顔写真

PHOTO

Matsushima Michiya
松嶋　道也
Matsushima Michiya
松嶋　道也
Graduate School of Engineering　Division of Materials and Manufacturing Science, Assistant Professor

keyword Visual inspection，Packaging reliability，Micro system，Electronics system integration

Research History 2

  1. 2005 -
    - 大阪大学大学院・助教

  2. 2005 -
    - Osaka University, Assistant Professor

Education 5

  1. Osaka University

    - 2005

  2. Osaka University

    - 2005

  3. Osaka University

    - 2002

  4. Osaka University

    - 2002

  5. Osaka University　School of Engineering Science Direct Affiliates

    - 2000

Professional Memberships 3

  1. Smart Processing Society for Materials, Environment & Energy

  2. The Japan Institute of Electronics Packaging

  3. 日本溶接学会

Research Areas 3

  1. Manufacturing technology (mechanical, electrical/electronic, chemical engineering) / Electronic devices and equipment /

  2. Informatics / Mechanics and mechatronics /

  3. Informatics / Robotics and intelligent systems /

Awards 3

  1. MES2017 ベストペーパー賞

    エレクトロニクス実装学会　2018/09

  2. マイクロ接合優秀研究賞

    2010

  3. 第52回塑性加工連合講演会ポスターセッション優秀賞

    2001

Papers 86

  1. Transient liquid-phase infiltration bonding of copper using porous copper interlayer

    Ryo Miyajima, Ryota Yagane, Michiya Matsushima, Shinji Fukumoto

    Journal of Materials Science: Materials in Electronics　Vol. 35　No. 5　2024/02/17　Research paper (scientific journal)

    Publisher: Springer Science and Business Media LLC

  2. 導電性接着剤におけるSn-3.0Ag-0.5Cu架橋による伝導性の向上

    谷山耕太郎, 千田拓実, 福本信次, 松嶋道也

    Mate2024（第30回「エレクトロニクスにおけるマイクロ接合・実装技術」シンポジウム論文集　Vol. 30　2024/02

  3. Electrodeposition Bonding of Copper to Aluminum via Anodic Oxide Film

    Yuto TANAKA, Ryosuke TSUTSUI, Michiya MATSUSHIMA, Shinji FUKUMOTO

    QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY　Vol. 41　No. 4　p. 356-363　2023　Research paper (scientific journal)

    Publisher: Japan Welding Society

  4. Change in electrical conductivity of electrically conductive adhesives during curing process

    Shinji Fukumoto, Kazuhiro Makimoto, Kengo Ohta, Tomohiro Nakamura, Michiya Matsushima, Kozo Fujimoto

    Journal of Materials Science　Vol. 57　No. 24　p. 11189-11201　2022/06　Research paper (scientific journal)

    Publisher: Springer Science and Business Media LLC

  5. Liquid Phase Infiltration Bonding of Copper Using Low Melting Point Metal and Porous Sheet

    屋金崚太, 松嶋道也, 福本信次

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 27th　2021

  6. Robot Soldering with Control of Bonding Temperature by Operating Parameters

    多田剛志, 石原佑真, 松嶋道也, 寺岡巧智, 中村健太, 萬田哲史, 見島雄太, 杉田卓也, 藤本公三, 福本信次

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 27th　2021

  7. Low Temperature Bonding of Copper by Electrodeposition

    中村光希, 松嶋道也, 福本信次

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 27th　2021

  8. Convex Shape Formation on Copper Substrate Surface using Cold Spray Process

    辻直生, 小倉翔太郎, 松嶋道也, 藤本公三, 福本信次

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 27th　2021

  9. Effect of Ampere-Class Current Loading on Electric Resistance of Ag Paste Wire

    中村友洋, 古井裕彦, 藤田晶, 田中勇登, 松嶋道也, 福本信次

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 27th　2021

  10. Effect of stress gradient on heat cycle fatigue life prediction of solder joints by repetitive bending test

    Michiya Matsushima, Kei Endo, Tetsuya Kawazoe, Shinji Fukumoto, Kozo Fujimoto

    Materials Science Forum　Vol. 1016 MSF　p. 875-881　2021　Research paper (international conference proceedings)

  11. Agペースト配線の電気的特性におよぼす熱ひずみの影響

    牧本和大, 福本信次, 加柴良裕, 松嶋道也, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 26th　2020

  12. V型溝を利用したソルダ粉末の溶融凝集およびぬれ性評価

    吉田圭佑, 福本信次, 松嶋道也, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 26th　2020

  13. 微細粒子を含有した低融点金属の金属架橋構造が導電性接着剤における熱伝導率に及ぼす影響の定量的評価

    南尚吾, 松嶋道也, 伊藤直樹, 福本信次, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 26th　2020

  14. コールドスプレー法を用いた基板表面への凹凸形成による樹脂-金属界面の強度改善

    森山悠佑, 松嶋道也, 福本信次, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 26th　2020

  15. Improvement of Thermal Conductive Property with Micro Particles in Low-melting-point Metal Bridges in Conductive Adhesives

    松嶋道也, 南尚吾, 伊藤直樹, 福本信次, 藤本公三

    電子情報通信学会論文誌 C(Web)　Vol. J103-C　No. 3　2020

  16. Report on 26th Symposium on “Microjoining and Assembly Technology in Electronics"

    Matsushima Michiya

    Yosetsu Gakkai Shi/Journal of the Japan Welding Society　Vol. 89　No. 4　p. 270-272　2020　Research paper (international conference proceedings)

  17. ソルダ樹脂ペーストを用いたバンプ形成において電極上に合一するフィラー量の偏りに影響を与える因子

    上野裕輔, 福本信次, 松嶋道也, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 25th　2019

  18. Agペースト配線の電気特性に及ぼすフィラー接触および混合比の影響

    大田賢吾, 福本信次, 加柴良裕, 松嶋道也, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 25th　2019

  19. 微細フィラー混合による低融点金属含有導電性樹脂の熱伝導特性への影響

    松嶋道也, 南尚吾, 伊藤直樹, 福本信次, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 25th　2019

  20. 熱硬化・熱可塑性ハイブリッド樹脂層を導入したパワーモジュール内部の応力-ひずみ場の評価

    多谷本真聡, 福本信次, 松嶋道也, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 25th　2019

  21. 導電性ペーストを用いた三次元配線の接続部分で生じる電気抵抗

    中村友洋, 福本信次, 松嶋道也, 藤本公三

    スマートプロセス学会学術講演会講演概要　Vol. 2019　2019

  22. 溶融ソルダインジェクション法におけるガラス-ソルダのぬれ性及び界面反応

    中村光希, 福本信次, 青木豊広, 青木豊広, 久田隆史, 松嶋道也, 藤本公三

    スマートプロセス学会学術講演会講演概要　Vol. 2019　2019

  23. Characteristics and microstructural development of cold-sprayed copper coating on aluminum

    Shinji Fukumoto, Kengo Ohta, Tatsunori Yanagimoto, Yoshihiro Kashiba, Masao Kikuchi, Michiya Matsushima, Kozo Fujimoto

    Materials Transactions　Vol. 60　No. 4　p. 602-610　2019　Research paper (scientific journal)

  24. Development of polyester-modified epoxy resins for self-organization soldering

    Shinji Fukumoto, Keisuke Yoshida, Yosuke Mizokami, Michiya Matsushima, Kozo Fujimoto

    Materials Transactions　Vol. 60　No. 6　p. 858-864　2019　Research paper (scientific journal)

  25. Electrical property improvement of copper filler conductive adhesive with low-melting point metal bridge

    Michiya Matsushima, Yusuke Takechi, Shogo Minami, Shinji Fukumoto, Kozo Fujimoto

    Materials Transactions　Vol. 60　No. 9　p. 2016-2021　2019　Research paper (scientific journal)

  26. Evaluation of Stress-strain State in Power Module Sealed with Hard Resin Containing an Interlayer with Low Elastic Modulus

    TAYAMOTO Masato, FUKUMOTO Shinji, MATSUSHIMA Michiya, FUJIMOTO Kozo

    Journal of Smart Processing　Vol. 8　No. 5　p. 205-212　2019

    Publisher: Smart Processing Society for Materials, Environment & Energy (High Temperature Society of Japan)

  27. アディティブパターニング配線における配線形状と電気的特性に及ぼすバインダ樹脂成分の影響

    LEE Youngbo, 福本信次, 加柴良裕, 松嶋道也, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 24th　2018

  28. 熱硬化・熱可塑性ハイブリッド樹脂を用いた自己組織化実装

    福本信次, 溝上陽介, 吉田圭佑, 上野裕輔, 松嶋道也, 菅武, 上島稔, 水口大輔, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 24th　2018

  29. 低融点金属薄膜を用いた銅電極間の固液反応拡散接合-接合部欠陥の形成要因-

    渡邉佑人, 福本信次, 松嶋道也, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 24th　2018

  30. 樹脂中のソルダぬれ性測定手法の提案とぬれ性に影響する諸因子

    溝上陽介, 福本信次, 松嶋道也, 上島稔, 水口大輔, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 24th　2018

  31. 3点曲げ試験によるソルダ接合部の熱サイクル疲労寿命予測における応力勾配の影響

    遠藤慶, 松嶋道也, 福本信次, 外薗洋昭, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 24th　2018

  32. Solderability using thermoset resin-Based solder pastes covered with thermoplastic resin film

    Shinji Fukumoto, Ryoichi Wakimoto, Kohei Yamauchi, Michiya Matsushima, Kozo Fujimoto

    Materials Transactions　Vol. 59　No. 8　p. 1359-1366　2018　Research paper (international conference proceedings)

  33. Report on 24th symposium on "Microjoining and assembly technology in electronics"

    Michiya Matsushima

    Yosetsu Gakkai Shi/Journal of the Japan Welding Society　Vol. 87　No. 6　p. 464-467　2018　Research paper (scientific journal)

  34. Effect of Characteristic of Resin on Coalescence Behavior of Solder Fillers in Self-Organization Assembly Method

    UENO Yusuke, FUKUMOTO Shinji, MATSUSHIMA Michiya, FUJIMOTO Kozo

    Journal of Smart Processing　Vol. 7　No. 5　p. 192-198　2018

    Publisher: Smart Processing Society for Materials, Environment & Energy (High Temperature Society of Japan)

  35. Report on 23rd Symposium on "Microjoining and Assembly Technology in Electronics"

    MATSUSHIMA Michiya

    JOURNAL OF THE JAPAN WELDING SOCIETY　Vol. 86　No. 4　p. 255-257　2017

    Publisher: JAPAN WELDING SOCIETY

  36. 温度場・応力場を制御可能な3点曲げ接合体強度試験

    川添徹也, 松嶋道也, 福本信次, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 23rd　2017

  37. 低融点金属含有による銅フィラー導電性樹脂の電気特性改善

    松嶋道也, 武知佑輔, 溝上陽介, 福本信次, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 23rd　2017

  38. Sn薄膜を用いたCuの固液反応拡散接合における接合部品質に及ぼす諸因子の検討

    木澤利成, 福本信次, 松嶋道也, 外薗洋昭, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 23rd　2017

  39. 応力成分を考慮した樹脂/金属接着界面の接着強度評価

    藤井達哉, 松嶋道也, 福本信次, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 23rd　2017

  40. Sn薄膜を用いたCuの固液反応拡散接合における初期欠陥形成

    福本信次, 木澤利成, 松嶋道也, 外薗洋昭, 藤本公三

    マイクロエレクトロニクスシンポジウム論文集　Vol. 27th　2017

  41. Effects of hybrid structures on the stress reduction and thermal properties of joints in electronics devices

    Michiya Matsushima, Noriyasu Nakashima, Satoshi Nishioka, Shinji Fukumoto, Kozo Fujimoto

    Materials Science Forum　Vol. 879　p. 1258-1264　2017　Research paper (international conference proceedings)

  42. Report on 23rd symposium on "microjoining and assembly technology in electronic

    Michiya Matsushima

    Yosetsu Gakkai Shi/Journal of the Japan Welding Society　Vol. 86　No. 4　p. 51-53　2017　Research paper (international conference proceedings)

  43. Metal Surface Condition Effect on Interfacial Property between Metal and Epoxy Resin

    Michiya Matsushima, Yuta Kato, Yusuke Takechi, Shinji Fukumoto, Kozo Fujimoto

    JOURNAL OF THE JAPAN INSTITUTE OF METALS　Vol. 81　No. 3　p. 109-114　2017　Research paper (scientific journal)

  44. Effect of zinc addition on void formation in solid-liquid interdiffusion bonding of copper

    S. Fukumoto, T. Miyazaki, M. Matsushima, K. Fujimoto

    Materials Transactions　Vol. 57　No. 6　p. 846-852　2016　Research paper (scientific journal)

  45. Report on 22nd symposium on microjoining and assembly technology in electronics

    Michiya Matsushima

    Yosetsu Gakkai Shi/Journal of the Japan Welding Society　Vol. 85　No. 4　p. 369-371　2016　Research paper (international conference proceedings)

  46. Effects of Metal Surface Conditions on Interfacial Characteristics between Metal and Epoxy Resin

    Michiya Matsushima, Yuta Kato, Yusuke Takechi, Shinji Fukumoto, Kozo Fujimoto

    MATERIALS TRANSACTIONS　Vol. 57　No. 6　p. 881-886　2016　Research paper (scientific journal)

  47. プレスフィット接続部の接触抵抗計測とそれによる接続部の評価

    深田健太郎, 福本信次, 松嶋道也, 江草稔, 加柴良裕, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 21st　2015

  48. 導電性樹脂接合部の熱特性および界面強度評価

    加藤裕太, 松嶋道也, 福本信次, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 21st　2015

  49. インコネルと貴金属合金のマイクロ抵抗溶接における表面状態の影響

    川上寛, 福本信次, 松嶋道也, 田邊享一郎, 田中邦弘, 坂入弘一, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 21st　2015

  50. Solid-liquid interdiffusion bonding of copper using Ag-Sn layered films

    S. Fukumoto, K. Miyake, S. Tatara, M. Matsushima, K. Fujimoto

    Materials Transactions　Vol. 56　No. 7　p. 1019-1024　2015　Research paper (scientific journal)

  51. Report on 21st symposium on "microjoining and assembly technology in electronics

    Michiya Matsushima

    Yosetsu Gakkai Shi/Journal of the Japan Welding Society　Vol. 84　No. 4　p. 276-278　2015　Research paper (international conference proceedings)

  52. 熱負荷によるはんだ接合部の組織変化の振動負荷寿命への影響

    松嶋道也, 松尾圭一郎, 舟引喜八郎, 福本信次, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 20th　2014

  53. ハイブリッド樹脂実装における導電路形成に影響を及ぼす諸因子

    福本信次, 山本悠斗, 薮田康平, 松嶋道也, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 20th　2014

  54. Effects of material property and structural design on the stress reduction of the joints in electronics devices

    Michiya Matsushima, Noriyasu Nakashima, Takashi Fujimoto, Shinji Fukumoto, Kozo Fujimoto

    Materials Science Forum　Vol. 783-786　p. 2765-2770　2014　Research paper (international conference proceedings)

  55. Report on 20th symposium on "microjoining and Assembly Technology in Electronics"

    Michiya Matsushima

    Yosetsu Gakkai Shi/Journal of the Japan Welding Society　Vol. 83　No. 4　p. 288-290　2014　Research paper (international conference proceedings)

  56. Influence of chemical bonding force on thermal reliability in resin-metal bonding

    KATO Yuta, MATSUSHIMA Michiya, FUKUMOTO Shinji, FUJIMOTO Kozo

    Preprints of the National Meeting of JWS　Vol. 93　p. 224-225　2013/08/12

    Publisher: JAPAN WELDING SOCIETY

  57. Idea of compound resin bonding with silicone rubber for electronics

    YAMAUCHI Kohei, MATSUSHIMA Michiya, FUKUMOTO Shinji, FUJIMOTO Kozo

    Preprints of the National Meeting of JWS　Vol. 93　p. 226-227　2013/08/12

    Publisher: JAPAN WELDING SOCIETY

  58. The creep property change of solder by thermal and mechanical stress and the crack initiation

    MATSUSHIMA Michiya, FUNABIKI Kihachiro, FUKUMOTO Shinji, FUJIMOTO Kozo

    Preprints of the National Meeting of JWS　Vol. 93　p. 166-167　2013/08/12

    Publisher: JAPAN WELDING SOCIETY

  59. FEM Analysis of Stress in the Structres under Bond Pad of Ultra Low-k Device

    HISADA Takashi, ABIRU Hijiri, YAMADA Yasuharu, AOKI Toyohiro, FUKUMOTO Shinji, MATSUSHIMA Michiya, FUJIMOTO Kozo

    Journal of Smart Processing　Vol. 2　No. 4　p. 186-191　2013/07/20

    Publisher: Smart Processing Society for Materials, Environment & Energy (High Temperature Society of Japan)

  60. Surface Mounting Process Using Hybrid Resin Sheet Including Self-Organizable Solder Particles

    Shinji Fukumoto, Shu Inoue, Ryoichi Wakimoto, Yuto Yamamoto, Michiya Matsushima, Kozo Fujimoto

    MATERIALS TRANSACTIONS　Vol. 54　No. 6　p. 899-904　2013/06　Research paper (scientific journal)

  61. Input Decrease Effects by Principle Component Analysis on the Neural Network Visual Inspection of Solder Joints

    MATSUSHIMA Michiya, FUKUMOTO Shinji, FUJIMOTO Kozo

    The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits　Vol. 16　No. 3　p. 206-210　2013/05/01　Research paper (scientific journal)

    Publisher: The Japan Institute of Electronics Packaging

  62. Estimation of current path area during small scale resistance spot welding of bulk metallic glass to stainless steel

    S. Fukumoto, A. Soeda, Y. Yokoyama, M. Minami, M. Matsushima, K. Fujimoto

    Science and Technology of Welding and Joining　Vol. 18　No. 2　p. 135-142　2013/02　Research paper (scientific journal)

  63. 構造設計による電子デバイス実装部の応力低減に関する研究

    中島功康, 松嶋道也, 福本信次, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 19th　2013

  64. 金属フィラー含有樹脂搭載基板において樹脂粘性の経時変化が実装性に及ぼす影響

    脇元亮一, 福本信次, 松嶋道也, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 19th　2013

  65. Sn薄膜とCuの界面における合金層形成挙動

    藤本高志, 福本信次, 松嶋道也, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 19th　2013

  66. マイクロ抵抗溶接によるニッケルおよび白金合金の接合界面形成プロセス

    福本信次, 平木尊士, 坂入弘一, 田中邦弘, 野村幸正, 松嶋道也, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 19th　2013

  67. 熱可塑性樹脂被覆による金属フィラー含有エポキシ樹脂のハイブリッド化とその実装性

    福本信次, 脇元亮一, 山本悠斗, 松嶋道也, 藤本公三

    マイクロエレクトロニクスシンポジウム論文集　Vol. 23rd　2013

  68. Report on 19th Symposium on “Microjoining and Assembly Technology in Electronics”

    Michiya Matsushima

    Yosetsu Gakkai Shi/Journal of the Japan Welding Society　Vol. 82　No. 4　p. 287-289　2013　Research paper (scientific journal)

  69. プリント配線基板へのスリット加工付与による大型電子部品はんだ接合部の長寿命化技術開発

    舟引喜八郎, 松嶋道也, 福本信次, 藤本公三, 山下浩儀, 出田吾朗, 新井等

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 18th　2012

  70. 銅の低融点薄膜接合においてインサート層構造が接合部特性に与える影響

    宮崎高彰, 藤本高志, 松嶋道也, 福本信次, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 18th　2012

  71. 実装材料へのAgフィラー含有シリコンゴムの適用

    西岡智志, 福本信次, 松嶋道也, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 18th　2012

  72. 金属フィラー含有熱硬化性樹脂シートの材料特性と接合性

    井上宗, 松嶋道也, 福本信次, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 18th　2012

  73. 金属ガラスとステンレス鋼のマイクロ抵抗スポット溶接部の微細組織

    南匡彦, 福本信次, 副田輝, 横山嘉彦, 高橋誠, 松嶋道也, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 18th　2012

  74. シート間抵抗計測による異材マイクロ抵抗スポット溶接における通電路の見積もり

    福本信次, 副田輝, 南匡彦, 横山嘉彦, 松嶋道也, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 18th　2012

  75. Microstructural development at weld interface between Zr-based glassy alloy and stainless steel by resistance microwelding

    S. Fukumoto, M. Minami, A. Soeda, M. Matsushima, M. Takahashi, Y. Yokoyama, K. Fujimoto

    Journal of Physics: Conference Series　Vol. 379　No. 1　2012　Research paper (international conference proceedings)

    Publisher: Institute of Physics Publishing

  76. Neural Network Visual Inspection with Learning Pseudo Samples of United Multi-angle Images

    Matsushima Michiya, Nakashima Noriyasu, Fujie Hiroyuki, Fukumoto Shinji, Fujimoto Kozo

    Preprints of the National Meeting of JWS　Vol. 2011　p. 68-68　2011

    Publisher: JAPAN WELDING SOCIETY

  77. 自己組織化実装プロセスにおける金属フィラー流動制御に関する研究

    清水悠矢, 井上宗, 松嶋道也, 福本信次, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 17th　2011

  78. Cu/Sn多層薄膜の固液反応を利用した電子デバイスの電極接合

    宮崎高彰, 田中篤志, 松嶋道也, 福本信次, 藤本公三

    マイクロエレクトロニクスシンポジウム論文集　Vol. 20th　2010

  79. Effects of Oxide Films around Solder Fillers and Activation Effect of Resin on Coalescence Behavior in Self-Organization Assembly Method

    OHTA Koushi, TOYA Masao, YASUDA Kiyokazu, MATSUSHIMA Michiya, FUJIMOTO Kozo

    The IEICE transactions on electronics C　Vol. 92　No. 12　p. 833-841　2009/12/01

    Publisher: The Institute of Electronics, Information and Communication Engineers

  80. A study on the number of inputs and training method in boundary category in Neuro Visual Inspection

    Proceedings of Microelectronics Symposium　Vol. 19th　p. 1B1-3　2009

    Publisher: The Japan Institute of Electronics Packaging

  81. Movement of solder fillers because of the unevenness of interfacial tension in self-organization assembly process

    Koushi Ohta, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

    Journal of Physics: Conference Series　Vol. 165　2009　Research paper (international conference proceedings)

  82. Fatigue life deterioration against vibration by pre-loaded thermal history

    Matsushima Michiya, Egusa Minoru, Shishihara Yuki, Yasuda Kiyokazu, Fujimoto Kozo

    Proceedings of JIEP Annual Meeting　Vol. 23　p. 188-189　2009

    Publisher: The Japan Institute of Electronics Packaging

  83. 自己組織化実装法による導電路形成過程の数値解析

    大田皓之, 戸屋正雄, 元重慎市, 安田清和, 松嶋道也, 藤本公三

    マイクロエレクトロニクスシンポジウム論文集　Vol. 17th　2007

  84. Effect of chip heating in thermal cycle test of BGA solder joint

    EGUSA Minoru, MATSUSHIMA Michiya, FUKUDA Kyohei, NAKAURA Masaki, YASUDA Kiyokazu, FUJIMOTO Kozo

    Preprints of the National Meeting of JWS　Vol. 2006　p. 203-203　2006

    Publisher: JAPAN WELDING SOCIETY

  85. Learning to dynamically manipulate: A table tennis robot controls a ball and rallies with a human being

    Fumio Miyazaki, Michiya Matsushima, Masahiro Takeuchi

    Advances in Robot Control: From Everyday Physics to Human-Like Movements　p. 317-341　2006　Part of collection (book)

    Publisher: Springer Berlin Heidelberg

  86. Learning to the robot table tennis task - Ball control & rally with a human

    Michiya Matsushima, Takaaki Hashimoto, Fumio Miyazaki

    Proceedings of the IEEE International Conference on Systems, Man and Cybernetics　Vol. 3　p. 2962-2969　2003　Research paper (international conference proceedings)

Misc. 160

  1. Change in Contact Resistance and Interfacial Microstructure at Press-Fit Connection Under Large Current Loading

    福本信次, 牧本和大, 多谷本真聡, 深田健太郎, 松嶋道也, 藤本公三

    銅と銅合金　Vol. 60　No. 1　p. 207-212　2021

    Publisher: 日本伸銅協会

  2. 大電流負荷に対するプレスフィット端子の接触抵抗および界面組織変化

    福本信次, 牧本和大, 多谷本真聡, 松嶋道也, 藤本公三

    日本銅学会講演大会講演概要集　Vol. 60th　2020

  3. Effective Factors on the Reliability Evaluation of Electronics Joint with Repetitive Bending Test

    Proceedings of JIEP Annual Meeting　Vol. 32　p. 372-375　2018

    Publisher: The Japan Institute of Electronics Packaging

  4. Formation of Defects in Solid-Liquid Reaction-Diffusion Bonding of Copper Using a Tin Film Interlayer (エレクトロニクス産業のもの創りにおける材料、プロセス、システム設計)

    FUKUMOTO Shinji, KIZAWA Toshinari, MATSUSHIMA Michiya, HOKAZONO Hiroaki, FUJIMOTO Kozo

    スマートプロセス学会誌 = Journal of smart processing　Vol. 6　No. 5　p. 188-194　2017/09

    Publisher: 高温学会

  5. Adhesive Strength and Stress Components on Interface between Metal and Epoxy Resin

    MES　Vol. 27　p. 65-68　2017

    Publisher: The Japan Institute of Electronics Packaging

  6. Property Improvement of Copper Filler Conductive Adhesive with Low Melting Point Metal

    Vol. 26　p. 127-130　2016/09/08

    Publisher: エレクトロニクス実装学会

  7. Formation of voids in electronic packaging using hybrid resin including solder fillers

    Vol. 26　p. 123-126　2016/09/08

    Publisher: エレクトロニクス実装学会

  8. Surface Processing on Metals and the Thermal and Mechanical Properties of Interface between the Resin and Metals

    Vol. 25　p. 33-36　2015/09/03

    Publisher: エレクトロニクス実装学会

  9. Evaluation of Resin Property and Mountability using Hybrid Resin Containing Solder Fillers

    Vol. 25　p. 37-40　2015/09/03

    Publisher: エレクトロニクス実装学会

  10. フィラー含有ハイブリッド樹脂実装における実装性評価

    山内浩平, 福本信次, 松嶋道也, 藤本公三

    Symposium on Microjoining and Assembly Technology in Electronics　Vol. 21st　2015

  11. Thermal and Mechanical Properties of Conductive Resin Joint with Surface Processing on Metals

    Proceedings of JIEP Annual Meeting　Vol. 29　p. 111-112　2015

    Publisher: The Japan Institute of Electronics Packaging

  12. Stress Reduction in Electronics Devices by Epoxy-Silicone Rubber Composite Joint

    Vol. 23　p. 321-324　2013/09/12

    Publisher: エレクトロニクス実装学会

  13. Voidless bonding of copper using Cu/Sn multi-thin film

    FUKUMOTO S., MIYAZAKI T., FUJIMOTO T., TAKAHASHI M., MATSUSHIMA M., FUJIMOTO K.

    Preprints of the National Meeting of JWS　Vol. 91　p. 84-85　2012/09/03

    Publisher: JAPAN WELDING SOCIETY

  14. Control of Ag filler dispersibility and specific resistance of conductive resin containing silicone rubber

    MATSUSHIMA Michiya, NISHIOKA Satoshi, FUKUMOTO Shinji, FUJIMOTO Kozo

    Preprints of the National Meeting of JWS　Vol. 91　p. 86-87　2012/09/03

    Publisher: JAPAN WELDING SOCIETY

  15. Influence of creep property change on thermal fatigue life of solder joint

    MATSUO Keiichiro, FUNABIKI Kihachiro, MATSUSHIMA Michiya, FUKUMOTO Shinji, FUJIMOTO Kozo

    Preprints of the National Meeting of JWS　Vol. 91　p. 92-93　2012/09/03

    Publisher: JAPAN WELDING SOCIETY

  16. Dissimilar metal joining for platinum alloys and nickel with micro-resistance welding

    HIRAKI Takashi, FUKUMOTO Shinji, MATSUSHIMA Michiya, FUJIMOTO Kozo, SAKAIRI Kochi, NOMURA Yukimasa, TANAKA Kunihiro

    Preprints of the National Meeting of JWS　Vol. 91　p. 318-319　2012/09/03

    Publisher: JAPAN WELDING SOCIETY

  17. A crack initiation and propagation simulation and the fatigue characteristics of solder joints considering the material property changes

    MATSUSHIMA Michiya

    Journal of Physics, J. Phys.: Conf. Ser.　Vol. 379　No. 1　2012

  18. Bonding of copper to silicon chips using vapor-deposited tin film

    FUJIMOTO Takashi, FUKUMOTO Shinji, MIYAZAKI Takaaki, SHIOTANI Keiichi, MATSUSHIMA Michiya, FUJIMOTO Kozo, KASHIBA Yoshihiro

    Vol. 89　p. 264-265　2011/08/18

  19. Changes of micro structure and creep property of lead free solder by thermal stress

    FUNABIKI Kihachiro, MATSUSHIMA Michiya, FUKUMOTO Shinji, FUJIMOTO Kozo

    Vol. 89　p. 278-279　2011/08/18

  20. Influence of pre-heat time and viscosity of resin on joining process with resin containing solder fillers

    WAKIMOTO Ryoichi, FUKUMOTO Shinji, MATSUSHIMA Michiya, FUJIMOTO Kozo

    Vol. 89　p. 272-273　2011/08/18

  21. Effect of Additional Learning in Neuro Visual Inspection System with Pseudo Defective Data Learning

    NAKASHIMA Noriyasu, MATSUSHIMA Michiya, FUKUMOTO Shinji, FUJIMOTO Kozo

    Vol. 89　p. 270-271　2011/08/18

  22. Neural Network Visual Inspection with learning good-defect boundary based on the distance index in principal component input space

    MATSUSHIMA Michiya, NAKASHIMA Noriyasu, FUJIE Hiroyuki, FUKUMOTO Shinji, FUJIMOTO Kozo

    Vol. 88　p. 146-147　2011/03/28

  23. Formation of current-carrying area between Zr based metallic glass and stainless steel by resistance micro-spot welding

    FUKUMOTO S., MATSUSHIMA M., FUJIMOTO K., SOEDA A., MINAMI M., YOKOYAMA Y.

    Preprints of the National Meeting of JWS　Vol. 88　p. 148-149　2011/03/28

    Publisher: JAPAN WELDING SOCIETY

  24. ステンレス鋼と金属ガラスのマイクロ抵抗スポット溶接におけるナゲット形成現象

    副田輝, 福本信次, 横山嘉彦, 南匡彦, 松嶋道也, 藤本公三

    第17回 エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集　Vol. Vol.17, pp.313-316　2011

  25. Zr基金属ガラスとステンレス鋼のマイクロ抵抗シーム溶接

    福本信次, 副田輝, 南匡彦, 松嶋道也, 横山嘉彦, 藤本公三

    第17回 エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集　Vol. Vol.17, pp.317-322　2011

  26. Interfacial Reaction in Semiconductor Devices by Room Temperature Ultrasonic Soldering

    NISHIOKA Satoshi, TANAKA Atsushi, FUKUMOTO Shiji, MATSUSHIMA Michiya, FUJIMOTO Kozo, FUJINO Junji

    Vol. 87　p. 344-345　2010/08/18

  27. Effect of Electrode Geometry on Nugget Formation for Dissimilar Joint between Metallic Glasses and Stainless Steel by Resistance Microwelding

    MINAMI Masahiko, FUKUMOTO Shinji, SOEDA Akira, MATSUSHIMA Michiya, FUJIMOTO Kozo, YOKOYAMA Yoshihiko

    Vol. 87　p. 346-347　2010/08/18

  28. Influence of Surface Oxide Film of Filler on Resin Viscosity and Filler Coalescence in Self-Organization Assembly Process

    INOUE Shu, OHTA Koushi, ARIMITSU Takushi, SHIMIZU Yuya, MATSUSHIMA Michiya, FUKUMOTO Shinji, FUJIMOTO Kozo

    Vol. 87　p. 350-351　2010/08/18

  29. Improvement of bondability of copper using multilayer film at low temperature

    FUKUMOTO S., MATSUSHIMA M., FUJIMOTO K., TANAKA A.

    Vol. 86　p. 102-103　2010/03/29

  30. Neural network visual inspection with boundary learning based on the distance index in input space

    Michiya Matsushima, Akira Soeda, Hiroyuki Fujie, Shinji Fukumoto, Kozo Fujimoto

    IEEE INTERNATIONAL SYMPOSIUM ON INDUSTRIAL ELECTRONICS (ISIE 2010)　Vol. pp.1742-1747　p. 1742-1747　2010

  31. The Material Deterioration and Microstructure Changes by the thermal Load and the Effects on the Fatigue Life against Vibration Load

    ICEP2010 Proceedings　Vol. pp.561-566　2010

  32. マイクロ抵抗溶接による金属ガラス/ステンレス鋼接合部の組織制御

    福本信次, 南匡彦, 副田輝, 松嶋道也, 横山嘉彦, 藤本公三

    第16回 エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集　Vol. Vol.16, 2010, pp.247-250　2010

  33. Cu/Sn多層薄膜を用いた銅の液層拡散接合プロセス

    田中篤志, 宮崎高彰, 西岡智志, 松嶋道也, 福本信次, 藤本公三

    第16回 エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集　Vol. Vol.16, 2010, pp.165-170　2010

  34. 温度サイクル負荷による材料特性変化がはんだ接合部の疲労特性に及ぼす影響

    獅子原祐樹, 松浪弘貴, 松嶋道也, 福本信次, 藤本公三

    第16回 エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集　Vol. Vol.16, 2010, pp.81-86　2010

  35. ニューロ視覚検査システムにおける固有ベクトルによる疑似不良品サンプル作成を用いた学習方法の検討

    藤江裕之, 松嶋道也, 福本信次, 藤本公三

    第16回 エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集　Vol. Vol.16, 2010, pp.35-40　2010

  36. Visual Inspection of Soldering Joints by Neural Network with Multi-angle View and Principal Component Analysis

    Michiya Matsushima, Naohiro Kawai, Hiroyuki Fujie, Kiyokazu Yasuda, Kozo Fujimoto

    SERVICE ROBOTICS AND MECHATRONICS　Vol. Vol.7, pp.305-310　p. 329-334　2010

  37. Neural network visual inspection with boundary learning based on the distance index in input space

    Michiya Matsushima, Akira Soeda, Hiroyuki Fujie, Shinji Fukumoto, Kozo Fujimoto

    IEEE INTERNATIONAL SYMPOSIUM ON INDUSTRIAL ELECTRONICS (ISIE 2010)　Vol. pp.1742-1747　p. 1742-1747　2010

  38. The Material Deterioration and Microstructure Changes by the thermal Load and the Effects on the Fatigue Life against Vibration Load

    ICEP2010 Proceedings　Vol. pp.561-566　2010

  39. Microstructural Control for Dissimilar Joints between Metallic Glasses and Stainless Steel by Resistance Microwelding

    16th Symposium on Microjoining and Assembly Technology in Electronics　Vol. Vol.16, 2010, pp.247-250　2010

  40. Liquid Phase Diffusion Bonding of Copper with Cu/Sn Multilayer Film

    16th Symposium on Microjoining and Assembly Technology in Electronics　Vol. Vol.16, 2010, pp.165-170　2010

  41. Influence of Material Property Change by Thermal Cycle Stress on Fatigue Characteristics of Solder Joint

    16th Symposium on Microjoining and Assembly Technology in Electronics　Vol. Vol.16, 2010, pp.81-86　2010

  42. Effect of Learning Method for Pseudo Defective Samples with Characteristic Vector in Neural Network Visual Inspection System

    16th Symposium on Microjoining and Assembly Technology in Electronics　Vol. Vol.16, 2010, pp.35-40　2010

  43. Multi-angle View Visual Inspection of Solder Joints with Neural Networks

    Proceedings of International Conference on Electronics Packaging (ICEP) 2009　Vol. pp.486-491　2009

  44. 熱硬化性樹脂実装部の残留応力評価に関する研究

    中浦正貴, 松嶋道也, 藤本公三

    第15回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集　Vol. Vol.15　2009

  45. Research on Residual Stress Evaluation of Thermosetting Resin Joint

    Proceedings of the 15th Symposium on Microjoining and Assembly Technology in Electronics　Vol. Vol.15　2009

  46. Multi-angle View Visual Inspection of Solder Joints with Neural Networks

    Proceedings of International Conference on Electronics Packaging (ICEP) 2009　Vol. pp.486-491　2009

  47. Study of deterioration of mechanical characteristics of solder joint under thermal circumstance

    SHISHIHARA Yuki, EGUSA Minoru, MATSUSHIMA Michiya, FUJIMOTO Kozo

    Pre-Prints of the National Meeting of JWS　Vol. 83　p. 416-417　2008/08/20

    Publisher: Japan Welding Society

  48. Effect of Ni Nano-Particles Addition in Sn-Bi Solder on Cu/Cu Thin Film Joint

    Smart Processing Technology　Vol. Vol.2 pp.107-110　2008

  49. Effect of Bubble Generation on Self-Organization Joining

    Smart Processing Technology　Vol. Vol.2 pp.75-78　2008

  50. Bended Interconnection using Graded Index Optical Waveguide for High Speed Optical Communication

    Kiyokazu Yasuda, Kunio Ota, Michiya Matsushima, Kozo Fujimoto

    ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS　Vol. Vol.2, pp.963-pp.968　p. 963-967　2008

  51. Movement of Solder Fillers due to Unevenness of Interfacial Tension in Self-Organization Assembly Process

    2008

  52. Observation of solder fillers coalescence in resin for development of self-organization assembly process

    Koushi Ohta, Masao Toya, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

    Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium　Vol. C5.1 (2008)　2008

  53. The effects of thermal environmental stress and residual stress on the reliability of BGA solder joints

    Proceedings of 8th International Welding Symposium　Vol. Vol.8, pp.72　2008

  54. Effect of Fluxing Activation on the Formation ob Bubbles in Self-Organization Joining (invited)

    Proceedings of 8th International Welding Symposium　Vol. Vol.8, pp.73　2008

  55. Movement Mechanism of Solder Fillers in Self-Organization Assembly Process

    Proceedings of 8th International Welding Symposium　Vol. Vol.8, pp.263　2008

  56. 鉛フリーはんだ実装部の熱環境下の振動負荷に対する信頼性評価

    信学技法　Vol. Vol.107, No.425　2008

  57. 初期残留応力及び環境ストレス下のはんだ強度劣化を考慮したBGA接合部の信頼性

    江草稔, 獅子原祐樹, 松嶋道也, 藤本公三

    第14回 エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集　Vol. Vol.14, 2008, pp.241-246　2008

  58. ニューロ視覚検査システムにおける複視線角画像による認識度向上

    河合直浩, 藤江裕之, 松嶋道也, 藤本公三

    第１４回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集　Vol. Vol.14, 2008, pp.451-456　2008

  59. Effect of micro structure in fuel cell electrode on concentration of species in reaction layer

    Masahiko Sugimura, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

    ADVANCED WELDING AND MICRO JOINING / PACKAGING FOR THE 21ST CENTURY　Vol. 580-582　p. 151-154　2008

  60. Effect of Ni Nano-Particles Addition in Sn-Bi Solder on Cu/Cu Thin Film Joint

    Smart Processing Technology　Vol. Vol.2 pp.107-110　2008

  61. Effect of Bubble Generation on Self-Organization Joining

    Smart Processing Technology　Vol. Vol.2 pp.75-78　2008

  62. Bended Interconnection using Graded Index Optical Waveguide for High Speed Optical Communication

    Proceedings 2008 2nd Electronics Systemintegration Technology Conference　Vol. Vol.2, pp.963-pp.968　2008

  63. Movement of Solder Fillers due to Unevenness of Interfacial Tension in Self-Organization Assembly Process

    2008

  64. Observation of Solder Fillers Coalescence in Resin for Development of Self-Organization Assembly Process

    e-Proceedings of the 33rd International Electronics Manufacturing Technology Conference (IEMT2008) No. C5.1, 2008　Vol. C5.1 (2008)　2008

  65. The effects of thermal environmental stress and residual stress on the reliability of BGA solder joints

    Proceedings of 8th International Welding Symposium　Vol. Vol.8, pp.72　2008

  66. Movement Mechanism of Solder Fillers in Self-Organization Assembly Process

    Proceedings of 8th International Welding Symposium　Vol. Vol.8, pp.263　2008

  67. Effect of Fluxing Activation on the Formation ob Bubbles in Self-Organization Joining (invited)

    Proceedings of 8th International Welding Symposium　Vol. Vol.8, pp.73　2008

  68. Visual Inspection of Soldering Joints by Neural Network with Multi-angle View and Principal Component Analysis

    Proceedings of the 7th International Conference on Machine Automation　Vol. Vol.7, pp.305-310　2008

  69. Reliability evaluation of lead free solder joint against vibration load under thermal circumstance

    MATSUSHIMA Michiya, HAMANO Toshiyuki, YASUDA Kiyokazu, FUJIMOTO Kozo

    IEICE Technical Report　Vol. Vol.107, No.425　No. 425　p. 117-122　2008

    Publisher: The Institute of Electronics, Information and Communication Engineers

  70. Improvement of Recognition Capability by using Multi-angle Image in Neuro Visual Inspection System

    FUJIE Hiroyuki, KAWAI Naohiro, MATSUSHIMA Michiya, FUJIMOTO Kozo

    14th Symposium on Microjoining and Assembly Technology in Electronics　Vol. Vol.14, 2008, pp.451-456　p. 422-423　2008

    Publisher: Japan Welding Society

  71. Influence of Initial Residual Stress and Deterioration of Solder Strength under Thermal Cycle Stress on Reliability of BGA Solder Joint

    14th Symposium on Microjoining and Assembly Technology in Electronics　Vol. Vol.14, 2008, pp.241-246　2008

  72. Effect of Micro Structure in Fuel Cell Electrode on Concentration of Species in Reaction Layer

    Masahiko Sugimura, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

    Materials Science Forum　Vol. Vol.580-582(2008) pp.151-154　p. 151-154　2008

  73. 鉛フリーはんだ実装部の温度環境下における振動負荷に対する信頼性評価

    松嶋道也, 浜野寿之, 安田清和, 藤本公三

    電子情報通信学会論文誌 C　Vol. Vol.J90-C, No.11, pp.807-813　No. 11　2007

  74. Numerical analysis of self-organizing interconnection process by 3 dimensional flow dynamics

    Koushi Ohta, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

    ADVANCES IN NANOMATERIALS AND PROCESSING, PTS 1 AND 2　Vol. 124-126　p. 543-+　2007

  75. 自己組織化実装プロセスにおける金属液滴の合一挙動に関する解析

    山下潤, 大田皓之, 安田清和, 松嶋道也, 藤本公三

    第１３回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集,Vol.13, 2007, pp.55-60　Vol. Vol.13, 2007, pp.55-60　2007

  76. 直接メタノール型燃料電池における反応の高効率化に及ぼす電極構造の影響

    杉村昌彦, 安田清和, 松嶋道也, 藤本公三

    第１３回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集,Vol.13, 2007, pp.91-96　Vol. Vol.13, 2007, pp.91-96　2007

  77. 製造プロセスに起因する界面粗さを考慮した光導波路の伝搬損失解析

    木村晃也, 安田清和, 松嶋道也, 藤本公三

    第１３回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集,Vol.13, 2007, pp.147-152　Vol. Vol.13, 2007, pp.147-152　2007

  78. 振動負荷疲労寿命に及ぼす熱負荷による組織変化の影響

    福田恭平, 江草稔, 中浦正貴, 松嶋道也, 安田清和, 藤本公三

    第１３回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集,Vol.13, 2007, pp.309-314　Vol. Vol.13, 2007, pp.309-314　2007

  79. Reliability Evaluation of Lead Free Solder Joint against Vibration Load under Thermal Circumstance

    MATSUSHIMA Michiya, HAMANO Toshiyuki, YASUDA Kiyokazu, FUJIMOTO Kozo

    The IEICE Transactions on Electronics　Vol. Vol.J90-C, No.11, pp.807-813　No. 11　p. 807-813　2007

    Publisher: The Institute of Electronics, Information and Communication Engineers

  80. Numerical Analysis of Self-Organizing Interconnection Process by 3 Dimensional Flow Dynamics

    Koushi Ohta, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

    Solid State Phenomena Vol. 124-126 (2007), pp.543-546　Vol. Vol.124-126, pp. 543-546　No. PART 1　p. 543-546　2007

  81. Propagation Loss Analysis of Optical Waveguide Considering Interfacial Roughness Due to Manufacturing Process

    Proceedings of the 13th Symposium on Microjoining and Assembly Technology in Electronics, Vol.13, 2007, pp.147-152　Vol. Vol.13, 2007, pp.147-152　2007

  82. Influence of Electrode Structure on Reaction Efficiency in Direct Methanol Fuel Cell

    Proceedings of the 13th Symposium on Microjoining and Assembly Technology in Electronics, Vol.13, 2007, pp.91-96　Vol. Vol.13, 2007, pp.91-96　p. 231-234　2007

    Publisher: エレクトロニクス実装学会

  83. Analysis Concerning the Coalescence Behavior of Metal Droplet in Self-organization Assembly Process

    Proceedings of the 13th Symposium on Microjoining and Assembly Technology in Electronics, Vol.13, 2007, pp.55-60　Vol. Vol.13, 2007, pp.55-60　2007

  84. Effect of Microstructure in Thermal Cycle Stress on Fatigue Life under Vibration Stress

    Proceedings of the 13th Symposium on Microjoining and Assembly Technology in Electronics, Vol.13, 2007, pp.309-314　Vol. Vol.13, 2007, pp.309-314　2007

  85. Experimental Verification of Lateral Flow Effects in Resin Containing Metallic Fillers on Self-organization Joining

    TOYA Masao, YASUDA Kiyokazu, MATSUSHIMA Michiya, FUJIMOTO Kozo

    Vol. 79　p. 408-409　2006/09/01

  86. Modeling of Three-Dimensional Optical Waveguide and Evaluation of the Light Propagation Loss for a Micro Stereo-Lithography in Resin

    NAKAMURA Masatoshi, YASUDA Kiyokazu, MATSUSHIMA Michiya, FUJIMOTO Kozo

    Vol. 79　p. 418-419　2006/09/01

  87. Effect of Chip Heating on Reliability Evaluation of BGA Solder Joints under Thermal Cycle Test

    EGUSA Minoru, MATSUSHIMA Michiya, YASUDA Kiyokazu, FUJIMOTO Kozo, FUKUDA Kyohei, NAKAURA Masaki

    Vol. 79　p. 420-421　2006/09/01

  88. Integrated design of embedded optical interconnect for direct laser process

    Proceedings of the Fourth International Congress on Laser Advanced Materials Processing (LAMP2006)　Vol. #06-15　2006

  89. ソルダフィラー含有樹脂の流動が自己組織化接合に与える効果の実験的検証

    戸屋正雄, 安田清和, 松嶋道也, 藤本公三

    第１６回マイクロエレクトロニクスシンポジウム論文集,Vol.16 (2006) pp.335-338　Vol. Vol.16 (2006) pp.335-338　2006

  90. 樹脂内部へのマイクロ光造形を想定した光実装のシミュレーションと損失評価

    中村匡利, 安田清和, 松嶋道也, 藤本公三

    第１６回マイクロエレクトロニクスシンポジウム論文集,Vol.16 (2006) pp.275-278　Vol. Vol.16 (2006) pp.275-278　2006

  91. Interface Properties of Thin Film Bonding by Low Melting Point Metal for MEMS devices

    Kiyokazu Yasuda, Katsumi Taniguchi, Tomoaki Goto, Michiya Matsushima, Kozo Fujimoto

    IEMT 2006: 31ST INTERNATIONAL CONFERENCE ON ELECTRONICS MANUFACTURING AND TECHNOLOGY　Vol. pp. 328-333　p. 328-+　2006

  92. グレーデッド型導波路を用いたチップ間光通信システムの伝搬損失評価

    太田邦夫, 中村匡利, 安田清和, 松嶋道也, 藤本公三

    第１２回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集,Vol.12, 2006, pp.455-460　Vol. Vol.12, pp.455-460　2006

  93. Sn/In合金薄膜によるCu/Cu接合における界面特性に関する研究

    第１２回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集,Vol.12, 2006, pp.377-380　Vol. Vol.12, pp.377-380　2006

  94. MARS法３次元2相流解析に基づく自己組織化実装プロセスの分析

    第１２回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集,Vol.12, 2006, pp.381-386　Vol. Vol.12, pp.381-386　2006

  95. 熱ストレスを考慮した振動負荷の累積損傷評価

    第１２回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集,Vol.12, 2006, pp.455-460　Vol. Vol.12, pp.265-270　2006

  96. Fatigue Life of Lead Free Solder BGA Joints Against Vibration Stress under High Temperature Circumstance

    松嶋道也, 古澤剛士, 福田恭平, 江草稔, 安田清和, 藤本公三

    高温学会誌　Vol. Vol.32 No.4, pp.219-225　No. 4　2006

  97. 熱負荷の影響を考慮した振動負荷に対する疲労損傷評価

    Vol. pp.93-106　2006

  98. グレーデッド型導波路を用いたチップ間光通信システムの伝搬損失評価

    第１２回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集,Vol.12, 2006　Vol. Vol.12, pp.455-460/,　2006

  99. MARS法３次元2相流解析に基づく自己組織化実装プロセスの分析

    大田こう之, 安田清和, 松嶋道也, 藤本公三

    第１２回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集,Vol.12, 2006　Vol. Vol.12, pp.381-386/,　2006

  100. Sn/In合金薄膜によるCu/Cu接合における界面特性に関する研究

    西沢福太郎, 谷口克己, 安田清和, 松嶋道也, 後藤友彰, 藤本公三

    第１２回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集,Vol.12, 2006　Vol. Vol.12, pp.377-380/,　2006

  101. 熱ストレスを考慮した振動負荷の累積損傷評価

    古沢剛士, 江草稔, 松嶋道也, 安田清和, 藤本公三, 中島宏晃, 浜野寿之

    第１２回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集,Vol.12, 2006　Vol. Vol.12, pp.265-270/,　2006

  102. Propagation Loss Evaluation of Inter-chip Optical Communication System with Graded Index Optical Waveguide

    Proceedings of the 12th Symposium on Microjoining and Assembly Technology in Electronics, Vol.12, 2006, pp.455-460　Vol. Vol.12, pp.455-460　2006

  103. Study of Self-Organization Assembly Process Based on MARS Method 3-Dimensional 2-Phase Flow Analysis

    Proceedings of the 12th Symposium on Microjoining and Assembly Technology in Electronics, Vol.12, 2006, pp.381-386　Vol. Vol.12, pp.381-386　2006

  104. Study on the Interface Characteristics of Copper Bonding Using Thin Film of Sn/In Alloys

    Proceedings of the 12th Symposium on Microjoining and Assembly Technology in Electronics, Vol.12, 2006, pp.377-380　Vol. Vol.12, pp.377-380　2006

  105. Cumulative Damage Evaluation of Vibration Stress Considering Thermal Stress

    Proceedings of the 12th Symposium on Microjoining and Assembly Technology in Electronics, Vol.12, 2006, pp.455-460　Vol. Vol.12, pp.265-270　2006

  106. Integrated design of embedded optical interconnect for direct laser process

    Proceedings of the Fourth International Congress on Laser Advanced Materials Processing (LAMP2006)　Vol. #06-15　2006

  107. Fatigue Life of Lead Free Solder BGA Joints Against Vibration Stress under High Temperature Circumstance

    MATSUSHIMA Michiya, FURUSAWA Takeshi, FUKUDA Kyohei, EGUSA Minoru, YASUDA Kiyokazu, FUJIMOTO Kozo

    Journal of High Temperature Society　Vol. Vol.32 No.4, pp.219-225　No. 4　p. 219-225　2006

    Publisher: High Temperature Society of Japan

  108. Experimental verification of lateral flow effects in resin containing solder fillers on self-organizaiton joining process

    Proceedings of the Microelectronics Symposium, Vol.16 (2006) pp.335-338　Vol. Vol.16 (2006) pp.335-338　p. 335-338　2006

    Publisher: エレクトロニクス実装学会

  109. Simulation of optical implementation and the evaluation of light propagation loss for a micro stereo-lithography in resin

    Proceedings of the 16th Microelectronics Symposium, Vol.16 (2006) pp.275-278　Vol. Vol.16 (2006) pp.275-278　p. 275-278　2006

    Publisher: エレクトロニクス実装学会

  110. Fatigue damage evaluation for vibration stress considering the effect of thermal cycle stress

    Vol. pp.93-106　2006

  111. Interface Properties of Thin Film Bonding by Low Melting Point Metal for MEMS devices

    Proceedings of the IEEE 31st International Conference on Electronics Manufacturing and Technology IEMT2006, pp.328-333　Vol. pp. 328-333　2006

  112. Study on the Interface Characteristics of Copper Bonding Using Thin Film of Sn/In Alloys

    Proceedings of the 12th Symposium on Microjoining and Assembly Technology in Electronics, Vol.12, 2006　Vol. Vol.12, pp.377-380/,　2006

  113. Study of Self-Organization Assembly Process Based on MARS Method 3-Dimensional 2-Phase Flow Analysis

    Proceedings of the 12th Symposium on Microjoining and Assembly Technology in Electronics, Vol.12, 2006　Vol. Vol.12, pp.381-386/,　2006

  114. Propagation Loss Evaluation of Inter-chip Optical Communication System with Graded Index Optical Waveguide

    Proceedings of the 12th Symposium on Microjoining and Assembly Technology in Electronics, Vol.12, 2006　Vol. Vol.12, pp.455-460/,　2006

  115. Cumulative Damage Evaluation of Vibration Stress Considering Thermal Stress

    Proceedings of the 12th Symposium on Microjoining and Assembly Technology in Electronics, Vol.12, 2006　Vol. Vol.12, pp.265-270/,　2006

  116. A learning approach to robotic table tennis

    Michiya Matsushima, Takaaki Hashimoto, Masahiro Takeuchi, Fumio Miyazaki

    IEEE Transactions on Robotics　Vol. 21　No. 4　p. 767-771　2005/08

  117. 124 Research on the effect of process factor and the filler observation of the self-organized packaging

    YAMASHITA Masaru, YASUDA Kiyokazu, MATSUSHIMA Michiya, FUJIMOTO Kozo

    Pre-Prints of the National Meeting of JWS　Vol. 77　p. 50-51　2005

    Publisher: Japan Welding Society

  118. Study of plastic strain and grain coarsening of BGA solder joint under vibraton load.

    Fukuda Kyohei, Yasuda Kiyokazu, Matsushima Michiya, Fujimoto Kozo

    Preprints of the National Meeting of JWS　Vol. 2005　No. 77　p. 27-27　2005

    Publisher: JAPAN WELDING SOCIETY

  119. Computational Fluid Dynamics Considering Influence of Anode Electrode Structure for Micro Direct Methanol Fuel Cell Design

    Proceedings of the International Fuel Cell Workshop (2005), Yamanashi, pp.288-293　Vol. pp.288-293　2005

  120. Numerical Study of the Self-Interconnection Assembly Method Using Resin Containing Solder Fillers

    Proc. of the 2005 International Conference on Solid State Devices and Materials, 2005, pp.566-567　Vol. pp.566-567　2005

  121. 微細周期構造を有する光導波路システム実設計のための損失評価

    マイクロエレクトロニクスシンポジウム論文集(2005) Vol.15, pp.289-292　Vol. Vol.15, pp.289-292　2005

  122. Propagation loss evaluation of optical transmission/interconnect system with grating structure

    Akiya Kimura, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

    EMAP 2005: International Symposium on Electronics Materials and Packaging　Vol. pp.125-128　p. 125-128　2005

  123. Design of the Anode Electrode Structure for the Micro Direct Methanol Fuel Cell by using the Numerical Analysis of Fuel Flow

    Proceedings of the 1st European Fuel Cell Technology and Applications Conference, pp.141 (2005)　Vol. pp.141　2005

  124. 鉛フリーはんだBGA接合部の振動負荷寿命への熱サイクル負荷の影響

    マイクロエレクトロニクスシンポジウム論文集(2005) Vol.15, pp.109-112　Vol. Vol.15, pp.109-112　2005

  125. Computational Fluid Dynamics Considering Influence of Anode Electrode Structure for Micro Direct Methanol Fuel Cell Design

    Vol. pp.288-293　2005

  126. Numerical Study of the Self-Interconnection Assembly Method Using Resin Containing Solder Fillers

    Vol. pp.566-567　2005

  127. 鉛フリーはんだBGA接合部の振動負荷寿命への熱サイクル負荷の影響

    松嶋 道也, 川合 有, 福田 恭平

    マイクロエレクトロニクスシンポジウム論文集　Vol. pp.109-112　p. 109-112　2005

    Publisher: エレクトロニクス実装学会

  128. 微細周期構造を有する光導波路システム実設計のための損失評価

    木村 晃也, 安田 清和, 松嶋 道也

    マイクロエレクトロニクスシンポジウム論文集　Vol. pp.289-292　p. 289-292　2005

    Publisher: エレクトロニクス実装学会

  129. Propagation loss evaluation of optical transmission/interconnect system with grating structure

    Akiya Kimura, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

    EMAP 2005: International Symposium on Electronics Materials and Packaging　Vol. pp.125-128　p. 125-128　2005

  130. Design of the anode electrode structure for the micro direct methanol fuel cell by using the numerical analysis of fuel flow

    Masahiko Sugimura, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

    Proceedings of the 1st European Fuel Cell Technology and Applications Conference 2005 - Book of Abstracts　Vol. pp.141　2005

  131. A Learning Approach to Robotic Table Tennis

    IEEE Transactions on Robotics　Vol. Vol.21, No.4, pp.767-771/,　2005

  132. 微細周期構造を有する光導波路システム実設計のための損失評価

    第15回マイクロエレクトロニクスシンポジウム論文集　Vol. pp.289-292　2005

  133. Computational Fluid Dynamics Considering Influence of Anode Electrode Structure for Micro Direct Methanol Fuel Cell Design

    Proceedings of the International Fuel Cell Workshop (2005), Yamanashi, pp.288-293　Vol. pp.288-293　2005

  134. Numerical Study of the Self-Interconnection Assembly Method Using Resin Containing Solder Fillers

    Proc. of the 2005 International Conference on Solid State Devices and Materials, 2005, pp.566-567　Vol. pp.566-567　2005

  135. Power Loss Evaluation for Real Design of Photonic Waveguide System including Micro Periodical Structure

    Proceedings of the 15th Micro Electronics Symposium(2005), Vol.15, pp.289-292　Vol. Vol.15, pp.289-292　2005

  136. Propagation loss evaluation of optical transmission/interconnect system with grating structure

    Akiya Kimura, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

    Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging　Vol. 2005　p. 125-128　2005

  137. Design of the Anode Electrode Structure for the Micro Direct Methanol Fuel Cell by using the Numerical Analysis of Fuel Flow

    Proceedings of the 1st European Fuel Cell Technology and Applications Conference, pp.141 (2005)　Vol. pp.141　2005

  138. The Influence of Thermal Cycle stress on Mechanical Fatigue Strength of Pb Free solder BGA Joints

    Proceedings of the Micro Electronics Symposium(2005) Vol.15, pp.109-112　Vol. Vol.15, pp.109-112　2005

  139. Computational Fluid Dynamics Considering Influence of Anode Electrode Structure for Micro Direct Methanol Fuel Cell Design

    Vol. pp.288-293　2005

  140. Numerical Study of the Self-Interconnection Assembly Method Using Resin Containing Solder Fillers

    Vol. pp.566-567　2005

  141. The Influence of Thermal Cycle stress on Mechanical Fatigue Strength of Pb Free solder BGA Joints

    Micro Electronics Symposium　Vol. pp.109-112　2005

  142. Power Loss Evaluation for Real Design of Photonic Waveguide System including Micro Periodical Structure

    Vol. pp.289-292　2005

  143. Propagation Loss Evaluation of Optical Transmission/Interconnect System with Grating Structure

    Kimura Akiya, Yasuda Kiyokazu, Matsushima Michiya, Fujimoto Kozo

    Proceedings of the 2005 International Symposium on Electronics Materials and Packaging (EMAP2005), Dec 11-14, 2005, Tokyo, Japan　Vol. pp.125-128　No. 77　p. 58-59　2005

    Publisher: Japan Welding Society

  144. Design of the Anode Electrode Structure for the Micro Direct Methanol Fuel Cell by using the Numerical Analysis of Fuel Flow

    Proceedings of the 1st European Fuel Cell Technology and Applications Conference　Vol. pp.141　2005

  145. A Learning Approach to Robotic Table Tennis

    IEEE Transactions on Robotics　Vol. Vol.21, No.4 pp.767-771/,　2005

  146. Numerical Study of the Self-Interconnection Assembly Method Using Resin Containing Solder Fillers

    Extended Abstracts of the 2005 International Conference on Solid State Devices and Materials　Vol. pp.566-567　2005

  147. Computational Fluid Dynamics Considering Influence of Anode Electrode Structure for Micro Direct Methanol Fuel Cell Design

    Proc. of International Fuel Cell Workshop 200　Vol. pp.288-293　2005

  148. A Robot Plays Table Tennis:Ball Control and Rally with a Human Being

    Proc. of IEEE International Conference on Methods and Models in Automation and Robotics　2004

  149. Realization of the Table Tennis Task based on Virtual Targets

    MIYAZAKI Fumio, TAKEUCHI Masahiro, MATSUSHIMA Michiya, KUSANO Takamichi, HASHIMOTO Naoaki

    Journal of the Robotics Society of Japan　Vol. Vol.21 No.1 pp.81-86　No. 1　p. 81-86　2003

    Publisher: The Robotics Society of Japan

  150. Three-dimensional laser forming of sheet metal using triangular patches

    M Otsu, H Miura, M Matsushima, K Osakada

    TRANSACTIONS OF THE NORTH AMERICAN MANUFACTURING RESEARCH INSTITUTION OF SME, VOL XXXI, 2003　Vol. Vol.31 pp. 87-94　p. 87-94　2003

  151. Three-dimensional laser forming of sheet metal using triangular patches

    M Otsu, H Miura, M Matsushima, K Osakada

    TRANSACTIONS OF THE NORTH AMERICAN MANUFACTURING RESEARCH INSTITUTION OF SME, VOL XXXI, 2003　Vol. Vol.31 pp. 87-94　p. 87-94　2003

  152. Learning to the robot table tennis task - Ball control & rally with a human

    M Matsushima, T Hashimoto, F Miyazaki

    2003 IEEE INTERNATIONAL CONFERENCE ON SYSTEMS, MAN AND CYBERNETICS, VOLS 1-5, CONFERENCE PROCEEDINGS　p. 2962-2969　2003

  153. Three-dimensional laser forming of sheet metal using triangular patches

    Transactions of North American Manufacturing Research Institution of SME　Vol. Vol.31, pp. 87-94/,　2003

  154. Realization of the table tennis task based on virtual targets

    F Miyazaki, M Takeuchi, M Matsushima

    2002 IEEE INTERNATIONAL CONFERENCE ON ROBOTICS AND AUTOMATION, VOLS I-IV, PROCEEDINGS　p. 3844-3849　2002

  155. Dynamic dexterity for the performance of "wall-bouncing" tasks

    M Takeuchi, F Miyazaki, M Matsushima, M Kawatani, T Hashimoto

    2002 IEEE INTERNATIONAL CONFERENCE ON ROBOTICS AND AUTOMATION, VOLS I-IV, PROCEEDINGS　Vol. 2　p. 1559-1564　2002

  156. A Change of Difficulty on"Wall-Bouncing"Taskt

    TAKEUCHI Masahiro, MIYAZAKI Fumio, MATSUSHIMA Michiya, KAWATANI Masato, HASHIMOTO Takaaki

    Vol. Vol.38 No.5 pp.456-461　No. 5　p. 456-461　2002

    Publisher: 計測自動制御学会

  157. Laser Forming of Three-Dimnsional Shaped Sheet Metal Using Triangular Patches

    Proc. 7th International Conference on Technology of Plasticity　Vol. pp.1021-1026　2002

  158. Realization of the table tennis task based on virtual targets

    Fumio Miyazaki, Masahiro Takeuchi, Michiya Matsushima, Takamichi Kusano, Takaaki Hashimoto

    Proceedings-IEEE International Conference on Robotics and Automation　Vol. 4　p. 3844-3849　2002

  159. Dynamic dexterity for the performance of "wall-bouncing" tasks

    M Takeuchi, F Miyazaki, M Matsushima, M Kawatani, T Hashimoto

    2002 IEEE INTERNATIONAL CONFERENCE ON ROBOTICS AND AUTOMATION, VOLS I-IV, PROCEEDINGS　p. 1559-1564　2002

  160. Laser Forming of Three-Dimnsional Shaped Sheet Metal Using Triangular Patches

    Proc. 7th International Conference on Technology of Plasticity　Vol. pp.1021-1026　2002

Publications 2

  1. マイクロ接合・実装技術

    マイクロ接合・実装技術編集委員会

    産業技術サービスセンター　2012/07

    ISBN: 9784915957888

  2. 標準マイクロソルダリング技術

    日本溶接協会マイクロソルダリング教育委員会

    日刊工業新聞社　2011/03

    ISBN: 9784526066535

Works 2

  1. 電子デバイスの自己組織化実装における金属フィラー溶融凝集機構の解明

    2008 -

  2. 高信頼性電子デバイス生産システムの研究開発

    2006 -

Industrial Property Rights 3

  1. 試験方法、試験サンプル、試験システム、評価方法、評価システム、及び評価プログラム

    藤本 公三, 福本 信次, 松嶋 道也, 川添 徹也, 外薗 洋昭, 高橋 良和, 西村 芳孝, 福田 恭平, 浅井 竜彦

    特許第6854480号

    出願日:2017/03/31

    登録日:2021/03/18

  2. 電子部品の実装方法、回路基板の作製方法及び電子部品のはんだ接合部の形成方法、並びに、接続層付きプリント配線板及びシート状接合部材

    藤本 公三, 福本 信次, 松嶋 道也, 渡邉 聡, 菅 武, 上島 稔, 坂本 健志, 井上 宗

    特許第6112797号

    出願日:2012/07/30

    登録日:2017/03/24

  3. 電子部品の実装方法、電子部品付き基板およびその接合層、ならびに接合用材料層付き基板およびシート状接合用部材

    藤本 公三, 福本 信次, 松嶋 道也, 山内 浩平, 上島 稔, 坂本 健志, 渡邉 聡, 菅 武

    出願日:2015/01/30