機関リポジトリ 3
-
Current-assisted low-temperature silver sinter bonding to silicon carbide by utilizing ion migration
Matsuda Tetsuhiro, Matsuda Tomoki, Kambara Makoto, Hirose Akio
Materials and Design Vol. 252 2025年4月1日
-
Lowering temperature of Cu sinter bonding under low-pressure in ambient air by in-situ generation and reduction of Cu₂O nanoparticles
Oba Miwa, Matsuda Tomoki, Dougakiuchi Masashi, Okubo Shio, Kambara Makoto
Journal of Materials Science: Materials in Electronics Vol. 36 No. 291 2025年2月10日
-
Evaluation of thermal anisotropic evolution in the sinter structure of direct sinter joining to silicon via coupled microstructural characterizations
Matsuda Tomoki, Seo Ryotaro, Takeuchi Akihisa, Uesugi Kentaro, Yasutake Masahiro, Kambara Makoto, Hirose Akio
Materials Science and Engineering: A Vol. 923 2025年2月1日