Selective Laser Heating for Novel Hybrid Bonding of Three-Dimensional Integrated Circuit

Hyayami Asahara, Kiyokazu Yasuda

Proc. 33th Microelectronics Symposium　p. 243-246　2023/09　Research paper (conference, symposium, etc.)

Low Temperature Copper Direct Bonding by Laser–Assisted Sintering

Kiyokazu Yasuda, Yuki Takada, Shungo Kishida, Yinan Zhang, Jenn-Ming Song

Journal of Japan Institute of Copper　Vol. 62　No. 1　p. 196-199　2023/08　Research paper (scientific journal)

Study on the SPCC and CFRTP Hybrid Joint Performance Produced with Additional Nylon-6 Interlayer by Ultrasonic Plastic Welding

Tai Wang, Kiyokazu Yasuda, Hiroshi Nishikawa

Polymers　Vol. 14　No. 23　p. 5235-5235　2022/12/01　Research paper (scientific journal)

Cu-Ag Nanocomposite Pastes for Low Temperature Bonding and Flexible Interlayer-Interconnections

Yin-Chi Lu, Wei-Hsun Liao, Ting-Jui Wu, Kiyokazu Yasuda, Jenn-Ming Song

Nanomaterials　Vol. 12　No. 23　p. 4241-4241　2022/11/29　Research paper (scientific journal)

Fabrication of micron-sized protrusions on metal surface for metal/polymer easy-disassembly joining by selective laser melting technology

Tai Wang, Kiyokazu Yasuda, Hiroshi Nishikawa

Materials & Design　Vol. 220　p. 110873-110873　2022/08　Research paper (scientific journal)

Optimization of Piezoresistive Strain Sensors Based on Gold Nanoparticle Deposits on PDMS Substrates for Highly Sensitive Human Pulse Sensing

Yu-Shun Su, Wei-Rong Yang, Wei-Wun Jheng, Watson Kuo, Shien-Der Tzeng, Kiyokazu Yasuda, Jenn-Ming Song

Nanomaterials　Vol. 12　No. 13　p. 2312-2312　2022/07/05　Research paper (scientific journal)

Biocompatibility and antimicrobial activity of copper(II) oxide hybridized with nano silicate platelets

Lalani Fernando, Wei-Ting Chen, Chung-Wei Lai, Fang-Yi Ye, Ping-Shan Lai, Jiang-Jen Lin, Kiyokazu Yasuda, Tsing-Tang Song, Jenn-Ming Song

Surface and Coatings Technology　Vol. 435　p. 128253-128253　2022/04　Research paper (scientific journal)

Hydrophilic nanoporous copper surface prepared by modified formic acid vapor treatment

Lap-Hong Chan, Kiyokazu Yasuda, Jenn-Ming Song, Tadatomo Suga

Surfaces and Interfaces　Vol. 28　p. 101620-101620　2022/02　Research paper (scientific journal)

Hollow iron submicron spheres with strong ferromagnetism

Pei-Kai Hsu, Shih-Yun Chen, Ji-Nan Cheng, Jenn-Ming Song, Kiyokazu Yasuda

Materials Letters　Vol. 308　p. 131121-131121　2022/02　Research paper (scientific journal)

Low-thermal-budget photonic sintering of hybrid pastes containing submicron/nano cuo/cu2o particles

Po-Hsiang Chiu, Wei-Han Cheng, Ming-Tsang Lee, Kiyokazu Yasuda, Jenn-Ming Song

Nanomaterials　Vol. 11　No. 7　2021/07/01　Research paper (scientific journal)

Geometrical Effects on Ultrasonic Al Bump Direct Bonding for Microsystem Integration: Simulation and Experiments

Jun-Hao Lee, Pin-Kuan Li, Hai-Wen Hung, Wallace Chuang, Eckart Schellkes, Kiyokazu Yasuda, Jenn-Ming Song

Micromachines　Vol. 12　No. 7　p. 750-750　2021/06/26　Research paper (scientific journal)

Photonic Sintering of Composite Pastes with Copper Oxide Powders Using Different Light Sources

Wei-Han Cheng, Po-Hsiang Chiu, Yan-Jie Li, Ming-Tsang Lee, Kiyokazu Yasuda, Jenn-Ming Song

2021 International Conference on Electronics Packaging (ICEP)　p. 11-12　2021/05/12　Research paper (international conference proceedings)

Characterization of Additively Formed Copper Layer by Blue Laser-Sintered Copper Nanoparticles

K. Yasuda, Y. Takada, J.-M. Song

Proc. 2021 International Conference on Electronics Packaging (ICEP)　p. 53-54　2021/05/12　Research paper (international conference proceedings)

Blue Laser Irradiation Effect on Copper Nanoparticles for Low-Temperature Sintering Bonding

Yuki Takada, Kiyokazu Yasuda, Jenn-Ming Song

Proc. 27th Symposium on "Microjoining and Assembly Technology in Electronics"　Vol. 27　p. 231-232　2021/02　Research paper (conference, symposium, etc.)

Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints

Jenn-Ming Song, Bo-Chang Huang, David Tarng, Chih-Pin Hung, Kiyokazu Yasuda

Nanomaterials　Vol. 10　No. 8　p. 1456-1456　2020/07/25　Research paper (scientific journal)

Surface Structuring for Hybrid Materials Adhesion and Joining

Kiyokazu YASUDA

Polymers　Vol. 69　No. 2　p. 57-59　2020/02　Research paper (scientific journal)

Micro Roughening of Copper Surface and Additive Spaying of Copper Particles for Low Temperature Sollid Phase Bonding

Yuki TAKADA, Tomoya ITO, Kiyokazu YASUDA

Proc. 29th Microelectronics Symposium　Vol. 29　p. 23-26　2019/09　Research paper (conference, symposium, etc.)

Laser metal bumping with SUS316L molten powder jet for steel / carbon fiber reinforced thermoplastics joint

K. Yasuda, Y. Uchida, R. Tamura, T. Hara, Y. Sato, M. Tsukamoto

Proc. the 8th International Congress on Laser Advanced Materials Processing (LAMP2019)　2019/09　Research paper (international conference proceedings)

Ultrasonic Bonding Technology for Micro System Integration

YASUDA Kiyokazu

Journal of The Japan Institute of Electronics Packaging　Vol. 22　No. 5　p. 395-399　2019/08

Ultrasonic Joining of Carbon Fiber Reinforced Thermoplastic and Ti Alloy

Rennosuke Tamura, Kiyokazu Yasuda

2018 IEEE CPMT Symposium Japan (ICSJ)　p. 135-138　2018/11　Research paper (international conference proceedings)

Direct Joining of Carbon Fiber Reinforced Thermoplastics and Magnesium Alloys by Thermal Compression

Kiyokazu Yasuda, Kohei Kawakami

Preprints of the National Meeting of JWS　Vol. 2018f　p. 424-425　2018/09　Research paper (conference, symposium, etc.)

Direct Joining of Carbon Fiber Reinforced Thermoplastics and Magnesium Alloys by Vertical Ultrasonic Vibration

Kohei Kawakami, Kiyokazu Yasuda

Preprints of the National Meeting of JWS　Vol. 2018f　p. 208-209　2018/09　Research paper (conference, symposium, etc.)

縦振動超音波によるアルミニウム合金と炭素繊維強化熱可塑性樹脂の接合

安田清和

超音波techno　Vol. 30　No. 4　p. 25-29　2018/08　Research paper (other academic)

Creation and functional control of metal nanoparticle-polymer interface by laser plasma EUV light excitation

K. Yasuda, N. Tanaka, N. Wada, H. Nishimura

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018　p. 535-538　2018/06/06　Research paper (international conference proceedings)

Laser Metal Bumping with SUS316L Molten Powder Jet by Blue Diode Laser for Steel / Carbon Fiber Reinforced Thermoplastics Joint

K. Yasuda, Y. Uchida, R. Tamura, T. Hara, Y. Sato, M. Tsukamoto

Technical Digest of the 3rd Smart Laser Processing Conference 2018　2018/04　Research paper (international conference proceedings)

Surface Layer Modification of Metal Nanoparticle Supported Polymer by Irradiation of Laser-Driven Extreme Ultraviolet Light

N. Tanaka, R. Deguchi, N. Wada, K. Yasuda, A. Yogo, H. Nishimura

Springer Proceedings in Physics　Vol. 202　p. 377-381　2018　Research paper (international conference proceedings)

Carbon Fiber Reinforced Platform for Automotive Electronics

Yuki Uchida, Kiyokazu Yasuda

Proceedings of the IEEE CPMT Symposium Japan 2017　p. 155-156　2017/11　Research paper (international conference proceedings)

Ultrasonic Joining of Carbon Fiber Reinforced Thermoplastics and Titanium Alloys

Rennosuke Tamura, Kiyokazu Yasuda

Preprints of the National Meeting of JWS　Vol. 2017f　p. 128-129　2017/09　Research paper (conference, symposium, etc.)

Microwave Joining of Carbon Fiber Reinforced Thermoplastic and Aluminum Alloys

Kiyokazu Yasuda, Hiroshi Nishida

Preprints of the National Meeting of JWS　Vol. 101　p. 312-313　2017/09　Research paper (other academic)

Disassembling Characteristics of Heterogeneous Materials Interface of Aluminum and Polyamide Resin by Microwave Heating

Kiyokazu Yasuda

Proc. of the 27th Microelectronics Symposium　Vol. 27　p. 263-266　2017/08　Research paper (other academic)

Study on Dissimilar Materials Joining of Carbon Fiber Reinforced Plastic and Steel

Yuki Uchida, Kiyokazu Yasuda, Yoshinori Hirata, Satoru Asai

2016/09　Research paper (conference, symposium, etc.)

Development of bio-adhesive surface for self-resilient interface materials

Kiyokazu Yasuda

Proc. of the 26th Microelectronics Symposium　Vol. 26　p. 243-246　2016/09　Research paper (other academic)

Biomimetic Welding Design for Aluminum Alloy and Carbon Fiber Reinforced Polymer

Kiyokazu Yasuda

Proc. The Ninth Pacific Rim International Conference on Advanced Materials and Processing (PRICM9)　p. 260-262　2016/08　Research paper (international conference proceedings)

Dissimilar Materials Joining of Aluminum Alloy and Carbon Fiber Reinforced Thermoplastics by Using Vertical Ultrasonic Vibration for Metal/Resin Hybrid Structure

Kiyokazu Yasuda, Hiroshi Nishida

Preprints of the National Meeting of J.W.S.　Vol. 98　p. 84-85　2016/04　Research paper (other academic)

Observation of Laser Driven Solder Particle Wetting in Functional Resin Reinforced Solder Paste

Kousei Kitamura, Kiyokazu Yasuda

Proceedings of the 22th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 22　p. 439-440　2016/02　Research paper (other academic)

Novel Micro Assembly using Functional Resin Reinforced Solder Paste Driven by Laser

Kiyokazu Yasuda

Proceedings of the 22th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 22　p. 303-306　2016/02　Research paper (scientific journal)

Direct Bonding of Carbon Fiber Reinforced Thermoplastics and Aluminum Alloys by Microwave Heating

Hiroshi Nishida, Kiyokazu Yasuda, Yoshinori Hirata

Preprints of the National Meeting of J.W.S.　Vol. 97　p. 342-343　2015/09　Research paper (other academic)

Void Reduction Effect by Inert Atmospheric Reflow Process in the Micro Bump Self-Formation

Mizuki Ishida, Kiyokazu Yasuda

Proc. of the 25th Microelectronics Symposium　Vol. 25　p. 297-300　2015/09　Research paper (other academic)

X-ray Photoelectron Spectroscopy Analysis of Gold Palladium Nanoparticles - PDMS Interface

Kiyokazu YASUDA, Nozomi TANAKA, Masaya MASUDA, Ryo DEGUCHI, Hiroaki NISHIMURA

Proc. of the 83rd Laser Materials Processing Conference　Vol. 83　2015/06　Research paper (other academic)

Biomimetic self-resilience materials design for tactile devices

K. Yasuda

ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference　p. 153-156　2015/05/20　Research paper (international conference proceedings)

Biomimetic Self-Resilience Materials Design for Tactile Devices

K. Yasuda

2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC)　p. 153-156　2015　Research paper (international conference proceedings)

Self-Linking Mechanism of Micro Solder Particles Dispersion in Liquidus Polymer

K. Yasuda, M. Ishida

2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC)　p. 157-160　2015　Research paper (international conference proceedings)

Conformation Analysis of Solder Micro Particles in Resin Liquids for the Self-Forming Micro Bumping

Kiyokazu YASUDA

Proc. of the International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation　Vol. 1　p. 200-201　2014/11　Research paper (international conference proceedings)

Hierarchically-Organized Aluminum Surface Formed by Anode Oxidation for Direct Bonding on Polyphenylene Sulfide

Ryo SAITO, Kiyokazu YASUDA, Yoshinori HIRATA

Proc. of the International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation　Vol. 1　p. 309-310　2014/11　Research paper (international conference proceedings)

Effect of Surface Pretreatment of Patterned Substrates on the Formation of Micro Bumps by Hybrid System of Sn-Bi-Ag Solder Particles and Epoxy

Kiyokazu YASUDA, Mizuki ISHIDA, Yoshinori HIRATA

Proc. of the International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation　Vol. 1　p. 311-312　2014/11　Research paper (international conference proceedings)

Effect of Surface Pretreatment of Patterned Substrates on the Formation of Micro Bumps by Hybrid System of Sn-Bi-Ag Solder Particles and Epoxy

Kiyokazu Yasuda

Proc. of the 24th Microelectronics Symposium　Vol. 24　p. 307-310　2014/09　Research paper (conference, symposium, etc.)

Surface Modification of Elastomeric Sheet Materials for the Self-Resilience Bio-Interface

Kiyokazu YASUDA, Kensuke KURODA, Masazumi OKIDO

Polymer Preprints, Japan　Vol. 63　No. 2　p. 6892-6893　2014/09　Research paper (other academic)

Effect of Surface Pretreatment of Patterned Substrates on the Formation of Micro Bumps by Hybrid System of Sn-Bi-Ag Solder Particles and Epoxy

Kiyokazu Yasuda

Proc. of the 24th Microelectronics Symposium　Vol. 24　p. 307-310　2014/09　Research paper (other academic)

Effect of Plasma Treatment on Resilience Properties of Natural Wrinkle Patterns

Kiyokazu Yasuda

The 15th IUMRS-International Conference in Asia (IUMRS-ICA 2014)　2014/08　Research paper (other academic)

Effect of Plasma Treatment on Resilience Properties of Natural Wrinkle Patterns

Kiyokazu Yasuda

The 15th IUMRS-International Conference in Asia (IUMRS-ICA 2014)　2014/08

Observation of Wetting and Spreading Phenomena of Functional Resin Reinforced Solder Paste

Kiyokazu Yasuda

Proceedings of the 20th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 20　p. 161-164　2014/02　Research paper (conference, symposium, etc.)

Observation of Wetting and Spreading Phenomena of Functional Resin Reinforced Solder Paste

Kiyokazu Yasuda

Proceedings of the 20th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 20　p. 161-164　2014/02　Research paper (scientific journal)

Effect of surface roughening of aluminum plates on the strength of bonds formed between aluminum and polyphenylene sulfide by thermosonic bonding

Kiyokazu Yasuda, Ryo Saito

INTERNATIONAL SYMPOSIUM ON INTERFACIAL JOINING AND SURFACE TECHNOLOGY (IJST2013)　Vol. 61　2014　Research paper (international conference proceedings)

Ultrasonic bonding of aluminum on polyphenylene sulfide

Kiyokazu Yasuda, Ryo Saito

Proceedings of International Symposium on Interfacial Joining and Surface Technology (IJST2013)　p. 39-40　2013/11　Research paper (international conference proceedings)

Hierarchical surface modification of self-resilience bio-interface materials by low pressure plasma

Kiyokazu Yasuda, Masafumi Hosoya

Proceedings of the 23rd Microelectronics Symposium　Vol. 23　p. 261-264　2013/09　Research paper (conference, symposium, etc.)

Hierarchical surface modification of self-resilience bio-interface materials by low pressure plasma

Kiyokazu Yasuda, Masafumi Hosoya

Proceedings of the 23rd Microelectronics Symposium　Vol. 23　p. 261-264　2013/09　Research paper (other academic)

Bonding Dissimilar Materials between Aluminum and Poly Phenylene Sulfide Resin for Metal-Resin Hybrid Structure

Ryo Saito, Kiyokazu Yasuda, Yoshinori Hirata

Preprints of the National Meeting of J.W.S.　Vol. 93　p. 230-231　2013/08　Research paper (other academic)

Microjoining by Means of Self-Formation of Melting Solder Bump Patterns in Thermo-Setting Resin

Kiyokazu Yasuda

Proceedings of the International Conference on Nanojoining and Microjoining 2012　p. 31-32　2012/12　Research paper (international conference proceedings)

Dynamic Mechanical Behavior of Sn-Bi Lead-Free Solders by Tensile Test under High Strain Rate

Kiyokazu Yasuda, Yoshihiro Sakino, Ikuo Shohji, Tadashi Takemoto, Hiroshi Nishikawa

Proceedings of the International Symposium on Visualization in Joining & Welding Science Through Advanced Measurements and Simulation　Vol. 2　2012/11　Research paper (international conference proceedings)

Self-Organized Adhesive Joining Using Containing Alloy Micro Particles and its Application to a Joining of Dissimilar Materials

Kiyokazu Yasuda

Material Stage　Vol. 12　No. 7　p. 40-44　2012/10

Self-Organized Adhesive Joining Using Containing Alloy Micro Particles and its Application to a Joining of Dissimilar Materials

Kiyokazu Yasuda

Material Stage　Vol. 12　No. 7　p. 40-44　2012/10

Hierarchical Surface Modification of Bio-Interface Material with Self-Resilence for the Improvement of Printing Property

Kiyokazu Yasuda

Proceedings of 22nd Microelectronics Symposium (MES2012)　Vol. 22　p. 73-74　2012/09　Research paper (other academic)

Self-Formation Process for the Hybrid System of Sn-Bi Solder and Silicone Polymer -Effect of the Distribution of Solder Particle Size on the Shape of Micro Bumps-

Kiyokazu Yasuda

Preprints of the National Meeting of J.W.S.　Vol. 91　p. 88-89　2012/09　Research paper (other academic)

Characterization of Micro Solder Bumps Fabricated by the Self-Formation Process

Kiyokazu Yasuda

The 2nd East Asia Symposium on Technology of Welding and Joining　2012/09　Research paper (conference, symposium, etc.)

Characterization of Micro Solder Bumps Fabricated by the Self-Formation Process

Kiyokazu Yasuda

The 2nd East Asia Symposium on Technology of Welding and Joining　2012/09

Low temperature solid-solid joining by the control of surface energy

Masashi Ohsima, Hisaaki Takao, Hirofumi Ito, Kiyokazu Yasuda

Preprints of the National Meeting of J.W.S.　Vol. 91　p. 114-115　2012/09　Research paper (other academic)

Self-Formation Process for the Hybrid System of Sn-Bi Solder and Silicone Polymer -Effect of the Distribution of Solder Particle Size on the Shape of Micro Bumps-

Kiyokazu Yasuda

Preprints of the National Meeting of J.W.S.　Vol. 91　p. 88-89　2012/09　Research paper (other academic)

Laser processing for strengthening of the self-restoring metal-elastomer interface on a silicone sheet

Kiyokazu Yasuda

J. Phys.: Conf. Ser.　Vol. 379　2012/08　Research paper (scientific journal)

自己復元性を有する生体インタフェース材料のレーザ表面処理による配線形成

関戸規之, 高井 治, 安田清和

第18回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集　Vol. 18　p. 323-326　2012/01　Research paper (conference, symposium, etc.)

Sn-Biはんだ粒子－シリコーン混合系による自己形成マイクロバンプの形態解析

雨森則人, 高井 治, 安田清和

第18回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集　Vol. 18　p. 103-106　2012/01　Research paper (conference, symposium, etc.)

Surface Characterization of Resilience Sheet as a Packaging Material for the Metallic Ink Printing

Kiyokazu Yasuda

2012 2ND IEEE CPMT SYMPOSIUM JAPAN　p. 239-242　2012　Research paper (international conference proceedings)

Surface characterization of resilience sheet as a packaging material for the metallic ink printing

Kiyokazu Yasuda

2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012　p. 239-242　2012　Research paper (international conference proceedings)

Laser processing for strengthening of the self-restoring metal-elastomer interface on a silicone sheet

Kiyokazu Yasuda

INTERNATIONAL SYMPOSIUM ON MATERIALS SCIENCE AND INNOVATION FOR SUSTAINABLE SOCIETY: ECO-MATERIALS AND ECO-INNOVATION FOR GLOBAL SUSTAINABILITY (ECO-MATES 2011)　Vol. 379　2012　Research paper (international conference proceedings)

Sn-Biはんだ粒子－シリコーン混合系による自己形成マイクロバンプの形態解析

雨森則人, 高井 治, 安田清和

第18回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集, Vol.18, pp.103-106 (2012)　Vol. 18　p. 103-106　2012/01　Research paper (scientific journal)

自己復元性を有する生体インタフェース材料のレーザ表面処理による配線形成

関戸規之, 高井 治, 安田清和

第18回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集, Vol. 18, pp. 323-326 (2012)　Vol. 18　p. 323-326　2012/01　Research paper (scientific journal)

Self-Assembly Process for Array Interconnects Pattern Using Solder/Polymer Hybrid Materials

Kiyokazu Yasuda

IEEE Transactions on Components, Packaging and Manufacturing Technology　Vol. 1　No. 12　p. 1895-1900　2011/12　Research paper (scientific journal)

Micro Pattening of Self-restoring Substrates for Flexible MEMS

Kiyokazu Yasuda

13th International Conference on Electronics Materials and Packaging (EMAP2011)　2011/12　Research paper (other academic)

Micro Pattening of Self-restoring Substrates for Flexible MEMS

Kiyokazu Yasuda

13th International Conference on Electronics Materials and Packaging (EMAP2011)　2011/12

Self-Assembly Process for Array Interconnects Pattern Using Solder/Polymer Hybrid Materials

Kiyokazu Yasuda

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY　Vol. 1　No. 12　p. 1895-1900　2011/12　Research paper (scientific journal)

Infrared Laser Micro Patterning of Silicone for the Fabrication of Bio-Interface Material

Noriyuki Sekido, Kiyokazu Yasuda, Osamu Takai

Proceedings of 15th International Conference on Thin Films (ICTF-15), CD-No. O-S6-18 (2011)　2011/11　Research paper (international conference proceedings)

Influence of Viscosity of Silicone on Sn-Bi Bump Assembly by Self-Formation Process

Norihito Amemori, Kiyokazu Yasuda, Osamu Takai

Proceedings of 15th International Conference on Thin Films (ICTF-15), CD-No. P-S6-17 (2011)　2011/11　Research paper (international conference proceedings)

Selective Printing Properties of Nickel Micro/Nano Particle Solution on Flexible Polymer Surface

Kiyokazu Yasuda

Proceedings of 15th International Conference on Thin Films (ICTF-15), CD-No. O-S6-05 (2011)　2011/11　Research paper (international conference proceedings)

Self-Retoring Materials Processing for Metal-Elastomer Interface by Nickel Deposition on Silicone Sheet

Kiyokazu Yasuda

Proceedings of International Sympsium on Materials and Innovation for Sustainable Society (ECO-MATES 2011)　Vol. 1　p. 157-158　2011/11　Research paper (international conference proceedings)

Sn-Bi系粒子－シリコーン混合系による 低温マイクロバンプ形成技術

安田清和

第52回マイクロ接合研究委員会ソルダリング分科会資料　Vol. 52　2011/10　Research paper (conference, symposium, etc.)

Self-Assembling Adhesive Bonding by Using Fusible Alloy Paste for Microelectronics Packaging

Kiyokazu Yasuda

Proceedings of the 10th International Symposium on Microelectronics and Packaging　Vol. 10　p. 249-251　2011/09　Research paper (international conference proceedings)

自己復元性を有する生体インタフェース材料の検討 ―基材表面処理が配線形成に及ぼす影響―

関戸則之, 安田清和, 高井 治

溶接学会全国大会講演概要第８９集　Vol. 89　p. 276-277　2011/09　Research paper (other academic)

Sn-Bi合金粒子－シリコーン高分子混合系の自己形成プロセス ―高分子粘性がマイクロバンプの形成に及ぼす影響―

雨森則人, 安田清和, 高井 治

溶接学会全国大会講演概要第８９集　Vol. 89　p. 274-275　2011/09　Research paper (other academic)

SnAgCu系はんだの高速引張変形挙動に関する基礎的検討

安田清和, 西川 宏

大阪大学接合科学研究所共同研究報告(2010年度）　p. 211-212　2011/07　Research paper (bulletin of university, research institution)

Observation of Micro Solder Bump Replication Phenomena by High Speed CCD Camera

Kiyokazu Yasuda, Norihito Amemori, Osamu Takai

Proc. of International Conference on Electronics Packaging (ICEP) 2011　p. 537-541　2011/04　Research paper (international conference proceedings)

Mechanical and Electrical Properties of Self-Restoring Sheet Materials for Stretchable Circuits

Kiyokazu Yasuda, Noriyuki Sekido, Osamu Takai

Proc. of International Conference on Electronics Packaging (ICEP) 2011　p. 981-985　2011/04　Research paper (international conference proceedings)

はんだ-高分子ハイブリッド材によるマイクロ接続のための自己形成プロセス

安田清和

第２５回エレクトロニクス実装学会春季講演大会講演論文集　Vol. 25　p. 334-335　2011/03　Research paper (other academic)

自己復元性を有する生体インタフェース材料の電気・機械的特性の向上

関戸規之, 安田清和, 高井 治

第17回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集　Vol. 17　p. 257-260　2011/02　Research paper (conference, symposium, etc.)

Sn-Biはんだ粒子－シリコーン混合系による自己形成マイクロバンプの観察

雨森則人, 安田清和, 高井 治

第17回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集　Vol. 17　p. 253-256　2011/02　Research paper (conference, symposium, etc.)

Dynamic mechanical behavior of Sn-Ag-Cu lead-free solders by tensile test under high strain rate

Kiyokazu Yasuda, Yoshihiro Sakino, Ikuo Shoji, Tadashi Takemoto

Proceedings of the International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2010)　p. 29-30　2010/11　Research paper (international conference proceedings)

Smart Processing for Micro Interconnects by Self-Replication

Kiyokazu Yasuda

Proceedings of Materials Science and Technology (MS&T) 2010　p. 2743-2751　2010/10　Research paper (international conference proceedings)

可融金属フィラー・樹脂ハイブリッド材によるMEMS接合

安田清和

2010年度精密工学会秋季大会学術講演会講演論文集　p. 477-478　2010/09　Research paper (other academic)

自己復元性を有する生体インタフェース材料の電気・機械的評価

関戸規之, 高井 治, 安田清和

第２０回マイクロエレクトロニクスシンポジウム論文集　Vol. 20　p. 207-210　2010/09　Research paper (other academic)

Analysis of macroscopic self-organization process in the hybrid system on low melting point solder and polymeric materials

Vol. 20　p. 223-226　2010/09　Research paper (other academic)

Process Design of Self-Replication for Micro Bump Formation

Kiyokazu Yasuda

Proceedings of IEEE CPMT Symposium Japan (ICSJ2010)　p. 118-121　2010/08　Research paper (international conference proceedings)

鉛フリーはんだの高速引張変形挙動に関する基礎的検討

安田清和, 竹本 正

大阪大学接合科学研究所共同研究報告(2009年度）　p. 222-223　2010/07　Research paper (bulletin of university, research institution)

Micro Bump Formation by Self-Replication Method

Kiyokazu Yasuda

Proc. International Conference on Electronics Packaging 2010 (ICEP2010)　p. 185-189　2010/04　Research paper (international conference proceedings)

Dynamic mechanical behavior of Sn-Ag-Cu lead-free solders by tensile test under high strain rate

Kiyokazu Yasuda, Yoshihiro Sakino, Ikuo Shohji, Tadashi Takemoto

Transactions of JWRI　Vol. 39　No. 2　2010/02　Research paper (bulletin of university, research institution)

Visual Inspection of Soldering Joints by Neural Network with Multi-angle View and Principal Component Analysis

Michiya Matsushima, Naohiro Kawai, Hiroyuki Fujie, Kiyokazu Yasuda, Kozo Fujimoto

SERVICE ROBOTICS AND MECHATRONICS　p. 329-334　2010　Research paper (international conference proceedings)

Self-Replicating Process for Micro Interconnect Array Pattern Using Solder/Polymer Hybrid Materials

Kiyokazu Yasuda

2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　p. 1416-1421　2010　Research paper (international conference proceedings)

Effects of Oxide Films around Solder Fillers and Activation Effect of Resin on Coalescence Behavior in Self-Organization Assembly Method

Koushi OHTA, Masao TOYA, Kiyokazu YASUDA, Michiya MATSUSHIMA, Kozo FUJIMOTO

Vol. J92-C　No. 12　p. 833-841　2009/12　Research paper (scientific journal)

Solder Filler Motion Driven by Interfacial Tension in Self-Organization Assembly Process

Kiyokazu Yasuda

J. Solid Mechanics and Materials Engineering　Vol. 3　No. 12　p. 1356-1362　2009/12　Research paper (scientific journal)

Filler Motion Dynamics in Resin for Flip Chip Micro Interconnects

K. Ohta, K. Fujimoto, M. Matsushima, K. Yasuda

Proc. International Conference on Electronics Packaging 2009 (ICEP2009)　p. 939-942　2009/04　Research paper (international conference proceedings)

Fatigue life deterioration against vibration by pre-loaded thermal history

Matsushima Michiya, Egusa Minoru, Shishihara Yuki, Yasuda Kiyokazu, Fujimoto Kozo

Proceedings of JIEP Annual Meeting　Vol. 23　p. 188-189　2009

Movement of solder fillers because of the unevenness of interfacial tension in self-organization assembly process

Koushi Ohta, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

Journal of Physics: Conference Series　Vol. 165　2009　Research paper (international conference proceedings)

Effect of Fluxing Activation on the Formation of Bubbles in Self-Organization Joining (invited)

Kiyokazu Yasuda, Masao Toya, Michiya Matsushima, Kozo Fujimoto

Proceedings of 8th International Welding Symposium　Vol. 8　2008/11　Research paper (international conference proceedings)

The effects of thermal environmental stress and residualstress on the reliability of BGA solder joints

Michiya Matsushima, Minoru Egusa, Kiyokazu Yasuda, Kozo Fujimoto

Proceedings of 8th International Welding Symposium　Vol. 8　2008/11　Research paper (international conference proceedings)

Visual Inspection of Soldering Joints by Neural Network with Multi-angle View and Principal Component Analysis

Michiya Matsushima, Naohiro Kawai, Hiroyuki Fujie, Kiyokazu Yasuda, Kozo Fujimoto

Proceedings of the 7th International Conference on Machine Automation　Vol. 7　p. 305-310　2008/09　Research paper (international conference proceedings)

Self-Organization Conductive Adhesion by Resin Containing Fusible Metallic Micro Particles (invited)

Kiyokazu Yasuda

Proc. of the 46th Symposium on Adhesion and Adhesives, the Adhesion Society of Japan　p. 163-166　2008/06　Research paper (other academic)

Effect of specimen size and aging on tensile properties of Sn-Ag-Cu lead-free solders

Ikuo Shohji, Tsutomu Osawa, Takashige Matsuki, Yoshiharu Kariya, Kiyokazu Yasuda, Tadashi Takemoto

MATERIALS TRANSACTIONS　Vol. 49　No. 5　p. 1175-1179　2008/05　Research paper (scientific journal)

Effect of Bubble Generation on Self-Organization Joining

K. Yasuda, S. Motoshige, M. Matsushima, K. Fujimoto

Smart Processing Technology　Vol. 2　p. 75-78　2008/03　Research paper (scientific journal)

Effect of Ni Nano-Particles Addition in Sn-Bi Solder on Cu/Cu Thin Film Joint

K. Yasuda, S. Miyazako, M. Matsushima, K. Fujimoto

Smart Processing Technology　Vol. 2　p. 107-110　2008/03　Research paper (scientific journal)

Effect of aging on tensile properties of low-melting lead-free solders evaluated by micro size specimens

I. Shohji, T. Osawa, T. Matsuki, Y. Kariya, K. Yasuda, T. Takemoto

Smart Processing Technology　Vol. 2　p. 99-102　2008/03　Research paper (scientific journal)

Tensile Properties of Several Lead-free Solders Evaluated by Micro Size Specimens

Tsutomu Osawa, Ikuo Shohji, Takashige Matsuki, Yoshiharu Kariya, Kiyokazu Yasuda, Tadashi Takemoto

Proc. 14th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 14　p. 115-118　2008/02　Research paper (scientific journal)

Moving Mechanisms of Solder Particles in Self-Organization Assembly Process

Koushi Ohta, Masao Toya, Shin-ichi Motoshige, Kiyokazu Yasuda, Kozo Fujimoto

Proc. 14th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 14　p. 207-212　2008/02　Research paper (scientific journal)

Relation between Activation Level of Resin and Mounting Performance in Self-Organization Assembly Process

Masao Toya, Koushi Ohta, Kiyokazu Yasuda, Kozo Fujimoto

Proc. 14th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 14　p. 201-206　2008/02　Research paper (scientific journal)

Reliability evaluation of lead free solder joint against vibration load under thermal circumstance

Michiya Matsushima, Toshiyuki Hamano, Kiyokazu Yasuda, Kozo Fujimoto

IEICE Technical Report　Vol. 107　No. 425　p. 117-122　2008/01　Research paper (other academic)

Bended Interconnection using Graded Index Optical Waveguide for High Speed Optical Communication

Kiyokazu Yasuda, Kunio Ota, Michiya Matsushima, Kozo Fujimoto

ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS　Vol. 2　p. 963-967　2008　Research paper (international conference proceedings)

Characterization for Dynamic Micro Wetting of Lead-Free Solder Paste

Kiyokazu Yasuda

ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS　Vol. 2　p. 1349-1352　2008　Research paper (international conference proceedings)

Influence of die adhesion properties on delamination of stacked chip interconnection encapsulated in plastic package

Shinji Takei, Masaaki Koyama, Tomoaki Goto, Kiyokazu Yasuda

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium　2008　Research paper (international conference proceedings)

Observation of solder fillers coalescence in resin for development of self-organization assembly process

Koushi Ohta, Masao Toya, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium　Vol. 8　2008　Research paper (international conference proceedings)

Effect of micro structure in fuel cell electrode on concentration of species in reaction layer

Masahiko Sugimura, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

ADVANCED WELDING AND MICRO JOINING / PACKAGING FOR THE 21ST CENTURY　Vol. 580-582　p. 151-154　2008　Research paper (international conference proceedings)

Estimation of thermal fatigue resistance of Sn-Bi (-Ag) and Sn-Ag-Bi-Cu lead-free solders using strain rate sensitivity index

Kiyokazu Yasuda, Ikuo Shohji, Tadashi Takemoto

ADVANCED WELDING AND MICRO JOINING / PACKAGING FOR THE 21ST CENTURY　Vol. 580-582　p. 221-+　2008　Research paper (international conference proceedings)

Effect of Aging on Tensile Properties of Low-Melting Lead-Free Solders Evaluated by Micro Size Specimens

Ikuo Shohji, Tsutomu Osawa, Takashige Matsuki, Yoshiharu Kariya, Kiyokazu Yasuda, Tadashi Takemoto

Proc. 2nd International Symposium on Smart Processing Technology　2007/11　Research paper (international conference proceedings)

Reliability Evaluation of Lead Free Solder Joint against Vibration Load under Thermal Circumstance

Michiya MATSUSHIMA, Toshiyuki HAMANO, Kiyokazu YASUDA, Kozo FUJIMOTO

The IEICE Transactions on Electronics　Vol. J90-C　No. 11　p. 807-813　2007/11　Research paper (scientific journal)

Numerical Study on Formation Process of Conductive Paths in Self-Organization Assembly Process

Koushi Ohta, Masao Toya, Shinichi Motoshige, Kiyokazu Yasuda, Kozo Fujimoto

Proceedings of the 17th Microelectronics Symposium　Vol. 17　p. 59-62　2007/09　Research paper (other academic)

Self-Organized Joining using Low-Melting-Point Metal Fillers

Kiyokazu Yasuda

Preprint of Kansai Workshop 2007　2007/07　Research paper (other academic)

Self-Organization Joining by Selective Wetting using Hybrid System of Resin/Fusible Metal Microparticles

Kiyokazu Yasuda

Technical Document of the JWES Advanced Materials Joining Committee　2007/07　Research paper (other academic)

Estimation of Thermal Fatigue Resistance of Sn-Bi(-Ag) and Sn-Ag-Bi-Cu Lead-Free Solders using Strain Rate Sensitivity Index

Kiyokazu Yasuda, Ikuo Shohji, Tadashi Takemoto

Proc. International Welding/Joining Conference-Korea 2007　p. 94-95　2007/05　Research paper (international conference proceedings)

Effect of Micro Structure in Fuel Cell Electrode on Concentration of Species in Reaction Layer

Masahiko Sugimura, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

International Welding/Joining Conference-Korea 2007　Vol. 580-582　p. 68-69　2007/05　Research paper (other academic)

System Integration by Opto-Electronics Device Packaging

Kozo Fujimoto, Kiyokazu Yasuda

Center of Excellence for Advanced Structural and Functional Materials Design (ASFMD) Reoprt 2006　p. 83-88　2007/03　Research paper (bulletin of university, research institution)

Optimal Structure Design of Micro-Fuel Cell for Portable Devices

Masahiko Sugimura, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

Center of Excellence for Advanced Structural and Functional Materials Design (ASFMD) Reoprt 2006　p. 163-164　2007/03　Research paper (bulletin of university, research institution)

Effect of Microstructure in Thermal Cycle Stress on Fatigue Life under Vibration Stress

K. Fukuda, M. Egusa, M. Nakaura, M. Matsushima, K. Yasuda, K. Fujimoto

Proceedings of the 13th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 13　p. 309-314　2007/02　Research paper (scientific journal)

Propagation Loss Analysis of Optical Waveguide Considering Interfacial Roughness Due to Manufacturing Process

Akiya Kimura, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

Proceedings of the 13th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 13　p. 147-152　2007/02　Research paper (scientific journal)

Influence of Electrode Structure on Reaction Efficiency in Direct Methanol Fuel Cell

Masahiko Sugimura, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

Proceedings of the 13th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 13　p. 91-96　2007/02　Research paper (scientific journal)

Analysis Concerning the Coalescence Behavior of Metal Droplet in Self-organization Assembly Process

Masaru Yamashita, Koushi Ohta, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

Proceedings of the 13th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 13　p. 55-60　2007/02　Research paper (scientific journal)

Numerical analysis of self-organizing interconnection process by 3 dimensional flow dynamics

Koushi Ohta, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

ADVANCES IN NANOMATERIALS AND PROCESSING, PTS 1 AND 2　Vol. 124-126　p. 543-+　2007　Research paper (international conference proceedings)

Self-Organizing Interconnection Process in Electronics Packaging

Kiyokazu Yasuda, Koushi Ohta, Masao Toya, Michiya Matsushima, Kozo Fujimoto

BK21 Korea University-Osaka University Workshop on Advanced Device and Materials　2007/01

Simulation of optical implementation and the evaluation of light propagation loss for a micro stereo-lithography in resin

Masatoshi Nakamura, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

Proceedings of the 16th Microelectronics Symposium　Vol. 16　p. 275-278　2006/10　Research paper (scientific journal)

Basic of Electronics Packaging

Kiyokazu Yasuda

METI Core Human Resource Development Program for Manufacturing by Business-Academia Collaboration, "Monozukuri Advanced Human Resource Development by Practice-base Pilot Program (OJE)", - Core Human Resource Development for Manufacturing Technology(Monozu　2006/10

Experimental verification of lateral flow effects in resin containing solder fillers on self-organizaiton joining process

Masao Toya, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

Proceedings of the 16th Microelectronics Symposium　Vol. 16　p. 335-338　2006/10　Research paper (scientific journal)

Numerical Analysis of Self-Organizing Interconnection Process by 3 Dimensional Flow Dynamics

Koushi Ohta, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

Proceedings of IUMRS-ICA-2006　Vol. 124-126　No. PART 1　p. 543-546　2006/09　Research paper (international conference proceedings)

Effects of Resin Flow Caused by Chip Lowering on Self-Organizing Interconnection Process

Koushi Ohta, Masao Toya, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

Proceedings of IUMRS-ICA-2006　2006/09　Research paper (international conference proceedings)

Fatigue Life of Lead Free Solder BGA Joints Against Vibration Stress under High Temperature Circumstance

Michiya MATSUSHIMA, Takeshi FURUSAWA, Kyouhei FUKUDA, Minoru EGUSA, Kiyokazu YASUDA, Kozo FUJIMOTO

Journal of High Temperature Society　Vol. 32　No. 4　p. 219-225　2006/07　Research paper (scientific journal)

Numerical analysis of anode electrode structure for optimized design in direct methanol fuel cell

Masahiko Sugimura, Michiya Matsushima, Kiyokazu Yasuda, Kozo Fujimoto

The 13th FCDIC Fuel Cell Symposium Proceedings　Vol. 13　p. 313-315　2006/05　Research paper (other academic)

Integrated design of embedded optical interconnect for direct laser process

K. Yasuda, K. Ota, M. Nakamura, A. Kimura, M. Matsushima, K. Fujimoto

Proceedings of the Fourth International Congress on Laser Advanced Materials Processing (LAMP2006)　2006/05　Research paper (international conference proceedings)

Research on Next Generation Electronics System Integration -Investigation of Self-Organizing Packaging Process based on MARS Method 3 Dimensional Binary Phase Flow Analysis-

Kiyokazu Yasuda, Kozo Fujimoto

Center of Excellence for Advanced Structural and Functional Materials Design (ASFMD) Reoprt 2005　p. 27-28　2006/03　Research paper (bulletin of university, research institution)

Cumulative Damage Evaluation of Vibration Stress Considering Thermal Stress

T. Furusawa, M. Egusa, M. Matsushima, K. Yasuda, K. Fujimoto, H. Nakajima, T. Hamano

Proceedings of the 12th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 12　p. 265-270　2006/02　Research paper (scientific journal)

Study on the Interface Characteristics of Copper Bonding Using Thin Film of Sn/In Alloys

Fukutaro Nishizawa, Katsumi Taniguchi, Kiyokazu Yasuda, Michiya Matsushima, Tomoaki Goto, Kozo Fujimoto

Proceedings of the 12th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 12　p. 377-380　2006/02　Research paper (scientific journal)

Study of Self-Organization Assembly Process Based on MARS Method 3-Dimensional 2-Phase Flow Analysis

Koushi Ohta, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

Proceedings of the 12th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 12　p. 381-386　2006/02　Research paper (scientific journal)

Propagation Loss Evaluation of Inter-chip Optical Communication System with Graded Index Optical Waveguide

Kunio Ota, Masatoshi Nakamura, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

Proceedings of the 12th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 12　p. 455-460　2006/02　Research paper (scientific journal)

Study on the Interface Characteristics of Copper Bonding Using Thin Film of Sn/In Alloys

Fukutaro Nishizawa, Katsumi Taniguchi, Kiyokazu Yasuda, Michiya Matsushima, Tomoaki Goto, Kozo Fujimoto

Proceedings of the 12th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 12　p. 377-380　2006/02　Research paper (scientific journal)

Cumulative Damage Evaluation of Vibration Stress Considering Thermal Stress

T. Furusawa, M. Egusa, M. Matsushima, K. Yasuda, K. Fujimoto, H. Nakajima, T. Hamano

Proceedings of the 12th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 12　p. 265-270　2006/02　Research paper (scientific journal)

Effect of chip heating in thermal cycle test of BGA solder joint

EGUSA Minoru, MATSUSHIMA Michiya, FUKUDA Kyohei, NAKAURA Masaki, YASUDA Kiyokazu, FUJIMOTO Kozo

Preprints of the National Meeting of JWS　Vol. 2006　p. 203-203　2006

Influence of resin viscosity and filler volume on self-organized micro interconnection

K Yasuda, K Ohta, K Fujimoto

ADVANCED STRUCTURAL AND FUNCTIONAL MATERIALS DESIGN, PROCEEDINGS　Vol. 512　p. 367-372　2006　Research paper (scientific journal)

Interface Properties of Thin Film Bonding by Low Melting Point Metal for MEMS devices

Kiyokazu Yasuda, Katsumi Taniguchi, Tomoaki Goto, Michiya Matsushima, Kozo Fujimoto

IEMT 2006: 31ST INTERNATIONAL CONFERENCE ON ELECTRONICS MANUFACTURING AND TECHNOLOGY　p. 328-+　2006　Research paper (international conference proceedings)

Design of the Anode Electrode Structure for the Micro Direct Methanol Fuel Cell by using the Numerical Analysis of Fuel Flow

Masahiko Sugimura, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

Proceedings of the 1st European Fuel Cell Technology and Applications Conference　Vol. 2005　2005/12　Research paper (international conference proceedings)

Estimation of thermal fatigue resistances of Sn-Ag and Sn-Ag-Cu lead-free solders using strain rate sensitivity index

Shohji, I, K Yasuda, T Takemoto

MATERIALS TRANSACTIONS　Vol. 46　No. 11　p. 2329-2334　2005/11　Research paper (scientific journal)

Power Loss Evaluation for Real Design of Photonic Waveguide System including Micro Periodical Structure

Akiya Kimura, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

Proceedings of the 15th Micro Electronics Symposium(2005)　Vol. 15　p. 289-292　2005/10　Research paper (scientific journal)

The Influence of Thermal Cycle stress on Mechanical Fatigue Strength of Pb Free solder BGA Joints

Michiya Matsushima, Yu Kawai, Kyouhei Fukuda, Kiyokazu Yasuda, Kozo Fujimoto

Proceedings of the Micro Electronics Symposium(2005)　Vol. 15　p. 109-112　2005/10　Research paper (scientific journal)

Numerical Study of the Self-Interconnection Assembly Method Using Resin Containing Solder Fillers

Koushi Ohta, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

Proc. of the 2005 International Conference on Solid State Devices and Materials　p. 566-567　2005/09　Research paper (international conference proceedings)

Computational Fluid Dynamics Considering Influence of Anode Electrode Structure for Micro Direct Methanol Fuel Cell Design

M. Sugimura, K. Yasuda, N. Nakao, M. Matsushima, K. Fujimoto

Proceedings of the International Fuel Cell Workshop (2005)　p. 288-293　2005/09　Research paper (international conference proceedings)

Novel interconnection method using electrically conductive paste with fusible filler

JM Kim, K Yasuda, K Fujimoto

JOURNAL OF ELECTRONIC MATERIALS　Vol. 34　No. 5　p. 600-604　2005/05　Research paper (scientific journal)

Database of Lead-Free Solder

Kiyokazu Yasuda

Welding Technology　Vol. 53　No. 4　p. 69-74　2005/04

416 Optimization of electrode structure by flow fluid simulation in direct methanol fuel cell

Sugimura Masahiko, Yasuda Kiyokazu, Fujimoto Kozo

Pre-Prints of the National Meeting of JWS　No. 76　p. 190-191　2005/03/22

Resin self-alignment processes for self-assembly systems

JM Kim, K Yasuda, K Fujimoto

JOURNAL OF ELECTRONIC PACKAGING　Vol. 127　No. 1　p. 18-24　2005/03　Research paper (scientific journal)

Adhesive joining process and joint property with low melting point filler

K Yasuda, JM Kim, K Fujimoto

JOURNAL OF ELECTRONIC PACKAGING　Vol. 127　No. 1　p. 12-17　2005/03　Research paper (scientific journal)

Self-Organized Packaging using Polymer Containing Low-Melting-Point-Metal

Kiyokazu Yasuda, Kohshi Ohta, Kozo Fujimoto

Proc. of the 11th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 11　p. 239-244　2005/02　Research paper (scientific journal)

Self-Organized Packaging by Polymer Containing Low Melting Point Metal - Experimental Verification of Process Rule Factors of Self-Organization -

Takayuki Yamada, Masaru Yamashita, Kiyokazu Yasuda, Kozo Fujimoto

Proc. of the 11th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 11　p. 245-250　2005/02　Research paper (scientific journal)

Study on Reliability of Solder Joint Combined Environment of Thermal and Vibration Stress

Yu Kawai, Kyohei Fukuda, Kiyokazu Yasuda, Kozo Fujimoto

Proc. of the 11th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 11　p. 319-324　2005/02　Research paper (scientific journal)

Study on The Interface Characteristics of Copper Direct Bonding Using Thin Film of Low Melting Temperature Alloys

Katsumi Taniguchi, Masahiro Ishikawa, Tomoaki Goto, Kiyokazu Yasuda, Kozo Fujimoto

Proc. of the 11th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 11　p. 425-428　2005/02　Research paper (scientific journal)

Research regarding additional study in neuro visual inspection system

Naoki Misonou, Kunio Ohta, Kiyokazu Yasuda, Kozo Fujimoto

Proc. of the 11th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 11　p. 385-390　2005/02　Research paper (scientific journal)

Study on Reliability of Solder Joint Combined Environment of Thermal and Vibration Stress

Yu Kawai, Kyohei Fukuda, Kiyokazu Yasuda, Kozo Fujimoto

Proc. of the 11th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 11　p. 319-324　2005/02　Research paper (scientific journal)

Propagation loss evaluation of optical transmission/interconnect system with grating structure

Akiya Kimura, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

EMAP 2005: International Symposium on Electronics Materials and Packaging　p. 125-128　2005　Research paper (international conference proceedings)

Isotropic conductive adhesives with fusible filler particles

JM Kim, K Yasuda, K Fujimoto

JOURNAL OF ELECTRONIC MATERIALS　Vol. 33　No. 11　p. 1331-1337　2004/11　Research paper (scientific journal)

Cu/Cu Direct Bonding using Thin Film of Low-Melting-Point Metals for Electronic Devices

Kiyokazu YASUDA, Kozo FUJIMOTO, Katsumi TANIGUCHI, Tomoaki GOTO

Proc. of International Conference on New Frontiers of Process Science and Engineering in Advanced Materials (PSEA'04)　p. 221-226　2004/11　Research paper (international conference proceedings)

Detection of Solder Joint Defection by Neural Network

Kunio Ohta, Naoki Misonou, Kiyokazu Yasuda, Kozo Fujimoto

Proc. of 14th Microelectronics Symposium　p. 81-84　2004/10　Research paper (scientific journal)

Analysis of propagation loss in light waveguide in consideration of heat distortion

Takeshi Furusawa, Kiyokazu Yasuda, Kozo Fujimoto

Proc. of 14th Microelectronics Symposium　Vol. 14　p. 325-328　2004/10　Research paper (scientific journal)

Interfacial Microstructure and Joint Properties of Copper Direct Bond Inserted by the Thin Film of Indium

Katsumi TANIGUCHI, Tomoaki GOTO, Kiyokazu YASUDA, Kozo FUJIMOTO

Proc. 2004 International Conference on Solid State Devices and Materials (SSDM 2004)　p. 282-283　2004/09　Research paper (international conference proceedings)

New process of self-organized interconnection in packaging using conductive adhesive with low melting point filler

K Yasuda, JM Kim, M Yasuda, K Fujimoto

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS　Vol. 43　No. 4B　p. 2277-2282　2004/04　Research paper (scientific journal)

Self-Organized ACP Interconnection Using Wetting Property of Fusible Fillers (Session Invite)

Kiyokazu YASUDA, Jong-Min KIM, Masahiro YASUDA, Kozo FUJIMOTO

Proc. International Conference on Electronics Packaging (2004 ICEP)　p. 125-140　2004/04　Research paper (international conference proceedings)

The effect of reduction capability of resin material on the solder wettability for electrically conductive adhesives (ECAs) assembly

JM Kim, K Yasuda, M Yasuda, K Fujimoto

MATERIALS TRANSACTIONS　Vol. 45　No. 3　p. 793-798　2004/03　Research paper (scientific journal)

Formation of a self-interconnected joint using a low-melting-point alloy adhesive

K Yasuda, JM Kim, M Yasuda, K Fujimoto

MATERIALS TRANSACTIONS　Vol. 45　No. 3　p. 799-805　2004/03　Research paper (scientific journal)

Self-Organized Joining Assembly Process by Electrically Conductive Adhesive Using Low Melting Point Fillers

Masahiro YASUDA, Jong-Min KIM, Kiyokazu YASUDA, Kozo FUJIMOTO

Proc. of the 10th Symposium on Microjoining and Assembly Technology in Electronics　No. 10　p. 183-188　2004/02　Research paper (scientific journal)

Study on the Interface Characteristics on Copper Direct Bonding Using Thin Film of Indium

Katsumi Taniguchi, Masayoshi SHIMODA, Tomoaki GOTO, Toshinori YAMADA, Kiyokazu YASUDA

Proc. of the 10th Symposium on Microjoining and Assembly Technology in Electronics　No. 10　p. 225-230　2004/02　Research paper (scientific journal)

New electrically conductive adhesives filled with low-melting-point alloy fillers

JM Kim, K Yasuda, M Rito, K Fujimoto

MATERIALS TRANSACTIONS　Vol. 45　No. 1　p. 157-160　2004/01　Research paper (scientific journal)

Thermo-mechanical damage analysis of through-hole formation by laser drilling for 3D opto-electronic device assembly

K Yasuda, M Kobayashi, K Fujimoto

FIFTH INTERNATIONAL SYMPOSIUM ON LASER PRECISION MICROFABRICATION　Vol. 5662　p. 621-626　2004　Research paper (international conference proceedings)

Copper Direct Bnding Process Using Thin Film of Indium

Katsumi Taniguchi, Masayoshi SHIMODA, Tomoaki GOTO, Toshinori YAMADA, Kiyokazu YASUDA, Kozo FUJIMOTO

Proc. of the 13th Microelectronics Symposium　Vol. 13　p. 172-175　2003/10　Research paper (scientific journal)

Resin Self-Alignment Processes for Assembly of Microelectronic and Optoelectronic Devices

Jong-Min KIM, Kiyokazu YASUDA, Kozo FUJIMOTO

Proc. of 3rd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics　Vol. 3　p. 17-22　2003/10　Research paper (international conference proceedings)

Adhesive Joining Process and Joint Property with Low Melting Point Filler

Kiyokazu YASUDA, Jong-Min KIM, Kozo FUJIMOTO

Proc. of 3rd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics　Vol. 3　p. 5-10　2003/10　Research paper (international conference proceedings)

New Process of Self-organzied Interconnection in Packaging by Conductive Adhesive with Low Melting Point Filler

Kiyokazu YASUDA, Jong-Min KIM, Masahiro YASUDA, Kozo FUJIMOTO

Proc. of the 2003 International Conference on Solid State Devices and Materials　p. 390-391　2003/09　Research paper (international conference proceedings)

Joining Mechanism and Joint Property by Polymer Adhesive with Low Melting Alloy Filler

Kiyokazu YASUDA, Jong-Min KIM, Masahiro RITO, Kozo FUJIMOTO

Proc. International Conference on Electronics Packaging (2003 ICEP)　p. 149-154　2003/04　Research paper (international conference proceedings)

Analysis of Primary Factor for Reflow Soldering Process with Diode-laser and Temperature Profile Control by Laser irradiation conditions

Mamoru Watanabe, Ryouji Inutuka, Kenji Takahashi, Michio Sakurai, Masahiro Yasuda, Kiyokazu Yasuda, Kozo Fujimoto

Proceedings of the 58th Laser Materials Processing Conference　p. 57-62　2003/03　Research paper (other academic)

Study on the Flux-free Direct Bonding and the Interface Characteristics Using Thin Film of Low Melting Temperature Alloys

Toshinori YAMADA, Hideaki AKAMIZU, Kiyokazu YASUDA, Kozo FUJIMOTO, Kazutaka IKEMI(Fuji Electric Co., LTD, Hirohiko WATANABE(Fuji Electric Co., LTD, Keiichi MATSUMURA(Fuji Electric Co, LT

Proc. of the 8th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 9　p. 103-108　2003/02　Research paper (scientific journal)

Assembly Process by Electrically Conductive Adhesive Using Low Melting Point Fillers

Masahiro RITO, Jong-Min KIM, Kiyokazu YASUDA, Kozo FUJIMOTO

Proc. of the 9th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 9　p. 115-120　2003/02　Research paper (scientific journal)

Alignment Motion of Self-Alignment Process Using Surface Tension of Liquid Resin

Jong-Min KIM, Kiyokazu YASUDA, Kozo FUJIMOTO

Proc. of the 9th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 9　p. 489-494　2003/02　Research paper (scientific journal)

Thermal analysis and quality prediction of via hole drilled on Si device by short pulse laser

K Yasuda, M Yasuda, K Fujimoto

THIRD INTERNATIONAL SYMPOSIUM ON LASER PRECISION MICROFABRICATION　Vol. 4830　p. 79-84　2003　Research paper (international conference proceedings)

Wetting and Spreading Properties of Lead Free Solder on Copper Substrate by Back-Plane YAG Laser Irradiation

Kiyokazu Yasuda, Mitsuhiro Okune, Shuji Nakata

Proc. Designing of International Structures in Advanced Materials and their Joints　p. 710-715　2002/11　Research paper (international conference proceedings)

Thermal analysis inlaser drilled via hole formation for 3-dimensional device creation

Masahiro Yasuda, Kiyokazu Yasuda, Kozo Fujimoto

Proc. of the 12th. Microelectronics Symposium　Vol. 12　p. 427-430　2002/10　Research paper (scientific journal)

3-D Highly Precise Self-Alignment Process Using Surface Tension of Liquid Resin Material

Jong-Min KIM, Kiyokazu YASUDA, Young-Eui SHIN, Kozo FUJIMOTO

IEICE TRANSACTIONS on Electronics　Vol. E85-C　No. 7　p. 1491-1498　2002/07　Research paper (scientific journal)

表面エネルギを評価指標としたはんだ付ブリッジの発生メカニズム -第２報-

古本敦司, 吉野 睦, 杉浦光宏, 安田清和

エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集　Vol. 8　p. 323-326　2002/01　Research paper (conference, symposium, etc.)

A Study on Design of Process for Self-Alignment Process Using Liquid Surface Tension

Jong-Min Kim, Kiyokazu Yasuda, Kozo Fujimoto

Proc. of the 8th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 8　p. 97-102　2002/01　Research paper (scientific journal)

Study of Evaluation of Adhesive Property in Resin Joint

Yusuke Ohta, Kiyokazu Yasuda, Kozo Fujimoto, Kazuhiro Nishikawa, Yoshihiko Yagi, Hiroyuki Ohtani

Proc. of the 8th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 8　p. 169-174　2002/01　Research paper (scientific journal)

Study of Nano Scale Structure Creation by Self-organization

Kazuhiko Negoro, Kiyokazu Yasuda, Kozo Fujimoto

Proc. of the 8th Symposium on Microjoining and Assembly Technology in Electronics　Vol. 8　p. 375-380　2002/01　Research paper (scientific journal)

Highly precise positioning method by pull-up model self-alignment process using liquid surface tension

Jong-Min Kim, Kiyokazu Yasuda, Kozo Fujimoto, Shuji Nakata

Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society　Vol. 20　No. 3　p. 346-354　2002　Research paper (scientific journal)

Geometry and Force Analysis of Molten Solder Surface in Microsoldering

Kiyokazu Yasuda, Kozo Fujimoto, Shuji Nakata

Proc. of the 7th International Syposium of Japan Welding Society　p. 1295-1300　2001/11　Research paper (international conference proceedings)

3-Dimensional Geometry and Force Analysis of Solder Meniscus on Surface Mount Device Model

Kiyokazu Yasuda, Kozo Fujimoto

Proc. of 2001 International Brazing & Soldering Conference　2001/10　Research paper (international conference proceedings)

Thermal Conduction Aspect of Immersion Copper Lead from Solder Paste and its Analysis of Wetting Phenomena

Kiyokazu Yasuda, Hideaki Akamizu, Kozo Fujimoto, Shuji Nakata

Proc. of the 7th Symposium on Micro-joining and Assembly Technology in Electronics　Vol. 7　p. 357-362　2001/02　Research paper (scientific journal)

Experimental Consideration of Wetting Behavior by In-situ Observation in Reflow Phenomenon

Kiyokazu Yasuda, Hideaki Akamizu, Kozo Fujimoto, Shuji Nakata

Proc. of the 7th Symposium on Micro-joining and Assembly Technology in Electronics　Vol. 7　p. 363-368　2001/02　Research paper (scientific journal)

Solder Bridging Mechanism by Comparing Surface Energy of Two Different States

Atsushi Furumoto, Denso Co, Mutsumi Yoshino, Denso Co, Mitsuhiro Sugiura, Denso Co, Kiyokazu Yasuda

Proc. of the 7th Symposium on Micro-joining and Assembly Technology in Electronics　Vol. 7　p. 369-372　2001/02　Research paper (scientific journal)

Numerical analysis of meniscus geometry and wetting force for wettability evaluation in reflow-mode wetting balance test

K Yasuda, T Kitada, K Fujimoto, S Nakata

MICRO MATERIALS, PROCEEDINGS　Vol. 3　p. 430-433　2000　Research paper (international conference proceedings)

Evaluation of wettability for microelectronic materials by reflow-mode wetting balance test

K Yasuda, H Akamizu, K Fujimoto, S Nakata

TWENTY SIXTH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, PROCEEDINGS　p. 247-252　2000　Research paper (international conference proceedings)

Analysis of Dynamic Wetting Phenomena in Evaluation of Wettability of Microelectronic Materials

Kiyokazu Yasuda, Mitsuhiko Ueda, Kozo Fujimoto, Shuji Nakata

Proc. of the 3rd Symposium on Microjoining and Assembly Technology in Electronics　Vol. 3　p. 243-248　1997/02　Research paper (scientific journal)

1995 Review of Welding in Japan III-4 Microjoining

Kiyokazu Yasuda

J. Japan Welding Society　Vol. 65　No. 5　p. 410-412　1996/07

Analysis of Wetting Force-Time Curve in Evaluation of Wettability of Microelectronic Materials

Kiyokazu Yasuda, Masanori Tada, Hidekazu Akasaka, Shuji Nakata

Proc. of the 2nd Symposium on Microjoining and Assembly Technology in Electronics　Vol. 2　p. 89-94　1996/02　Research paper (scientific journal)

Evaluation of Wettability of Microelectronic Materials and Its Problems

Kiyokazu Yasuda, Masanori Tada, Hidekazu Akasaka, Shuji Nakata

Proc. of the 2nd Symposium on Microjoining and Assembly Technology in Electronics　Vol. 2　p. 95-100　1996/02　Research paper (other academic)

1994 Review of Welding in Japan III-4 Microjoining

Kiyokazu Yasuda

J. Japan Welding Society　Vol. 64　No. 5　p. 361-363　1995/07

1993 Review of Welding in Japan III-4 Microjoining

Kiyokazu Yasuda

J. Japan Welding Society　Vol. 63　No. 5　p. 359-405　1994/07

Characterization of Thin Film Substrate Interface made by Ionized Cluster Beam Deposition

Kiyokazu YASUDA, Shuji NAKATA, Kazumichi MACHIDA, Youichi HASHIMOTO

Proc. the 5th International Syposium of the Japan Welding Society　1990/04　Research paper (international conference proceedings)