An Shen, Shih-kang Lin, Hiroshi Nishikawa

    Materialia Vol. 6 2019/06 Research paper (scientific journal)

  165. Microstructure and Property Changes in Cu/Sn-58Bi/Cu Solder Joints during Thermomigration

    Yu-An Shen, Shiqi Zhou, Jiahui Li, K. N. Tu, Hiroshi Nishikawa

    Proceeding of 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) p. 2003-2008 2019/05 Research paper (international conference proceedings)

  166. Effects of In and Zn Double Addition on Eutectic Sn-58Bi Alloy

    Shiqi Zhou, Yu-An Shen, Hiroshi Nishikawa, Tiffani Uresti, Vasanth C. Shunmugasamy, Bilal Mansoor

    Proceeding of 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) p. 1081-1086 2019/05 Research paper (international conference proceedings)

  167. Effects of In Content on the Microstructure and Mechanical Properties of In-Bi Alloys During Isothermal Aging

    Sanghun Jin, Omid Mokhtari, Shutetsu Kanayama, Hiroshi Nishikawa

    Metals Vol. 9 No. 5 2019/05 Research paper (scientific journal)

  168. Bonding strength of Cu-to-Cu joints using Cu cold spray deposition by an oxidation and reduction process for power device package

    Juncai Hou, Chengxin Li, Sijie Huang, Hiroshi Nishikawa

    Proc. of 2019 International Conference of Electronics Packaging (ICEP) p. 432-436 2019/04 Research paper (international conference proceedings)

  169. Development of Sn-Bi-In-Ga quaternary low-temperature solders

    Chih-han Yang, Shiqi Zhou, Shih-kang Lin, Hiroshi Nishikawa

    Proc. of 2019 International Conference of Electronics Packaging (ICEP) p. 367-369 2019/04 Research paper (international conference proceedings)

  170. The study of Sn-45Bi-2.6Zn alloy before and after thermal aging

    Shiqi Zhou, Chih-han Yang, Yu-An Shen, Shih-kang Lin, Hiroshi Nishikawa

    Proc. of 2019 International Conference of Electronics Packaging (ICEP) p. 333-336 2019/04 Research paper (international conference proceedings)

  171. A Cu-Cu Bonding Method Using Preoxidized Cu Microparticles under Formic Acid Atmosphere

    Runhua Gao, Jiahui Li, Yu-An Shen, Hiroshi Nishikawa

    Proc. of 2019 International Conference of Electronics Packaging (ICEP) p. 159-162 2019/04 Research paper (international conference proceedings)

  172. Improved mechanical properties induced by In and In & Zn double additions to eutectic Sn58Bi alloy

    Shiqi Zhou, Yu-An Shen, Tiffani Uresti, Vasanth C.Shunmugasamy, Bilal Mansoor, Hiroshi Nishikawa

    Journal of Materials Science: Materials in Electoronics Vol. 30 No. 8 p. 7423-7434 2019/04 Research paper (scientific journal)

  173. Effect of Substrates on Fracture Mechanism and Process Optimization of Oxidation-Reduction Bonding with Copper Microparticles

    Runhua Gao, Siliang He, Yu-An Shen, Hiroshi Nishikawa

    Journal of Electronic Materials Vol. 48 No. 4 p. 2263-2271 2019/04 Research paper (scientific journal)

  174. Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder

    Yu-An Shen, Chun-Ming Lin, Jiahui Li, Siliang He, Hiroshi Nishikawa

    Scientific Reports Vol. 9 p. 3658-3658 2019/03 Research paper (scientific journal)

  175. 銅ナノ粒子を利用した焼結接合技術

    西川 宏

    金属 Vol. 89 No. 3 p. 8-12 2019/03

  176. Thermomigration Induced Microstructure and Property Changes in Sn-58Bi Solders

    Yu-An Shen, Shiqi Zhou, Jiahui Li, K.N. Tu, Hiroshi Nishikawa

    Materials & Design Vol. 166 2019/03 Research paper (scientific journal)

  177. Effect of Substrates on Fracture Mechanism and Process Optimization of Oxidation-Reduction Bonding with Copper Microparticles

    Runhua Gao, Siliang He, Yu-An Shen, Hiroshi Nishikawa

    Journal of Electronic Materials p. PDF Available-PDF Available 2019/02 Research paper (scientific journal)

  178. A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders

    Chih-han Yang, Shiqi Zhou, Shih-kang Lin, Hiroshi Nishikawa

    Materials Vol. 12 No. 4 2019/02 Research paper (scientific journal)

  179. パワーサイクル試験におけるダイボンド部劣化状況の熱抵抗測定による評価

    金黒 秀平, 佐々木 喜七, 西川 宏

    第25回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 397-398 2019/01 Research paper (other academic)

  180. Sn-Ag-Inはんだ実装品におけるSnウィスカ成長メカニズム

    斎藤 彰, 西川 宏

    第25回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 261-266 2019/01 Research paper (other academic)

  181. Cuナノポーラスシートを用いた接合部の劣化挙動の解明

    古賀 俊一, 齋藤 美紀子, 水野 潤, 西川 宏

    第25回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 73-76 2019/01 Research paper (other academic)

  182. 銅及び銅合金の溶接技術(3)

    西川 宏

    Jitsu・Ten 実務&展望 Vol. 52 No. 1 p. 17-21 2019/01

  183. Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy

    Shiqi Zhou, Chih-han Yang, Shih-kang Lin, Abdulaziz Nasser AlHazaa, Omid Mokhtari, Xiangdong Liu, Hiroshi Nishikawa

    Materials Science and Engineering: A Vol. 744 p. 560-569 2019/01 Research paper (scientific journal)

  184. Development of Multiple Laser Beam Irradiation Method for Precision Laser Cladding of Metal

    Kohei Asano, Masahiro Tsukamoto, Yoshinori Funada, Yu Sakon, Kento Morimoto, Yuji Sato, Shin-ichiro Masuno, Takahiro Hara, Hiroshi Nishikawa

    The Review of Laser Engineering Vol. 46 No. 10 p. 604-613 2018/10 Research paper (scientific journal)

  185. Low Temperature Flip Chip Bonding Using Squeegee-Embedded Au Nanoporous Bump Activated by VUV/O3 Treatment

    Weixin Fu, Tatsushi Kaneda, Akiko Okada, Kaori Matsunaga, Shuichi Shoji, Mikiko Saito, Hiroshi Nishikawa, Jun Mizuno

    Journal of Electronic Materials Vol. 47 No. 10 p. 5952-5958 2018/10 Research paper (scientific journal)

  186. Microstructure and mechanical properties of indium-bismuth alloys for low melting-temperature solder

    Sanghun Jin, Min-Su Kim, Shutetsu Kaneyama, Hiroshi Nishikawa

    Journal of Materials Science: Materials in Electoronics Vol. 29 No. 19 p. 19460-19468 2018/10 Research paper (scientific journal)

  187. Enhancement of nano-silver chip attachment by using transient liquid phase reaction with indium

    C. A. Yang, S. Yang, X. Liu, H. Nishikawa, C. R. Kao

    Journal of Alloys and Compounds Vol. 762 p. 586-597 2018/09/25 Research paper (scientific journal)

    Publisher: Elsevier Ltd
  188. 異種金属を用いたナノポーラス構造による界面形成現象の比較

    古賀 俊一, 齋藤 美紀子, 水野 潤, 西川 宏

    第28回マイクロエレクトロニクスシンポジウム論文集 p. 273-276 2018/09 Research paper (other academic)

  189. 銅及び銅合金の溶接技術(2)

    西川 宏

    Jitsu・Ten 実務&展望 Vol. 51 No. 5 p. 22-27 2018/09

  190. Textile-Integrated Stretchable Structures for Wearable Wireless Platforms

    Han He, Xiaochen Chen, Omid Mokhtari, Hiroshi Nishikawa, Leena Ukkonen, Johanna Virkki

    Proc. of 7th Electronics System-Integration Technology Conference p. INTS3A-6:1-INTS3A-6:4 2018/09 Research paper (international conference proceedings)

  191. Interfacial Reaction of Sn-Ag-Cu-Ni Solder/Cu Joints by Laser Process

    Hiroshi Nishikawa, Ryo Matsunobu

    Proc. of 7th Electronics System-Integration Technology Conference p. INTS2A-4:1-INTS2A-4:4 2018/09 Research paper (international conference proceedings)

  192. Control for Au-Ag Nanoporous Structure by Electrodeposition and Dealloying

    Mikiko Saito, Jun Mizuno, Shunichi Koga, Hiroshi Nishikawa

    Proc. of 7th Electronics System-Integration Technology Conference p. MAT1-1:1-MAT1-1:4 2018/09 Research paper (international conference proceedings)

  193. Shear properties of In-Bi alloy joints with Cu substrates during thermal aging

    Sanghun Jin, Min-Su Kim, Shutetsu Kaneyama, Hiroshi Nishikawa

    Microelectronics Reliability Vol. 88-90 p. 795-800 2018/09 Research paper (scientific journal)

  194. 銅及び銅合金の溶接技術

    西川 宏

    Jitsu・Ten 実務&展望 Vol. 51 No. 4 p. 20-25 2018/07

  195. Improvement in the mechanical properties of eutectic Sn58Bi alloy by 0.5 and 1 wt% Zn addition before and after thermal aging

    Shiqi Zhou, Omid Mokhtari, Muhammad Ghufan Rafique, Vasanth C. Shunmugasamy, Bilal Mansoor, Hiroshi Nishikawa

    Journal of Alloy and Compounds Vol. 765 p. 1243-1252 2018/07 Research paper (scientific journal)

  196. Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition

    Junghwan Bang, Dong-Yurl Yu, Ming Yang, Yong-Ho Ko, Jeong-Won Yoon, Hiroshi Nishikawa, Chang-Woo Lee

    Metals Vol. 8 No. 8 p. 586:1-586:11 2018/07 Research paper (scientific journal)

  197. Materials Merging Mechanism of Microfluidic Electroless Interconnection Process

    S. Yang, H. T. Hung, P. Y. Wu, Y. W. Wang, H. Nishikawa, C. R. Kao

    Journal of The Electrochemical Society Vol. 165 No. 7 p. D273-D281 2018/07 Research paper (scientific journal)

  198. Mechanical properties of Sn-Bi-In-Ga low melting temperature solder alloys

    Chih-Han Yang, Shiqi Zhou, Hiroshi Nishikawa, Shih-Kang Lin

    2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018 p. 409-410 2018/06/06 Research paper (international conference proceedings)

    Publisher: Institute of Electrical and Electronics Engineers Inc.
  199. Microstructural characterization of Ni-based self-fluxing alloy after selective surface-engineering using diode laser

    Eun-Joon Chun, Changkyoo Park, Hiroshi Nishikawa, Min-Su Kim

    Applied Surface Science Vol. 442 p. 726-735 2018/06/01 Research paper (scientific journal)

    Publisher: Elsevier B.V.
  200. High Reliability Sintered Silver-Indium Bonding with Anti-Oxidation Property for High Temperature Application

    Chun An Yang, C. Robert Kao, Hiroshi Nishikawa, Chin C. Lee

    Proc. of 2018 IEEE 70th Electronic Components and Technology Conference p. 1993-1999 2018/05 Research paper (international conference proceedings)

  201. Improvement of Mechanical Properties of Zn-Added Sn58Bi Alloy by Zn Segregation on the Sn-Bi Phase Boundaries During Thermal Aging

    Shiqi Zhou, Omid Mokhtari, Hiroshi Nishikawa

    Proc. of 2018 IEEE 69th Electronic Components and Technology Conference p. 1899-1905 2018/05 Research paper (international conference proceedings)

  202. Development of Low-Temperature, Pressureless Copper-to-Copper Bonding by Microfluidic Electroless Interconnection Process

    Sean Yang, Han-Tan Hung, Hiroshi Nishikawa, C. Robert Kao

    Proc. of 2018 IEEE 68th Electronic Components and Technology Conference p. 308-313 2018/05 Research paper (international conference proceedings)

  203. Low temperature bonding with high shear strength using micro-sized Ag particle paste for power electronic packaging

    Myong-Hoon Roh, Hiroshi Nishikawa, Seiichiro Tsutsumi, Naruhiko Nishiwaki, Keiichi Ito, Koji Ishikawa, Akihiro Katsuya, Nobuo Kamada, Mutsuo Saito

    Journal of Materials Science: Materials in Electronics Vol. 29 No. 5 p. 3800-3807 2018/03/01 Research paper (scientific journal)

    Publisher: Springer New York LLC
  204. Laser-assisted selective fusing of thermal sprayed Ni-based self-fluxing alloys by using high-power diode lasers

    Eun-Joon Chun, Min-Su Kim, Hiroshi Nishikawa, Changkyoo Park, Jeong Suh

    OPTICS AND LASER TECHNOLOGY Vol. 100 p. 317-324 2018/03 Research paper (scientific journal)

  205. Transient liquid phase bonding of magnesium alloy AZ31 using Cu coatings and Cu coatings with Sn interlayers

    Abdulaziz Nasser AlHazaa, Muhammad Ali Shar, Anas Mahmoud Atieh, Hiroshi Nishikawa

    Metals Vol. 8 No. 1 p. 1-10 2018/01/16 Research paper (scientific journal)

    Publisher: MDPI AG
  206. Lead-free high temperature bonding processes for next generation power module packaging

    Min-Su KIM, Hiroshi NISHIKAWA

    Journal of Smart Processing -for Materials, Environment & Energy- Vol. 7 No. 1 p. 28-31 2018/01

  207. Characterization of moderately halotolerant selenate-And tellurite-reducing bacteria isolated from brackish areas in Osaka

    Satoshi Soda, Wenbo Ma, Masashi Kuroda, Hiroshi Nishikawa, Yuanyuan Zhang, Michihiko Ike

    Bioscience, Biotechnology and Biochemistry Vol. 82 No. 1 p. 173-181 2018 Research paper (scientific journal)

    Publisher: Japan Society for Bioscience Biotechnology and Agrochemistry
  208. Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution

    Jan-Ervin C. Guerrero, Drexel H. Camacho, Omid Mokhtari, Hiroshi Nishikawa

    International Journal of Corrosion Vol. 2018 2018 Research paper (scientific journal)

    Publisher: Hindawi Limited
  209. Effect of surface potential distribution on corrosion behavior of SnAgCu solder/Cu substrate interface

    Omid Mokhtari, Hiroshi Nishikawanisik

    Solid State Phenomena Vol. 273 p. 77-82 2018 Research paper (international conference proceedings)

    Publisher: Trans Tech Publications Ltd
  210. Effect of indium on deformation of binary In-Bi alloys

    Sanghun Jin, Min-su Kim, Shutetsu Kanayama, Hiroshi Nishikawa

    Proc. of 19th Electronics Packaging Technology Conference p. 181:1-181:5 2017/12 Research paper (international conference proceedings)

  211. Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint

    Junghwan Bang, Dong-Yurl Yu, Yong-Ho Ko, Min-Su Kim, Hiroshi Nishikawa, Chang-Woo Lee

    JOURNAL OF ALLOYS AND COMPOUNDS Vol. 728 p. 992-1001 2017/12 Research paper (scientific journal)

  212. Transmission Electron Microscopy Investigation on the Oxidation Behavior of Electroless Ni/Immersion Au Surface Finish at 250 degrees C

    Min-Su Kim, Hiroshi Nishikawa

    JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY Vol. 17 No. 11 p. 8522-8527 2017/11 Research paper (scientific journal)

  213. Suppression of void formation at the interface in laser soldering

    Ryo matsunobu, Hiroshi nishikawa

    Proc. of the 12th International Microsystems, Packaging, Assembly and Circuits Technology p. 338-341 2017/10 Research paper (international conference proceedings)

  214. Impact strength of Sn-Ag-Cu/Cu solder bumps formed by an induction heating method

    Yujian Zhang, Siliang He, Hiroshi Nishikawa

    Proc. of the 12th International Microsystems, Packaging, Assembly and Circuits Technology p. 159-162 2017/10 Research paper (international conference proceedings)

  215. The evaluation of mechanical properties of Sn58BiXTi solder by tensile test

    Shiqi Zhou, Xiangdong Liu, Omid Mokhtari, Hiroshi Nishikawa

    18th International Conference on Electronic Packaging Technology, ICEPT 2017 p. 703-707 2017/09/19 Research paper (international conference proceedings)

    Publisher: Institute of Electrical and Electronics Engineers Inc.
  216. Thermal stability of low-temperature sintered joint using Sn-coated Cu particles during isothermal aging at 250 A degrees C

    Xiangdong Liu, Shiqi Zhou, Hiroshi Nishikawa

    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS Vol. 28 No. 17 p. 12606-12616 2017/09 Research paper (scientific journal)

  217. Influence of ENIG defects on shear strength of pressureless Ag nanoparticle sintered joint under isothermal aging

    Min-Su Kim, Hiroshi Nishikawa

    MICROELECTRONICS RELIABILITY Vol. 76 p. 420-425 2017/09 Research paper (scientific journal)

  218. Effect of bonding conding conditions on shear strength of joints at 200°C using Sn-coated Cu Particle

    Hiroshi Nishikawa, Xiangdong Liu, Siliang He

    Proc. of The 18th International Coference on Electronic Pacaging Technology p. 181:1-181:4 2017/09 Research paper (international conference proceedings)

  219. Development of Die Attachment Technology for Power IC Module by Introducing Indium into Sintered Nano-Silver Joint

    C. A. Yang, C. Robert Kao, H. Nishikawa

    Proceedings - Electronic Components and Technology Conference p. 1974-1980 2017/08/01 Research paper (international conference proceedings)

    Publisher: Institute of Electrical and Electronics Engineers Inc.
  220. Brazing Graphite to Aluminum Nitride for Thermal Dissipation Purpose

    Tsung-Te Chou, Wei-Hsing Tuan, Hiroshi Nishikawa, Biing-Jyh Weng

    ADVANCED ENGINEERING MATERIALS Vol. 19 No. 7 p. 1-10 2017/07 Research paper (scientific journal)

  221. Effect of isothermal aging at 250 C on shear strength of joints using Sn-Coated Cu particle paste for high-temperature application

    Hiroshi Nishikawa, Xiangdong Liu, Siliang He

    Proceeding of IMPAS International Conference on High Temparature Electronics Network (HiTEN 2017) Vol. 2017 No. HiTen p. 202-206 2017/07 Research paper (international conference proceedings)

  222. マイクロ接合をめぐる最近の動向-マイクロ接合研究委員会-

    廣瀬 明夫, 福本 信次, 西川 宏, 佐野 智一

    溶接学会誌 Vol. 86 No. 5 p. 382-392 2017/05

  223. Effect of temperature and substrate on shear strength of the joints formed by sintering of micro-sized Ag particle paste without pressure

    Myong-Hoon Roh, Hiroshi Nishikawa, Seiichiro Tsutsumi, Naruhiko Nishiwaki, Keiichi Ito, Koji Ishikawa, Akihiro Katsuya, Nobuo Kamada, Mutsuo Saito

    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS Vol. 28 No. 10 p. 7292-7301 2017/05 Research paper (scientific journal)

  224. Pressureless sintering bonding using hybrid microscale Cu particle paste on ENIG, pure Cu and pre-oxidized Cu substrate by an oxidation-reduction process

    Xiangdong Liu, Hiroshi Nishikawa

    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS Vol. 28 No. 7 p. 5554-5561 2017/04 Research paper (scientific journal)

  225. Interfacial reaction, ball shear strength and fracture surface analysis of lead-free solder joints prepared using cobalt nanoparticle doped flux

    G. K. Sujan, A. S. M. A. Haseeb, Hiroshi Nishikawa, M. A. Amalina

    JOURNAL OF ALLOYS AND COMPOUNDS Vol. 695 p. 981-990 2017/02 Research paper (scientific journal)

  226. Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach

    Xiangdong Liu, Siliang He, Hiroshi Nishikawa

    JOURNAL OF ALLOYS AND COMPOUNDS Vol. 695 p. 2165-2172 2017/02 Research paper (scientific journal)

  227. ナノポーラス金接合に向けた真空紫外光による表面前処理

    金田 建志, 岡田 愛姫子, 付 偉欣, 庄子 習一, 齋藤 美紀子, 西川 宏, 水野 潤

    第23回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 23 p. 429-432 2017/01 Research paper (conference, symposium, etc.)

  228. Effect of substrate metallization on the impact strength of Sn-Ag-Cu solder bumps fabricated in a formic acid atmosphere

    Siliang He, Hiroshi Nishikawa

    2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP) p. 381-385 2017 Research paper (international conference proceedings)

  229. Effect of Au surface finish on Ni addition solder/substrate interface using a laser soldering process

    Ryo Matsunobu, Hiroshi Nishikawa

    Vol. 23 p. 463-464 2017/01 Research paper (other academic)

  230. Formation of Solder Bumps on Electroless Ni/Au Plating Using Formic Acid Atmosphere

    Siliang HE, Hiroshi Nishikawa

    Vol. 23 p. 77-78 2017/01 Research paper (other academic)

  231. Effect of Bonding Temperature on the Joining of Ti-6Al-4V Alloy Using Cu Coatings and Sn Interlayers

    Abdulaziz N. AlHazaa, Sultan H. AlGharbi, Hiroshi Nishikawa

    JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE Vol. 26 No. 1 p. 407-417 2017/01 Research paper (scientific journal)

  232. Formation and growth of intermetallic compound at Sn-Ag-Cu-Ni/Cu interface using laser soldering

    Ryo Matsunobu, Hiroshi Nishikawa

    Vol. 26 p. 95-98 2016/09 Research paper (other academic)

    Publisher:
  233. A comparative study between formic acid atmosphere and liquid flux in reflow

    Siliang He, Hiroshi Nishikawa

    p. 107-110 2016/09 Research paper (other academic)

  234. Interfacial Reaction between Sn-Ag-Cu-Mg solder and ENIG substrate

    Hiroshi Nishikawa, Abdulaziz N. Alhazaa, Siliang He, Abdulhakim A. Almajid, Mahmoud S. Soliman

    Key Engineering Materials Vol. 706 p. 2016-2019 2016/07 Research paper (scientific journal)

  235. Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging

    Xiangdong Liu, Hiroshi Nishikawa

    SCRIPTA MATERIALIA Vol. 120 p. 80-84 2016/07 Research paper (scientific journal)

  236. Effect of Isothermal Aging at 250 °C on Shear Strength of Joints Using Au Nanoporous Nonding for Die Attach

    Hiroshi Nishikawa, Kaori Matsunaga, Min-Su Kim, Mikiko Saito, Jun Mizuno

    Proc. of IMAPS International Conference and Exhibition on High Temperature Electronics (HiTEC2016) p. 143-147 2016/05 Research paper (international conference proceedings)

  237. Transient liquid phase bonding of Sn-Bi solder with added Cu particles

    Omid Mokhtari, Hiroshi Nishikawa

    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS Vol. 27 No. 5 p. 4232-4244 2016/05 Research paper (scientific journal)

  238. The shear strength of transient liquid phase bonded Sn-Bi solder joint with added Cu particles

    Omid Mokhtari, Hiroshi Nishikawa

    ADVANCED POWDER TECHNOLOGY Vol. 27 No. 3 p. 1000-1005 2016/05 Research paper (scientific journal)

  239. Effect of magnetic flux density on Sn crystallographic orientation in a solder joint system

    Kimihiro Yamanaka, Hiroshi Nishikawa, Hirohisa Taguchi, Miyuki Harada, Koichi Ochi

    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS Vol. 27 No. 4 p. 3710-3714 2016/04 Research paper (scientific journal)

  240. Microstructural Change of Ag Nanoporous Bonding Joint During Thermal Storage Test

    Min-Su KIM, Hiroshi NISHIKAWA

    22nd Symposium on "Microjoining and Asswmbly Technology in Electronics" p. 101-104 2016/02 Research paper (other academic)

  241. Cu/Cu Bonding Using a Au Nanoporous Sheet by Electrochemical Corrosion

    Kaori MATSUNAGA, Min-Su KIM, Hiroshi NISHIKAWA, Mikiko SAITO, Jun MIZUNO

    22nd Symposium on "Microjoining and Assembly Technology in Electronics" p. 89-92 2016/02 Research paper (other academic)

  242. Correlation between microstructure and mechanical properties of Sn-Bi-X solders

    Omid Mokhtari, Hiroshi Nishikawa

    Materials Science and Engineering A Vol. 651 p. 831-839 2016/01/10 Research paper (scientific journal)

    Publisher: Elsevier Ltd
  243. マイクロ接合研究委員会

    福本 信次, 岩田 剛治, 西川 宏, 廣瀬 明夫

    溶接学会誌 Vol. 85 No. 1 p. 137-140 2016

    Publisher: 一般社団法人 溶接学会
  244. Bonding Process Using Microscale Ag Particle Paste for Die Attach

    H. Nishikawa, X. Liu, X. Wang, A. Fujita, N. Kamada, M. Saito

    2016 6TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC) p. sp4p8:1-sp4p8:4 2016 Research paper (international conference proceedings)

  245. Effect of Zn Addition on Interfacial Reactions Between Sn-Bi Solder and Cu Substrate

    Omid Mokhtari, Shiqi Zhou, Y. C. Chan, Hiroshi Nishikawa

    MATERIALS TRANSACTIONS Vol. 57 No. 8 p. 1272-1276 2016 Research paper (scientific journal)

  246. Pressureless Bonding by Micro-Sized Silver Particle Paste for High-Temperature Electronic Packaging

    Myong-Hoon Roh, Hiroshi Nishikawa, Seiichiro Tsutsumi, Naruhiko Nishiwaki, Keiichi Ito, Koji Ishikawa, Akihiro Katsuya, Nobuo Kamada, Mutsuo Saito

    MATERIALS TRANSACTIONS Vol. 57 No. 7 p. 1209-1214 2016 Research paper (scientific journal)

  247. Reliability of Ag Nanoporous Bonding Joint for High Temperature Die Attach under Temperature Cycling

    Min-Su Kim, Kaori Matsunaga, Yong-Ho Ko, Chang-Woo Lee, Hiroshi Nishikawa

    MATERIALS TRANSACTIONS Vol. 57 No. 7 p. 1192-1196 2016 Research paper (scientific journal)

  248. Improved Joint Strength with Sintering Bonding Using Microscale Cu Particles by an Oxidation-reduction Process

    Xiangdong Liu, Hiroshi Nishikawa

    2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) p. 455-460 2016 Research paper (international conference proceedings)

  249. Bonding process without pressure using a chestnut-burr-like particle paste for power electronics

    Myong-Hoon Roh, Hiroshi Nishikawa, Seiichiro Tsutsumi, Naruhiko Nishiwaki, Keiichi Ito, Koji Ishikawa, Akihiro Katsuya, Nobuo Kamada, Mutsuo Saito

    2016 International Conference on Electronics Packaging (ICEP) p. 391-394 2016 Research paper (international conference proceedings)

  250. Investigation of connecting techniques for high temperature application on power modules

    Fumiyoshi Kawashiro, Yoshiki Endo, Tatsuo Tonedachi, Hiroshi Nishikawa

    2016 International Conference on Electronics Packaging (ICEP) p. 378-381 2016 Research paper (international conference proceedings)

  251. Low temperature bonding using microscale Cu particles coated with thin Sn layers at 200 degrees C

    Xiangdong Liu, Siliang He, Hiroshi Nishikawa

    2016 International Conference on Electronics Packaging (ICEP) p. 306-309 2016 Research paper (international conference proceedings)

  252. Correlation between microstructure and mechanical properties of Sn-Bi-X solders

    Omid Mokhtari, Hiroshi Nishikawa

    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING Vol. 651 p. 831-839 2016/01 Research paper (scientific journal)

  253. Thermally stable Cu3Sn/Cu composite joint for high-temperature power device

    Xiangdong Liu, Siliang He, Hiroshi Nishikawa

    SCRIPTA MATERIALIA Vol. 110 p. 101-104 2016/01 Research paper (scientific journal)

  254. Effects of Indium Content on the Tensile Properties of Sn-Bi-In Solder

    MOKHTARI Omid, NISHIKAWA Hiroshi

    Trans. JWRI Vol. 44 No. 2 p. 19-22 2015/12 Research paper (bulletin of university, research institution)

    Publisher: Joining and Welding Research Institute, Osaka University
  255. Microscale Ag particle paste for sintered joints in high-power devices

    Hiroshi Nishikawa, Xiangdong Liu, Xianfan Wang, Akira Fujita, Nobuo Kamada, Mutsuo Saito

    MATERIALS LETTERS Vol. 161 p. 231-233 2015/12 Research paper (scientific journal)

  256. Microstructure of Transient Liquid Phase Sintering Joint by Sn-Coated Cu Particles for High Temperature Packaging

    Xiangdong Liu, Hiroshi Nishikawa

    IMAPS2015 p. 000449-000452 2015/10 Research paper (international conference proceedings)

  257. Effect of porous copper on the properties of electrically conductive adhesives

    Li-Ngee Ho, Hiroshi Nishikawa

    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS Vol. 26 No. 10 p. 7771-7779 2015/10 Research paper (scientific journal)

  258. Effects of bonding temperature on microstructure, fracture behavior and joint strength of Ag nanoporous bonding for high temperature die attach

    Min-Su Kim, Hiroshi Nishikawa

    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING Vol. 645 p. 264-272 2015/10 Research paper (scientific journal)

  259. High temperature reliability of joints using a Au nanoporous sheet

    Kaori MATSUNAGA, Min-Su KIM, Hiroshi NISHIKAWA, Mikiko SAITO, Jun MIZUNO

    Vol. 25 p. 147-150 2015/09 Research paper (other academic)

    Publisher:
  260. Effect of Constant Temperature and Humidity Aging on Long-term Reliability of Electrically Conductive Adhesives with Different Ag Fillers

    J. TAJIMA, H. NISHIKAWA

    Vol. 25 p. 91-94 2015/09 Research paper (other academic)

    Publisher:
  261. エレクトロニクス分野におけるマイクロ接合・実装技術動向

    西川 宏

    溶接学会誌 Vol. 84 No. 5 p. 388-390 2015/07

  262. Bonding strength of Cu/Cu joints using micro-sized Ag particle paste for high-temperature application

    H. Nishikawa, X. Liu, X. Wang, A. Fujita, N. Kamada, M. Saito

    Proceedings of International Conference on High Temperature Electronics Network(HiTEN 2015) p. 68-72 2015/07 Research paper (international conference proceedings)

  263. Ball Shear Strength and Fracture Modes of Lead-Free Solder Joints Prepared Using Nickel Nanoparticle Doped Flux

    G. K. Sujan, A. S. M. A. Haseeb, M. A. Amalina, Hiroshi Nishikawa

    ELECTRONIC MATERIALS LETTERS Vol. 11 No. 3 p. 452-456 2015/05 Research paper (scientific journal)

  264. Reliability of copper wire bonds on a novel over-pad metallization

    Fumiyoshi Kawashiro, Satoshi Itoh, Takehiko Maeda, Tetsuya Hirose, Akira Yajima, Takaki Etoh, Hiroshi Nishikawa

    JAPANESE JOURNAL OF APPLIED PHYSICS Vol. 54 No. 5 p. 05EC01-1-05EC01-8 2015/05 Research paper (scientific journal)

  265. Shear strength of Cu-to-Cu joints using mixed Ag particle paste

    Hiroshi Nishikawa, Keiichi Niwa

    Quarterly J. Japan Welding Soc. Vol. 33 No. 2 p. 75s-78s 2015/04 Research paper (scientific journal)

  266. ダイボンディング用のAuナノポーラスシートの作製

    松永 香織, Min-Su Kim, 西川 宏, 齋藤 美紀子, 水野 潤

    第21回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 427-428 2015/02 Research paper (other academic)

  267. はんだバンプ微細化による接合強度の長期信頼性への影響

    宇治野 真, 西川 宏

    第21回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 p. 391-394 2015/02 Research paper (other academic)

  268. Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn-Ag Cu solder on a Cu Pad

    Hiroshi Nishikawa, Noriya Iwata

    Journal of Materials Processing Technology Vol. 215 p. 6-11 2015 Research paper (scientific journal)

    Publisher: Elsevier Ltd
  269. Effect of Isothermal Aging on Microstructure and Joint Strength of Ag Nanoporous Bonding for High Temperature Die Attach

    Min-Su Kim, Hiroshi Nishikawa

    2015 10TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT) p. 104-106 2015 Research paper (international conference proceedings)

  270. Impact strength of Sn-58mass%Bi/Cu joints by laser process

    Hiroshi Nishikawa, Sinya Kubota

    2015 EUROPEAN MICROELECTRONICS PACKAGING CONFERENCE (EMPC) p. P_B04_1-P_B04_4 2015 Research paper (international conference proceedings)

  271. Improvement of Joint Reliability of Sn-Ag-Cu Solder Bumps on Cu by a Laser Process

    Hiroshi Nishikawa, Noriya Iwata

    MATERIALS TRANSACTIONS Vol. 56 No. 7 p. 1025-1029 2015 Research paper (scientific journal)

  272. Improved Low Temperature Gold-Gold Bonding Using Nanoporous Powder Bump Using Vacuum Ultraviolet Irradiation Pre-treatment

    Tatsushi Kaneda, Jun Mizuno, Akiko Okada, Kaori Matsunaga, Shuichi Shoji, Mikiko Saito, Hiroshi Nishikawa

    2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) p. 473-477 2015 Research paper (international conference proceedings)

  273. Effect of Au nanoporous structure on bonding strength

    Kaori Matsunaga, Min-Su Kim, Hiroshi Nishikawa, Mikiko Saito, Jun Mizuno

    2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) p. 830-833 2015 Research paper (international conference proceedings)

  274. Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn-Ag Cu solder on a Cu Pad

    Hiroshi Nishikawa, Noriya Iwata

    JOURNAL OF MATERIALS PROCESSING TECHNOLOGY Vol. 215 p. 6-11 2015/01 Research paper (scientific journal)

  275. Effect of thermal aging on microstructure of Sn-Bi-In solder joint

    MOKHTARI Omid, NISHIKAWA Hiroshi

    Trans. JWRI Vol. 43 No. 2 p. 21-25 2014/12 Research paper (bulletin of university, research institution)

    Publisher: Joining and Welding Research Institute, Osaka University
  276. Investigation of Formation and Growth Behavior of Cu/Al Intermetallic Compounds during Isothermal Aging

    Omid Mokhtari, Min-Su Kim, Hiroshi Nishikawa, Fumiyoshi Kawashiro, Satoshi Itoh, Takehiko Maeda, Tetsuya Hirose, Takaki Eto

    Transactions of The Japan Institute of Electronics Packaging Vol. 7 No. 1 p. 1-7 2014/12 Research paper (scientific journal)

    Publisher: The Japan Institute of Electronics Packaging
  277. Silver nanoporous sheet for solid-state die attach in power device packaging

    Min-Su Kim, Hiroshi Nishikawaa

    SCRIPTA MATERIALIA Vol. 92 p. 43-46 2014/12 Research paper (scientific journal)

  278. Nano-porous structure control under electrodeposition and dealloying conditions for low-temperature bonding

    Mikiko Saito, Kaori Matsunaga, Jun Mizuno, Hroshi Nishikawa

    Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014 p. S8P4-1-S8P4-4 2014/11/18 Research paper (international conference proceedings)

    Publisher: Institute of Electrical and Electronics Engineers Inc.
  279. Relationship between bonding conditions and strength for joints using a Au nanoporous sheet

    Kaori Matsunaga, Min-Su Kim, Hiroshi Nishikawa, Mikiko Saito, Jun Mizuno

    Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014 2014/11/18 Research paper (international conference proceedings)

    Publisher: Institute of Electrical and Electronics Engineers Inc.
  280. Thermal stability of electroless nickel/immersion gold surface finish for direct bond copper

    Min-Su Kim, Hiroshi Nishikawa

    Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014 2014/11/18 Research paper (international conference proceedings)

    Publisher: Institute of Electrical and Electronics Engineers Inc.
  281. Effects of in and Ni addition on microstructure of Sn-58Bi solder joint

    Omid Mokhtari, Hiroshi Nishikawa

    Journal of Electronic Materials Vol. 43 No. 11 p. 4158-4170 2014/11/01 Research paper (scientific journal)

    Publisher: Springer New York LLC
  282. Effects of In and Ni Addition on Microstructure of Sn-58Bi Solder Joint

    Omid Mokhtari, Hiroshi Nishikawa

    JOURNAL OF ELECTRONIC MATERIALS Vol. 43 No. 11 p. 4158-4170 2014/11 Research paper (scientific journal)

  283. はんだ接合部微細化によるはんだ/Cu 界面への影響

    宇治野 真, 西川 宏

    MES 2014 エレクトロニクス実装学会 秋季大会 論文集 p. 291-294 2014/09 Research paper (other academic)

  284. Au ナノポーラス接合の接合材表面構造と接合強度の関係

    松永 香織, Min-Su Kim, 西川 宏, 齋藤 美紀子, 水野 潤

    MES 2014 エレクトロニクス実装学会 秋季大会 論文集 p. 179-182 2014/09 Research paper (other academic)

  285. Copper-Filled Electrically Conductive Adhesives with Enhanced Shear Strength

    Li-Ngee Ho, Hiroshi Nishikawa

    JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE Vol. 23 No. 9 p. 3371-3378 2014/09 Research paper (scientific journal)

  286. Impact strength of Sn-3.0Ag-0.5Cu solder bumps during isothermal aging

    JianXin Wang, Hiroshi Nishikawa

    MICROELECTRONICS RELIABILITY Vol. 54 No. 8 p. 1583-1591 2014/08 Research paper (scientific journal)

  287. Effects of Joining Conditions on Cu/Cu Joint Using Chestnut-burr-like Micro-sized Ag Particles

    Hiroshi NISHIKAWA, Xianfan WANG, Akira FUJITA, Nobuo KAMADA, Mutsuo SAITO

    Journal of Smart Processing Vol. 3 No. 4 p. 239-246 2014/07 Research paper (scientific journal)

  288. The Melting-point Increase of Sn-Bi Solder Joint by Cu Particles Addition

    Omid Mokhtari, Hiroshi Nishikawa

    High Temperature Electronics(HiTEC 2014) Conference Proceedings 2014/05 Research paper (international conference proceedings)

  289. 様々なサイズ・形状の銀フィラーを混合した導電性接着剤の熱伝導性

    小島 慎也, 西川 宏

    第20回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 20 p. 395-396 2014/02 Research paper (other academic)

  290. レーザ加熱したはんだバンプの接合信頼性への微細化の影響

    宇治野 真, 西川 宏

    第20回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 20 p. 381-382 2014/02 Research paper (other academic)

  291. いがぐり状マイクロサイズAg粒子を用いたCu/Cu接合プロセスの検討

    西川 宏, 王 暁帆, 藤田 晶, 鎌田 信雄, 齋藤 六雄

    第20回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 20 p. 153-156 2014/02 Research paper (other academic)

  292. Sn-Biはんだ継手の衝撃強度や接合界面に及ぼすレーザ照射条件の影響

    窪田 慎也, 西川 宏

    第20回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 20 p. 47-50 2014/02 Research paper (other academic)

  293. Microstructural change of Ag nanoporous bonding joint and interdiffusion of Cu/Ag during thermal aging

    Min-Su Kim, Hiroshi Nishikawa

    2014 4TH IEEE INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) p. 42-42 2014 Research paper (international conference proceedings)

  294. LOW-TEMPERATURE GOLD-GOLD BONDING USING SELECTIVE FORMATION OF NANOPOROUS POWDERS FOR BUMP INTERCONNECTS

    Hayata Mimatsu, Jun Mizuno, Takashi Kasahara, Mikiko Saito, Shuichi Shoji, Hiroshi Nishikawa

    2014 IEEE 27TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS) p. 1131-1134 2014 Research paper (international conference proceedings)

  295. Microstructure of lead-free solder bumps using laser reflow soldering

    Hiroshi Nishikawa, Noriya Iwata, Shinya Kubota

    INTERNATIONAL SYMPOSIUM ON INTERFACIAL JOINING AND SURFACE TECHNOLOGY (IJST2013) Vol. 61 No. 012038 p. 1-4 2014 Research paper (international conference proceedings)

  296. Effect of joining conditions on the joint strength of Ag nanoporous bonding

    Min-Su Kim, Hiroshi Nishikawa

    2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP) p. 521-525 2014 Research paper (international conference proceedings)

  297. Effect of isothermal aging on the growth behavior of Cu/Al intermetallic compounds

    Omid Mokhtari, Min-Su Kim, Hiroshi Nishikawa, Fumiyoshi Kawashiro, Satoshi Itou, Takehiko Maeda, Tetsuya Hirose, Takaki Eto

    2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP) p. 144-147 2014 Research paper (international conference proceedings)

  298. Properties of Cu Filled Electrically Conductive Adhesive (ECA) Affected by Viscosity of the ECA Paste

    HO Li-Ngee, NISHIKAWA Hiroshi

    Trans. JWRI Vol. 42 No. 2 p. 25-28 2013/12 Research paper (bulletin of university, research institution)

    Publisher: Joining and Welding Research Institute, Osaka University
  299. Explanation of impact load curve in ball impact test in relation to thermal aging

    Tomoya Daito, Hiroshi Nishikawa, Tadashi Takemoto, Takashi Matsunami

    MICROELECTRONICS RELIABILITY Vol. 53 No. 12 p. 2005-2011 2013/12 Research paper (scientific journal)

  300. Properties of phenolic-based Ag-filled conductive adhesive affected by different coupling agents

    Li-Ngee Ho, Teng Fei Wu, Hiroshi Nishikawa

    Journal of Adhesion Vol. 89 No. 11 p. 847-858 2013/11/02 Research paper (scientific journal)

  301. Fabrication of nanoporous silver and microstructural change during dealloying of melt-spun Al-20 at.%Ag in hydrochloric acid

    Min-Su Kim, Hiroshi Nishikawa

    JOURNAL OF MATERIALS SCIENCE Vol. 48 No. 16 p. 5645-5652 2013/08 Research paper (scientific journal)

  302. Evaluation of mechanical property of Sn-Bi solder joint with Cu pad using a miniature impact test

    H. Nishikawa, T. Yamamoto

    Proceedings of the 7th Asia Pacific IIW International Congress 2013 p. 168-171 2013/07 Research paper (international conference proceedings)

  303. A Review of Welding in Japan -Micro Joining-

    Hiroshi Nishikawa

    Vol. 82 No. 5 p. 392-394 2013/07

  304. Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives

    Li-Ngee Ho, Hiroshi Nishikawa

    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS Vol. 24 No. 6 p. 2077-2081 2013/06 Research paper (scientific journal)

  305. Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste

    Tomohiro Yamakawa, Tadashi Takemoto, Masayoshi Shimoda, Hiroshi Nishikawa, Kunio Shiokawa, Nobuto Terada

    JOURNAL OF ELECTRONIC MATERIALS Vol. 42 No. 6 p. 1260-1267 2013/06 Research paper (scientific journal)

  306. Low-Temperature Au-Au Bonding Using Nanoporous Au-Ag Sheets

    Hayata Mimatsu, Jun Mizuno, Takashi Kasahara, Mikiko Saito, Hiroshi Nishikawa, Shuichi Shoji

    JAPANESE JOURNAL OF APPLIED PHYSICS Vol. 52 No. 5 p. 050204-1-050204-3 2013/05 Research paper (scientific journal)

  307. Joint strength of Cu-to-Cu joint using Cu nanoparticle paste

    H. Nishikawa, T. Hirano, N. Terada

    Proc. of International Conference on Electronics Packaging (ICEP 2013) p. 200-203 2013/04 Research paper (international conference proceedings)

  308. レーザ加熱によるSn-Bi/Cu接合部の衝撃強度向上

    窪田 慎也, 西川 宏

    第19回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 19 p. 477-478 2013/01 Research paper (other academic)

  309. 各種因子が導電性接着剤の耐イオンマイグレーション性に与える影響

    植田 城央, 西川 宏

    第19回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 19 p. 167-170 2013/01 Research paper (other academic)

  310. 混合Agペーストを用いたCu/Cu接合における接合層と接合強度の関係

    丹羽 恵一, 西川 宏

    第19回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 19 p. 79-82 2013/01 Research paper (other academic)

  311. Contact angle between Sn-Ag-Cu solder and electroplated Cu-based Bulk Metallic Glass

    H. Nishikawa, T. Naoi, M. Saito, J. Mizuno, M. Fukuhara

    PROCEEDINGS OF THE 1ST INTERNATIONAL JOINT SYMPOSIUM ON JOINING AND WELDING p. 553-556 2013 Research paper (international conference proceedings)

  312. Copper Filled Polyurethane Based Electrically Conductive Adhesive with Improved Mechanical Strength

    Li-Ngee Ho, Hiroshi Nishikawa

    2013 EUROPEAN MICROELECTRONICS PACKAGING CONFERENCE (EMPC) p. ThA3-3:1-ThA3-3:4 2013 Research paper (international conference proceedings)

  313. Joint strength of Cu-to-Cu joint using mixed Ag particle paste

    H. Nishikawa, K. Niwa

    2013 EUROPEAN MICROELECTRONICS PACKAGING CONFERENCE (EMPC) p. ThA2-4:1-ThA2-4:4 2013 Research paper (international conference proceedings)

  314. Coarsening of Bi phase and intermetallic layer thickness in Sn-58Bi-X (X=In and Ni) solder joint

    Omid Mokhtari, Hiroshi Nishikawa

    2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) p. 250-253 2013 Research paper (international conference proceedings)

  315. Properties of Porous Copper Filled Electrically Conductive Adhesives

    Li-Ngee Ho, Hiroshi Nishikawa

    2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) p. 221-+ 2013 Research paper (international conference proceedings)

  316. Effects of Ag Content on the Mechanical Properties of Bi-Ag Alloys Substitutable for Pb based Solder

    SHIMODA Masayoshi, YAMAKAWA Tomohiro, SHIOKAWA Kunio, NISHIKAWA Hiroshi, TAKEMOTO Tadashi

    Trans. JWRI Vol. 41 No. 2 p. 51-54 2012/12 Research paper (bulletin of university, research institution)

    Publisher: Joining and Welding Research Institute, Osaka University
  317. Surfactant-Free Synthesis of Copper Particles for Electrically Conductive Adhesive Applications

    Li-Ngee Ho, Hiroshi Nishikawa

    JOURNAL OF ELECTRONIC MATERIALS Vol. 41 No. 9 p. 2527-2532 2012/09 Research paper (scientific journal)

  318. Evaluation of Electrical Resistivity of Electrically Conductive Adhesives Filled with Cu Alloy Fillers Under Various Conditions

    Vol. 51 No. 1 p. 279-283 2012/08 Research paper (scientific journal)

    Publisher:
  319. Evaluation of Bondability of Cu-to-Cu Joints using Cu nanoparticle Paste

    Vol. 51 No. 1 p. 275-278 2012/08 Research paper (scientific journal)

    Publisher:
  320. Bi-Ag合金を用いた銅継手の延性改善

    下田 将義, 山川 智弘, 塩川 国夫, 西川 宏, 竹本 正

    銅と銅合金 Vol. 51 No. 1 p. 271-274 2012/08 Research paper (scientific journal)

  321. 高温はんだ代替Cuナノ粒子ペーストの接合性に及ぼす接合条件の影響

    西川 宏, 平野 智章, 竹本 正, 寺田 信人

    第22回マイクロエレクトロニクスシンポジウム論文集 p. 115-116 2012/07 Research paper (other academic)

  322. Effect of Silane Coupling Agents on the Properties of Copper Filled Electrically Conductive Adhesive

    Li-Ngee Ho, Hiroshi Nishikawa

    Proceedings of 2012 international Conference on Microelectronics, Optoelectronics and Nanoelectronics p. N004-1-N004-4 2012/07 Research paper (international conference proceedings)

  323. Impact Strength of Sn-Ag-Cu Solder Joints in Electroless Ni-P/Au Plating in Laser Reflow Soldering

    NISHIKAWA Hiroshi, IWATA Noriya, TAKEMOTO Tadashi

    Trans. JWRI Vol. 41 No. 1 p. 33-36 2012/06 Research paper (bulletin of university, research institution)

    Publisher: Joining and Welding Research Institute, Osaka University
  324. Effect of Interfacial Reaction Layer Thickness on Fracture Morphology and Impact Resistance of Sn-Ag-Cu Solder Bump Joint

    DAITO Tomoya, NISHIKAWA Hiroshi, TAKEMOTO Tadashi

    Journal of Smart Processing Vol. 1 No. 3 p. 143-148 2012/06 Research paper (scientific journal)

    Publisher: Smart Processing Society for Materials, Environment & Energy (High Temperature Society of Japan)
  325. Effect of isothermal Aging on Sn-Ag-Cu solder joints on electroless Ni-P/Au plating by laser reflow soldering

    H. Nishikawa, N. Iwata, T. Takemoto

    roc. 5th International Brazing and Soldering Conference (IBSC 2012) p. 1-4 2012/04 Research paper (international conference proceedings)

  326. 導電性接着剤の導電フィラーと導電性

    西川 宏

    スマートプロセス学会誌 Vol. 1 No. 3 p. 138-142 2012/04

  327. 鉛フリーはんだの進歩と新規はんだ代替接合材料の新たな潮流

    西川 宏

    溶接学会誌 Vol. 81 No. 1 p. 45-57 2012/01

  328. Effcts of Sintering Structure of Ag on Bonding Strength in Pressureless Bonding using Ag Nanoparticle Paste

    Keiichi Niwa, Hiroshi Nishikawa, Nobuto Terada

    18th Symposium on "Microjoining and Assembly Technology in Electronics" Vol. 18 p. 463-464 2012/01 Research paper (other academic)

  329. Effect of Conductive Filler on Electrochemical Migration Property of Electrically Conductive Adhesive

    Kunio Ueda, Hiroshi Nishikawa

    18th Symposium on "Microjoining and Assembly Technology in Electronics" Vol. 18 p. 443-444 2012/01 Research paper (other academic)

  330. Evaluation of Joint Reliability for Sn-Bi Solder/Cu by Solder Bump Impact Test

    Terumasa Yamamoto, Hiroshi Nishikawa

    18th Symposium on "Microjoining and Assembly Technology in Electronics" Vol. 18 p. 95-98 2012/01 Research paper (other academic)

  331. Effect of Surface Finish on Impact Resistance of Sn-3.0Ag-0.5Cu Solder Joints

    Tomoya Daito, Hiroshi Nishikawa, Tadashi Takemoto, Takashi Matsunami

    18th Symposium on "Microjoining and Assembly Technology in Electronics" Vol. 18 p. 79-84 2012/01 Research paper (other academic)

  332. Using Nano-Porous Au-Ag Sheets as a Joint Layer for Low-Temperature Au-Au Bonding

    Hayata Mimatsu, Jun Mizuno, Takashi Kasahara, Mikiko Saito, Hiroshi Nishikawa, Shuichi Shoji

    2012 2ND IEEE CPMT SYMPOSIUM JAPAN p. 277-280 2012 Research paper (international conference proceedings)

  333. Evaluation of Plasma Ion Beam Sputtered TiN/TiAlN Multilayers on Steel for Bio Implant Applications

    Balasubramanian Subramanian, Takahashi Makoto, Nishikawa Hiroshi, Kobayashi Akira, Guruswamy Brindha

    Transactions of JWRI Vol. 40 No. 2 p. 55-58 2011/12 Research paper (bulletin of university, research institution)

    Publisher: Joining and Welding Research Institute, Osaka University
  334. Bonding process of Cu/Cu joint using Cu nanoparticle paste

    Takemoto Tadashi, Nishikawa Hiroshi, Hirano Tomoaki

    Transactions of JWRI Vol. 40 No. 2 p. 33-36 2011/12 Research paper (bulletin of university, research institution)

    Publisher: Joining and Welding Research Institute, Osaka University
  335. Impact reliability of micro-joints soldered with Sn-Ag-Cu solder using laser process

    H. Nishikawa, N. Iwata, T. Takemoto

    Proceedings of Sino-Japanese Workshop on Welding Thermo-Physics p. 12-1-12-4 2011/11 Research paper (international conference proceedings)

  336. Enhancement of solderability of Cu60Zr30Ti10 bulk metallic glass by dealloying in hydrofluoric acid solution

    T. Naoi, H. Nishikawa, T. Takemoto, H. Abe, M. Fukuhara, A. Inoue

    Quarterly J. Japan Welding Soc. Vol. 39 No. 2 p. 293-295 2011/08 Research paper (scientific journal)

  337. Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder/Co-P Plating and Ni-Co-P Plating

    T. Daito, H. Nishikawa, T. Takemoto, T. Matsunami

    Quarterly J. Japan Welding Soc. Vol. 39 No. 2 p. 224-225 2011/08 Research paper (scientific journal)

  338. Enhancement of solderability of Cu60Zr30Ti10 bulk metallic glass by dealloying in hydrofluoric acid solution

    T. Naoi, H. Nishikawa, T. Takemoto, H. Abe, M. Fukuhara, A. Inoue

    Quarterly J. Japan Welding Soc. Vol. 39 No. 2 p. 293-295 2011/08 Research paper (scientific journal)

  339. Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder/Co-P Plating and Ni-Co-P Plating

    T. Daito, H. Nishikawa, T. Takemoto, T. Matsunami

    Quarterly J. Japan Welding Soc. Vol. 39 No. 2 p. 224-225 2011/08 Research paper (scientific journal)

  340. Solderability of metallic glass

    Hiroshi Nishikawa, Tadashi Takemoto

    Welding International Vol. 25 No. 7 p. 505-508 2011/07 Research paper (scientific journal)

  341. エレクトロニクス分野におけるマイクロ接合・実装技術動向

    西川 宏

    溶接学会誌 Vol. 80 No. 5 p. 458-460 2011/07

  342. Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives

    Li-Ngee Ho, Teng Fei Wu, Hiroshi Nishikawa, Tadashi Takemoto, Koichi Miyake, Masakazu Fujita, Koyu Ota

    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS Vol. 22 No. 7 p. 735-740 2011/07 Research paper (scientific journal)

  343. Effect of different copper fillers on the electrical resistivity of conductive adhesives

    Li-Ngee Ho, Hiroshi Nishikawa, Tadashi Takemoto

    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS Vol. 22 No. 5 p. 538-544 2011/05 Research paper (scientific journal)

  344. Effect of Laser Irradiation Conditions on Bonding Characteristics of Lead-free Solder Joints by Laser Soldering

    N. Iwata, H. Nishikawa, T. Takemoto

    Proc. of International Conference on Electronics Packaging p. 881-884 2011/04 Research paper (international conference proceedings)

  345. Effects of Joining Conditions on Joint Strength of Cu/Cu Joint Using Cu Nanoparticle Paste

    Hiroshi Nishikawa, Tomoaki Hirano, Tadashi Takemoto, Nobuhito Terada

    The Open Surface Science Journal Vol. 3 p. 60-64 2011/04 Research paper (scientific journal)

  346. Effects of Joining Conditions on Joint Strength of Cu/Cu Joint Using Cu Nanoparticle Paste

    Hiroshi Nishikawa, Tomoaki Hirano, Tadashi Takemoto, Nobuhito Terada

    The Open Surface Science Journal Vol. 3 p. 60-64 2011/04 Research paper (scientific journal)

  347. レーザはんだ付されたSn-3Ag-0.5Cuはんだ継手の接合性評価

    岩田 典也, 西川 宏, 竹本 正

    第17回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 17 p. 299-302 2011/02 Research paper (other academic)

  348. Cuナノ粒子継手の接合性に及ぼす雰囲気の影響

    平野 智章, 西川 宏, 竹本 正, 寺田 信人

    第17回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 17 p. 95-98 2011/02 Research paper (other academic)

  349. Effect of heating method on microstructure of Sn-3.0Ag-0.5Cu solder on Cu substrate

    H. Nishikawa, N. Iwata, T. Takemoto

    EMPC-2011: 18TH EUROPEAN MICROELECTRONICS & PACKAGING CONFERENCE p. 221-224 2011 Research paper (international conference proceedings)

  350. Evaluation of Absorbed Impact Energy of Sn-3.0Ag-0.5Cu (-xCo) Solder Joints with Co-P Plating Using a Ball Impact Test

    Tomoya Daito, Hiroshi Nishikawa, Tadashi Takemoto, Takashi Matsunami

    Transactions of The Japan Institute of Electronics Packaging Vol. 3 No. 1 p. 18-23 2010/12 Research paper (scientific journal)

    Publisher: The Japan Institute of Electronics Packaging
  351. Enhancement of solderability of Cu60Zr30Ti10 bulk metallic glass by dealloying in hydrofluoric acid solution

    Takehiro Naoi, Hiroshi Nishikawa, Tadashi Takemoto, Hiroya Abe, Mikio Fukuhra, Akihisa Inoue

    Trans. JWRI Vol. 39 No. 2 p. 293-295 2010/12 Research paper (bulletin of university, research institution)

    Publisher: Joining and Welding Research Institute, Osaka University
  352. Interfacial reaction between Sn-3.0Ag-0.5Cu solder/Co-P plating and Ni-Co-P plating

    Tomoya Daito, Hiroshi Nisikawa, Tadashi Takemoto, Takashi Matsunami

    Trans. JWRI Vol. 39 No. 2 p. 224-225 2010/12 Research paper (bulletin of university, research institution)

    Publisher: Joining and Welding Research Institute, Osaka University
  353. High-Temperature Resistant Intermetallic Compound Joints for Si Chips and Cu Substrates

    Toshihide Takahashi, Shuichi Komatsu, Hiroshi Nishikawa, Tadashi Takemoto

    JOURNAL OF ELECTRONIC MATERIALS Vol. 39 No. 10 p. 2274-2280 2010/10 Research paper (scientific journal)

  354. Effects of Silver Coating Covered with Copper Filler on Electrical Resistivity of Electrically Conductive Adhesives

    Hiroshi Nishikawa, Saya Mikami, Koichi Miyake, Akira Aoki, Tadashi Takemoto

    MATERIALS TRANSACTIONS Vol. 51 No. 10 p. 1785-1789 2010/10 Research paper (scientific journal)

  355. Conductive Filler for Technical Advantages of Conductive Adhessives

    H. Nishikawa

    Journal of the Japan Welding Society Vol. 79 No. 6 p. 550-555 2010/09

    Publisher: JAPAN WELDING SOCIETY
  356. Grain Morphology and Mechanical Property of Intermetallic Compound at Interface Between Co Added Solder and Cu

    H. Nishikawa, Feng Gao, A, Komatsu, T. Takemoto

    Journal of the JRICu Vol. 49 No. 1 p. 120-124 2010/08 Research paper (scientific journal)

    Publisher:
  357. Improvement of High-Temperature Performance of Zn-Sn Solder Joint

    Toshihide Takahashi, Shuichi Komatsu, Hiroshi Nishikawa, Tadashi Takemoto

    JOURNAL OF ELECTRONIC MATERIALS Vol. 39 No. 8 p. 1241-1247 2010/08 Research paper (scientific journal)

  358. Impact Test of Sn-3.0Ag-0.5Cu (-xCo) Solder with Co-P Plating

    T. Daito, H. Nishikawa, T. Takemoto, T. Matsunami

    Proc. International Conference on Electronics Packaging 2010 (ICEP 2010) p. 796-799 2010/04 Research paper (international conference proceedings)

  359. Mechanism of Damage of Flow Soldering Bath by Molten Lead-free Solder and its Prevention Methods

    H. Nishikawa, L.. N. Ho, T.Takemoto, Y. Kashiwagi, M. Yamamoto, M. Nakamoto

    Proc. 16th Symposium on Microjoining and Assembly Technology in Electronics Vol. 16 p. 115-118 2010/02 Research paper (other academic)

  360. High-temperatureresistant Lead-free Joint with Thin Film Joining

    T. Takahashi, S. Suenaga, S. Komatsu, H. Nishikawa, T. Takemoto

    Proc. 16th Symposium on Microjoining and Assembly Technology in Electronics Vol. 16 p. 171-176 2010/02 Research paper (other academic)

  361. Thin film joining for high-temperature performance of power semi-conductor devices

    Toshihide Takahashi, Shuichi Komatsu, Hiroshi Nishikawa, Tadashi Takemoto

    MICROELECTRONICS RELIABILITY Vol. 50 No. 2 p. 220-227 2010/02 Research paper (scientific journal)

  362. LOW TEMPERATURE BONDING OF BULK METALLIC GLASS USING AN ULTRASONIC PROCESS

    Hiroshi Nishikawa, Krit WongPiromsarn, Hiroya Abe, Tadashi Takemoto, Masao Kubo, Yoshiharu Sanagawa, Takamasa Sakai, Mikio Fukuhara, Akihisa Inoue

    CHARACTERIZATION AND CONTROL OF INTERFACES FOR HIGH QUALITY ADVANCED MATERIALS III Vol. 219 p. 29-+ 2010 Research paper (international conference proceedings)

  363. Electrical Properties of Pre-Alloyed Cu-P Containing Electrically Conductive Adhesive

    Li-Ngee Ho, Teng Fei Wu, Hiroshi Nishikawa, Tadashi Takemoto

    JOURNAL OF ADHESION Vol. 86 No. 8 p. 805-813 2010 Research paper (scientific journal)

  364. LOW TEMPERATURE BONDING OF BULK METALLIC GLASS USING AN ULTRASONIC PROCESS

    Hiroshi Nishikawa, Krit WongPiromsarn, Hiroya Abe, Tadashi Takemoto, Masao Kubo, Yoshiharu Sanagawa, Takamasa Sakai, Mikio Fukuhara, Akihisa Inoue

    CHARACTERIZATION AND CONTROL OF INTERFACES FOR HIGH QUALITY ADVANCED MATERIALS III Vol. 219 p. 29-+ 2010 Research paper (international conference proceedings)

  365. Effects of Trace Elements in Copper Fillers on the Electrical Properties of Conductive Adhesives

    Li-Ngee Ho, Hiroshi Nishikawa, Naohide Natsume, Tadashi Takemoto, Koichi Miyake, Masakazu Fujita, Koyu Ota

    JOURNAL OF ELECTRONIC MATERIALS Vol. 39 No. 1 p. 115-123 2010/01 Research paper (scientific journal)

  366. Erosion Behavior and Interfacial Reaction of Stainless Steels in Molten Lead-free Solder

    NISHIKAWA Hiroshi, KANG Songai, TAKEMOTO Tadash

    Trans. JWRI Vol. 38 No. 2 p. 53-56 2009/12 Research paper (bulletin of university, research institution)

    Publisher: Joining and Welding Research Institute, Osaka University
  367. Estimation Method for Liquidus Temperature of Lead-Free Solder Using Differential Scanning Calorimetry Profiles

    Hiroshi Nishikawa, Yoshihito Hamada, Tadashi Takemoto

    JOURNAL OF ELECTRONIC MATERIALS Vol. 38 No. 12 p. 2610-2616 2009/12 Research paper (scientific journal)

  368. Effect of elements Ni and Co on morphology and type of IMC at Sn-3Ag-0.5Cu solder joint interface

    Gong-Ge Meng, Tadashi Takemoto, Hiroshi Nishikawa

    Journal of Harbin Institute of Technology (New Series) Vol. 16 No. 5 p. 648-651 2009/10 Research paper (scientific journal)

  369. Improved wettability of Sn-based solder over the Cu60Zr30Ti10 bulk metallic glass surface

    A. Imai, M. Katayama, S. Maruyama, H. Nishikawa, T. Wada, H. Kimura, M. Fukuhara, T. Takemoto, A. Inoue, Y. Matsumoto

    JOURNAL OF MATERIALS RESEARCH Vol. 24 No. 9 p. 2931-2934 2009/09 Research paper (scientific journal)

  370. 導電性接着剤の高性能化

    西川 宏, 竹本 正

    科学と工業 2009/08

  371. Solderability of Bulk Metallic Glasses Using Lead-Free Solders

    Hiroshi Nishikawa, Krit WongPiromsarn, Hiroya Abe, Tadashi Takemoto, Mikio Fukuhara, Akihisa Inoue

    MATERIALS TRANSACTIONS Vol. 50 No. 6 p. 1326-1329 2009/06 Research paper (scientific journal)

  372. Dealloying of Cu-Zr-Ti Bulk Metallic Glass in Hydrofluoric Acid Solution

    Hiroya Abe, Kazuyoshi Sato, Hiroshi Nishikawa, Tadashi Takemoto, Mikio Fukuhara, Akihisa Inoue

    MATERIALS TRANSACTIONS Vol. 50 No. 6 p. 1255-1258 2009/06 Research paper (scientific journal)

  373. Solderability of Metallic Glass

    H. Nishikawa, T. Takemoto

    Journal of the Japan Welding Society Vol. 78 No. 2 p. 31-34 2009/03

  374. Interaction behavior between the additives and Sn in Sn-3.0Ag-0.5Cu-based solder alloys and the relevant joint solderability

    Fangjie Cheng, Feng Gao, Hiroshi Nishikawa, Tadashi Takemoto

    JOURNAL OF ALLOYS AND COMPOUNDS Vol. 472 No. 1-2 p. 530-534 2009/03 Research paper (scientific journal)

  375. Mechanical properties versus temperature relation of individual phases in Sn-3.0Ag-0.5Cu lead-free solder alloy

    Feng Gao, Hiroshi Nishikawa, Tadashi Takemoto, Jianmin Qu

    MICROELECTRONICS RELIABILITY Vol. 49 No. 3 p. 296-302 2009/03 Research paper (scientific journal)

  376. Enhancement of Au Dissolution by Microorganisms Using an Accelerating Cathode Reaction

    Yoshito Kita, Hiroshi Nishikawa, Michihiko Ike, Tadashi Takemoto

    METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE Vol. 40 No. 1 p. 39-44 2009/02 Research paper (scientific journal)

  377. Amorphous/crystalline transition of copper at room-temperature

    M. Fukuhara, H. Abe, H. Nishikawa, T. Takemoto, G. Xie, A. Inoue

    CHEMICAL PHYSICS LETTERS Vol. 469 No. 4-6 p. 289-292 2009/02 Research paper (scientific journal)

  378. Fluxless joining of aluminium alloy to steel by laser irradiation method

    Tadashi Takemoto, Sachio Kimura, Yousuke Kawahito, Hiroshi Nishikawa, Seiji Katayama

    Welding International Vol. 23 No. 5 p. 316-322 2009 Research paper (scientific journal)

  379. Reduction of damage of soldering iron tip by addition of co and Ni To Sn-Ag-Cu lead-free solder

    Tadashi Takemoto, Ken-Ichi Tomitsuka, Toshio Tooyama, Hiroshi Nishikawa

    Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society Vol. 27 No. 2 p. 209s-213s 2009 Research paper (scientific journal)

  380. Measurement of erosion of stainless steel by molten lead-free solder using micro-focus X-ray CT system

    Hiroshi Nishikawa, Songai Kang, Tadashi Takemoto

    Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society Vol. 27 No. 2 p. 214s-218s 2009 Research paper (scientific journal)

  381. Characteristics of Electrically Conductive Adhesives filled with Copper nanoparticles with Organic Layer

    L-N. Ho, H. Nishikawa, T. Takemoto, Y. Kashiwagi, M. Yamamoto, M. Nakamoto

    2009 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE (EMPC 2009), VOLS 1 AND 2 p. 443-+ 2009 Research paper (international conference proceedings)

  382. Effect of Some Factors on Erosion of Stainless Steel by Molten Lead-free Solder

    H.Nishikawa, K.Sabase, T.Takemoto

    Proc. 15th Symposium on Microjoining and Assembly Technology in Electronics Vol. 15 p. 387-390 2009/01 Research paper (other academic)

  383. Mechanism of Damage of Flow Soldering Bath by Molten Lead-free Solder and its Prevention Methods

    T.Takemoto, H.Nishikawa, K. Serizawa, K.Yamamoto

    Proc. 15th Symposium on Microjoining and Assembly Technology in Electronics Vol. 15 p. 383-386 2009/01 Research paper (other academic)

  384. Fluxless Joining of Aluminum Alloy to Steel by Laser Irradaiation Method

    Tadashi Takemoto, Sachio Kimura, Yousuke Kawahito, Hiroshi Nishikawa, Seiji Katayama

    Journal of Light Metal Welding & Construction Vol. 46 No. 7 p. 300-308 2008/07 Research paper (scientific journal)

    Publisher: Japan Light Metal Welding Association
  385. Effect of Ni or Co addition to Sn-Ag solder on microstructure and joint strength at interface

    Hiroshi Nishikawa, Akira Komatsu, Tadashi Takemoto

    MATERIALS TRANSACTIONS Vol. 49 No. 7 p. 1518-1523 2008/07 Research paper (scientific journal)

  386. Estimation of the thermal fatigue resistance and creep properties of the Co/Ni-bearing SAC305 lead-free solders by the strain rate change tensile test

    Fangjie Cheng, Hiroshi Nishikawa, Tadashi Takemoto

    MATERIALS TRANSACTIONS Vol. 49 No. 7 p. 1503-1507 2008/07 Research paper (scientific journal)

  387. Characterization of Co-Sn intermetallic compounds in Sn-3.0Ag-0.5Cu-0.5Co lead-free solder alloy

    Feng Gao, Fangjie Cheng, Hiroshi Nishikawa, Tadashi Takemoto

    MATERIALS LETTERS Vol. 62 No. 16 p. 2257-2259 2008/06 Research paper (scientific journal)

  388. Microstructural and mechanical properties of Sn-Ag-Cu lead-free solders with minor addition of Ni and/or Co

    Fangjie Cheng, Hiroshi Nishikawa, Tadashi Takemoto

    JOURNAL OF MATERIALS SCIENCE Vol. 43 No. 10 p. 3643-3648 2008/05 Research paper (scientific journal)

  389. Microstructural and Mechanical Properties of the SAC305 Solder Doped with Co and Ni Minor Elements

    F-J Cheng, H. Nishikawa, T. Takemoto

    Smart Processing Technology Vol. 2 p. 305-312 2008/03 Research paper (scientific journal)

  390. Electrical Conductivity of Conductive Adhesives with low melting point metal

    H. Nishikawa, K. Tsuji, N. Terada, T. Takemoto

    Smart Processing Technology Vol. 2 p. 115-118 2008/03 Research paper (scientific journal)

  391. The creep deformation characterization of Sn-3.5Ag lead-free solder alloy

    F. Gao, H. Nishikawa, T. Takemoto

    Smart Processing Technology Vol. 2 p. 123-126 2008/03 Research paper (scientific journal)

  392. Laser Joining of 6061 Aluminum Alloy and Steel using Zn Filler Metal

    T. Takemoto, S. Kimura, Y. Kawahito, H. Nishikawa

    Smart Processing Technology Vol. 2 p. 127-130 2008/03 Research paper (scientific journal)

  393. Microstructural and Mechanical Behavior of Plasma Sprayed YSZ Coating on Ni Super Alloy during Hot Corrosion

    Abbas Afrasiabi, Mohsen Saremi, Akira Kobayashi, Hiroshi Nishikawa

    Smart Processing Technology Vol. 2 p. 41-44 2008/03 Research paper (scientific journal)

    Publisher:
  394. Improvement of Electrical Conductivity for Cu Filled Conductive Adhesives

    H. Nishikawa, K. Tsuji, N. Terada, T. Takemoto

    Proc. 14th Symposium on Microjoining and Assembly Technology in Electronics Vol. 14 p. 169-172 2008/02 Research paper (other academic)

  395. Wetting characteristics of Sn-Ag-Cu solder on Pd-based metallic glass

    Hiroshi Nishikawa, Krit WongPiromsarn, Hiroya Abe, Tadashi Takernoto, Mikio Fukuhara, Takeshi Wada, Akihisa Inoue

    MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS Vol. 148 No. 1-3 p. 124-127 2008/02 Research paper (scientific journal)

  396. Electrical Property of Conductive Adhesives Using Silver-coated Copper Filler

    Hiroshi Nishikawa, Saya Mikami, Nobuto Terada, Koich Miyake, Akira Aoki, Tadashi Takemoto

    ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS p. 825-+ 2008 Research paper (international conference proceedings)

  397. Temperature dependence of mechanical properties of individual phases in Sn-3.0Ag-0.5Cu lead-free solder alloy

    Feng Gao, Hiroshi Nishikawa, Tadashi Takemoto, Jianmin Qu

    58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS p. 466-+ 2008 Research paper (international conference proceedings)

  398. Effects of isothermal aging on the microstructure and tensile behavior of Sn-3.0Ag-0.5Cu-0.2Co solder

    Fangjie Cheng, Hiroshi Nishikawa, Tadashi Takemoto

    ADVANCED WELDING AND MICRO JOINING / PACKAGING FOR THE 21ST CENTURY Vol. 580-582 p. 239-242 2008 Research paper (international conference proceedings)

  399. Interfacial reaction of electroless Ni-P plating with Sn-3.5Ag (-Co) solder

    Hiroshi Nishikawa, Akira Komatsu, Tadashi Takemoto

    ADVANCED WELDING AND MICRO JOINING / PACKAGING FOR THE 21ST CENTURY Vol. 580-582 p. 243-246 2008 Research paper (international conference proceedings)

  400. Micromechanical responses of Sn-3.5Ag-xCo lead-free solders by nanoindentation

    Feng Gao, Hiroshi Nishikawa, Tadashi Takemoto

    ADVANCED WELDING AND MICRO JOINING / PACKAGING FOR THE 21ST CENTURY Vol. 580-582 p. 209-212 2008 Research paper (international conference proceedings)

  401. Additive effect of Kirkendall void formation in Sn-3.5Ag solder joints on common substrates

    Feng Gao, Hiroshi Nishikawa, Tadashi Takemoto

    JOURNAL OF ELECTRONIC MATERIALS Vol. 37 No. 1 p. 45-50 2008/01 Research paper (scientific journal)

  402. Intermetallics evolution in Sn-3.5Ag based lead-free solder matrix on an OSPCu finish

    Feng Gao, Hiroshi Nishikawa, Tadashi Takemoto

    JOURNAL OF ELECTRONIC MATERIALS Vol. 36 No. 12 p. 1630-1634 2007/12 Research paper (scientific journal)

  403. Effects of Co Addition on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu Solder Alloy

    CHENG Fangjie, NISHIKAWA Hiroshi, TAKEMOTO Tadashi

    Trans. JWRI Vol. 36 No. 1 p. 53-56 2007/09 Research paper (bulletin of university, research institution)

  404. Morphology and pull strength of Sn-Ag(-Co) solder joint with copper pad

    Hiroshi Nishikawa, Akira Komatsu, Tadashi Takemoto

    JOURNAL OF ELECTRONIC MATERIALS Vol. 36 No. 9 p. 1137-1143 2007/09 Research paper (scientific journal)

  405. Correlations between IMC thickness and three factors in Sn-3Ag-0.5Cu alloy system

    Gong-ge MENG, T. Takemoto, H. Nishikawa

    Transactions of Nonferrous Metals Society of China (English Edition) Vol. 17 No. 4 p. 686-690 2007/08 Research paper (scientific journal)

  406. Effective Electrode Work Functions in Helium Gas Tungsten Arc During Operation

    Shinichi Tashiro, Hiroshi Nishikawa, Manabu Tanaka

    PLASMA PROCESSES AND POLYMERS Vol. 4 p. S995-S998 2007/04 Research paper (scientific journal)

  407. Evaluation of Sn-3.5Ag based solder joint by ball impact test

    H. Nishikawa, K. Miki, T. Takemoto

    Proc. IPC/JEDEC Global Conference on Lead Free Reliability and Reliability Testing for RoHS Lead Free Electronics p. 0.417361111111111-0.420833333333333 2007/04 Research paper (international conference proceedings)

  408. The Microstructure Characterization of Sn-Ag-Cu Solder with Small Amount of Co Addition

    F. CHENG, H.Nishikawa, T.Takemoto

    Proc. 13th Symposium on Microjoining and Assembly Technology in Electronics p. 193-196 2007/02 Research paper (other academic)

  409. Wettability between Pd-based Metallic Glass and Lead-free Solder

    H. Nishikawa, W. P. Krit, H.Abe, T.Takemoto, M.Hukuhara, T.Wada, A.Inoue

    Proc. 13th Symposium on Microjoining and Assembly Technology in Electronics p. 179-182 2007/02 Research paper (other academic)

  410. Suppression of Damage of Soldering Iron Tip by using of Co, Ni Added Flux Cored Solder Wire

    T.Takemoto, K. Tomitsuka, H.Nishikawa

    Proc. 13th Symposium on Microjoining and Assembly Technology in Electronics Vol. 13 p. 263-266 2007/02 Research paper (other academic)

  411. Effective electrode work functions in argon gas tungsten arc during operation

    M. Tanaka, S. Tashiro, H. Nishikawa, M. Ushio

    SURFACE & COATINGS TECHNOLOGY Vol. 201 No. 9-11 p. 5383-5386 2007/02 Research paper (scientific journal)

  412. Effect of aging conditions on impact strength of Sn-3.5 based solder joint

    Hiroshi Nishikawa, Kousuke Miki, Tadashi Takemoto

    2007 9TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2 Vol. 9 p. 553-+ 2007 Research paper (international conference proceedings)

  413. MEASUREMENTS OF CATHODE SURFACE TEMPERATURE OF PLASMA TORCH

    Shinichi Tashiro, Hiroshi Nishikawa, Manabu Tanaka

    CHARACTERIZATION AND CONTROL OF INTERFACES FOR HIGH QUALITY ADVANCED MATERIALS II Vol. 198 p. 395-400 2007 Research paper (international conference proceedings)

  414. TOPOLOGY ANALYSIS OF THE CU3SN PHASE IN ELECTRONIC INTERCONNECTIONS

    Feng Gao, Hiroshi Nishikawa, Tadashi Takemoto

    CHARACTERIZATION AND CONTROL OF INTERFACES FOR HIGH QUALITY ADVANCED MATERIALS II Vol. 198 p. 401-406 2007 Research paper (international conference proceedings)

  415. A TREATMENT OF CARBONACEOUS WASTE CONTAINING METALS BY STEAM PLASMA

    Hiroshi Nisikawa, Sumihiro Higuchi, Manabu Tanaka, Tadashi Takemoto

    CHARACTERIZATION AND CONTROL OF INTERFACES FOR HIGH QUALITY ADVANCED MATERIALS II Vol. 198 p. 353-+ 2007 Research paper (international conference proceedings)

  416. Nano-scale mechanical responses of sn-ag based lead-free solders

    Feng Gao, Hiroshi Nishikawa, Tadashi Takemoto

    57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS p. 205-+ 2007 Research paper (international conference proceedings)

  417. Effective electrode work functions in helium gas tungsten arc during operation

    Shinichi Tashiro, Hiroshi Nishikawa, Manabu Tanaka

    Plasma Processes and Polymers Vol. 4 No. 1 p. S995-S998 2007 Research paper (international conference proceedings)

  418. Morphology and growth pattern transition of intermetallic compounds between Cu and Sn-3.5Ag containing a small amount of additives

    Feng Gao, Tadashi Takemoto, Hiroshi Nishikawa

    JOURNAL OF ELECTRONIC MATERIALS Vol. 35 No. 12 p. 2081-2087 2006/12 Research paper (scientific journal)

  419. Joint Strength between Sn-Ag Based Lead-free Solder and Cu Pad by Ball Shear Test

    H.Nishikawa, A. Komatsu, T. Takemoto

    Transactions of JWRI Vol. 35 No. 2 p. 53-56 2006/12 Research paper (bulletin of university, research institution)

    Publisher: Joining and Welding Research Institute, Osaka University
  420. Estimation of the micromechanical characteristics of Sn-3.5Ag-0.1Co lead-free solder

    F. Gao, H. Nishikawa, T. Takemoto

    Proc. EcoDesign 2006 Asia Pacific Symposium p. 81-85 2006/12 Research paper (international conference proceedings)

  421. Erosion Protective Design for Lead-free Wave Soldering Bath

    T. Takemoto, H. Nishikawa, F. Gao

    Proc. EcoDesign 2006 Asia Pacific Symposium p. 77-80 2006/12 Research paper (international conference proceedings)

  422. Decomposition of residual cyanide by bacteria used for Au bioleaching

    Y. KITA, H. OKAMOTO, H. NISHIKAWA, T. TAKEMOTO

    Environmental Conservation Engineering Vol. 35 No. 12 p. 908-915 2006/12 Research paper (scientific journal)

    Publisher: Society of Environmental Conservation Engineering
  423. A New Sorting Process of Aluminum Scraps Using Surface Morphology after Laser Irradiation

    H. Nishikawa, K. Seo, S. Katayama, T. Takemoto

    Going Green CARE INNOVATION 2006 p. 2.2.3:1-2.2.3:4 2006/11 Research paper (international conference proceedings)

  424. Gasification Process for Carbonized Waste by Hybrid Steam Plasma

    H.Nishikawa, M.Ibe, M. Tanaka, T.Takemoto, M.Ushio

    J. the Japan Society of Waste Management Experts Vol. 17 No. 6 p. 396-403 2006/11 Research paper (scientific journal)

    Publisher: Japan Society of Material Cycles and Waste Management
  425. 低融点金属とフラックスを添加したCuペーストの開発

    細谷一雄, 寺田信人, 松葉 頼重, 竹本 正, 西川 宏

    第16回マイクロエレクトロニクスシンポジウム論文集 p. 131-134 2006/10 Research paper (other academic)

  426. Effective Electrode Work Functions in Helium Gas Tungsten Arc during Operation

    Shinichi Tashiro, Hiroshi Nishikawa, Manabu Tanaka

    Tenth International Conference on Plasma Surface Engineering p. 543-543 2006/09 Research paper (international conference proceedings)

  427. Effect of DC steam plasma on gasifying carbonized waste

    Hiroshi Nishikawa, Masaaki Ibe, Manabu Tanaka, Tadashi Takemoto, Masao Ushio

    VACUUM Vol. 80 No. 11-12 p. 1311-1315 2006/09 Research paper (scientific journal)

  428. Effect of Additional Element on Interfacial Reaction and Shear Strength between Lead-free Solder and Copper

    H.Nishikawa, A.Komatsu, T.Takemoto

    J. JRICu Vol. 45 No. 1 p. 217-222 2006/08 Research paper (scientific journal)

    Publisher:
  429. Effects of cyanide and dissolved oxygen concentration on biological Au recovery

    Yoshito Kita, Hiroshi Nishikawa, Tadashi Takemoto

    JOURNAL OF BIOTECHNOLOGY Vol. 124 No. 3 p. 545-551 2006/07 Research paper (scientific journal)

  430. Interaction Behavior on the Additives Redistribution during Lead-free Soldering Process

    F.Gao, T.Takemoto, H.Nishikawa, A.Komatsu

    Smart Processing Technology Vol. 1 p. 199-202 2006/06 Research paper (scientific journal)

  431. Prevention of Dissolution of Plated iron in Molten Lead-free Solder by Adding Minor Element to Solder

    H.Nishikawa, A.Komatsu, T.Uetani, T.Takemoto

    Smart Processing Technology Vol. 1 p. 195-198 2006/06 Research paper (scientific journal)

  432. Microstructure and mechanical properties evolution of intermetallics between Cu and Sn-3.5Ag solder doped by Ni-Co additives

    F. Gao, T. Takemoto, H. Nishikawa, A. Komatsu

    JOURNAL OF ELECTRONIC MATERIALS Vol. 35 No. 5 p. 905-911 2006/05 Research paper (scientific journal)

  433. Microstructure of interface between Sn-Cu solder with Ni and Cu plate

    Hiroshi Nishikawa, Jin Yu Piao, Tadashi Takemoto

    JOURNAL OF THE JAPAN INSTITUTE OF METALS Vol. 70 No. 5 p. 427-433 2006/05 Research paper (scientific journal)

  434. Interfacial reaction between Sn-0.7Cu (-Ni) solder and Cu substrate

    H Nishikawa, JY Piao, T Takemoto

    JOURNAL OF ELECTRONIC MATERIALS Vol. 35 No. 5 p. 1127-1132 2006/05 Research paper (scientific journal)

  435. Effect of Co Addition to Sn-Ag Solder on Interfacial Reaction and Joint Strength of Solder with Cu

    H.nishikawa, A.Komatsu, T.Takemoto

    TMS2006 135th Annual Meeting & Exhibition 2006/03 Research paper (other academic)

  436. Morphology and Growth Pattern Transition of IMCs between Cu and Sn3.5Ag Containing Small Amount of Additives

    F.Gao, T.Takemoto, H.Nishikawa

    TMS2006 135th Annual Meeting & Exhibition 2006/03 Research paper (other academic)

  437. Effects of Co and Ni addition on reactive diffusion between Sn-3.5Ag solder and Cu during soldering and annealing

    F Gao, T Takemoto, H Nishikawa

    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING Vol. 420 No. 1-2 p. 39-46 2006/03 Research paper (scientific journal)

  438. Microstructure and Mechanical Characteristics of Cu6Sn5-based Intermentallics Containing Additives

    H.Nishikawa, F.Gao, T.Takemoto

    Proc. the 12th Symposium on Microjoining and Assembly Technology in Electronics Vol. 12 p. 73-76 2006/02 Research paper (scientific journal)

  439. プラズマトーチにおける作動中タングステン陰極の仕事関数の測定

    田代真一, 西川 宏, 田中 学

    シンポジウム講演資料 2006/02 Research paper (other academic)

  440. The contrasting and statistics of spreading area data in soldering wettability

    Gongge Meng, Tadashi Takemoto, Hiroshi Nishikawa

    ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS p. 423-+ 2006 Research paper (international conference proceedings)

  441. Phase stability assessment and microstructure modification at lead-free solder joint

    F. Gao, H. Nishikawa, T. Takemoto

    ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS p. 738-+ 2006 Research paper (international conference proceedings)

  442. Application of Nd : YAG laser to aluminum alloy sorting

    H Nishikawa, K Seo, S Katayama, T Takemoto

    MATERIALS TRANSACTIONS Vol. 46 No. 12 p. 2641-2646 2005/12 Research paper (scientific journal)

  443. Degradation Mechanism on Joint of Betweens Ag-Epoxy Conductive Adhesive and Sn/Ni Plating Chip by Reliability Test

    Woo-Ju Jeong, H.Nishikawa, S.Okumi, D. Itou, T. Takemoto

    J. Adhesion Soc. Japan Vol. 41 No. 12 p. 490-497 2005/12 Research paper (scientific journal)

    Publisher: The Adhesion Society of Japan
  444. Microstructure Characterization of Cu6Sn5-based Intermetallic Compounds at Solder Matrix and Relevant Solder Joints

    G.Feng, H.Nishikawa, T.Takemoto

    TRANSACTIONS OF JWRI Vol. 34 No. 2 p. 57-61 2005/12 Research paper (bulletin of university, research institution)

    Publisher: Joining and Welding Research Institute, Osaka University
  445. Interfacial reaction between Sn-Ag-Co solder and metals

    H Nishikawa, A Komatsu, T Takemoto

    MATERIALS TRANSACTIONS Vol. 46 No. 11 p. 2394-2399 2005/11 Research paper (scientific journal)

  446. Electrical characteristics of a new class of conductive adhesive

    WJ Jeong, H Nishikawa, D Itou, T Takemoto

    MATERIALS TRANSACTIONS Vol. 46 No. 10 p. 2276-2281 2005/10 Research paper (scientific journal)

  447. Heat Input Properties of Hollow Cathode Arc as a Welding Heat Source

    H.Nishikawa, S.Shobako, M.Ohta, T.Ohji

    Journal of Physics D: Applied Physics Vol. 38 No. 18 p. 405-410 2005/09 Research paper (scientific journal)

  448. Effect of Irradiation Conditions on Aluminium Alloy Sorting by Using Nd:YAG Laser

    H.Nishikawa, K.Seo, S.Katayama, T.Takemoto

    Advances in Ecomaterials Vol. 1 p. 135-141 2005/07 Research paper (international conference proceedings)

    Publisher: STALLION PRESS
  449. Microstructure of Sn-Ag-Co Solder Reacted with Cu substrate

    H.Nishikawa, A.Komatsu, T.Takemoto

    Proc. 3rd International Conference on Lead Free Electronics p. 0.959027778-0.961111111 2005/06 Research paper (international conference proceedings)

  450. Effect of solvent evaporation and shrink on conductivity of conductive adhesive

    WJ Jeong, H Nishikawa, H Gotoh, T Takemoto

    MATERIALS TRANSACTIONS Vol. 46 No. 3 p. 704-708 2005/03 Research paper (scientific journal)

  451. Additive Alloying Effects on the Generation of Intermetallic Compounds Between Sn-Ag-Ni-Co Solders and Cu

    F.Gao, T.Takemoto, H.Nishikawa, A.Komatsu

    TMS 2005, 135th Annual Meeting & Exhibition 2005/02 Research paper (other academic)

  452. Effect of Co Addition to Sn-Ag Solder on Interfacial Reaction

    H. NISHIKAWA, A. KOMATSU, K. UETANI, T. TAKEMOTO

    Proc. the 11th Symposium on Microjoining and Assembly Technology in Electronics Vol. 11 p. 129-132 2005/02 Research paper (scientific journal)

  453. Solderability and Microstructure of Various Iron-base Substrates

    K. KIFUNE, T. TAKEMOTO, H. NISHIKAWA, N. FUJITA, K. UETANI, N. SEKIMORI

    Proc. 11th Symposium on Microjoining and Assembly Technology in Electronics, Vol. 11(2005), 125-128 Vol. 11 p. 125-128 2005/02 Research paper (scientific journal)

  454. Growth Rate of Intermetallic Compounds at Sn-3.0Ag-0.5Cu/Cu Interface

    T. TAKEMOTO, Y. KAMATA, H. NISHIKAWA, T. IIDA

    Proc. 11th Symposium on Microjoining and Assembly Technology in Electronics, Vol. 11(2005), 111-114 Vol. 11 p. 111-114 2005/02 Research paper (scientific journal)

  455. Recycle of Valuable Metals in Waste Printed Wiring Board using Bacteria

    Y. KITA, H. NISHIKAWA, M. IKE, T. TAKEMOTO

    Proc. the 11th Symposium on Microjoining and Assembly Technology in Electronics Vol. 11 p. 87-89 2005/02 Research paper (scientific journal)

  456. Low environmentally impact recovery of gold using cyanide producing bacteria

    Yosbito Kita, Hiroshi Nishikawa, Michibiko Ike, Tadashi Takemoto

    FOURTH INTERNATIONAL SYMPOSIUM ON ENVIRONMENTALLY CONSCIOUS DESIGN AND INVERSE MANUFACTURING, PROCEEDINGS p. 935-938 2005 Research paper (international conference proceedings)

  457. Dissolution of Gold from Printed Wiring Board using Bacteria having Cyanide Generation and Decomposition Ability

    Y. KITA, H. NISHIKAWA, M. IKE, T. TAKEMOTO

    Proc. EcoDesign 2004 Japan Symposium p. 198-201 2004/12 Research paper (other academic)

  458. The Overview of IMS Project EFSOT Japan 2003

    M.Okamoto, K.Serizawa, H.Satoh, M.Chiba, K.Omae, E.Hirao, N.Itsubo, A.Inaba, T.Takemoto, H.Nishikawa

    Proc. The Sixth International Conference on EcoBalance p. 1-4 2004/11 Research paper (international conference proceedings)

  459. Effect of Grain Size on Reaction between Pb-free Solder and Plated Iron

    H.Nishikawa, T.Takemoto, T.Uetani, N.Sekimori

    Proc. PSEA '04, 502, 405-410 2004/11 Research paper (other academic)

  460. Improvement of Bond Characteristics of Conductive Adhesives by Curing Condition

    W. J. JEONG, K. TSUJI, H. SAKAI, H. NISHIKAWA, H. GOTOH, T. TAKEMOTO

    Proc. PSEA'04 Vol. 2 2004/11 Research paper (international conference proceedings)

  461. Topological Modification of IMC between Cu substrate and Sn-3.5Ag Solder with Addition Co participation

    F.GAO, T.TAKEMOTO, H.NISHIKAWA, A.KOMATSU

    Proc. 7th International Conference on Lead Free Electronic Components and Assemblies 2004/10 Research paper (international conference proceedings)

  462. Effect of Ni Addition on Interfacial Reaction Between Sn-Cu Solder and Cu Base Metal

    H.Nisikawa, J.Y.Piao, T.Takemoto

    Proc.Internationl Conference on Joining of Advanced and Specialty Materials VII 2004/10 Research paper (international conference proceedings)

  463. Damage Control of Soldering Iron Tip for Lead-free Solder

    H.Nishikawa, T.Takemoto, T.Uetani

    Proc.Internationl Conference on Joining of Advanced and Specialty Materials VII 2004/10 Research paper (international conference proceedings)

  464. Review of IMS Project EFSOT Japan 2003

    M.Okamoto, K.Serizawa, S.satoh, M.Chiba, K.Omae, E.Hirano, S.Nakamoto, N.Itsubo, A.Inaba, T.Takemoto, H.Nishikawa

    Proc. 2nd International Conference on Lead Free Electronics p. 40:1-40:9 2004/06 Research paper (international conference proceedings)

  465. Reduction of Damage of Soldering Iron Tip by Molten Lead Free Solders

    H.Nishikawa, T.Takemoto, T.Uetani, N.Sekimori

    2nd International Conference on Lead Free Electronics p. 37:1-37:5 2004/06 Research paper (international conference proceedings)

  466. Effect of Ni Concentration on Reaction between Sn-Cu-Ni soler and Cu base metal

    H.Nishikawa, J.Y.Piao, T.Takemoto

    2nd International Conference on Lead Free Electronics p. 27:1-27:4 2004/06 Research paper (international conference proceedings)

  467. Damage of Stainless Steels by Contact with Molten Pb-free Solder and Cu base metal

    H.Nishikawa, Y.Kamata, T.Iida, T.Takemoto

    2nd International Conference on Lead Free Electronics p. 15:1-15:4 2004/06 Research paper (international conference proceedings)

  468. Heat Input Energy to Anode for Hollow Cathode Arc

    Nishikawa,H, Shobako,S, Ohta,M, Ohji,T

    Proc. 4th Int. Conf. of Physical and Numerical Simulation of Materials 2004/05 Research paper (international conference proceedings)

  469. A treatment of carbonaceous wastes using thermal plasma with steam

    H Nishikawa, M Ibe, M Tanaka, M Ushio, T Takemoto, K Tanaka, N Tanahashi, T Ito

    VACUUM Vol. 73 No. 3-4 p. 589-593 2004/04 Research paper (scientific journal)

  470. Effect of iron plating conditions on reaction in molten lead-free solder

    H Nishikawa, T Takemoto, K Kifune, T Uetani, N Sekimori

    MATERIALS TRANSACTIONS Vol. 45 No. 3 p. 741-746 2004/03 Research paper (scientific journal)

  471. Simple Removal Method of Copper from Cu-enriched Flow Soldering Bath

    T.Takemoto, T.Takahashi, H.Nishikawa

    Proc. 10th Symposium on Microjoining and Assembly Technology in Electronics, 10, 257-260 2004/02 Research paper (scientific journal)

  472. Interrelation between Electrical Resistance and Shear Strength for Conductive Adhesive

    H.Nishikawa, W-J.Jeong, K.Tsuji, H.Sakai, T.Takemoto, H.Gotoh

    Proc. 10th Symposium on Microjoining and Assembly Technology in Electronics, 10, 179-182 2004/02 Research paper (scientific journal)

  473. Damages of Soldering Iron by Lead-Free Solder and Its Improvement

    T.UETANI, M. YAMAZAKI, T. TAKEMOTO, H. NISIKAWA, K.Kifune

    Proc. 10th Symposium on Microjoining and Assembly Technology in Electronics, 10,25-28 2004/02 Research paper (scientific journal)

  474. Effect of minor elements on interfacial reaction between lead-free solders and Cu

    Preprints of the National Meeting of JWS Vol. 2004 p. 51-51 2004

    Publisher: JAPAN WELDING SOCIETY
  475. Gold recovery from printed wiring board using bioleaching

    Y Kita, H Nishikawa, T Takemoto

    Electronics Goes Green 2004 (Plus): Driving Forces for Future Electronics, Proceedings p. 653-656 2004 Research paper (international conference proceedings)

  476. Simple removal method of enriched copper from lead-free soldering bath

    H Nishikawa, T Takemoto, T Takahashi

    Electronics Goes Green 2004 (Plus): Driving Forces for Future Electronics, Proceedings p. 373-378 2004 Research paper (international conference proceedings)

  477. A Heat Treatment of Carbonaceous Residues by Thermal Plasma with Steam

    H.Nishikawa, M.Ibe, M.Tanaka, M.Ushio, T.Takemoto, K.Tanaka, N.Tanahashi, T.Itou

    Advances in Applied Plasma Science, 399-402 2003/09 Research paper (international conference proceedings)

  478. Charactriscics of Conductive Adhive for High Conductivity in Electronics Packaging

    W-J.Jeong, H.Nishikawa, T.Tadashi, H.Gotoh

    2003 Internatinal Conference on Electronics Packaging (ICEP) Proceedings, 386-389 2003/04

  479. 鉛フリーはんだ付用こて先チップの損傷抑制

    西川 宏, 竹本 正, 上谷 孝司, 木船 弘一

    溶接学会全国大会講演概要 Vol. 2003 p. 500-500 2003

    Publisher: 一般社団法人 溶接学会
  480. Reduction of copper content from dip-type lead-free soldering bath

    T Takemoto, T Takahashi, H Nishikawa

    2003 3RD INTERNATIONAL SYMPOSIUM ON ENVIRONMENTALLY CONSCIOUS DESIGN AND INVERSE MANUFACTURING - ECODESIGN '03 p. 838-842 2003 Research paper (international conference proceedings)

  481. A basic study toward automated sorting of aluminum scraps

    H Nishikawa, K Hiroe, S Katayama, T Takemoto

    2003 3RD INTERNATIONAL SYMPOSIUM ON ENVIRONMENTALLY CONSCIOUS DESIGN AND INVERSE MANUFACTURING - ECODESIGN '03 p. 510-514 2003 Research paper (international conference proceedings)

  482. Fundamental Characteristics of the Hollow Cathode Arc as Welding Heat Source

    Nishikawa,H, Ohji,T, Takemoto,T

    Trans. JWRI, 32, 1, 63-66 2003/01 Research paper (scientific journal)

  483. Characteristics of Hollow Cathode Arc Plasma as a Heat Source

    Hiroshi Nishikawa, Toshikazu Maruyama, Takayoshi Ohji

    IEEJ Trans. FM, Vol.123, No.1, 2003 2003/01 Research paper (scientific journal)

  484. Scavening of Copper from Lead-free Flow Soldering Bath

    T.Takahashi, T.Takemoto, H.Nishikawa

    Proc. EcoDesign 2002 Japan Symposium, 128-131 2002/12 Research paper (other academic)

  485. Characteristics of Hollow Cathode Arc as Heat Source -Application of Hollow Cathode Arc to Welding of Aluminum Alloy-

    Nishikawa Hiroshi, Kosaka kei, Ohji Takayoshi

    Journal of High Temperature Society. Vol. 28 No. 6 p. 344-350 2002/11 Research paper (scientific journal)

    Publisher:
  486. Characteristics of hollow cathode arc as welding heat source: arc characteristics and melting properties

    H Nishikawa, K Yoshida, T Ohji, Y Suita, K Masubuchi

    SCIENCE AND TECHNOLOGY OF WELDING AND JOINING Vol. 7 No. 5 p. 280-285 2002/10 Research paper (scientific journal)

  487. Effect of Gravity on Arc Welding Phenomenon -Development of Welding Technology in Space-

    Fukushima Komaki, Nishikawa Hiroshi, Ohji Takayoshi

    2002/01 Research paper (other academic)

  488. Fundamental characteristics of hollow cathode arc welding

    Kazuhiro Yoshida, Hiroshi Nishikawa, Takayoshi Ohji, Yoshikazu Suita, Koichi Masubuchi

    Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society Vol. 20 No. 1 p. 47-52 2002 Research paper (scientific journal)

    Publisher: Japan Welding Society
  489. Characteristics of HCA as a heat source under low pressure condition

    Hiroshi Nishikawa, Kazuhiro Yoshida, Toshikazu Maruyama, Takayoshi Ohji e

    T. IEE Japan Vol. 122 No. 1 p. 79-86 2002/01 Research paper (scientific journal)

  490. Characteristics of Hollow Cathode Arc as a Welding Heat Source -Penetration Mechanism by HCA method-

    Hiroshi Nishikawa, Toshikazu Maruyama, Kazuhiro Yoshida, Takayoshi Ohji, Yoshikazu Suita(Takamatsu National College of Technology, Koichi Masubuchi(Massachusetts, Institute of Technology

    2001/11 Research paper (other academic)

  491. Characteristics of Hollow Cathode Arc as a welding heat source -Ignition process and melting property-

    H.Nishikawa, K.Yoshida, T.Maruyama, T.Ohji, Y.Suita(Takamatsu National College of Technology, K.Masubuchi(Massachusetts, Institute of Technology

    2001/05 Research paper (other academic)

  492. Welding in Space --- New Frontier

    Hiroshi Nishikawa, Takayoshi Ohji

    2001/01

  493. Gas hollow tungsten are characteristics under simulated space environment

    H Nishikawa, K Yoshida, T Maruyama, T Ohji, Y Suita, K Masubuchi

    SCIENCE AND TECHNOLOGY OF WELDING AND JOINING Vol. 6 No. 1 p. 12-16 2001 Research paper (scientific journal)

  494. Gas Hollow Tungsten Arc Characteristics Under Simulated Spce Environment

    Hiroshi Nishikawa, Kazuhiro Yoshida, Toshikazu Maruyama, Takayoshi Ohji, Yoshikazu Suita, Takamatsu National, College of Technology, Koichi Masubuchi, Massachusetts Institute of Technology

    2000/07 Research paper (other academic)

  495. Characteristics of HCA as a heat source under low pressure condition

    Hiroshi Nishikawa, Kazuhiro Yoshida, Toshikazu Maruyama, Takayoshi Ohji, Yoshikazu Suita, Takamatsu National, College of Technology, Koichi Masubuchi(Massachusetts, Institute of Technology

    Vol. 122 No. 1 p. 79-86 2000/06 Research paper (other academic)

  496. Hollow Electrode GHTA Experiments under Simulated Space Environments in a Flying Laboratory

    Koichi Masubuchi(Massachusetts, Institute of Technology, Yoshikazu Suita, Takamatsu National, College of Technology, Noboru Terajima, Takamatsu National, College of Technology, Yoshiyuki Tsukuda, Takamatsu National College of Technology, Teppei Kohno, Takamatsu National, College of Technology, Takayoshi Ohji, Hiroshi Nishikawa

    2000/05 Research paper (other academic)

  497. Fundamental characteristics of GHTA under low pressure

    Hiroshi Nishikawa, Kazuhiro Yoshida, Takayoshi Ohji, Yoshikazu Suita, Yoshiyuki Tsukuda, Noboru Terajima, Takashi Hatta, Tettpei Kohno, Kenji Kawata, Rikiya Inokuma, Koichi Masubuchi

    Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society Vol. 18 No. 2 p. 272-279 2000 Research paper (scientific journal)

    Publisher: Japan Welding Soc
  498. GHTA welding experiments under simulated space environment in flying laboratory

    Yoshikazu Suita, Yoshiyuki Tsukuda, Noboru Terajima, Takashi Hatta, Teppei Kohno, Rikiya Inokuma, Kenji Kawata, Takayoshi Ohji, Hiroshi Nishikawa, Kazuhiro Yoshida, Koichi Masubuchi

    Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society Vol. 18 No. 2 p. 228-235 2000 Research paper (scientific journal)

    Publisher: Japan Welding Soc
  499. GHTA Welding Experiments under Simulated Space Environment by Parabolic Flight

    Yoshikazu Suita, Takamatsu National, College of Technology, Noboru Terajima, Takamatsu National, College of Technology, Yoshiyuki Tsukuda, Takamatsu National College of Technology, Teppei Kohno, Takamatsu National, College of Technology, Rikiya Inokuma, Takamatsu National, College of Technology, Takashi Hatta, Takamatsu National, College of Technology, Kenji Kawada, Takamatsu National, College of Technology, Takayoshi Ohji, Hiroshi Nishikawa, Kazuhiro Yoshida, Koichi Masubuchi, Massachusetts Institute of Technology

    2000/01 Research paper (other academic)

  500. Model Analysis of Circumferential GTA Welding of Pipes

    Fumikazu Miyasaka, Tomoyuki Yokogawa, Takeshi Masutani, Hiroshi Nishikawa, Takayoshi Ohji, Yoshinori Hirata

    Vol. 16 No. 4 p. 471-478 1998/11 Research paper (scientific journal)

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    TMS2025 154th Annual Meeting & Exhibition, Las Vegas 2025/03/23 Research paper, summary (international conference)

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    International conference and Exhibition High Temperature Electronics Network (HiTEN2024), Edinburgh 2024/07 Research paper, summary (international conference)

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    TMS2024 Annual Meeting & Exhibition, 2024/03 Research paper, summary (international conference)

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    The Advanced Materials Research Grand Meeting (MRM2023/IUMRS-ICA2023), Kyoto, Japan 2023/12 Research paper, summary (international conference)

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    Hiroaki Tatsumi, Hiroshi Nishikawa

    The 5th International Conference on Nanojoining and Microjoining (NMJ 2023), Leipzig, Germany 2023/11 Research paper, summary (international conference)

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    中脇 啓貴, 巽 裕章, Chih-han Yang, Shih-kang Lin, 西川 宏

    2023年度 スマートプロセス学会 学術講演会, 大阪大学 中之島センター 2023/11 Research paper, summary (national, other academic conference)

  9. Synthesis of macroporous microspheres through a thermal decomposition in water vapor and its application to nanoparticle collection

    Takahiro Kozawa, Hiroaki Tatsumi, Hiroshi Nishikawa

    The 3rd International Symposium on Design & Engineering by Joint Inverse Innovation for Materials Architecture (DEJI2MA-3), Tokyo 2023/10 Research paper, summary (international conference)

  10. 異種材料接合部の界面理解に向けた密度汎関数理論計算

    巽 裕章、新田 隼也、伊藤 篤史、高山 有道、西川 宏

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  11. Effect of bonding condition on joint strength using Sn-coated Cu particles for high-temperature applications

    Hiroshi Nishikawa, Xiangdong Liu, Sijie Huang

    The 76th IIW Annual Assembly, Singapore 2023/07 Research paper, summary (international conference)

  12. Effect of Cu Addition on Mechanical Properties of In-Sn Alloy Before and After Isothermal Aging

    Hiroshi Nishikawa, Han Le Duy, Hiroaki Tatsumi

    TMS2023 152nd Annual Meeting Exhibition, San Diego 2023/03 Research paper, summary (international conference)

  13. Thermal and Mechanical Evaluation of Anisotropic Cu-Solder Composite Joint on High Temperature Storage

    Hiroaki Tatsumi, Hiroshi Nishikawa

    TMS2023 152nd Annual Meeting Exhibition, San Diego 2023/03 Research paper, summary (international conference)

  14. Comparative Study of Sn-based Solder Wettability and Interfacial Reactions on Aluminum Substrate

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    Visual-JW 2022, 大阪 2022/11 Research paper, summary (international conference)

  15. 表面改質したZrO2ナノ粒子を添加したSn-In共晶はんだの機械的特性と接合強度

    新田 隼也、巽 裕章、西川 宏

    2022年度 スマートプロセス学会 学術講演会, 大阪 2022/11 Research paper, summary (national, other academic conference)

  16. マイクロサイズ銀粒子ペーストへのセラミック粒子添加による接合部の耐熱性向上

    淀 将悟、巽 裕章、西川 宏

    第31回 2022JIEPワークショップ, 川崎 2022/10 Research paper, summary (national, other academic conference)

  17. 100℃での銀ナノペースト焼結体のエレクトマイグレーション現象評価

    黒田 裕志, 巽 裕章, 西川 宏

    実装フェスタ関西2022, 大阪 2022/07 Research paper, summary (national, other academic conference)

  18. Sn Steaming Phenomenon during Fluxless Soldering under a Formic Acid Atmosphere

    Siliang He, Runhua Gao, Jiahui Li, Sijie HUANG, Hiroshi Nishikawa

    Visual-JW 2019 & WSE 2019, Osaka, Japan 2019/11 Research paper, summary (international conference)

  19. Influence of Thermomigration on Microstructure and Properties of Cu/Sn-58Bi/Cu Solder Joint

    Yu-An Shen, Shiqi Zhou, Jiahui Li, Hiroshi Nishikawa

    Visual-JW 2019 & WSE 2019, Osaka, Japan 2019/11 Research paper, summary (international conference)

  20. Ductile Damage Criterion for Sn-Ag-Cu Solder Failure Prediction Using Finite Element Method

    Mai MORISHITA, Kunio NARASAKI, Ninshu MA, Hiroshi NISHIKAWA

    Visual-JW 2019 & WSE 2019, Osaka, Japan 2019/11 Research paper, summary (international conference)

  21. Effect of Ni into solder on void formation at the interface

    Hiroshi Nishikawa, Ryo Matsunobu

    4th International Conference on Nanojoining and Microjoining 2018, Nara, Japan 2018/12 Research paper, summary (international conference)

  22. Shear properties of In-Bi alloy joints with Cu substrates during thermal aging

    Sanghun Jin, Min-Su Kim, Shutetsu Kanayama, Hiroshi Nishikawa

    29TH EUROPEAN SYMPOSIUM ON RELIABILITY OF ELECTRON DEVICES, FAILURE PHYSICS AND ANALYSIS, Aalborg, Denmark 2018/10 Research paper, summary (international conference)

  23. Long-term reliability of joint using Ag nanoporous sheet without solvent

    Hiroshi Nishikawa, Min-Su Kim

    The 71st IIW ANNUAL ASSEMBLY & INTERNATIONAL CONFERENCE, Bali, Indonesia 2018/07 Research paper, summary (international conference)

  24. Fabrication of Cu Nano-porous Structure by Dealloying of Cu-Mg Alloy and its Application for Bonding

    Vol. 27 p. 181-184 2017/08/29

    Publisher: エレクトロニクス実装学会
  25. The effect of minor Ni addition on impact strength of Sn-Ag-Cu solder joint in laser soldering

    Vol. 27 p. 211-214 2017/08/29

    Publisher: エレクトロニクス実装学会
  26. IMC Formation and Suppression at the Interface of High Pb Containing Solder/Cu Frame

    Vol. 27 p. 85-88 2017/08/29

    Publisher: エレクトロニクス実装学会
  27. Bonding process using a nanoporous gold sheet for high temperature electronics

    Hiroshi Nishikawa, Kaori Matsunaga, Min-su Kim, Mikiko Saito, Jun Mizuno

    International Symposium on Micro-Nano Sience and Technology 2016, Tokyo, Japan 2016/12 Research paper, summary (international conference)

  28. TEM investigation on the oxidation behavior of electroless Ni/immersion Au surface finish at 250℃

    Min-Su Kim, Hiroshi Nishikawa

    International Conference on Electronic Materials and Nanotechnology for Green Environment (ENGE2016), Jeju, Korea 2016/11 Research paper, summary (international conference)

  29. Fracture behavior of low-pressure assisted Cu to Cu joint using micro-sized Ag particle paste for Power device packaging

    Myong-Hoon Roh, Hiroshi Nishikawa, Seiichiro Tsutsumi, Naruhiko Nishiwaki, Keiichi Ito, Koji Ishikawa, Akihiro Katsuya, Nobuo Kamada, and Matsuo Saito

    The 15th International Symposium on Microelectronics and Packaging (ISMP2016), Seoul, Korea 2016/10 Research paper, summary (international conference)

  30. Effect of Aging Time on the Formation of IMC Layer as well as Voids in the Sn-Ag-Cu-Ni/Cu Substrate Interface in Laser Soldering

    Ryo Matsunobu, Hiroshi Nishikawa

    The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2016), Osaka, Japan 2016/10 Research paper, summary (international conference)

  31. Effect of Thermal Aging on the Impact Strength of Soldered Bumps under Formic Acid Atmosphere

    Siliang He, Hiroshi Nishikawa

    The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2016), Osaka, Japan 2016/10 Research paper, summary (international conference)

  32. Effect of Solder Paste Addition on Shear Strength using Micro-sized Silver Particle Paste without Pressure for Power Device Packaging

    Myong-Hoon Roh, Min-su KIM, Hiroshi Nishikawa

    The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2016), Osaka, Japan 2016/10 Research paper, summary (international conference)

  33. Microstructural Characteristics of Al-Ag Precursor for Fabricating Nanoporous Ag and its Dealloying Behavior in HCl Solution

    Min-su KIM, Hiroshi Nishikawa

    The 1st International Symposium on Creation of Life Innovation Materials for Interdisciplinary and International Researcher Development (iLIM-1), Osaka, Japan 2016/10 Research paper, summary (international conference)

  34. Low-Pressure and Low-Temperature Bonding using Micro-Sized Ag Paste for Power Electronic Devices

    Myong-Hoon Roh, Hiroshi Nishikawa, Seiichiro Tsutsumi, Naruhiho Nishiwaki, Keiichi Ito, Koji Ishikawa, Akihiro Katsuya, Nobuo Kamada, Mutsuo Saito

    3rd International Conference on Nanojoining and Microjoining (NMJ 2016), Ontario, Canada 2016/09 Research paper, summary (international conference)

  35. Intermetallic compound formation at the interface between Sn-Bi solder and Cu by laser soldering

    Hiroshi Nishikawa, Shinya Kubota

    3rd International Conference on Nanojoining and Microjoining (NMJ 2016), Ontario, Canada 2016/09 Research paper, summary (international conference)

  36. High temperature die attach without organic materials using Ag nanoporous material

    Min-Su Kim, Hiroshi Nishikawa

    The 21th International High Technologies Enviroment Safety & Health (IHTESH2016), Kobe, Japan 2016/05 Research paper, summary (international conference)

  37. The effect of heating conditons on voids formation during soldering using formic acid atmosphere

    He Siliang, Nishikawa Hiroshi

    Preprints of the National Meeting of JWS Vol. 2016 p. 158-159 2016/04 Research paper, summary (national, other academic conference)

    Publisher: JAPAN WELDING SOCIETY
  38. Reliability of Die Attach Using Ag Nanoporous Sheet for High Temperature Electronics

    Min-Su Kim, Hiroshi Nishikawa

    TMS2016, Nashville, USA 2016/02 Research paper, summary (international conference)

  39. Interfacial Reaction between Sn-Ag-Cu-Mg Solder and ENIG Substrate

    Hiroshi Nishikawa, Abdulaziz N. Alhazaa, Siliang He, Abdulhakim A. Almajid, Mahmoud S. Soliman

    2nd International Conference on the Science & Engineering of Materials(ICoSEM2015), Kuala Lumpur, Malaysia 2015/11 Research paper, summary (international conference)

  40. はんだ濡れ性および界面反応におけるギ酸雰囲気の影響

    何 思亮, 西川 宏, 菊池 大地, 上島 稔

    (一社)溶接学会 平成27年度秋季全国大会, 札幌 2015/09 Research paper, summary (national, other academic conference)

  41. Microstructural analysis of Cu particulate reinforced Sn-Bi solder

    Omid Mokhtari, Hiroshi Nishikawa

    The 5th International Conference on the Characterization and Control of Interfaces for High Quality Advanced Materials and the 51st Summer Symposium on Powder Technology(ICCCI2015), Kurashiki, Japan 2015/07 Research paper, summary (international conference)

  42. Properties of Nanoporous Structures Obtained by Electrodeposition and Dealloying for Low-Temperature Bonding

    Mikiko Saito, Kaori Matsunaga, Jun Mizuno, Hiroshi Nishikawa

    The 6th International Symposium on Advanced Materials Development and Integration of Novel Structured Metallic and Inorganic Materials(AMDI-6), Tokyo, Japan 2015/06 Research paper, summary (international conference)

  43. Microstructure of Cu-to-Cu joint using nanoporous bonding

    Kaori Matsunaga, Min-Su Kim, Hiroshi Nishikawa, Mikiko Saito, Jun Mizuno

    The 6th International Symposium on Advanced Materials Development and Integration of Novel Structured Metallic and Inorganic Materials(AMDI-6), Tokyo, Japan 2015/06 Research paper, summary (international conference)

  44. Impact Strength of Sn-Bi/Cu Joints Soldered by Laser Process

    Hiroshi Nishikawa, Shinya Kubota

    TMS 2015, Orland, USA 2015/03 Research paper, summary (international conference)

  45. 電析法と選択溶解法を用いたナノポーラス構造制御

    齋藤 美紀子, 水野 潤, 西川 宏

    第5回6大学6研究所連携プロジェクト公開討論会, 東京 2015/03 Research paper, summary (national, other academic conference)

  46. 高鉛含有はんだ代替高温接合材料とその接合プロセスの開発

    西川 宏, 齋藤 美紀子, 水野 潤

    第5回6大学6研究所連携プロジェクト公開討論会, 東京 2015/03 Research paper, summary (national, other academic conference)

  47. Improvement of impact reliability of solder bumps using laser process

    H. Nishikawa, N. Iwata

    2nd International Conference on Nanojoining and Microjoining (NMJ 2014), Emmetten, Switzerland 2014/12 Research paper, summary (international conference)

  48. Microstructure, Thermal, and Phase Analysis of Sn-Bi Solder with 30 Mass %Cu Particle Additions

    Omid Mokhtari, Hiroshi Nishikawa

    The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation, in conjunction with Symposium on the Research Activities of Joint Usage / Research Center on Joining and Welding (Visual-JW 2014), Osaka, Japan 2014/11 Research paper, summary (international conference)

  49. Interfacial Reaction and Joint Strength of Ag Nanoporous Bonding with Electroless Nickel/Immersion Gold Substrate

    Min-Su Kim, Hiroshi Nishikawa

    The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation, in conjunction with Symposium on the Research Activities of Joint Usage / Research Center on Joining and Welding (Visual-JW 2014), Osaka, Japan 2014/11 Research paper, summary (international conference)

  50. Effect of Metal Filler Content on Ionic Migration Property of Ag-Filled Electrically Conductive Adhesives

    Hiroshi Nishikawa, Kunio Ueda

    The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation, in conjunction with Symposium on the Research Activities of Joint Usage / Research Center on Joining and Welding (Visual-JW 2014), Osaka, Japan 2014/11 Research paper, summary (international conference)

  51. Bonding Process using Mixed Ag Particle Paste for High Temperature Application

    Hiroshi Nishikawa, Keiichi Niwa

    The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation, in conjunction with Symposium on the Research Activities of Joint Usage / Research Center on Joining and Welding (Visual-JW 2014), Osaka, Japan 2014/11 Research paper, summary (international conference)

  52. Nano-porous Structure Control under Electrodeposition and Dealloying Conditions

    M. Saito, K. Matsunaga, J. Mizuno, H. Nishikawa

    The 5th International Symposium on Advanced Materials Development and Integration of Novel Structured Metallic and Inorganic Materials (AMDI-5) Conjunction with 6th IBB Frontier Symposium, Tokyo, Japan 2014/11 Research paper, summary (international conference)

  53. Shear strength of Cu/Cu joints using Au nanoporous sheet for high-temperature application

    Kaori Matsunaga, Min-Su Kim, Hiroshi Nishikawa, Mikiko Saito, Jun Mizuno

    The 5th International Symposium on Advanced Materials Development and Integration of Novel Structured Metallic and Inorganic Materials (AMDI-5) Conjunction with 6th IBB Frontier Symposium, Tokyo, Japan 2014/11 Research paper, summary (international conference)

  54. Bonding Process Using Metallic Particle Paste for Electronic Component Assembly

    Hiroshi Nishikawa, Xianfan WANG

    International Symposium of Globalization in Joining Technology and Materials Science Collaboration Networking in Asia, Bangkok, Thailand 2014/11 Research paper, summary (international conference)

  55. Effect of dealloying time on the ligament size and microstructure of Ag nanoporous structure

    Min-Su Kim, Hiroshi Nishikawa

    International Union of Materials Research Societies-The IUMRS International Conference in Asia 2014(IUMRS-ICA 2014), Fukuoka, Japan 2014/08 Research paper, summary (international conference)

  56. The effect of Cu particle additons on the microstructure and melting point of Sn-Bi solder for die attachment

    Omid Mokhtari, Hiroshi Nishikawa

    4th International IEEE Workshop on Low Temperature Bonding for 3D Integration(LTB-3D 2014), Tokyo, Japan 2014/07 Research paper, summary (international conference)

  57. Low-Temperature Bonding Using Selective Formation of Nanoporous Powders for Bump Interconnects

    Jun Mizuno, Hayata Mimatsu, Takashi Kasahara, Mikiko Saito, Shuichi Shoji, Hiroshi Nishikawa

    International Union of Materials Research Societies-International Conference on Electronic Materials 2014(IUMRS-ICEM2014), Taipei, Taiwan 2014/06 Research paper, summary (international conference)

  58. Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects

    Hayata Mimatsu, Jun Mizuno, Takashi Kasahara, Mikiko Saito, Shuichi Shoji, Hiroshi Nishikawa

    Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) p. 1131-1134 2014 Research paper, summary (international conference)

    Publisher: Institute of Electrical and Electronics Engineers Inc.
  59. Low temperature and low pressure bump bonding realized by single-micrometer Ag-nanoparticle bumps

    Weixin Fu, Takashi Kasahara, Akiko Okada, Shuichi Shoji, Akitsu Shigetou, Jun Mizuno

    Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 2014 Research paper, summary (international conference)

    Publisher: IEEE Computer Society
  60. Microstructural change of Ag nanoporous bonding joint and interdiffusion of Cu/Ag during thermal aging

    Min-Su Kim, Hiroshi Nishikawa

    Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 2014 Research paper, summary (international conference)

    Publisher: IEEE Computer Society
  61. Effect of nanoparticle addition on bonding process using micro-sized particle paste

    Hiroshi Nishikawa, Keiichi Niwa

    66th IIW Annual Assembly, Essen, Germany 2013/09 Research paper, summary (international conference)

  62. 銀―エポキシ系導電性接着剤の熱伝導性向上に関する検討

    小島 慎也, 西川 宏

    (一社)溶接学会 平成25年度秋季全国大会, 岡山 2013/09 Research paper, summary (national, other academic conference)

  63. Surface Modification of Cu-based Bulk Metallic Glass by Electroplating Method

    Hiroshi Nishikawa, Takehiro Naoi, Mikiko Saito, Jun Mizuno, Mikio Fukuhara

    The 8th Pacific Rim International Congress on Advanced Materials and Processing, Hawaii, USA 2013/08 Research paper, summary (international conference)

  64. Impact Strength of Joints Soldered by Laser Process

    Hiroshi Nishikawa

    JWRI-KMUTNB workshop 2013, Osaka, Japan 2013/05 Research paper, summary (international conference)

  65. レーザはんだ付したはんだバンプ衝撃強度に及ぼす微細化の影響

    宇治野 真, 西川 宏

    (一社)スマートプロセス学会平成25年春季総合学術講演会, 大阪 2013/05 Research paper, summary (national, other academic conference)

  66. 導電性接着剤の熱伝導性に及ぼす金属フィラー形状および含有量の影響

    小島 慎也, 西川 宏

    (一社)スマートプロセス学会平成25年春季総合学術講演会, 大阪 2013/05 Research paper, summary (national, other academic conference)

  67. 銅ハイブリットペーストによる高強度接合

    山川 智弘, 竹本 正, 下田 将義, 西川 宏, 塩川 国夫, 中谷 誠登, 後藤 英之

    第27回エレクトロニクス実装学会春季講演大会, 宮城 2013/03 Research paper, summary (national, other academic conference)

  68. Bi-Ag系高温鉛フリーはんだへの元素添加による延性改善

    下田 将義, 山川 智弘, 塩川 国夫, 西川 宏, 竹本 正

    第27回エレクトロニクス実装学会春季講演大会, 宮城 2013/03 Research paper, summary (national, other academic conference)

  69. Evaluation of impact property of low-melting-point solder joints on Cu pad

    Hiroshi Nishikawa, Terumasa Yamamoto

    142nd Annual Meeting &Exhibition (TMS2013), San Antonio, USA 2013/03 Research paper, summary (international conference)

  70. 銅ナノペーストの低温焼結性に及ぼすプロセス条件の影響

    山川 智弘, 下田 将義, 竹本 正, 西川 宏, 塩川 国夫, 後藤 英之

    (一社)スマートプロセス学会先進プロセス研究集会, 大阪 2013/02 Research paper, summary (national, other academic conference)

  71. リフロー加熱とレーザ加熱でのはんだ接合部界面の衝撃強度比較

    窪田 慎也、西川 宏

    (一社)スマートプロセス学会H24度秋季学術総合講演会, 大阪 2012/11 Research paper, summary (national, other academic conference)

  72. Properties of Polyurethane Based Electrically Conductive Adhesive Prepared with Different Tertiary Amines

    L-N. Ho, H. Nishikawa

    The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2012), Osaka, Japan 2012/11 Research paper, summary (international conference)

  73. Effect of Cu particle addition on the microstructure of Sn-Bi solder alloy

    M. Omid, H. Nishikawa

    The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2012), Osaka, Japan 2012/11 Research paper, summary (international conference)

  74. Effect of Cu Pad on Fracture Behavior of BGA Joints in Impact Test

    J. Wang, H. Nishikawa, M. Omid

    The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2012), Osaka, Japan 2012/11 Research paper, summary (international conference)

  75. Copper Nanoparticle Paste for High-Temperature Applications

    Hiroshi Nishikawa, Tomoaki Hirano, Tadashi Takemoto

    2nd Japanese-Sino Workshop on Welding Thermo-Physics, Osaka, Japan 2012/11 Research paper, summary (international conference)

  76. Effect of Surface Conditions on Wetting Behavior of Sn-3.0Ag-0.5Cu solder on Cu-based Bulk Metallic Glass

    H. Nishikawa, T. Naoi, M. Saito, J. Mizuno, and M. Fukuhara

    Advanced Materials Development and Integration of Novel Structural Metallic and Inorganic Materials (AMDI-3), Toyohashi, Japan 2012/11 Research paper, summary (international conference)

  77. Copper Filled Electrically Conductive Adhesives

    Li-Ngee Ho, Hiroshi Nishikawa

    JWRI-UM Seminar 2012, Osaka, Japan 2012/11 Research paper, summary (international conference)

  78. 産業用電子機器の高信頼性接合に向けた接合プロセスの開発

    下田 将義, 山川 智弘, 塩川 国夫, 西川 宏, 竹本 正

    第101回マイクロ接合研究委員会, 大阪 2012/09 Research paper, summary (national, other academic conference)

  79. レーザプロセスを用いたSn-Bi共晶はんだ接合部の衝撃強度評価

    窪田 慎也、西川 宏

    (一社)溶接学会平成24年度秋季全国大会, 奈良 2012/09 Research paper, summary (national, other academic conference)

  80. Rheological, Electrical and Mechanical Properties of Ag Filled Electrically Conductive Adhesive

    Li-Ngee. Ho, Teng-Fei. Wu, Hiroshi Nishikawa

    The Fourth International Conference on the Characterization and Control of Interfaces for High Quality Advanced Materials (ICCCI 2012), Kurashiki, Japan 2012/09 Research paper, summary (international conference)

  81. Effects of minor alloying additive on the microstructure of the interface between Sn-58Bi solder and Cu substrate

    M. Omid, H. Nishikawa

    The Fourth International Conference on the Characterization and Control of Interfaces for High Quality Advanced Materials (ICCCI 2012), Kurashiki, Japan 2012/09 Research paper, summary (international conference)

  82. Effect of joining atmosphere on joining process using Cu nanoparticle paste

    Hiroshi Nishikawa, Tomoaki Hirano, Tadashi Takemoto, Nobuhito Terada

    65th Annual Assembly of Int. Inst. Welding (IIW), Denver, USA 2012/07 Research paper, summary (international conference)

  83. 銅ナノ粒子ペースト低温接合と継手の信頼性評価

    山川 智弘, 下田 将義, 西川 宏, 竹本 正, 塩川 国夫, 久永 聡, 寺田 信人

    第26回エレクトロニクス実装学会春季講演大会, 東京 2012/03 Research paper, summary (national, other academic conference)

  84. Bi-Ag系高温鉛フリーはんだの延性改善

    下田 将義, 山川 智弘, 塩川 国夫, 西川 宏, 竹本 正

    第26回エレクトロニクス実装学会春季講演大会, 東京 2012/03 Research paper, summary (national, other academic conference)

  85. 銅ナノペーストを用いた銅の低温接合プロセスの検討

    山川 智弘, 下田 将義, 西川 宏, 竹本 正, 塩川 国夫, 寺田 信人

    銅及び銅合金技術研究会 第51回講演大会, 京都 2011/11 Research paper, summary (national, other academic conference)

  86. Bi-Ag合金の銅とのぬれ及び継手の機械的特性

    下田 将義, 山川 智弘, 塩川 国夫, 西川 宏, 竹本 正

    銅及び銅合金技術研究会 第51回講演大会, 京都 2011/11 Research paper, summary (national, other academic conference)

  87. Cuナノ粒子の接合性に及ぼす接合温度の影響

    山川 智弘, 下田 将義, 西川 宏, 竹本 正, 塩川 国夫, 寺田 信人, 久永 聡

    (社)日本金属学会 2011年秋期大会, 沖縄 2011/11 Research paper, summary (national, other academic conference)

  88. Bi-Ag系高温鉛フリーはんだの機械的特性

    下田 将義, 山川 智弘, 塩川 国夫, 西川 宏, 竹本 正

    (社)日本金属学会 2011年秋期大会, 沖縄 2011/11 Research paper, summary (national, other academic conference)

  89. Cuナノ粒子継手の接合強度に及ぼす銀ナノ粒子添加の影響

    魏 立順, 西川 宏, 寺田 信人

    (社)日本金属学会 2011年秋期大会, 沖縄 2011/11 Research paper, summary (national, other academic conference)

  90. 低融点はんだ/Cu継手の耐落下衝撃性評価

    山本 晃将, 西川 宏

    (社)日本金属学会 2011年秋期大会, 沖縄 2011/11 Research paper, summary (national, other academic conference)

  91. Cu粒子含有導電性接着剤の各種環境下における信頼性評価

    南 歩, 西川 宏, 竹本 正, 三宅 行一, 山内 真一

    銅及び銅合金技術研究会 第51回講演大会, 京都 2011/11 Research paper, summary (national, other academic conference)

  92. Effect of hardness of solder matrix on impact property of solder joints

    T. Yamamoto, H. Nishikawa

    International Symposium on Materials Science and Innovation for Sustainable Society (ECO-MATES 2011), Osaka, Japan 2011/11 Research paper, summary (international conference)

  93. Effect of sintering behavior of Ag nanoparticles on Cu-to-Cu joint strength

    Hiroshi Nishikawa, Keiichi Niwa, Tadashi Takemoto, Nobuhito Terada

    The 64th IIW Annual Assembly & International Conference, Chennai, India 2011/07 Research paper, summary (international conference)

  94. Wetting Behavior of Lead-free Solder on Cu60Zr30Ti10 Bulk Metallic Glasses Treated by Dealloying and Electroplating Method

    T. Naoi, H. Nishikawa, M. Fukuhara, A. Inoue

    Joint Conference of The Fifth International Conference on the Science and Technology for Advanced Ceramics (STAC5) and The 2nd International Conference on Advanced Materials Development and Integration of Novel Structured Metallic and Inorganic Materials, Yokohama, Japan 2011/06 Research paper, summary (international conference)

  95. Intermetallic Compound Formation and Growth at the lead-free solder/Cu interface during laser reflow soldering and during isothermal aging

    Hiroshi Nishikawa, Noriya Iwata, Tadashi Takemoto

    141st Annual Meeting & Exhibition (TMS 2012), Florida, USA 2011/03 Research paper, summary (international conference)

  96. Bi-Ag系高温鉛フリーはんだの基礎実装特性

    下田 将義, 山川 智弘, 塩川 国夫, 西川 宏, 竹本 正

    第25回エレクトロニクス実装学会春季講演大会, 横浜 2011/03 Research paper, summary (national, other academic conference)

  97. 銅ナノ粒子ペーストの真空焼結性に及ぼす予熱条件の影響

    山川 智弘, 下田 将義, 西川 宏, 塩川 国夫, 上田 雅行, 阿部 真太郎, 竹本 正

    第25回エレクトロニクス実装学会春季講演大会, 横浜 2011/03 Research paper, summary (national, other academic conference)

  98. Preparation and Characterization of TiN/TiO2 Nanostructured Multilayers by Plasma Ion Sputtering for Bio Implant Applications

    B. Subramanian, A. Kobayashi, H. Nishikawa, M. Takahashi, R. Ananthakumar, M. Jayachandran

    18th Annual Meeting of IAPS International Workshop 2011in Melbourne, Melbourne, Australia 2011/03 Research paper, summary (international conference)

  99. Erosion behavior of stainless steels in molten lead-free solder

    H. Nishikawa, S. Kang, T. Takemoto

    TMS 2011 140th Annual Meeting & Exhibition, San Diego, USA 2011/02 Research paper, summary (international conference)

  100. Enhancement of solderability of Cu60Zr30Ti10 bulk metallic glass by dealloying in hydrofluoric acid solution

    Takehiro Naoi, Hiroshi Nishikawa, Tadashi Takemoto, Hiroya Abe, Mikio Fukuhra, Akihisa Inoue

    Visual-JW2010, Osaka, Japan 2010/11 Research paper, summary (international conference)

  101. Interfacial reaction between Sn-3.0Ag-0.5Cu solder/Co-P plating and Ni-Co-P plating

    Tomoya Daito, Hiroshi Nishikawa, Tadashi Takemoto, Takashi Matsunami

    Visual-JW2010, Osaka, Japan 2010/11 Research paper, summary (international conference)

  102. Solderability of Cu60Zr30Ti10 Metallic Glass Using Surface Treatment

    H. Nishikawa, T. Naoi, H. Abe, T. Takemoto, M. Fukuhara, A. Inoue

    Materials Science & Technology 2010 Conference and Exhibition, Houston, USA 2010/10 Research paper, summary (international conference)

  103. 有機被覆銀ナノ粒子を用いた無加圧接合プロセスの検討

    長岡 亨, 森貞 好昭, 福角 真男, 柏木 行康, 山本 真理, 中許 昌美, 西川 宏

    (社)日本金属学会 2010年秋期大会, 札幌 2010/09 Research paper, summary (national, other academic conference)

  104. Cuフィラー導電性接着剤の長期安定性向上

    南 歩, 西川 宏, 竹本 正, 三宅 行一, 山内 真一

    (社)日本金属学会 2010年秋期大会, 札幌 2010/09 Research paper, summary (national, other academic conference)

  105. Cu60Zr30Ti10の鉛フリーはんだ付

    直井 健浩, 西川 宏, 竹本 正, 阿部 浩也, 福原 幹夫, 井上 明久

    (社)日本金属学会 2010年秋期大会, 札幌 2010/09 Research paper, summary (national, other academic conference)

  106. Cuナノ粒子ペーストの接合性に及ぼすプロセス条件の影響

    平野 智章, 西川 宏, 竹本 正, 寺田 信人

    第23回エレクトロニクス実装学会春季講演大会, 横浜 2010/03 Research paper, summary (national, other academic conference)

  107. Interfacial Reaction between Sn-Ag-Cu Solder and Cu Base Metal Using Laser Soldering Process

    H. Nishikawa, N. Iwata, T. Takemoto

    2010 TMS Annual Meeting & Exhibition, Seattle, USA 2010/02 Research paper, summary (international conference)

  108. 鉛フリーはんだバンプの耐衝撃特性に及ぼす基板表面めっきの影響

    大藤 友也, 西川 宏, 竹本 正, 松浪 卓史

    (社)高温学会 平成21年度秋季総合学術講演会, 大阪 2009/12 Research paper, summary (national, other academic conference)

  109. レーザはんだ付部の耐衝撃性評価

    岩田 典也, 西川 宏, 竹本 正

    (社)高温学会 平成21年度秋季総合学術講演会, 大阪 2009/12 Research paper, summary (national, other academic conference)

  110. 銀フィラーエポキシ樹脂導電性接着剤のレーザ照射硬化特性

    栗野 修, 西川 宏, 竹本 正

    (社)高温学会 平成21年度秋季総合学術講演会, 大阪 2009/12 Research paper, summary (national, other academic conference)

  111. Characteristics of electrically conductive adhesives filled with silver-coated copper

    H. Nishikawa, N. Terada, K.Miyake, A. Aoki, T. takemoto

    The 5th KWJS-JWS Young Researcher Symposium, Jeju, Korea 2009/11 Research paper, summary (international conference)

  112. Effect of Ultrasonic Conditions on Aluminum Wire Bonding for Bulk Metallic Glasses

    H. Nishikawa, Krit W-P, H. Abe, T. Takemoto, M. Kubo, Y. Sanagawa, T Sakai, M. Fukuhara, A. Inoue

    Materials Science & Technology 2009 Conference & Exhibition, Pittsburgh, USA 2009/10 Research paper, summary (international conference)

  113. Wetting Behavior of Sn3.0Ag0.5Cu Solder on Stainless Steels

    H-Q. Wang, H. Nishikawa, T. Takemoto

    The Third International Conference on the Characterization and Control of Interfaces for High Quality Advanced Materials, and Joining Technology for New Metallic Glasses and Inorganic Materials (ICCCI 2009), Kurashiki, Japan 2009/09 Research paper, summary (international conference)

  114. 鉛フリーはんだ接合界面組織とバンプの耐衝撃性評価

    大藤 友也, 西川 宏, 竹本 正, 松浪 卓史

    (社)日本金属学会 2009年秋期大会, 京都 2009/09 Research paper, summary (national, other academic conference)

  115. 半導体レーザによるAgフィラー導電性接着剤の硬化特性

    栗野 修, 竹本 正, 西川 宏

    (社)溶接学会 平成21年度秋季全国大会, 徳島 2009/09 Research paper, summary (national, other academic conference)

  116. レーザはんだ付鉛フリーはんだバンプの衝撃試験

    岩田 典也, 西川 宏, 竹本 正

    (社)溶接学会 平成21年度秋季全国大会, 徳島 2009/09 Research paper, summary (national, other academic conference)

  117. Low Temperature Bonding of Bulk Metallic Glass Using Ultrasonic Process

    H. Nishikawa, Krit W-P, H. Abe, T. Takemoto, M. Kubo, Y. Sanagawa, T Sakai, M Fukuhara, A. Inoue

    The Third International Conference on the Characterization and Control of Interfaces for High Quality Advanced Materials, and Joining Technology for New Metallic Glasses and Inorganic Materials (ICCCI 2009), Kurashiki, Japan 2009/09 Research paper, summary (international conference)

  118. Dealloying of Cu-Zr-Ti Bulk Metallic Glass

    H. Abe, K. Sato, H. Nishikawa, T. Takemoto, M. Fukuhara, A. Inoue

    The Third International Conference on the Characterization and Control of Interfaces for High Quality Advanced Materials, and Joining Technology for New Metallic Glasses and Inorganic Materials (ICCCI 2009), Kurashiki, Japan 2009/09 Research paper, summary (international conference)

  119. Application of Copper Nanoparticles with Organic Layer as Metallic Fillers in Electrically Conductive Adhesives

    Ho Li Ngee, Nishikawa Hiroshi, Takemoto Tadashi, Kashiwagi Yukiyasu, Yamamoto Mari, Nakamoto Masami

    Proceedings of JIEP Annual Meeting Vol. 23 No. 0 p. 266-267 2009/03/11

    Publisher: 一般社団法人エレクトロニクス実装学会
  120. Measurement Method of Liquidus Temperature of Lead-Free Solder Using Differential Scanning Calorimetry Curves

    H. Nishikawa, Y. Hamada, T. Takemoto

    2009 TMS Annual Meeting & Exhibition, San Francisco, USA 2009/02 Research paper, summary (international conference)

  121. The Electrical Property of Copper and Copper Alloy Particles Containing Electrically Conductive Adhesives

    TAKEMOTO Tadashi, HO Li-Ngee Ho, NISHIKAWA Hiroshi, NATSUME Naohide

    Transactions of JWRI Vol. 37 No. 2 p. 69-73 2008/12

    Publisher: Joining and Welding Research Institute, Osaka University
  122. Solderability of bulk metallic glasses using several lead-free solders

    H. Nishikawa, K. Wongpiromsarn, H. Abe, T. Takemoto, M. Fukuhara, A. Inoue

    The IUMRS International Conference in Asia 2008, Nagoya, Japan 2008/12 Research paper, summary (international conference)

  123. Reduction of Damage of Soldering Iron Tip by Addition of Co, Ni to Sn-Ag-Cu Lead-free Solder

    T. Takemoto, K. Tomitsuka, T. Tooyama, H. Nishikawa

    The 8th International Welding Symposium (8WS), Kyoto, Japan 2008/11 Research paper, summary (international conference)

  124. Measurement of erosion of stainless steel by molten lead-free solder using micro-focus X-ray CT system

    H. Nishikawa, S. Kang, T. Takemoto

    The 8th International Welding Symposium (8WS), Kyoto, Japan 2008/11 Research paper, summary (international conference)

  125. Wetting behavior between lead-free solders and bulk metallic glasses

    H. Nishikawa, W-P Krit, H. Abe, T. Takemoto, M. Fukuhara, T. Wada, A. Inoue

    Materials Science & Technology 2008 Conference and Exhibition, Pittsburgh 2008/10 Research paper, summary (international conference)

  126. Zr, Cu 基金属ガラスのはんだ付の検討

    W-P KRIT、西川 宏、竹本 正、阿部 浩也、福原 幹夫、井上 明久

    (社)日本金属学会 2008年秋期大会, 熊本 2008/09 Research paper, summary (national, other academic conference)

  127. Sn-3.0Ag-0.5Cu はんだ/無電解 Co-P めっき界面の微細組織観察

    大藤 友也、西川 宏、竹本 正、下地 輝明

    (社)日本金属学会 2008年秋期大会, 熊本 2008/09 Research paper, summary (national, other academic conference)

  128. 耐酸化性に優れた銅粒子含有導電性接着剤の検討

    Ho Li Ngee、西川 宏、竹本 正、夏目 直英、三宅 行一、藤田 政和、織田 晃祐

    第18回マイクロエレクトロニクスシンポジウム, 京都 2008/09 Research paper, summary (national, other academic conference)

  129. 448 Electrical property of conductive adhesive using Cu nanoparticles with organic layer

    NISHIKAWA Hiroshi, HO Li Ngee, NATSUME Naohide, TAKEMOTO Tadashi, KASHIWAGI Yukiyasu, YAMAMOTO Mari, NAKAMOTO

    Pre-Prints of the National Meeting of JWS No. 83 p. 408-409 2008/08/20

    Publisher: Japan Welding Society
  130. Electrical property of conductive adhesive using Cu nanoparticles with organic layer

    Nishikawa Hiroshi, Ho Li Ngee, Natsume Naohide, Takemoto Tadashi, Kashiwagi Yukiyasu, Yamamoto Mari, Nakamoto Masami

    Prep.Nat.Meet.JWS Vol. 2008 No. 0 p. 448-448 2008/08/20

    Publisher: 一般社団法人 溶接学会
  131. ステンレス鋼の損傷評価標準試験

    西川 宏, 竹本 正

    (社)電子情報技術産業協会 フロー槽損傷抑制技術標準化研究委員会, 東京 2008/03 Research paper, summary (national, other academic conference)

  132. 鉛フリーはんだとPd基金属ガラスの界面反応

    西川 宏, 阿部 浩也, 竹本 正, 福原 幹夫, 和田 武, 井上 明久

    3大学3研究所連携プロジェクト公開討論会「先進材料・新接合技術とその応用」, 東京 2008/03 Research paper, summary (national, other academic conference)

  133. Pd基金属ガラスと低温材料との反応

    西川 宏, W-P KRIT, 阿部 浩也, 竹本 正, 福原 幹夫, 和田 武, 井上 明久

    日本金属学会春季全国大会, 東京 2008/03 Research paper, summary (national, other academic conference)

  134. ステンレス鋼の損傷評価に関する今後の課題

    西川 宏, 竹本 正

    (社)電子情報技術産業協会 フロー槽損傷抑制技術標準化研究委員会, 東京 2008/02 Research paper, summary (national, other academic conference)

  135. 損傷に及ぼすステンレス鋼種の影響評価

    西川 宏, 竹本 正

    (社)電子情報技術産業協会 フロー槽損傷抑制技術標準化研究委員会, 東京 2008/01 Research paper, summary (national, other academic conference)

  136. Microstructural and mechanical properties of the SAC305 solder alloys modified by the dual addition of Co-Ni

    F-J Cheng, H. Nishikawa, T. Takemoto

    2nd Int. Symp. Smart Process. Tech. (SPT'07), Osaka, Japan 2007/11 Research paper, summary (international conference)

  137. Electrical Conductivity of Conductive Adhesives with low melting point metal

    H. Nishikawa, K. Tsuji, N. Terada, T. Takemoto

    2nd Int. Symp. Smart Process. Tech. (SPT'07), Osaka, Japan 2007/11 Research paper, summary (international conference)

  138. The creep deformation characterization of Sn-3.5Ag lead-free solder by nanoindentation

    F. Gao, H. Nishikawa, T. Takemoto

    2nd Int. Symp. Smart Process. Tech. (SPT'07), Osaka, Japan 2007/11 Research paper, summary (international conference)

  139. Laser Joining of 6061 Aluminum Alloy and Steel using Zn Filler Metal

    T. Takemoto, S. Kimura, Y. Kawahito, H. Nishikawa

    2nd Int. Symp. Smart Process. Tech. (SPT'07), Osaka, Japan 2007/11 Research paper, summary (international conference)

  140. Shear strength and impact strength of Sn-3.5Ag (-Co) solder/Cu joint

    H. Nishikawa, K. Miki, T. Takemoto

    Materials Science & Technology 2007 Conference and Exhibition, Detroit 2007/09 Research paper, summary (international conference)

  141. ステンレス鋼エロージョンの概要と研究の現状

    竹本 正, 西川 宏

    (社)電子情報技術産業協会 フロー槽損傷抑制技術標準化研究委員会, 東京 2007/07 Research paper, summary (national, other academic conference)

  142. Effects of Isothermal Aging on the Microstructure and Tensile Behavior of Sn-3.5Ag-0.5Cu-0.2Co Solder

    H. Nishikawa, K. W. Piromsarn, H. Abe, T. Takemoto, M. Fukuhara, T. Wada, A. Inoue

    Joint Conference of 1st International Conference on Science and Technology for Advanced Ceramics (STAC) and 2nd International Conference on Joining Technology for New Metallic Glasses and Inorganic Materials (JTMC), Kanagawa, Japan 2007/05 Research paper, summary (international conference)

  143. Effects of Isothermal Aging on the Microstructure and Tensile Behavior of Sn-3.5Ag-0.5Cu-0.2Co Solder

    F. Cheng, H. Nishikawa, T. Takemoto

    IWJC-Korea 2007, Korea 2007/05 Research paper, summary (international conference)

  144. Micromechanical responses of Sn-3.5Ag-xCo Lead-free Solders by Nanoindentation

    F. Gao, H. Nishikawa, T. Takemoto

    IWJC-Korea 2007, Korea 2007/05 Research paper, summary (international conference)

  145. Interfacial Reaction of Electroless Ni-P Plating with Sn-3.5Ag(-Co) Solder

    H. Nishikawa, A. Komatsu, T. Takemoto

    IWJC-Korea 2007, Korea 2007/05 Research paper, summary (international conference)

  146. Sn-Ag系鉛フリーはんだバンプの衝撃試験

    三木 康功, 西川 宏, 竹本 正

    (社)溶接学会平成19年度春季全国大会, 東京 2007/04 Research paper, summary (national, other academic conference)

  147. 銀被覆銅フィラー導電性接着剤の電気特性

    三上 紗弥, 西川 宏, 竹本 正, 寺田 信人, 三宅 行一, 青木 晃

    第21回エレクトロニクス実装学会講演大会, 東京 2007/03 Research paper, summary (national, other academic conference)

  148. Sn-Ag-CuはんだへのP添加がステンレス鋼のエロージョンに与える影響

    小林 達彦, 竹本 正, 西川 宏, 高 峰

    第21回エレクトロニクス実装学会講演大会, 東京 2007/03 Research paper, summary (national, other academic conference)

  149. 各種ステンレス鋼表面処理の耐エロージョン試験方法

    西川 宏, 竹本 正

    (社)日本溶接協会 フロー槽エロージョン委員会, 東京 2007/01 Research paper, summary (national, other academic conference)

  150. 様々な表面状態のアルミニウムスクラップへのレーザ分別技術の適用

    瀬尾 浩平, 西川 宏, 片山 聖二, 竹本 正

    軽金属学会関西支部研究発表会, 京都 2007/01 Research paper, summary (national, other academic conference)

  151. Development of Eco-friendly Lead-free Solder by Alloying Methodology

    F. Gao, H. Nishikawa, T. Takemoto

    The 6th Japan/Korea Joint Workshop on Smart Processing Developments for Environment-friendly Advanced Materials, Osaka, Japan 2006/11 Research paper, summary (international conference)

  152. はんだ中の不純物のエロージョンへの影響

    西川 宏, 竹本 正

    (社)日本溶接協会 フロー槽エロージョン委員会, 東京 2006/10 Research paper, summary (national, other academic conference)

  153. Measurement of maximum erosion depth of stainless steel in molten lead-free solder

    NISHIKAWA Hiroshi, KANG Songai, TAKEMOTO Tadashi

    Vol. 79 p. 424-425 2006/09/01

  154. Topology Analysis and Depressing Approach of ε-Cu3Sn Phase at Solder/Cu Interface

    F. Gao, H. Nishikawa, T. Takemoto

    The Second International Conference on the Characterization and Control of Interfaces, Kurashiki 2006/09 Research paper, summary (international conference)

  155. A Treatment Of Carbonaceous Waste Containing Metals By Steam Plasma

    H.Nishikawa, S.Higuchi, M.Tanaka, T.Takemoto

    The Second International Conference on the Characterization and Control of Interfaces, Kurashiki 2006/09 Research paper, summary (international conference)

  156. Microstructure and Tensile Properties of Sn-3.0Ag-0.5Cu Bulk Solders with Minor Element of Co and Ni"

    C. Fangjie, H. Nishikawa, T.Takemoto

    2006/09 Research paper, summary (national, other academic conference)

  157. Morphology Evolution of Ag3Sn Phase at the Sn3.5Ag Based Solder Joints with Common Substrates

    F. Gao, H. Nishikawa, T. Takemoto

    2006/09 Research paper, summary (national, other academic conference)

  158. CTスキャンを用いた鉛フリーはんだによるステンレス鋼エロージョン深さの測定

    康 松愛, 竹本 正, 西川 宏

    溶接学会平成18年度秋期全国大会, 札幌 2006/09 Research paper, summary (national, other academic conference)

  159. Co添加鉛フリーはんだとNiめっき基板の接合強度

    西川 宏, 小松 朗, 竹本 正

    溶接学会平成18年度秋期全国大会, 札幌 2006/09 Research paper, summary (national, other academic conference)

  160. レーザ溶融痕の表面輝度分布測定を利用したアルミニウム合金の分別

    瀬尾 浩平, 西川 宏, 片山 聖二, 竹本 正

    日本金属学会2006年秋期全国大会, 新潟 2006/09 Research paper, summary (national, other academic conference)

  161. Measurements of cathode surface temperature of plasma torch

    Shinichi Tashiro, Hiroshi Nishikawa, Manabu Tanaka

    The Second International Conference on the Characterization and Control of Interfaces for High Quality Advanced Materials, and Joining Technology for New Metallic Glasses and Inorganic Materials (ICCCI 2006),, Kurashiki, Japan 2006/09 Research paper, summary (international conference)

  162. ティグアークにおける陰極作動中タングステン電極の仕事関数の測定(第4報)

    田代 真一, 西川 宏, 田中 学

    (社)溶接学会平成18年度秋季全国大会, 札幌 2006/09 Research paper, summary (national, other academic conference)

  163. 界面反応と金属間化合物へのCo微量添加の影響

    西川 宏, 高 峰, 竹本 正

    溶接学会マイクロ接合研究委員会第41回ソルダリング分科会, 東京 2006/07 Research paper, summary (national, other academic conference)

  164. ステンレス鋼微細組織のエロージョンへの影響

    西川 宏, 康 松愛, 竹本 正

    (社)日本溶接協会 フロー槽エロージョン委員会, 東京 2006/06 Research paper, summary (national, other academic conference)

  165. 微生物利用による廃プリント基板からの貴金属スマート回収プロセス

    北 義人, 岡本 英丈, 西川 宏, 竹本 正

    大阪大学接合科学研究所 産学連携シンポジウム, 大阪 2006/06 Research paper, summary (national, other academic conference)

  166. Microstructure modification of Sn3.0Ag0.5Cu/Cu solder joint by minor additives during isothermal annealing

    F.Gao, H. Nishikawa, T.Takemoto

    2006/06 Research paper, summary (national, other academic conference)

  167. アルミニウム合金分別技術開発-カスケードリサイクルから水平リサイクルへ-

    西川 宏, 瀬尾 浩平, 竹本 正

    大阪大学接合科学研究所 産学連携シンポジウム, 大阪 2006/06 Research paper, summary (national, other academic conference)

  168. レーザ照射条件のアルミニウム合金分別精度に与える影響

    瀬尾 浩平, 西川 宏, 片山 聖二, 竹本 正

    (社)高温学会 平成18年度春季総合学術講演会, 大阪 2006/05 Research paper, summary (national, other academic conference)

  169. ティグアークにおける陰極作動中タングステン電極の仕事関数の測定(第3報)

    田代 真一, 西川 宏, 田中 学

    (社)溶接学会平成18年度春季全国大会, 東京 2006/04 Research paper, summary (national, other academic conference)

  170. Sn-Ag系はんだ/Cu接合強度に及ぼす界面微細組織の影響

    西川 宏, 小松 朗, 竹本 正

    (社)溶接学会 平成18年度春季全国大会, 東京 2006/03 Research paper, summary (national, other academic conference)

  171. ステンレス鋼のエロージョンとフラックスの影響

    西川 宏, 康 松愛, 竹本 正

    (社)日本溶接協会 フロー槽エロージョン委員会, 東京 2006/03 Research paper, summary (national, other academic conference)

  172. CTスキャンを用いた鉛フリーはんだによるステンレス鋼エロージョン深さの測定

    康 松愛, 竹本 正, 西川 宏

    第20回エレクトロニクス実装学会講演大会, 東京 2006/03 Research paper, summary (national, other academic conference)

  173. プラズマトーチにおける作動中タングステン陰極の仕事関数の測定

    田代 真一, 西川 宏, 田中 学

    中央大学理工学研究所附属熱プラズマ研究センター第2回熱プラズマ研究シンポジウム, 東京 2006/02 Research paper, summary (national, other academic conference)

  174. 鉛フリーはんだによるステンレス鋼侵食抑止技術

    西川 宏, 康 松愛, 竹本 正

    (社)日本溶接協会 フロー槽エロージョン委員会, 東京 2005/12 Research paper, summary (national, other academic conference)

  175. Interfacial Reaction between Lead-free Solder Added Minor Element and Metals

    H. NISHIKAWA, T. TAKEMOTO

    The 5th Korea-Japan Joint Workshop on Environmental-friendly Advanced Materials, Masan, Korea 2005/12 Research paper, summary (international conference)

  176. Interaction Behavior on the Additives Re-distribution during Lead-free Soldering Process

    F. Gao, T. Takemoto, H. Nishikawa, A. Komatsu

    International Symposium on Smart Processing Technology, 大阪 2005/11 Research paper, summary (international conference)

  177. Prevention of Dissolution of Plated Iron in Molten Lead-free Solder by Adding Minor Element to Solder

    H. NISHIKAWA, A. KOMATSU, T. UETANI, T. TAKEMOTO

    International Symposium on Smart Processing Technology, 大阪 2005/11 Research paper, summary (international conference)

  178. 鉛フリーはんだ/銅基板界面反応に及ぼす添加元素の影響

    西川 宏, 小松 朗, 竹本 正

    銅及び銅合金技術研究会第45回講演大会, 2005/11 Research paper, summary (national, other academic conference)

  179. ステンレス鋼のエロージョンに及ぼす基礎因子

    西川 宏, 康 松愛, 竹本 正

    (社)日本溶接協会 フロー槽エロージョン委員会, 東京 2005/09 Research paper, summary (national, other academic conference)

  180. 導電性接着における電気抵抗低減に関する実装プロセスの検討

    酒井 洋彰, 西川 宏, 竹本 正, 寺田 信人

    溶接学会秋期全国大会, 福井 2005/09 Research paper, summary (national, other academic conference)

  181. Sn-Ag-CoはんだとCu基板間の界面反応及び接合強度

    小松 朗, 西川 宏, 高 峰, 竹本 正

    溶接学会秋期全国大会, 福井 2005/09 Research paper, summary (national, other academic conference)

  182. エロージョン界面の元素分析

    西川 宏, 康 松愛, 竹本 正

    (社)日本溶接協会 フロー槽エロージョン委員会, 東京 2005/06 Research paper, summary (national, other academic conference)

  183. ステンレス鋼のエロージョン深さ測定方法

    西川 宏, 康 松愛, 竹本 正

    (社)日本溶接協会 フロー槽エロージョン委員会, 東京 2005/04 Research paper, summary (national, other academic conference)

  184. Sn-Ag-Ni-Co鉛フリーはんだと銅界面における金属間化合物形成

    高 峰, 西川 宏, 小松 朗, 竹本 正

    溶接学会春期全国大会, 東京 2005/04 Research paper, summary (national, other academic conference)

  185. Co添加鉛フリーはんだと銅母材界面の微細組織

    高 峰, 西川 宏, 小松 朗, 竹本 正

    溶接学会春期全国大会, 東京 2005/04 Research paper, summary (national, other academic conference)

  186. 418 Intermetallic Compound formation of Sn-Ag-Ni-Co Lead-free Solder with Copper Base Metal

    Gao F., Nishikawa H., Komatsu A., Takemoto T.

    Pre-Prints of the National Meeting of JWS No. 76 p. 194-195 2005/03/22

    Publisher: Japan Welding Society
  187. 417 Interfacial Microstructure between Co added Lead-free Solder and Copper Base Metal

    Gao F., Nishikawa H., Komatsu A., Takemoto T.

    Pre-Prints of the National Meeting of JWS No. 76 p. 192-193 2005/03/22

    Publisher: Japan Welding Society
  188. 微生物を用いた金の回収における溶解速度向上

    北 義人, 西川 宏, 池 道彦, 竹本 正

    資源と素材学会, 早稲田大学 2005/03 Research paper, summary (national, other academic conference)

  189. レーザを利用したアルミニウム合金分別に影響を及ぼす因子の検討

    西川 宏, 瀬尾 浩平, 竹本 正

    軽金属学会関西支部研究発表会, 大阪科学技術センター 2005/01 Research paper, summary (national, other academic conference)

  190. 炭化物残渣ガス化のための水蒸気プラズマの観察

    伊部 匡晃, 西川 宏, 田中 学

    廃棄物学会研究発表会講演論文集 Vol. 15 p. 993-995 2004/11/17

    Publisher: 廃棄物学会
  191. A Gasification Process of Carbonaceous Residues by Steam Plasma

    NISHIKAWA Hiroshi

    Vol. 17 No. 4 p. 813-813 2004/09/01

  192. 311 Reaction between lead-free solders with minor addition of Co and metals

    Komatsu Akira, Nishikawa Hiroshi, Takemoto Tadashi, Uetani Takashi

    Pre-Prints of the National Meeting of JWS No. 75 p. 166-167 2004/08/20

    Publisher: Japan Welding Society
  193. Gasification Process of Carbonized Wastes by Using Steam Plasma

    IBE Masaaki, NISHIKAWA Hiroshi, TANAKA Manabu, TAKEMOTO Tadashi, USHIO Masao

    Vol. 30 No. 4 p. 20-20 2004/07/30

  194. Effect of minor elements addition in lead-free solder on interfacial reactions with Cu

    Nishikawa Hiroshi, Piao Jinyu, Komatsu Akira, Takemoto Tadashi

    Pre-Prints of the National Meeting of JWS No. 74 p. 116-117 2004/03/21

    Publisher: Japan Welding Society
  195. Reactivity of steam plasma toward carbide

    IBE Masaaki

    Vol. 17 No. 1 p. 3-3 2004/03/01

  196. 2G12-1 Control of cyanide formation and decomposition by Chromobacterium violaceum

    OKAMOTO Hidetake, KITA Yoshito, NISHIKAWA Hiroshi, TAKEMOTO Tadashi

    Vol. 16 p. 200-200 2004

    Publisher: 日本生物工学会
  197. Suppression of damage of soldering iron tip for lead-free soldering

    Nishikawa Hiroshi, Takemoto Tadashi, Uetani Takashi, Kouichi Kifune

    Pre-Prints of the National Meeting of JWS No. 73 p. 138-139 2003/09/08

    Publisher: Japan Welding Society
  198. Fundamental Characteristics of the Hollow Cathode Arc as Welding Heat Source(Physics, Processes, Instruments & Measurements, INTERNATIONAL SYMPOSIUM OF JWRI 30TH ANNIVERSARY)

    OHJI Takayoshi, TAKEMOTO Tadashi, NISHIKAWA Hiroshi

    Transactions of JWRI Vol. 32 No. 1 p. 63-66 2003/07

    Publisher: Joining and Welding Research Institute, Osaka University
  199. Basic study on advanced sorting of aluminum alloys

    HIROE Keiichi, NISHIKAWA Hiroshi, KATAYAMA Seiji, TAKEMOTO Tadashi

    Vol. 104 p. 39-40 2003/04/20

  200. Effect of Curing Condition on Electrical Resistance of Conductive Adhesives

    TSUJI Kyouhei, JEONG Woo Ju, NISHIKAWA Hiroshi, TAKEMOTO Tadashi, GOTOH Hideyuki

    Pre-Prints of the National Meeting of JWS No. 72 p. 198-199 2003/03/24

    Publisher: Japan Welding Society
  201. Development of dioxin-free process for carbonized residual matters using staem.

    牛尾誠夫, 田中学, 津村卓也, 西川宏, 伊藤拓仙, 田中和士, 棚橋尚貴

    第3回廃棄物処理科学研究発表会成果発表抄録集 平成15年度 廃棄物処理対策研究推進事業 p. 33-35 2003

  202. 中空陰極アークのプラズマ特性とその熱源特性に関する研究 ―電子密度・電子温度による溶融メカニズムの検討―,

    電気学会論文誌A Vol. 123巻 1号,pp.35-42 2003

  203. Characteristics of hollow cathode arc as welding heat source: arc characteristics and melting properties

    H Nishikawa, K Yoshida, T Ohji, Y Suita, K Masubuchi

    SCIENCE AND TECHNOLOGY OF WELDING AND JOINING Vol. 7 No. 5 p. 280-285 2002/10

  204. Application of Hollow Cathode Arc to Welding of Aluminum Alloy

    NISHIKAWA Hiroshi, KOSAKA Kei, OHJI Takayoshi

    Pre-Prints of the National Meeting of JWS No. 71 p. 260-261 2002/09/03

    Publisher: Japan Welding Society
  205. 852 Effect of pH value on gold leaching by cyanogenic microorganism

    Kita Yoshito, Takemoto Tadashi, Nishikawa Hiroshi, Ike Michihiko, Fujita Masanori

    Vol. 14 p. 156-156 2002

    Publisher: 日本生物工学会
  206. Hollow Cathode Arcの熱源特性に関する研究―アルミニウム合金の溶接への適用―,,

    高温学会誌 Vol. 28巻 6号, pp.344-350 2002

  207. Hollow Cathode Arc溶接現象に関する基礎的研究

    溶接学会論文集 Vol. 第20巻 第1号,pp.47-52 2002

  208. 低圧下における中空陰極アークの熱源的特性に関する研究

    電気学会論文誌A Vol. 122巻 1号, pp.79-86 2002

  209. Gas hollow tungsten are characteristics under simulated space environment

    H Nishikawa, K Yoshida, T Maruyama, T Ohji, Y Suita, K Masubuchi

    SCIENCE AND TECHNOLOGY OF WELDING AND JOINING Vol. 6 No. 1 p. 12-16 2001

  210. GHTA welding experiments under simulated space environment in flying laboratory

    Yoshikazu Suita, Yoshiyuki Tsukuda, Noboru Terajima, Takashi Hatta, Teppei Kohno, Rikiya Inokuma, Kenji Kawata, Takayoshi Ohji, Hiroshi Nishikawa, Kazuhiro Yoshida, Koichi Masubuchi

    Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society Vol. 18 No. 2 p. 228-235 2000

    Publisher: Japan Welding Soc
  211. Fundamental characteristics of GHTA under low pressure

    Hiroshi Nishikawa, Kazuhiro Yoshida, Takayoshi Ohji, Yoshikazu Suita, Yoshiyuki Tsukuda, Noboru Terajima, Takashi Hatta, Tettpei Kohno, Kenji Kawata, Rikiya Inokuma, Koichi Masubuchi

    Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society Vol. 18 No. 2 p. 272-279 2000

    Publisher: Japan Welding Soc
  212. 航空機を使用した模擬宇宙環境下でのGHTA溶接実験(共著)

    吹田義一, 佃芳行, 寺嶋昇, 八田崇, 河野鉄平, 黄地尚義, 西川宏, 吉田和弘, 増淵興一

    溶接学会論文集 Vol. 18 No. 2 p. 228-235 2000

  213. 低圧下でのGHTA放電の特性と母性の溶融特性(共著)溶接学会論文集

    西川宏, 吉田和弘, 黄地尚義, 吹田義一, 佃芳行, 寺嶋昇, 川田賢司, 猪熊力也, 増淵興一

    溶接学会論文集 Vol. 18 No. 2 p. 272-279 2000

  214. 100℃での銀ナノペースト焼結体のエレクトマイグレーション現象評価

    黒田 裕志, 巽 裕章, 西川 宏

    実装フェスタ関西2022, 大阪 1905/07 Research paper, summary (national, other academic conference)

Publications 8

  1. 標準マイクロソルダリング技術 第4版

    巽 裕章, 西川 宏

    日刊工業新聞社 2024/03/30 Scholarly book

    ISBN: 9784526083280

  2. 次世代パワー半導体の熱設計と実装技術

    西川 宏

    シーエムシー出版 2020/01 Scholarly book

    ISBN: 9784781314365

  3. Novel Structured Metallic and Inorganic Materials

    Hiroshi Nishikawa

    Springer 2019/07 Scholarly book

    ISBN: 9789811376108

  4. 導電性フィラー,導電助剤の分散性向上,評価,応用

    西川 宏

    (株)技術情報協会 2015/06 Scholarly book

    ISBN: 9784861045837

  5. エポキシ樹脂の"特性改良"と"高機能/複合化"技術

    西川 宏

    (株)技術情報協会 2015/02 Scholarly book

    ISBN: 9784861045707

  6. マイクロ接合・実装技術

    西川 宏

    (株)産業技術サービスセンター 2012/07 Scholarly book

    ISBN: 9784915957888

  7. 標準マイクロソルダリング技術 第3版

    西川 宏

    (株)日刊工業新聞社 2011/03 Scholarly book

    ISBN: 9784526066535

  8. The Latest Technology of Epoxy Resin for Electronic Devices II

    Hiroshi Nishikawa

    CMC Pub. Co., Ltd. 2011/01 Scholarly book

    ISBN: 9784781303147

Presentations 64

  1. New wave of die-attach materials and processes for power devices

    Hiroshi Nishikawa

    2024 International Conference on Brazing, Diffusion Bonding and Micro-Nano Joining (BDB-MNJ 2024) 2024/10/20

  2. New Wave of Electronic Packaging: Low-Temperature Solder and its Impacts

    Hiroshi Nishikawa

    The International Union of Materials Research Societies - 18th International Conference on Electronic Materials 2024 (IUMRS-ICEM 2024) 2024/05

  3. Potential of low temperature soldering using hypoeutectic Sn-Bi alloys

    Hiroshi Nishikawa

    7th International Conference on Advanced Electromaterials 2023/10

  4. Solid-phase bonding process using nanostructured surface for power devices in automotive

    Hiroshi Nishikawa

    17th International Conference Reliability and Stress-Related Phenomena in Nanoelectornics (IRSP 2023) 2023/04

  5. Solid-phase bonding using nanostructured surface for power devices

    Hiroshi Nishikawa

    Seminar between IMS-VAST and JWRI-OU 2023/03

  6. Die bonding process using nanostructured surface for power devices

    Hiroshi Nishikawa

    International Welding/Joining Conference-Korea 2022 2022/10

  7. Thermal Conductivity of Sintered Joint Using Micro-sized Ag Particles for Power Devices

    Hiroshi Nishikawa

    2021 Materials Research Society-Taiwan International Conference (2021 MRSTIC) 2021/11

  8. Novel Die Attach Materials and Processes for Power Devices

    Hiroshi Nishikawa

    6th International Conference of Advanced Electomaterials 2021/11

  9. Nanoporou-metal sintering for high-temperature die attach in power devices

    Hiroshi Nishikawa

    The 22nd International Conference on Electronic Packaging Technology (ICEPT2021) 2021/09

  10. Bonding materials and processes for high-temperature electronics

    Hiroshi Nishikawa

    Sustainnability Leads Weekly Webinars 2021/07

  11. エレクトロニクス実装分野で求められる新たなマイクロ接合技術

    西川 宏

    大阪大学接合科学研究所 第18回 産学連携シンポジウム 2021/07

  12. Transient Liquid Phase Bonding using Sn-coated Cu Particles for High-Temperature Applications

    Hiroshi Nishikawa

    The 18th International Symposium on Microelectronics and Packaging 2019/11

  13. 金属粒子の焼結現象を利用したエレクトロニクス向け微細接合技術

    西川 宏

    (一社)粉体粉末冶金協会 2019年春季大会 2019/06

  14. Basic Characteristics of Laser Solder Process

    Hiroshi Nishikawa

    2019 Spring Conference of the Korean Welding and Joining Society 2019/05

  15. Bonding process using a nanoporous sheet for high temperature electronics

    Hiroshi Nishikawa

    1st JWRI-IMS Collaboration Seminar on Joining and Materials Science 2019/01

  16. レーザはんだ付におけるはんだ/Cu界面反応と高信頼性化

    西川 宏

    日本溶接協会はんだ・微細接合部会シンポジウム 2018/11

  17. Reliability of Joint Bonded by Micro-sized Ag Particles for Die-attach in Power Devices

    Hiroshi Nishikawa

    MS&T18 2018/10

  18. 「パワーデバイス実装に関わる国際標準化」ディスクリートタイプパワーデバイスの成果

    西川 宏

    電子実装技術標準化 活動報告会2018 2018/07

  19. Power Device Assembly, METI national PJ in Japan

    Hiroshi Nishikawa

    Jisso International Council, 2018 Spring Meeting 2018/05

  20. Recent Trends in Micro-joining Process for Electronics

    Hiroshi Nishikawa

    Monthly Seminar Talk at Abdullah Institute for Nanotechnology 2017/12

  21. New bonding process using maicroscale particles for die-attach in power devices

    Hiroshi Nishikawa

    18th International Union of Materials Research Societies-International Conference in Asia (IUMRS-ICA 2017) 2017/11

  22. New process using localized heating method for lead-free solders

    Hiroshi Nishikawa, Yujian Zhang, Noriya Iwata

    The 15th international conference on QiR 2017/07

  23. Novel soldering process using localized heating method for wearable devices

    Hiroshi Nishikawa

    International Welding/Joining Conference-Korea2017 2017/04

  24. Pb-free bonding process for semiconductor power device

    Hiroshi Nishikawa

    The 10th Thailand International Metallurgy Conference (TIMETC-10) 2017/03

  25. Formation and Growth of Intermetallic Compound Layer at the Lead-free Solder/Cu Interface Using Laser Soldering Process

    Hiroshi Nishikawa, Noriya Iwata, Shinya Kubota

    TMS 2017 146th Annual Meeting & Exhibition 2017/02

  26. Intermetallic Compound Formation and Mechanical Property of Sn-Cu-xCr/Cu Lead-free Solder Joint

    Jung-Hwan BANG, Dong-Yuri YU, Yong-Ho KO, Hiroshi NISHIKAWA, Chang-Woo LEE

    The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2016) 2016/10

  27. Pb-free bonding process for electronics packaging

    Hiroshi Nishikawa

    The 21th International High Technologies Enviroment Safety & Health (IHTESH2016) 2016/05

  28. Bonding Process using Ag nanoporous metal for high-temperature application

    Hiroshi Nishikawa

    Workshop on Joining and Welding Technology 2015/12

  29. Micro-joints soldered with lead-free solder using laser process

    Hiroshi Nishikawa

    International Symposium in Qatar, Joining Technologies and Materials Science 2015/12

  30. Bonding Process using Nanomaterials for Electronics Packaging

    Hiroshi Nishikawa

    The second workshop on welding and Joining (WWJ2015), 2015/08

  31. Recent Trends in Micro-Joining Process for Electronics Packaging

    Hiroshi Nishikawa

    Workshop between Faculty of Engineering, Kasetsart University (KU) and Joining and Welding Research Institute (JWRI), Osaka University 2015/08

  32. Recent Trends in Micro-Joining Process for Electronics Packaging

    Hiroshi Nishikawa

    Workshop Between Workshop between Department of Metallurgical Engineering, Chulalongkorn University and Joining and Welding Research Institute, Osaka University 2015/08

  33. Impact Strength of lead-free solder/Cu bumps by Laser Process

    Hiroshi Nishikawa, Noriya Iwata

    International Conference on Frontiers in Materials Processing, Applications, Research & Technology(FiMPART'2015) 2015/06

  34. Bonding Process Using Metallic Particle Paste for High-Temperature Application

    H. Nishikawa, X. Wang

    2nd JWRI-MSE Workshop on Materials Design and Joining 2015 2015/01

  35. Pressure-Assisted Bonding Process Using Nanomaterials for electronics packaging

    Hiroshi Nishikawa, Kaori Matsunaga, Min-Su Kim, Mikiko Saito, Jun Mizuno

    The 5th International Symposium on Advanced Materials Development and Integration of Novel Structured Meallic and Inorganic Materials(AMDI-5) 2014/11

  36. Effect of isothermal aging on Sn-Ag-Cu solder joints on Cu pad in laser soldering

    Hiroshi Nishikawa

    The First Workshop on Welding and Joining (WWJ 2014) 2014/08

  37. Characteristics of Micro-joints Soldered with Sn-3.0Ag-0.5Cu Solder Using Laser Process

    H. Nishikawa, N. Iwata

    International Union of Materials Research Societies-International Conference on Electronic Materials 2014(IUMRS-ICEM2014) 2014/06

  38. Microstructural Modifications of Sn-Bi/Cu Joints soldered by Laser Process

    H. Nishikawa, S. Kubota

    International Symposium on Metallurgy and Welding Technology 2014(ISMWT2014) 2014/05

  39. レーザ加熱を利用したはんだ付技術

    西川 宏

    第1回地域ネットワーク形成講演会 2013/12

  40. ナノ材料を利用したはんだ代替高耐熱性接合プロセス

    西川 宏

    大阪大学新技術説明会 2013/07

  41. Shear Impact Strength of Lead-free Solder Bumps on Cu Pad

    Hiroshi Nishikawa

    1st Japan-Taiwan Workshop on Materilas Design and Joining 2013/05

  42. Joint strenght of Cu-to-Cu joint using Cu nanoparticle past

    H. Nishikawa, T. Hirano, N. Terada

    International Conference on Electronics Packaging (ICEP 2013) 2013/04

  43. Recent Trends in Micro-Joining Process for Electronic Packaging

    H. Nishikawa

    International Seminar at King Saud University -From the latest research activities at JWRI- 2013/03

  44. Novel Bonding Process Using Nanoparticles for Electronics Packaging

    H. Nishikawa

    International Seminar on Advanced Joining Technology -From the latest research activities at JWRI 2012/11

  45. EPMAによる微細接合部界面の分析事例紹介

    西川 宏

    2012・表面分析ユーザーズミーティング 2012/10

  46. Recent Trends in Micro-Joining Process for Electronic Packaging

    H. Nishikawa

    International Seminar on Advanced Joining Technology by Joining and Welding Reserch Institute 2012/09

  47. Erosion Test Method in Molten Lead-free Solder for Surface Coated Stainless Steel

    H. Nishikawa

    Jisso International Council 2012 2012/05

  48. Cu粒子を利用した導電性接着とナノ粒子ボンディング

    西川 宏

    第66回新無機膜研究会 2012/03

  49. Impact reliability of micro-joints soldered with Sn-Ag-Cu solder using laser process

    H. Nishikawa, N. Iwata, T. Takemoto

    Sino-Japanese Workshop on Welding Thermo-Physics 2011/11

  50. 高温はんだ代替銅ナノ粒子ペーストの接合強度

    西川 宏, 平野 智章, 竹本 正, 寺田 信人

    はんだ・微細接合部会シンポジウム 2011/09

  51. 銅ナノ粒子ペーストを用いた接合継手の接合強度評価

    西川 宏, 平野 智章, 竹本 正, 寺田 信人

    第51回マイクロ接合研究委員会ソルダリング分科会 2011/07

  52. 銅ナノ粒子による低温接合

    山川 智弘, 下田 将義, 西川 宏, 竹本 正, 塩川 国夫, 寺田 信人

    第8回スマートプロセス研究センター産学連携シンポジウム 2011/06

  53. 次世代微細接合技術としての導電性接着剤

    西川 宏

    第8回スマートプロセス研究センター産学連携シンポジウム 2011/06

  54. Erosion damage on stainless steel by lead-free solder

    H. Nishikawa

    Jisso International Council 2011 2011/05

  55. 微細接合用材料の問題点とその新展開

    西川 宏

    (社)溶接学会九州支部主催「第1回 若手グループ研究会・見学会」 2009/03

  56. 導電性接着剤の基礎と銅系金属粒子の適用

    西川 宏

    第9回若手研究会セミナー「銅粒子を用いた導電材料技術の現状」 2009/01

  57. Sn-Ag系鉛フリーはんだへのNi, Co微量添加の影響

    西川 宏, 竹本 正

    第44回マイクロ接合研究委員会ソルダリング分科会 2007/10

  58. 鉛フリーはんだ接合界面の機械的特性評価試験方法の検討

    西川 宏, 竹本 正

    平成19年度大阪大学接合科学研究所特別講演・研究集会 2007/09

  59. 金属スクラップのスマート分別

    西川 宏

    産学官連携推進大会2007 in 北大阪 2007/02

  60. 環境を考慮したエレクトロニクス実装 -微細高密度実装における有害物質フリー化-

    西川 宏

    次世代エレクトロニクスデバイス・実装分野の研究開発・製造技術の展開 2006/12

  61. アルミニウムスクラップのスマート分別技術

    西川 宏

    さかい産学連携共創フェア 2006/11

  62. Co, Ni添加Sn-Ag系鉛フリーはんだの界面反応特性

    西川 宏, 竹本 正

    平成18年度大阪大学接合科学研究所特別講演・研究集会 2006/09

  63. バクテリアを利用したプリント基板からの貴金属回収

    西川 宏

    近畿バイオインダストリー振興会議 フォローアップ勉強会 2006/03

  64. 導電性接着剤の高強度・高導電性化

    西川 宏, 竹本 正

    大阪大学特別講演会・研究集会「導電性接着のナノテクノロジーによる信頼性向上」 2005/11

Industrial Property Rights 12

  1. 低温接合方法及び接合体

    西川 宏

    第7233680

    登録日:2023/02

  2. 銅粒子を用いた低温接合方法

    西川 宏

    特許第6659026号

    出願日:2015/10

    登録日:2020/02

  3. ナノポーラスめっき構造体とそれを用いた接合技術

    西川 宏

    特許第6442688号

    出願日:2014/12

    登録日:2018/12

  4. マイクロサイズ粒子を用いた無加圧下での接合技術

    西川 宏

    特許第6433324号

    出願日:2015/02

    登録日:2018/11

  5. プリコートしたマイクロサイズ粒子を用いた接合技術

    西川 宏

    特許第6406546号

    出願日:2015/02

    登録日:2018/09

  6. マイクロサイズ銀粒子を用いた接合方法

    西川 宏

    特許第6380791号

    出願日:2014/08

    登録日:2018/08

  7. 銅材の接合方法

    西川 宏

    特許第6347385号

    出願日:2013/11

    登録日:2018/06

  8. はんだ槽の侵食防止方法

    竹本 正, 西川 宏, 他3名

    特許第4840960号

    出願日:2004/12

    登録日:2011/10

  9. 接合材およびその製造方法、素子搭載用基板、並びに、電子モジュールの製造方法

    巽 裕章、内田 弘翔、西川 宏

    特願2025-038696

    出願日:2025/03/11

  10. アモルファス金属・金属ガラス接合体

    中田 一博, 黒田 敏雄, 竹本 正, 藤井 英俊, 阿部 浩也, 津村 卓也, 前田 将克, 寺島 岳史, 西川 宏, 野城 清, 井上 明久, 木村 久道, 張 偉, Dmitri V.Louzguine, 福原 幹夫, 王 新敏, 和田 武, 謝 国強, 関 一郎

    出願日:2007/03

  11. 合金分別方法及びそれを用いた分別システム

    竹本 正, 西川 宏, 片山 聖二

    出願日:2003/01

  12. 中空電極を用いたアーク溶接方法

    黄地 尚義, 西川 宏

    出願日:2001/12

Institutional Repository 22

Content Published in the University of Osaka Institutional Repository (OUKA)
  1. Interfacial reaction and IMC growth kinetics at the Bi2Te3/Ag interface during isothermal aging

    Pak Seong Woo, Tatsumi Hiroaki, Wang Jianhao, Wu Albert T., Nishikawa Hiroshi

    Intermetallics Vol. 179 2025/04/01

  2. Atomistic behavior of Cu–Cu solid-state bonding in polycrystalline Cu with high-density boundaries

    Tatsumi Hiroaki, Kao C. R., Nishikawa Hiroshi

    Materials and Design Vol. 250 2025/02/01

  3. Thermal decomposition temperature-dependent bonding performance of Ag nanostructures derived from metal–organic decomposition

    Wang Chuncheng, Tatsumi Hiroaki, Nishikawa Hiroshi

    Journal of Materials Science Vol. 59 No. 40 p. 19038-19056 2024/10/15

  4. Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation

    Liu Yang, Chen Chuantong, Wang Ye, Zhang Zheng, Liu Ran, Ueshima Minoru, Ota Ichiro, Nishikawa Hiroshi, Nishijima Masahiko, Nakayama Koji S., Suganuma Katsuaki

    Composites Part B: Engineering Vol. 281 2024/07/15

  5. Quasi-direct Cu–Si3N4 bonding using multi-layered active metal deposition for power-module substrate

    Tatsumi Hiroaki, Moon Seongjae, Takahashi Makoto, Kozawa Takahiro, Tsushima Eiki, Nishikawa Hiroshi

    Materials and Design Vol. 238 2024/02/01

  6. Impact of crystalline orientation on Cu–Cu solid-state bonding behavior by molecular dynamics simulations

    Tatsumi Hiroaki, Kao C. R., Nishikawa Hiroshi

    Scientific Reports Vol. 13 No. 1 2023/12/27

  7. Strength-enhanced Sn–In low-temperature alloy with surface-modified ZrO₂ nanoparticle addition

    Nitta Shunya, Tatsumi Hiroaki, Nishikawa Hiroshi

    Journal of Materials Science: Materials in Electronics Vol. 34 No. 31 2023/11/01

  8. Effects of Indium Content on the Tensile Properties of Sn-Bi-In Solder

    Mokhtari Omid, Nishikawa Hiroshi

    Transactions of JWRI Vol. 44 No. 2 p. 19-22 2015/12

  9. Effect of Thermal Aging on Microstructure of Sn-Bi-In Solder Joint

    Mokhtari Omid, Nishikawa Hiroshi

    Transactions of JWRI Vol. 43 No. 2 p. 21-25 2014/12

  10. Effects of Ag Content on the Mechanical Properties of Bi-Ag Alloys Substitutable for Pb based Solder

    Shimoda Masayoshi, Yamakawa Tomohiro, Shiokawa Kunio, Nishikawa Hiroshi, Takemoto Tadashi

    Transactions of JWRI Vol. 41 No. 2 p. 51-54 2012/12

  11. Evaluation of Plasma Ion Beam Sputtered TiN/TiAlN Multilayers on Steel for Bio Implant Applications

    Balasubramanian Subramanian, Guruswamy Brindha, Takahashi Makoto, Nishikawa Hiroshi, Kobayashi Akira

    Transactions of JWRI Vol. 40 No. 2 p. 55-58 2011/12

  12. Bonding process of Cu/Cu joint using Cu nanoparticle paste

    Nishikawa Hiroshi, Hirano Tomoaki, Takemoto Tadashi

    Transactions of JWRI Vol. 40 No. 2 p. 33-36 2011/12

  13. Interfacial reaction between Sn-3.0Ag-0.5Cu solder/Co-P plating and Ni-Co-P plating

    Daito Tomoya, Nishikawa Hiroshi, Takemoto Tadashi, Matsunami Takashi

    Transactions of JWRI Vol. 39 No. 2 p. 224-225 2010/12

  14. Enhancement of solderability of Cu60Zr30Ti10 bulk metallic glass by dealloying in hydrofluoric acid solution

    Naoi Takehiro, Fukuhara Mikio, Inoue Akihisa, Nishikawa Hiroshi, Takemoto Tadashi, Abe Hiroya

    Transactions of JWRI Vol. 39 No. 2 p. 293-295 2010/12

  15. Erosion Behavior and Interfacial Reaction of Stainless Steels in Molten Lead-free Solder

    Nishikawa Hiroshi, Kang Songai, Takemoto Tadashi

    Transactions of JWRI Vol. 38 No. 2 p. 53-56 2009/12

  16. Enhancement of Au Dissolution by Microorganisms Using an Accelerating Cathode Reaction

    Kita Yoshito, Nishikawa Hiroshi, Ike Michihiko, Takemoto Tadashi

    Metallurgical and Materials Transactions B Vol. 40 No. 1 p. 39-44 2009/02

  17. The Electrical Property of Copper and Copper Alloy Particles Containing Electrically Conductive Adhesives

    Ho Li-Ngee Ho, Nishikawa Hiroshi, Natsume Naohide, Takemoto Tadashi

    Transactions of JWRI Vol. 37 No. 2 p. 69-73 2008/12

  18. Effects of Co Addition on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu Solder Alloy

    Cheng Fangjie, Nishikawa Hiroshi, Takemoto Tadashi

    Transactions of JWRI Vol. 36 No. 1 p. 53-56 2007/07

  19. Joint Strength between Sn-Ag Based Lead-free Solder and Cu Pad by Ball Shear Test

    Nishikawa Hiroshi, Komatsu Akira, Takemoto Tadashi

    Transactions of JWRI Vol. 35 No. 2 p. 53-56 2006/12

  20. Microstructure Characterization of Cu₆Sn₅-based Intermetallic Compounds at Solder Matrix and Relevant Solder Joints

    Gao Feng, Nishikawa Hiroshi, Takemoto Tadashi

    Transactions of JWRI Vol. 34 No. 2 p. 57-61 2005/12

  21. Fundamental Characteristics of the Hollow Cathode Arc as Welding Heat Source(Physics, Processes, Instruments & Measurements, INTERNATIONAL SYMPOSIUM OF JWRI 30TH ANNIVERSARY)

    Nishikawa Hiroshi, Ohji Takayoshi, Takemoto Tadashi

    Transactions of JWRI Vol. 32 No. 1 p. 63-66 2003/07

  22. 宇宙環境下におけるアーク放電とその熱源特性に関する研究

    Nishikawa Hiroshi