Oxidation-free silver porous sheet bonding onto a bare copper substrate in air

Eunjin Jo, YehRi Kim, Sangmin Lee, Masahiko Nishijima, Chuantong Chen, Katsuaki Suganuma, Young-Bae Park, Dongjin Kim

Materials Letters　Vol. 378　p. 137633-137633　2025/01　Research paper (scientific journal)

Effect of Ni addition and bath temperature on electroless Cu microstructure in microvia preparation for HDI substrate

Zheng Zhang, Ming-Chun Hsieh, Masahiko Nishijima, Aiji Suetake, Hiroshi Yoshida, Rieko Okumuara, Chuantong Chen, Hiroki Seto, Kei Hashizume, Yuhei Kitahara, Haruki Nagamura, Katsuaki Suganuma

Applied Surface Science　Vol. 678　p. 161128-161128　2024/12　Research paper (scientific journal)

Driving forces of solid-state Cu-to-Cu direct bonding suppressing the work-hardening loss by refill friction stir spot welding

Sangmin Lee, Seungyeop Baek, Seung-Joon Lee, Chuantong Chen, Masahiko Nishijima, Katsuaki Suganuma, Hiroshi Utsunomiya, Ninshu Ma, Ha-Young Yu, Dongjin Kim

Materials Science and Engineering: A　Vol. 915　p. 147178-147178　2024/11　Research paper (scientific journal)

Improved thermal shock reliability of Ag paste sintered joint by adjusted coefficient of thermal expansion with Ag-Si atomized particles addition

Wangyun Li, Chuantong Chen, Masahiko Nishijima, Minoru Ueshima, Hiroshi Nishikawa, Katsuaki Suganuma

Materials and Design　Vol. 246　p. 113308-113308　2024/10　Research paper (scientific journal)

Metastable phases of Ag–Si: amorphous Si and Ag-nodule mediated bonding

Koji S. Nakayama, Masahiko Nishijima, Yicheng Zhang, Chuantong Chen, Minoru Ueshima, Katsuaki Suganuma

Scientific Reports　Vol. 14　No. 1　2024/09/03　Research paper (scientific journal)

Microstructure characteristics for improved thermal shock reliability of sintered Ag Al paste in SiC power module

Fupeng Huo, Chuantong Chen, Zheng Zhang, Yicheng Zhang, Aiji Suetake, Kazutaka Takeshita, Yoshiji Yamaguchi, Yashima Momose, Katsuaki Suganuma

Materials Characterization　p. 114360-114360　2024/09　Research paper (scientific journal)

Development of SiC Power Module Structure by Micron-Sized Ag-Paste Sinter Joining on Both Die and Heatsink to Low-Thermal-Resistance and Superior Power Cycling Reliability

Chuantong Chen, Aiji Suetake, Fupeng Huo, Dongjin Kim, Zheng Zhang, Ming-Chun Hsieh, Wanli Li, Naoki Wakasugi, Kazutaka Takeshita, Yoshiji Yamaguchi, Yashima Momose, Katsuaki Suganuma

IEEE Transactions on Power Electronics　Vol. 39　No. 9　p. 10638-10650　2024/09　Research paper (scientific journal)

Evaluating the Performance of Micro-Bump Flip-Chip Packaging Enhanced by Copper Paste

Ran Liu, Zheng Zhang, Masahiko Nishijima, Chuantong Chen, Hirokatsu Sakamoto, Akihiko Happoya, Katsuaki Suganuma

2024 25th International Conference on Electronic Packaging Technology (ICEPT)　p. 1-4　2024/08/07　Research paper (international conference proceedings)

Temperature and thickness-dependent silver hillock generation mechanism and surface morphology nature of direct plated silver layers onto copper substrates

YehRi Kim, Seoah Kim, Zheng Zhang, Chuantong Chen, Katsuaki Suganuma, Byeong Kwon Ju, Dongjin Kim

Journal of Alloys and Compounds　Vol. 997　p. 174871-174871　2024/08　Research paper (scientific journal)

Enhancing thermal-mechanical performance of micron Ag/ZrW2O8 nanorod die-attach paste with low thermal expansion

Yuxin Xu, Xiaoming Qiu, Suyu Wang, Fupeng Huo, Yutai Su, Long Xu, Ninshu Ma, Chuantong Chen, Katsuaki Suganuma

Journal of Alloys and Compounds　Vol. 996　p. 174874-174874　2024/08　Research paper (scientific journal)

Low-temperature Copper Sinter-joining Technology for Power Electronics Packaging: A Review

Yujian Wang, Dou Xu, Haidong Yan, Cai-Fu Li, Chuantong Chen, Wanli Li

Journal of Materials Processing Technology　p. 118526-118526　2024/07　Research paper (scientific journal)

Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties

Fupeng Huo, Chuantong Chen, Zheng Zhang, Yicheng Zhang, Aiji Suetake, Kazutaka Takeshita, Yoshiji Yamaguchi, Yashima Momose, Keke Zhang, Katsuaki Suganuma

Journal of Materials Research and Technology　Vol. 31　p. 3591-3603　2024/07　Research paper (scientific journal)

Self-assembled layer as an effective way to block copper diffusion into epoxy

Shuaijie Zhao, Chuantong Chen, Masahiko Nishijima, Motoharu Haga, Minoru Ueshima, Hirose Suzuki, Hiroto Takenaka, Katsuaki Suganuma

Materials Letters　Vol. 367　p. 136589-136589　2024/07　Research paper (scientific journal)

Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation

Yang Liu, Chuantong Chen, Ye Wang, Zheng Zhang, Ran Liu, Minoru Ueshima, Ichiro Ota, Hiroshi Nishikawa, Masahiko Nishijima, Koji S. Nakayama, Katsuaki Suganuma

Composites Part B: Engineering　Vol. 281　p. 111519-111519　2024/07　Research paper (scientific journal)

Effects of high temperature and high humidity on the reliability of copper/epoxy bond

Shuaijie Zhao, Chuantong Chen, Masahiko Nishijima, Rieko Okumura, Motoharu Haga, Minoru Ueshima, Hirose Suzuki, Hiroto Takenaka, Katsuaki Suganuma

Applied Surface Science　Vol. 660　p. 159970-159970　2024/07　Research paper (scientific journal)

Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging

Fupeng Huo, Chuantong Chen, Zheng Zhang, Ye Wang, Aiji Suetake, Kazutaka Takeshita, Yoshiji Yamaguchi, Yashima Momose, Katsuaki Suganuma

Materials & Design　Vol. 240　p. 112863-112863　2024/04　Research paper (scientific journal)

Copper diffusion into epoxy under high temperature

Shuaijie Zhao, Chuantong Chen, Masahiko Nishijima, Motoharu Haga, Minoru Ueshima, Hirose Suzuki, Hiroto Takenaka, Katsuaki Suganuma

Materials Letters　Vol. 361　p. 136157-136157　2024/04　Research paper (scientific journal)

Effect of thermal-mechanical conditions on strength of silanized Al alloy/CFRTP hybrid joint made by thinning-controlled hot pressing

Weihao Li, Peihao Geng, Ninshu Ma, Chuantong Chen

Materials Today Communications　Vol. 38　p. 108507-108507　2024/03　Research paper (scientific journal)

Size effect of nickel-based single crystal superalloy revealed by nanoindentation with low strain rates

Xu Long, Ziyi Shen, Jiao Li, Ruipeng Dong, Ming Liu, Yutai Su, Chuantong Chen

Journal of Materials Research and Technology　Vol. 29　p. 2437-2447　2024/03　Research paper (scientific journal)

Investigation of the influence of aluminum surficial water on aluminum-plastic hybrids through a combined experimental and simulation approach

Shuaijie Zhao, Chuantong Chen, Hang Liang, Shuohan Wang, Fuminobu Kimura, Yusuke Kajihara

Applied Surface Science　p. 159694-159694　2024/02　Research paper (scientific journal)

Quantitative Elemental Characterization for Electroless Cu Plating Interface of Micro-via by ToF-SIMS

Masahiko Nishijima, Ming Chun Hsieh, Zhang Zheng, Rieko Okumuara, Aiji Suetake, Hiroyoshi Yoshida, Chuantong Chen, Hiroaki Seto, Yuhei Kitahara, Kei Hashizume, Katsuaki Suganuma

2024 International Conference on Electronics Packaging, ICEP 2024　p. 11-12　2024　Research paper (international conference proceedings)

Al heat affected zone-less resistance element welded lap joints of Al alloy and 1 GPa class steel: Transition of microstructure and fracture with heat transfer

Seungyeop Baek, Junyeong Kim, Taeyang Kwak, Taejin Lee, Hyun-chul Lee, Chuantong Chen, Peihao Geng, Ninshu Ma, Seung-Joon Lee, Dongjin Kim

Journal of Materials Research and Technology　Vol. 28　p. 3541-3565　2024/01　Research paper (scientific journal)

Toward defect-less and minimized work-hardening loss implementation of Al alloy/high-purity Cu dissimilar lap joints by refill friction stir spot welding for battery tab-to-busbar applications

Dongjin Kim, Seungyeop Baek, Masahiko Nishijima, Hyun-chul Lee, Peihao Geng, Ninshu Ma, Zheng Zhang, Hyunsu Park, Chuantong Chen, Seung-Joon Lee, Katsuaki Suganuma

Materials Science and Engineering: A　p. 146089-146089　2024/01　Research paper (scientific journal)

Controlling the thermal aging and Kirkendall void diffusion speed of sputtered silver interlayers in GaN power semiconductor packaging interfaces for in-wheel motor system integrations

Dongjin Kim, Chuantong Chen, Sangmin Lee, Min-Su Kim, Katsuaki Suganuma

Corrosion Science　Vol. 226　p. 111614-111614　2024/01　Research paper (scientific journal)

Pressureless sinter-joining of micron-Ag flake pastes at 160 °C enabled by solvent and interface engineering

Wanli Li, Yitian Li, Yujian Wang, Yuncan Liu, Chuantong Chen, Jie Zhang, Haidong Yan

Journal of Materials Processing Technology　Vol. 322　p. 118207-118207　2023/12　Research paper (scientific journal)

Structural investigation of nanovoids around the interface of micro-vias by spherical aberration corrected scanning transmission electron microscopy

M.C. Hsieh, M. Nishijima, K. Jogo, Z. Zhang, R. Okumuara, H. Yoshida, C. Chen, A. Suetake, H. Honma, H. Seto, Y. Kitahara, K. Kita, K. Suganuma

Microelectronics Reliability　Vol. 150　p. 115231-115231　2023/11　Research paper (scientific journal)

Large area bare Cu-Cu interconnection using micro-Cu paste at different sintering temperatures and pressures

W.Y. Li, C.T. Chen, M. Ueshima, T. Kobatake, K. Suganuma

Microelectronics Reliability　Vol. 150　p. 115105-115105　2023/11　Research paper (scientific journal)

Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate

Shuaijie Zhao, Chuantong Chen, Motoharu Haga, Minoru Ueshima, Hirose Suzuki, Hiroto Takenaka, Hidetoshi Hirahara, Jing Sang, Katsuaki Suganuma

Microelectronics Reliability　Vol. 149　p. 115211-115211　2023/10　Research paper (scientific journal)

Enhanced reliability for power modules via a new Ag/Si sinter joining strategy

Yang Liu, Chuantong Chen, Koji S. Nakayama, Minoru Ueshima, Takeshi Sakamoto, Naoe Takuya, Hiroshi Nishikawa, Katsuaki Suganuma

Advancing Microelectronics　Vol. 2023　No. EMPC　p. 242-244　2023/09　Research paper (international conference proceedings)

Effect of nanosecond pulsed laser parameters on texturing formation of metallic surface: Experiment and modelling

Suyu Wang, Wenquan Wang, Yuxin Xu, Xinge Zhang, Chuantong Chen, Peihao Geng, Ninshu Ma

Journal of Materials Research and Technology　Vol. 26　p. 7775-7788　2023/09　Research paper (scientific journal)

Development of high thermal conductivity of Ag/diamond composite sintering paste and its thermal shock reliability evaluation in SiC power modules

Yuxin Xu, Xiaoming Qiu, Wangyun Li, Suyu Wang, Ninshu Ma, Minoru Ueshima, Chuantong Chen, Katsuaki Suganuma

Journal of Materials Research and Technology　Vol. 26　p. 1079-1093　2023/09　Research paper (scientific journal)

Large-scale bare Cu bonding by 10 μm-sized Cu–Ag composite paste in low temperature low pressure air conditions

Chuantong Chen, Shuaijie Zhao, Takuya Sekiguchi, Katsuaki Suganuma

Journal of Science: Advanced Materials and Devices　Vol. 8　No. 3　p. 100606-100606　2023/09　Research paper (scientific journal)

Die Attach for Microelectronic Packaging: Copper Paste Comparison Between Pressure and Pressureless Techniques

Ran Liu, Zheng Zhang, Masahiko Nishijima, Chuantong Chen, Akio Shimoyama, Hirokatsu Sakamoto, Akihiko Happoya, Katsuaki Suganuma

2023 24th International Conference on Electronic Packaging Technology (ICEPT)　p. 1-4　2023/08/08　Research paper (international conference proceedings)

Interfacial microstructures and corrosion behavior of tungsten heavy alloy/superalloy dissimilar joints: design, regulation and mechanism

Yuxin Xu, Xiaoming Qiu, Suyu Wang, Chuantong Chen, Fei Xing, Katsuaki Suganuma

Journal of Materials Research and Technology　Vol. 25　p. 6323-6337　2023/07　Research paper (scientific journal)

Effects of low melting point SnBi58 alloy on the properties of isotropic conductive adhesives

Weiwei Zhang, Zheng Zhang, Hao Liu, Jianqiang Wang, Fangcheng Duan, Ziwen Lv, Wentong Chen, Xinjie Wang, Mingyu Li, Chuantong Chen, Hongtao Chen

International Journal of Adhesion and Adhesives　Vol. 125　p. 103419-103419　2023/07　Research paper (scientific journal)

A Novel Chiplet Integration Architecture Employing Pillar-Suspended Bridge with Polymer Fine-Via Interconnect

Yasuhiro Morikawa, Meiten Koh, Hiroyuki Hashimoto, Chuantong Chen, Ye Wang, Ichiro Kono, Shinji Wakisaka, Ken Ukawa, Takafumi Fukushima, Katsuaki Suganuma, Yoichiro Kurita

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)　2023/05　Research paper (international conference proceedings)

High reliability design Ag sinter joining on softened Ni-P /Pt/Ag metallization substrate during harsh thermal cycling

Chuantong Chen, Yang Liu, Wangyun Li, Fupeng Huo, Minoru Ueshima, Takehsi Sakamoto, Yukinori Oda, Katsuaki Suganuma

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)　2023/05　Research paper (international conference proceedings)

Effect of thermal condition on isothermal-pressing joined strength of silanized Al alloy/carbon fiber-reinforced polyamide-6

Weihao Li, Peihao Geng, Qian Wang, Ninshu Ma, Shuaijie Zhao, Chuantong Chen

Journal of Materials Research and Technology　Vol. 24　p. 8035-8052　2023/05　Research paper (scientific journal)

Development of micron-sized Cu–Ag composite paste for oxidation-free bare Cu bonding in air condition and its deterioration mechanism during aging and power cycling tests

Chuantong Chen, Dongjin Kim, Yang Liu, Takuya Sekiguchi, Yutai Su, Xu Long, Canyu Liu, Changqing Liu, Katsuaki Suganuma

Journal of Materials Research and Technology　Vol. 24　p. 8967-8983　2023/05　Research paper (scientific journal)

Gaussian filtering method of evaluating the elastic/elasto-plastic properties of sintered nanocomposites with quasi-continuous volume distribution

Yutai Su, Ziyi Shen, Xu Long, Chuantong Chen, Lehua Qi, Xujiang Chao

Materials Science and Engineering: A　Vol. 872　p. 145001-145001　2023/05　Research paper (scientific journal)

Effect of Aging and Thermal Shock on the Reliability of Silver Sintered Die Attach for SiC Power Devices

Wangyun Li, Chuantong Chen, Yang Liu, Minoru Ueshima, Takeshi Sakamoto, Katsuaki Suganuma

2023 International Conference on Electronics Packaging (ICEP)　2023/04/19　Research paper (international conference proceedings)

Rapid silver sinter joining technology for large area chips

Luobin Zhang, Chuantong Chen, Fupeng Huo, Wangyun Li, Katsuaki Suganuma

2023 International Conference on Electronics Packaging (ICEP)　2023/04/19　Research paper (international conference proceedings)

Study of Cu Micro-via by TOF-SIMS and STEM

Masahiko Nishijima, Ming-Chun Hsieh, Zhang Zheng, Aiji Suetake, Hiroshi Yoshida, Rieko Okumuara, Chuantong Chen, Hidekazu Homma, Koji Kita, Katsuaki Suganuma

2023 International Conference on Electronics Packaging (ICEP)　2023/04/19　Research paper (international conference proceedings)

Pattern Design of SiC-TEG Heater Chip with Uniform Temperature Distribution Applied in Power Module Packaging

Fupeng Huo, Ye Wang, Chuantong Chen, Peihao Geng, Luobin Zhang, Yoshiji Yamaguchi, Katsuaki Suganuma

2023 International Conference on Electronics Packaging (ICEP)　2023/04/19　Research paper (international conference proceedings)

A Novel and Cost-Effective Ag/Si Composited Paste With Highly Stable Microstructure Maintaince in Thermal Shock Cycles

Y. Liu, C. Chen, M. Ueshima, T. Sakamoto, T. Naoe, H. Nishikawa, K. Suganuma

2023 International Conference on Electronics Packaging (ICEP)　2023/04/19　Research paper (international conference proceedings)

Novel Al /AlN bonding by micro-sized Ag particles sinter joining in low temperature low pressure air conditions

Chuantong Chen, Yang Liu, Minoru Ueshima, Katsuaki Suganuma

2023 International Conference on Electronics Packaging (ICEP)　2023/04/19　Research paper (international conference proceedings)

Effect of Ni additive on electroless Cu quality for high density interconnect PCB substrate

Zheng Zhang, Ming-Chun Hsieh, Masahiko Nishijima, Aiji Suetake, Hiroshi Yoshida, Rieko Okumuara, Chuantong Chen, Hidekazu Homma, Koji Kita, Katsuaki Suganuma

2023 International Conference on Electronics Packaging (ICEP)　2023/04/19　Research paper (international conference proceedings)

Unveiling the damage evolution of SAC305 during fatigue by entropy generation

Xu Long, Ying Guo, Yutai Su, Kim S. Siow, Chuantong Chen

International Journal of Mechanical Sciences　Vol. 244　p. 108087-108087　2023/04　Research paper (scientific journal)

Statistical effects of pore features on mechanical properties and fracture behaviors of heterogeneous random porous materials by phase-field modeling

Yutai Su, Jiaqi Zhu, Xu Long, Liguo Zhao, Chuantong Chen, Changqing Liu

International Journal of Solids and Structures　Vol. 264　p. 112098-112098　2023/03　Research paper (scientific journal)

Improving bonding strength of Al/CFRTP hybrid joint through modifying friction spot joining tools

Peihao Geng, Hong Ma, Weihao Li, Kazuki Murakami, Qian Wang, Ninshu Ma, Yasuhiro Aoki, Hidetoshi Fujii, Chuantong Chen

Composites Part B: Engineering　Vol. 254　p. 110588-11058　2023/02　Research paper (scientific journal)

Failure mechanisms of the bonded interface between mold epoxy and metal substrate exposed to high temperature

Shuaijie Zhao, Chuantong Chen, Motoharu Haga, Minoru Ueshima, Hidetoshi Hirahara, Jing Sang, Sung hun Cho, Tohru Sekino, Katsuaki Suganuma

Composites Part B: Engineering　p. 110562-110562　2023/02　Research paper (scientific journal)

Fine Pitch Micro Via Interconnection with Reliable Electroless/electric Cu plating Layers Combined with High Power DUV Picosecond Laser for Organic Substrates

Ming Chun Hsieh, Zheng Zhang, Masahiko Nishijima, Aiji Suetake, Chuantong Chen, Hiroyoshi Yoshida, Wangyun Li, Rieko Okumura, Hidekazu Homma, Koji Kita, George Okada, Katsuaki Suganuma

Proceedings - Electronic Components and Technology Conference　Vol. 2023-May　p. 1381-1384　2023　Research paper (international conference proceedings)

Effect of Mg remelting and mechanical hooks of steel on the mechanical and fatigue responses of resistance element welded AZ31/DP780 joints: Experimental, FEM and thermodynamic calculation studies

Seungyeop Baek, Ninshu Ma, Jongho Song, Dong-Kyu Kim, Seung-Joon Lee, Chuantong Chen, Dongjin Kim

Journal of Materials Research and Technology　Vol. 22　p. 1210-1237　2023/01　Research paper (scientific journal)

Chemical bonding of copper and epoxy through a thiol-based layer for post 5G/6G semiconductors

Shuaijie Zhao, Chuantong Chen, Motoharu Haga, Minoru Ueshima, Katsuaki Suganuma

Applied Surface Science　Vol. 608　p. 155165-155165　2023/01　Research paper (scientific journal)

Development of crack-less and deformation-resistant electroplated Ni/electroless Ni/Pt/Ag metallization layers for Ag-sintered joint during a harsh thermal shock

Yang Liu, Chuantong Chen, Zheng Zhang, Minoru Ueshima, Takeshi Sakamoto, Takuya Naoe, Hiroshi Nishikawa, Yukinori Oda, Katsuaki Suganuma

Materials and Design　Vol. 224　p. 111389-111389　2022/12　Research paper (scientific journal)

Online condition monitoring of solder fatigue in a clip-bonding SiC MOSFET power assembly via acoustic emission technique

Zheng Zhang, Chuantong Chen, Aiji Suetake, Hiroshi Ishino, Hirokazu Sampei, Takeshi Endo, Kazuhiko Sugiura, Kazuhiro Tsuruta, Katsuaki Suganuma

IEEE Transactions on Power Electronics　2022/10　Research paper (scientific journal)

Oxidation-enhanced bonding strength of Cu sinter joints during thermal storage test

Yue Gao, Jinting Jiu, Chuantong Chen, Katsuaki Suganuma, Rong Sun, Zhi-Quan Liu

Journal of Materials Science & Technology　Vol. 115　p. 251-255　2022/07　Research paper (scientific journal)

Influence of laser welding power on steel/CFRP lap joint fracture behaviors

Hongbo Xia, Yunwu Ma, Chuantong Chen, Jianhui Su, Chengsong Zhang, Caiwang Tan, Liqun Li, Peihao Geng, Ninshu Ma

Composite Structures　Vol. 285　p. 115247-115247　2022/04　Research paper (scientific journal)

Thermal fatigue behaviors of SiC power module by Ag sinter joining under harsh thermal shock test

Chuantong Chen, Hao Zhang, Jinting Jiu, Xu Long, Katsuaki Suganuma

China Welding (English Edition)　Vol. 31　No. 1　p. 15-21　2022/03/25　Research paper (scientific journal)

Microstructural and interface geometrical influence on the mechanical fatigue property of aluminum/high-strength steel lap joints using resistance element welding for lightweight vehicles: experimental and computational investigation

Seungyeop Baek, Gun Yung Go, Jong Wook Park, Jongho Song, Hyun chul Lee, Seung Joon Lee, Sangmin Lee, Chuantong Chen, Min Su Kim, Dongjin Kim

Journal of Materials Research and Technology　Vol. 17　p. 658-678　2022/03/01　Research paper (scientific journal)

Effects of rotation tool-induced heat and material flow behaviour on friction stir lapped Al/steel joint formation and resultant microstructure

Peihao Geng, Yunwu Ma, Ninshu Ma, Hong Ma, Yasuhiro Aoki, Huihong Liu, Hidetoshi Fujii, Chuantong Chen

International Journal of Machine Tools and Manufacture　Vol. 174　p. 103858-103858　2022/03　Research paper (scientific journal)

Constitutive, creep, and fatigue behavior of sintered Ag for finite element simulation of mechanical reliability: a critical review

Xu Long, Ying Guo, Yutai Su, Kim S. Siow, Chuantong Chen

Journal of Materials Science: Materials in Electronics　Vol. 33　No. 5　p. 2293-2309　2022/01/10　Research paper (scientific journal)

Fatigue-Resistant of Ag Sinter Joining on Ni-P/Pd/Au Finished DBA Substrate with Thick Ni-P Layer During Thermal Shock Test

Chuantong Chen, Katsuaki Suganuma

ECS Transactions　Vol. 108　No. 6　p. 21-26　2022　Research paper (international conference proceedings)

Reliability evaluation on Ag sintering die attach for SiC power modules during long-term thermal aging/cycling

Y. Liu, C. Chen, M. Ueshima, T. Sakamoto, T. Naoe, H. Nishikawa, K. Suganuma

2022 International Conference on Electronics Packaging, ICEP 2022　p. 49-50　2022　Research paper (international conference proceedings)

Micro-flake Ag paste sinter joining on bare DBA substrate for high temperature SiC power modules

Chuantong Chen, Zheng Zhang, Yang Liu, Katsuaki Suganuma

2022 International Conference on Electronics Packaging, ICEP 2022　p. 9-10　2022　Research paper (international conference proceedings)

Cracking-Less Heat-Resistant Electroless Ni-P Plating Film for Wide Bandgap Power Modules

Ming Chun Hsieh, Chuantong Chen, Aiji Suetake, Zheng Zhang, Katsuaki Suganuma, Ryuji Saito, Norihiko Hasegawa, Kei Hashizume, Kuniaki Otsuka

Proceedings - Electronic Components and Technology Conference　Vol. 2022-May　p. 1300-1303　2022　Research paper (international conference proceedings)

Ag die-attach paste modified by WC additive for high-temperature stability enhancement

Yang Liu, Chuantong Chen, Katsuaki Suganuma, Takeshi Sakamoto, Minoru Ueshima, Takuya Naoe, Hiroshi Nishikawa

Proceedings - Electronic Components and Technology Conference　Vol. 2022-May　p. 2153-2157　2022　Research paper (international conference proceedings)

Novel Ag salt paste for large area Cu-Cu bonding in low temperature low pressure and air condition

Chuantong Chen, Bowen Zhang, Katsuaki Suganuma, Takuya Sekiguchi

Proceedings - Electronic Components and Technology Conference　Vol. 2022-May　p. 1126-1132　2022　Research paper (international conference proceedings)

Real-time monitoring and diagnosis of die attach structure deterioration by using acoustic emission method

Zheng Zhang, Aiji Suetake, Chuantong Chen, Osamu Katayama, Hiroshi Ishino, Takeshi Endo, Kazuhiko Sugiura, Kazuhiro Tsuruta, Katsuaki Suganuma

2022 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2022)　p. 91-92　2022　Research paper (international conference proceedings)

Ag-Ag direct bonding via a pressureless, low-temperature, and atmospheric stress migration bonding method for 3D integration packaging

Zheng Zhang, Aiji Suetake, Ming-Chun Hsieh, Chuantong Chen, Hiroshi Yoshida, Katsuaki Suganuma

IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)　p. 1409-1412　2022　Research paper (international conference proceedings)

Chemical bonding copper and epoxy through self-assembled layer

Shuaijie Zhao, Chuantong Chen, Minoru Ueshima, Motoharu Haga, Katsuaki Suganuma

2022 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2022)　p. 123-124　2022　Research paper (international conference proceedings)

Robust bonding and microstructure behavior of aluminum/high-strength steel lap joints using resistance element welding process for lightweight vehicles: Experimental and numerical investigation

Seungyeop Baek, Jongho Song, Hyun-chul Lee, Seung-yeon Park, Kuk-Hyun Song, Sangmin Lee, Seung-Joon Lee, Chuantong Chen, Dongjin Kim

Materials Science and Engineering: A　Vol. 833　p. 142378-142378　2022/01　Research paper (scientific journal)

Interface-mechanical and thermal characteristics of Ag sinter joining on bare DBA substrate during aging, thermal shock and 1200W/cm2 power cycling tests

Chuantong Chen, Dongjin Kim, Zheng Zhang, Naoki Wakasugi, Yang Liu, Ming-Chun Hsieh, Shuaijie Zhao, Aiji Suetake, Katsuaki Suganuma

IEEE Transactions on Power Electronics　Vol. 37　No. 6　p. 1-1　2022　Research paper (scientific journal)

Development of anti-oxidation Ag salt paste for large-area (35 × 35 mm2) Cu-Cu bonding with ultra-high bonding strength

Bowen Zhang, Chuantong Chen, Takuya Sekiguchi, Yang Liu, Caifu Li, Katsuaki Suganuma

Journal of Materials Science & Technology　Vol. 113　p. 261-270　2022/01　Research paper (scientific journal)

Porosity effect on fracture behavior of sintered silver nanoparticles by phase-field modeling

Jiaqi Zhu, Yutai Su, Chen Chuantong, Kim S. Siow, Ruitao Tang, Xu Long

2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)　2021/12/07　Research paper (international conference proceedings)

Reverse Analysis of Surface Strain in Elasto-Plastic Materials by Nanoindentation

Xu Long, Ziyi Shen, Changhen Lu, Qipu Jia, Cao Guan, Chuantong Chen, Haodong Wang, Ye Li

International Journal of Applied Mechanics　2021/11/30　Research paper (scientific journal)

Reliability of Ag Sinter-Joining Die Attach Under Harsh Thermal Cycling and Power Cycling Tests

Zheng Zhang, Chuantong Chen, Aiji Suetake, Ming-Chun Hsieh, Katsuaki Suganuma

Journal of Electronic Materials　Vol. 50　No. 12　p. 6597-6606　2021/10/11　Research paper (scientific journal)

Failure investigation of a Ag sinter-joining SiC power device under harsh cycling conditions

Zheng Zhang, Chuantong Chen, Aiji Suetake, Tetsu Takemasa, Ming-Chun Hsieh, Yang Liu, Katsuaki Suganuma

ECS Transactions　Vol. 104　No. 7　p. 93-100　2021/10/01　Research paper (scientific journal)

The Ʃ3 twin dependence of thermo-mechanical fatigue of a polycrystalline high-purity Cu film

Dongjin Kim, Chanyang Choe, Chuantong Chen, Sangmin Lee, Seung-Joon Lee, Semin Park, Seungjun Noh, Katsuaki Suganuma

International Journal of Fatigue　Vol. 150　p. 106331-106331　2021/09　Research paper (scientific journal)

Modified Ni/Pd/Au-finished DBA substrate for deformation-resistant Ag–Au joint during long-term thermal shock test

Yang Liu, Chuantong Chen, Dongjin Kim, Zheng Zhang, Xu Long, Katsuaki Suganuma

Journal of Materials Science: Materials in Electronics　Vol. 32　No. 15　p. 20384-20393　2021/07/10　Research paper (scientific journal)

Improved thermal cycling reliability of Ag sinter joining by optimized chip mounting speed and push depth

Tetsu Takemasa, Chuantong Chen, Katsuaki Suganuma

Journal of Materials Science: Materials in Electronics　Vol. 32　No. 14　p. 19890-19900　2021/07/07　Research paper (scientific journal)

Fracture mechanism of microporous Ag-sintered joint in a GaN power device with Ti/Ag and Ni/Ti/Ag metallization layer at different thermo-mechanical stresses

Dongjin Kim, Sangmin Lee, Chuantong Chen, Seung-Joon Lee, Shijo Nagao, Katsuaki Suganuma

JOURNAL OF MATERIALS SCIENCE　Vol. 56　No. 16　p. 9852-9870　2021/06　Research paper (scientific journal)

Pressureless and low-temperature sinter-joining on bare Si, SiC and GaN by a Ag flake paste

Zheng Zhang, Chuantong Chen, Aiji Suetake, Ming-Chun Hsieh, Aya Iwaki, Katsuaki Suganuma

Scripta Materialia　Vol. 198　p. 113833-113833　2021/06　Research paper (scientific journal)

Low temperature Cu sinter joining on different metallization substrates and its reliability evaluation with a high current density

Chuantong Chen, Aya Iwaki, Aiji Suetake, Kazuhiko Sugiura, Kiyoshi Kanie, Katsuaki Suganuma

Proceedings of the International Symposium on Power Semiconductor Devices and ICs　Vol. 2021-　p. 387-390　2021/05/30　Research paper (international conference proceedings)

Novel approach of die attach technology for SiC power module by pure Al thin film bonding

Chuantong Chen, Katsuaki Suganuma

2021 International Conference on Electronics Packaging, ICEP 2021　p. 99-100　2021/05/12　Research paper (international conference proceedings)

Pressureless and low temperature direct bonding on Si, SiC and GaN via Ag paste sinter-joining

Zheng Zhang, Chuantong Chen, Aiji Suetake, Ming-Chun Hsieh, Aya Iwaki, Katsuaki Suganuma

2021 International Conference on Electronics Packaging (ICEP)　2021/05/12　Research paper (international conference proceedings)

Interface reaction and evolution of micron-sized Ag particles paste joining on electroless Ni-/Pd-/Au-finished DBA and DBC substrates during extreme thermal shock test

Chuantong Chen, Zheng Zhang, Dongjin Kim, Tetsuya Sasamura, Yukinori Oda, Ming-Chun Hsieh, Aya Iwaki, Aiji Suetake, Katsuaki Suganuma

Journal of Alloys and Compounds　Vol. 862　p. 158596-158596　2021/05　Research paper (scientific journal)

Online Thermal Resistance and Reliability Characteristic Monitoring of Power Modules With Ag Sinter Joining and Pb, Pb-Free Solders During Power Cycling Test by SiC TEG Chip

Dongjin Kim, Shijo Nagao, Chuantong Chen*, Naoki Wakasugi, Yasuyuki Yamamoto, Aiji Suetake, Tetsu Takemasa, Tohru Sugahara, Katsuaki Suganuma

IEEE Transactions on Power Electronics　Vol. 36　No. 5　p. 4977-4990　2021/05　Research paper (scientific journal)

Large-scale ceramic–metal joining by nano-grained Ag particles paste sintering in low-temperature pressure-less conditions

Chuantong Chen, Katsuaki Suganuma

Scripta Materialia　Vol. 195　p. 113747-113747　2021/04　Research paper (scientific journal)

Real-Time Acoustic Emission Monitoring of Wear-Out Failure in SiC Power Electronic Devices During Power Cycling Tests

Chanyang Choe, Chuantong Chen, Shijo Nagao, Katsuaki Suganuma

IEEE Transactions on Power Electronics　Vol. 36　No. 4　p. 4420-4428　2021/04　Research paper (scientific journal)

Reliability Evaluation of Ag Sinter-Joining Die Attach Under a Harsh Thermal Cycling Test

Zheng Zhang, Chuantong Chen, Aiji Suetake, Ming-Chun Hsieh, Aya Iwaki, Katsuaki Suganuma

TMS 2021 150th Annual Meeting & Exhibition Supplemental Proceedings　p. 701-708　2021　Part of collection (book)

Development of Solder Deterioration Diagnosis System of a Power Module via the Acoustic Emission Monitoring (AEM) Technique

Zheng Zhang, Aiji Suetake, Chuantong Chen, Hiroshi Ishino, Hirokazu Sampei, Takeshi Endo, Kazuhiko Sugiura, Kazuhiro Tsuruta, Katsuaki Suganuma

2021 33RD INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD)　p. 179-182　2021　Research paper (international conference proceedings)

Low temperature SiC die-attach bonding technology by hillocks generation on Al sheet surface with stress self-generation and self-release

Chuantong Chen, Katsuaki Suganuma

Scientific Reports　Vol. 10　No. 1　2020/12/01　Research paper (scientific journal)

Fracture mechanism and strength evaluation of Al5052/CFRP joint produced by coaxial one-side resistance spot welding

Sendong Ren, Yunwu Ma, Shuhei Saeki, Yoshiaki Iwamoto, Chuantong Chen, Ninshu Ma

Composite Structures　Vol. 252　2020/11/15　Research paper (scientific journal)

Evaluation of high temperature reliability of SiC die attached structure with sinter micron-size Ag particles paste on Ni-P/Pd/Au plated substrates

Chuantong Chen, Zheng Zhang, Katsuaki Suganuma

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)　2020/09/15　Research paper (international conference proceedings)

Thermal evaluation of metalized ceramic substrates for use in next-generation power modules toward international standardization

Naoki Wakasugi, Chuantong Chen, Kiyoshi Hirao, Shijo Nagao, Katsuaki Suganuma

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)　2020/09/15　Research paper (international conference proceedings)

Effect of oxygen on microstructural coarsening behaviors and mechanical properties of Ag sinter paste during high-temperature storage from macro to micro

Chuantong Chen, Chanyang Choe, Dongjin Kim, Zheng Zhang, Xu Long, Zheng Zhou, Fengshun Wu, Katsuaki Suganuma

Journal of Alloys and Compounds　Vol. 834　2020/09/05　Research paper (scientific journal)

Reactive wafer bonding with nanoscale Ag/Cu multilayers

Yu chen Liu, Shih kang Lin, Hao Zhang, Shijo Nagao, Chuantong Chen, Katsuaki Suganuma

Scripta Materialia　Vol. 184　p. 1-5　2020/07/15　Research paper (scientific journal)

Robust bonding and thermal-stable Ag–Au joint on ENEPIG substrate by micron-scale sinter Ag joining in low temperature pressure-less

Chuantong Chen, Zheng Zhang, Qian Wang, Bowen Zhang, Yue Gao, Tetsuya Sasamura, Yukinori Oda, Ninshu Ma, Katsuaki Suganuma

Journal of Alloys and Compounds　Vol. 828　2020/07/05　Research paper (scientific journal)

Advanced SiC power module packaging technology direct on DBA substrate for high temperature applications: Ag sinter joining and encapsulation resin adhesion

Chuantong Chen, Zheng Zhang, Katsuaki Suganuma

IEEE Electronic Components and Technology Conference　Vol. 2020-June　p. 1408-1413　2020/06　Research paper (international conference proceedings)

3D pyramid-shape Ag plating assisted interface connection growth of sinter micron-sized Ag paste

Chuantong Chen, Yue Gao, Zhi Quan Liu, Katsuaki Suganuma

Scripta Materialia　Vol. 179　p. 36-39　2020/04　Research paper (scientific journal)

Strengthening of DBA substrate with Ni/Ti/Ag metallization for thermal fatigue-resistant Ag sinter joining in GaN power modules

Dongjin Kim, Chuantong Chen, Seung Joon Lee, Shijo Nagao, Katsuaki Suganuma

Journal of Materials Science: Materials in Electronics　Vol. 31　No. 4　p. 3715-3726　2020/02/01　Research paper (scientific journal)

Bonding and High-Temperature Storage Performance of Die Attachment with Ag Paste Sintering on Bare Direct Bonding Aluminum (DBA) Substrate

Zheng Zhang, Chuangtong Chen, Dongjin Kim, Aiji Suetake, Shijo Nagao, Katsuaki Suganuma

Minerals, Metals and Materials Series　p. 697-706　2020　Research paper (international conference proceedings)

Fatigue and Creep Properties of Sintered Ag Paste from Room Temperature to High Temperature

Chuantong Chen, Chanyang Choe, Aiji Suetake, Katsuaki Suganuma

Minerals, Metals and Materials Series　p. 707-716　2020　Research paper (international conference proceedings)

Lifetime Prediction of a SiC Power Module by Micron/Submicron Ag Sinter Joining Based on Fatigue, Creep and Thermal Properties from Room Temperature to High Temperature

Chuantong Chen, Chanyang Choe, Dongjin Kim, Katsuaki Suganuma

Journal of Electronic Materials　2020　Research paper (scientific journal)

Mechanical characteristics and fracture behavior of GaN/DBA die-attached during thermal aging: pressure-less hybrid Ag sinter joint and Pb–5Sn solder joint

Dongjin Kim, Chuantong Chen, Shijo Nagao, Katsuaki Suganuma

Journal of Materials Science: Materials in Electronics　Vol. 31　No. 1　p. 587-598　2020/01/01　Research paper (scientific journal)

Well-Controlled Decomposition of Copper Complex Inks Enabled by Metal Nanowire Networks for Highly Compact, Conductive, and Flexible Copper Films

Bowen Zhang, Chuantong Chen, Wanli Li, Jeyun Yeom, Katsuaki Suganuma

Advanced Materials Interfaces　Vol. 7　No. 1　2020/01/01　Research paper (scientific journal)

Micron-sized Ag flake particles direct die bonding on electroless Ni–P-finished DBC substrate: low-temperature pressure-free sintering, bonding mechanism and high-temperature aging reliability

Chuantong Chen, Zheng Zhang, Bowen Zhang, Katsuaki Suganuma

Journal of Materials Science: Materials in Electronics　Vol. 31　No. 2　p. 1247-1256　2020/01/01　Research paper (scientific journal)

Effect of W content in Co-W-P metallization on both oxidation resistance and resin adhesion

Tomohito Iwashige, Takeshi Endo, Kazuhiko Sugiura, Kazuhiro Tsuruta, Yuichi Sakuma, Yukinori Oda, Chuantong Chen, Shijo Nagao, Tohru Sugahara, Katsuaki Suganuma

Journal of Materials Science　Vol. 55　No. 2　p. 644-659　2020/01/01　Research paper (scientific journal)

Interfacial oxidation protection and thermal-stable sinter Ag joining on bare Cu substrate by single-layer graphene coating

Chuantong Chen, Zheng Zhang, Dongjin Kim, Bowen Zhang, Masami Tanioku, Takao Ono, Kazuhiko Matsumoto, Katsuaki Suganuma

Applied Surface Science　Vol. 497　p. 143797-143797　2019/12/15　Research paper (scientific journal)

Measurement of heat dissipation and thermal-stability of power modules on DBC substrates with various ceramics by SiC Micro-heater chip system and ag sinter joining

Dongjin Kim, Yasuyuki Yamamoto, Shijo Nagao, Naoki Wakasugi, Chuantong Chen, Katsuaki Suganuma

Micromachines　Vol. 10　No. 11　2019/11/01　Research paper (scientific journal)

Improvement of high-temperature thermal aging reliability of Ag–Au joints by modifying Ni/Au surface finish

Zheng Zhang, Chuantong Chen, Albert T. Wu, Katsuaki Suganuma

Journal of Materials Science: Materials in Electronics　Vol. 30　No. 22　p. 20292-20301　2019/11/01　Research paper (scientific journal)

Necking growth and mechanical properties of sintered Ag particles with different shapes under air and N<inf>2</inf> atmosphere

Chuantong Chen, Jeyun Yeom, Chanyang Choe, Guiming Liu, Yue Gao, Zheng Zhang, Bowen Zhang, Dongjin Kim, Katsuaki Suganuma

Journal of Materials Science　Vol. 54　No. 20　p. 13344-13357　2019/10/30　Research paper (scientific journal)

Development of high-strength and superior thermal shock-resistant GaN/DBA die attach structure with Ag sinter joining by thick Ni metallization

D. Kim, C. Chen, S. Noh, S. J. Lee, Z. Zhang, Y. Kimoto, T. Sugahara, K. Suganuma

Microelectronics Reliability　Vol. 100-101　2019/09　Research paper (scientific journal)

Reliability analysis of sintered Cu joints for SiC power devices under thermal shock condition

Yue Gao, Shuhei Takata, Chuantong Chen, Shijo Nagao, Katsuaki Suganuma, Amir Sajjad Bahman, Francesco Iannuzzo

Microelectronics Reliability　Vol. 100-101　2019/09　Research paper (scientific journal)

Enhancement of bonding strength in Ag sinter joining on Au surface finished substrate by increasing Au grain-size

Zheng Zhang, Chuantong Chen, Guiming Liu, Caifu Li, Seigo Kurosaka, Shijo Nagao, Katsuaki Suganuma

Applied Surface Science　Vol. 485　p. 468-475　2019/08/15　Research paper (scientific journal)

Reliability analysis of sintered Cu joints under power cycle condition

Yue Gao, Chuantong Chen, Shijo Nagao, Katsuaki Suganuma, Amir Sajjad Bahman, Francesco Iannuzzo

2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019　2019/08　Research paper (international conference proceedings)

Sinterability improvement of hybrid silver sinter joining paste by adding silver nanoparticles

Tomoya Egawa, Hao Zhang, Takanori Kobatake, Yasuyuki Akai, Chuantong Chen, Katsuaki Suganuma

2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019　2019/08　Research paper (international conference proceedings)

Sinter Ag joining on different metallization substrate and their high temperature reliability

Chuantong Chen, Dongjin Kim, Katsuaki Suganuma

2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019　2019/08　Research paper (international conference proceedings)

Microstructural and mechanical reliability of a GaN/DBA die-attached module with Ag sinter joining in harsh thermal environments

Dongjin Kim, Chuantong Chen, Katsuaki Suganuma

2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019　2019/08　Research paper (international conference proceedings)

Effect of annealing Co-W-P metallization substrate onto its resin adhesion

Tomohito Iwashige, Takeshi Endo, Kazuhiko Sugiura, Kazuhiro Tsuruta, Yuichi Sakuma, Seigo Kurosaka, Yukinori Oda, Chuantong Chen, Shijo Nagao, Katsuaki Suganuma

Journal of Materials Science: Materials in Electronics　Vol. 30　No. 14　p. 13247-13257　2019/07/30　Research paper (scientific journal)

CoW metallization for high strength bonding to both sintered Ag joints and encapsulation resins

Tomohito Iwashige, Takeshi Endo, Kazuhiko Sugiura, Kazuhiro Tsuruta, Yuichi Sakuma, Seigo Kurosaka, Yukinori Oda, Chuantong Chen, Shijo Nagao, Katsuaki Suganuma

Journal of Materials Science: Materials in Electronics　Vol. 30　No. 12　p. 11151-11163　2019/06/30　Research paper (scientific journal)

Ag particles for sinter bonding: Flakes or spheres?

Jeyun Yeom, Shijo Nagao, Chuantong Chen, Tohru Sugahara, Hao Zhang, Chanyang Choe, Cai Fu Li, Katsuaki Suganuma

Applied Physics Letters　Vol. 114　No. 25　2019/06/24　Research paper (scientific journal)

Alloying and Embedding of Cu-Core/Ag-Shell Nanowires for Ultrastable Stretchable and Transparent Electrodes

Bowen Zhang, Wanli Li, Masaya Nogi, Chuantong Chen, Yang Yang, Tohru Sugahara, Hirotaka Koga, Katsuaki Suganuma

ACS Applied Materials and Interfaces　Vol. 11　No. 20　p. 18540-18547　2019/05/22　Research paper (scientific journal)

Effect of substrate preheating treatment on thermal reliability and micro-structure of Ag paste sintering on Au surface finish

Zheng Zhang, Chuantong Chen, Katsuaki Suganuma, Seigo Kurosaka

Proceedings - Electronic Components and Technology Conference　Vol. 2019-May　p. 474-478　2019/05　Research paper (international conference proceedings)

Low temperature low pressure solid-state porous Ag bonding for large area and its high-reliability design in die-attached power modules

Chuantong Chen, Dongjin Kim, Zhenghong Wang, Zheng Zhang, Yue Gao, Chanyang Choe, Katsuaki Suganuma

Ceramics International　Vol. 45　No. 7　p. 9573-9579　2019/05　Research paper (scientific journal)

Direct bonding with Ni-P finished DBC substrate with sinter Ag micro-sized particles

Chuantong Chen, Zheng Zhang, Takuya Misaki, Shijo Nagao, Katsuaki Suganuma

2019 International Conference on Electronics Packaging, ICEP 2019　p. 61-64　2019/04　Research paper (international conference proceedings)

Fully embedded CuNWs/PDMS conductor with high oxidation resistance and high conductivity for stretchable electronics

Bowen Zhang, Wanli Li, Yang Yang, Chuantong Chen, Cai Fu Li, Katsuaki Suganuma

Journal of Materials Science　Vol. 54　No. 8　p. 6381-6392　2019/04　Research paper (scientific journal)

Low-temperature and pressureless sinter joining of Cu with micron/submicron Ag particle paste in air

Zheng Zhang, Chuantong Chen, Yang Yang, Hao Zhang, Dongjin Kim, Toru Sugahara, Shijo Nagao, Katsuaki Suganuma

Journal of Alloys and Compounds　Vol. 780　p. 435-442　2019/04　Research paper (scientific journal)

Reliability Evaluation of SiC Power Module with Sintered Ag Die Attach and Stress-Relaxation Structure

Kazuhiko Sugiura, Tomohito Iwashige, Kazuhiro Tsuruta, Chuantong Chen, Shijo Nagao, Tsuyoshi Funaki, Katsuaki Suganuma

IEEE Transactions on Components, Packaging and Manufacturing Technology　Vol. 9　No. 4　p. 609-615　2019/04　Research paper (scientific journal)

Thermal stability improvement of sintered Ag die-attach materials by addition of transition metal compound particles

Kazuhiko Sugiura, Tomohito Iwashige, Kazuhiro Tsuruta, Chuantong Chen, Shijo Nagao, Tohru Sugahara, Katsuaki Suganuma

Applied Physics Letters　Vol. 114　No. 16　p. 161903-1-1619034　2019/04　Research paper (scientific journal)

Long-term reliability of GaN/DBA die-attached module with Ag sinter paste and with high temperature solder

Dongjin Kim, Zheng Zhang, Yukiharu Kimoto, Chuantong Chen, Seongjun Noh, Katsuaki Suganuma

EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging　2019/03/05　Research paper (international conference proceedings)

Die attach module by Cu sheet interconnect for high temperature applications

Chuantong Chen, Dongjin Kim, Zheng Zhang, Katsuaki Suganuma

EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging　2019/03/05　Research paper (international conference proceedings)

Improvement of the Bond Strength of Ag Sinter-Joining on Electroless Ni/Au Plated Substrate by a One-Step Preheating Treatment

Chuantong Chen, Zheng Zhang, Chanyang Choe, Dongjin Kim, Seungjun Noh, Toru Sugahara, Katsuaki Suganuma

Journal of Electronic Materials　Vol. 48　No. 2　p. 1106-1115　2019/02/15　Research paper (scientific journal)

Microstructure and mechanical properties of sintered Ag particles with flake and spherical shape from nano to micro size

Chuantong Chen, Katsuaki Suganuma

Materials and Design　Vol. 162　p. 311-321　2019/01/15　Research paper (scientific journal)

In situ TEM observation of sintered Ag die-attach layer with added tungsten carbide particles while heating to high temperature

Kazuhiko Sugiura, Tomohito Iwashige, Kazuhiro Tsuruta, Chuantong Chen, Shijo Nagao, Tohru Sugahara, Katsuaki Suganuma

Japanese Journal of Applied Physics　Vol. 58　No. 10　2019　Research paper (scientific journal)

GaN micro-heater chip for power cycling of die attach modules with Ag sinter joint and high temperature solder

Dongjin Kim, Shijo Nagao, Chuantong Chen, Yasuyuki Yamamoto, Naoki Wakasugi, Yukiharu Kimoto, Tetsu Takemasa, Tohru Sugahara, Katsuaki Suganuma

PCIM Europe Conference Proceedings　p. 1024-1029　2019　Research paper (international conference proceedings)

Highly reliable package using Cu particles sinter paste for next generation power devices

Yue Gao, Chuantong Chen, Shijo Nagao, Katsuaki Suganuma, Amir Sajjad Bahman, Francesco Ia Nnuzzo

PCIM Europe Conference Proceedings　p. 1036-1039　2019　Research paper (international conference proceedings)

Thermal conductivity and interface thermal resistance evaluation of DBC/DBA in power die attach modules

Chuantong Chen, Naoki Sato, Tetsuro Ogushi, Shijo Nagao, Katsuaki Suganuma

PCIM Europe Conference Proceedings　p. 879-883　2019　Research paper (international conference proceedings)

Sintering Cu paste on Cu plates with different metallization

Shuhei Takata, Chuantong Chen, Yue Gao, Katsuaki Suganuma

PCIM Europe Conference Proceedings　p. 1030-1035　2019　Research paper (international conference proceedings)

Ag sinter joining technology for different metal interface (Au, Ag, Ni, Cu, Al) in wide band gap power modules

C. Chen, K. Suganuma

ECS Transactions　Vol. 92　No. 7　p. 147-156　2019　Research paper (international conference proceedings)

Uncertainty factor for improving thermal conductivity measurement accuracy of high thermal conductive materials

Naoki Sato, Tetsuro Ogushi, Naoki Wakasugi, Kazutaka Takeshita, Chuantong Chen, Shijo Nagao, Katsuaki Suganuma

Journal of Japan Institute of Electronics Packaging　Vol. 22　No. 2　p. 164-171　2019　Research paper (scientific journal)

Thermal shock reliability of a GaN die-attach module on DBA substrate with Ti/Ag metallization by using micron/submicron Ag sinter paste

Dongjin Kim, Chuantong Chen, Chun Pei, Zheng Zhang, Shijo Nagao, Aiji Suetake, Tohru Sugahara, Katsuaki Suganuma

Japanese Journal of Applied Physics　Vol. 58　No. SB　p. SBBD15-1-SBBD15-8　2019　Research paper (scientific journal)

Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere

Yue Gao, Wanli Li, Chuantong Chen, Hao Zhang, Jinting Jiu, Cai Fu Li, Shijo Nagao, Katsuaki Suganuma

Materials and Design　Vol. 160　p. 1265-1272　2018/12/15　Research paper (scientific journal)

Improvement in bonding strength of Ag sinter joining on gold surface finished substrates by increasing the gold grain size

Zheng Zhang, Chuangtong Chen, Seigo Kurosaka, Katsuaki Suganuma

2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018　p. 22-25　2018/12　Research paper (international conference proceedings)

Thermal shock performance of DBA/AMB substrates plated by Ni and Ni-P layers for high-temperature applications of power device modules

Chanyang Choe, Chuantong Chen, Seungjun Noh, Katsuaki Suganuma

Materials　Vol. 11　No. 12　p. 2394-1-2394-11　2018/11/28　Research paper (scientific journal)

Bonding technology using cold-rolled Ag sheet in die-attachment applications

Seungjun Noh, Chanyang Choe, Chuantong Chen, Hao Zhang, Katsuaki Suganuma

2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018　p. 1598-1601　2018/10/22　Research paper (international conference proceedings)

Heat-resistant packaging technology for wide bandgap power devices and thermal reliability testing

K. Suganuma, H. Zhang, S. Nagao, C. Chen, T. Sugahara, A. Shimoyama, A. Suetake

2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018　No. 8507900　p. 142-147　2018/10/22　Research paper (international conference proceedings)

Thermal shock reliability of GaN die-attached on DBA with Ag sinter paste

Dongjin Kim, Chuantong Chen, Zheng Zhang, Shijo Nagao, Aiji Suetake, Nagao Shijo, Katsuaki Suganuma, Chun Pei

Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018　p. 93-96　2018/10/02　Research paper (international conference proceedings)

Effect of temperature on electrochemical corrosion of Zn-30Sn lead-free solder

Zhenghong Wang, Zelin Yang, Shenbo Zeng, Gong Zhang, Jianchun Liu, Chuantong Chen, Katsuaki Suganuma

Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018　p. 10-14　2018/10/02　Research paper (international conference proceedings)

Effect of oxygen on Ag sintering technology with low temperature pressureless

Chuantong Chen, Chanyang Choe, Zheng Zhang, Shijo Nagao, Katsuaki Suganuma

Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018　p. 15-18　2018/10/02　Research paper (international conference proceedings)

Printed wire interconnection using Ag sinter paste for wide band gap power semiconductors

Seungjun Noh, Chanyang Choe, Chuantong Chen, Hao Zhang, Katsuaki Suganuma

Journal of Materials Science: Materials in Electronics　Vol. 29　No. 17　p. 15223-15232　2018/09/01　Research paper (scientific journal)

Large-area die-attachment by silver stress migration bonding for power device applications

Seungjun Noh, Hao Zhang, Jeyun Yeom, Chuantong Chen, Caifu Li, Katsuaki Suganuma

Microelectronics Reliability　Vol. 88-90　p. 701-706　2018/09　Research paper (scientific journal)

Influence of thermal exposure upon mechanical/electrical properties and microstructure of sintered micro-porous silver

Chanyang Choe, Seungjun Noh, Chuantong Chen, Dongjin Kim, Katsuaki Suganuma

Microelectronics Reliability　Vol. 88-90　p. 695-700　2018/09　Research paper (scientific journal)

Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure

Dongjin Kim, Chuantong Chen, Aiji Suetake, Chanyang Choe, Tohru Sugahara, Shijo Nagao, Katsuaki Suganuma

Microelectronics Reliability　Vol. 88-90　p. 779-787　2018/09　Research paper (scientific journal)

Corrosion mechanism of Zn-30Sn high-temperature, lead-free solder in neutral NaCl solution

Zhenghong Wang, Chuantong Chen, Jianchun Liu, Gong Zhang, Katsuaki Suganuma

Corrosion Science　Vol. 140　No. 1　p. 40-50　2018/08/01　Research paper (scientific journal)

Solid porous Ag–Ag interface bonding and its application in the die-attached modules

Chuantong Chen, Katsuaki Suganuma

Journal of Materials Science: Materials in Electronics　Vol. 29　No. 15　p. 13418-13428　2018/08/01　Research paper (scientific journal)

Low-stress design of bonding structure and its thermal shock performance (− 50 to 250 °C) in SiC/DBC power die-attached modules

Chuantong Chen, Chanyang Choe, Zheng Zhang, Dongjin Kim, Katsuaki Suganuma

Journal of Materials Science: Materials in Electronics　Vol. 29　No. 16　p. 14335-14346　2018/08/01　Research paper (scientific journal)

Effect of porosity on the mechanical properties of sintered porous Ag: micro-compression experiments and simulations

Chuantong Chen, Chun Pei, Shijo Nagao, Katsuaki Suganuma

2018/07

Metallization technology of SiC power module in high temperature operation

Tomohito Iwashige, Kazuhiko Sugiura, Takeshi Endo, Kazuhiko Tsuruta, Yuichi Sakuma, Seigo Kurosaka, Yukinori Oda, Chuantong Chen, Shijo Nagao, Katsuaki Suganuma

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018　p. 371-374　2018/06/06　Research paper (international conference proceedings)

Ag joint bonding technology for bare copper substrate in low temperature, pressureless and air condition

Zheng Zhang, Chuantong Chen, Hao Zhang, Shijo Nagao, Katsuaki Suganuma

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018　p. 55-58　2018/06/06　Research paper (international conference proceedings)

Effect of pre-Annealing of Au metallization structure on the bonding performance with low temperature pressureless sintering Ag

Chuantong Chen, Zheng Zhang, Shijo Nagao, Katsuaki Suganuma, Tomohito Iwashige, Kazuhiko Sugiura, Kazuhiro Tsuruta

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018　p. 116-120　2018/06/06　Research paper (international conference proceedings)

AE evaluation of GaN die-attach on DBC substrate,

C. Y. Choe, S. J. Noh, C. Chen, S. Nagao, K. Suganuma

2018/06　Research paper (other academic)

High-temperature reliability of low-temperature and pressureless micron Ag sintered joints for die attachment in high-power device

Hao Zhang, Chuantong Chen, Jinting Jiu, Shijo Nagao, Katsuaki Suganuma

Journal of Materials Science: Materials in Electronics　Vol. 29　No. 10　p. 8854-8862　2018/05/01　Research paper (scientific journal)

Electrochemical Behavior of Sn-9Zn-xTi Lead-Free Solders in Neutral 0.5M NaCl Solution

Zhenghong Wang, Chuantong Chen, Jinting Jiu, Shijo Nagao, Masaya Nogi, Hirotaka Koga, Hao Zhang, Gong Zhang, Katsuaki Suganuma

Journal of Materials Engineering and Performance　Vol. 27　No. 5　p. 2182-2191　2018/05/01　Research paper (scientific journal)

Bonding technology based on solid porous Ag for large area chips

Chuantong Chen, Seungjun Noh, Hao Zhang, Chanyang Choe, Jinting Jiu, Shijo Nagao, Katsuaki Suganuma

Scripta Materialia　Vol. 146　p. 123-127　2018/03/15　Research paper (scientific journal)

High-temperature reliability of sintered microporous Ag on electroplated Ag, Au, and sputtered Ag metallization substrates

Chuantong Chen, Katsuaki Suganuma, Tomohito Iwashige, Kazuhiko Sugiura, Kazuhiro Tsuruta

Journal of Materials Science: Materials in Electronics　Vol. 29　No. 3　p. 1785-1797　2018/02/01　Research paper (scientific journal)

Effect of electroplated Au layer on bonding performance of Ag pastes

Taikun Fan, Hao Zhang, Panju Shang, Caifu Li, Chuantong Chen, Jianxin Wang, Zhiquan Liu, Hao Zhang, Katsuaki Suganuma

Journal of Alloys and Compounds　Vol. 731　No. 15　p. 1280-1287　2018/01/15　Research paper (scientific journal)

Thermal Stability of Silver Paste Sintering on Coated Copper and Aluminum Substrates

Chun Pei, Chuantong Chen, Katsuaki Suganuma, Guicui Fu

Journal of Electronic Materials　Vol. 47　No. 1　p. 811-819　2018/01/01　Research paper (scientific journal)

Heat-resistant die-attach with cold-rolled Ag sheet

Seungjun Noh, Chanyang Choe, Chuantong Chen, Katsuaki Suganuma

Applied Physics Express　Vol. 11　No. 1　2018/01　Research paper (scientific journal)

Packaging material technology for wide band gap power devices and its performance/reliability evaluation

K. Suganuma, N. Sato, A. Suetake, C. Choe, T. Sugahara, S. Nagao, C. Chen

ECS Transactions　Vol. 86　No. 12　p. 17-22　2018　Research paper (international conference proceedings)

Printed Wiring for High-Power Electric Devices by Using Ag-sinter paste

Seungjun Noh, Chuantong Chen, Shijo Nagao, Katsuaki Suganuma

International Symposium on Microelectronics　Vol. 2017　No. 1　p. 000093-000096　2017/10　Research paper (international conference proceedings)

Thermal effect on material properties of sintered porous silver during high temperature ageing

Chanyang Choe, Seungjun Noh, Chuantong Chen, Toshiyuki Ishina, Shijo Nagao, Katsuaki Suganuma

18th International Conference on Electronic Packaging Technology, ICEPT 2017　p. 1492-1496　2017/09/19　Research paper (international conference proceedings)

Solvent effect on pressureless and low-temperature sintering of Ag paste for die-attachment in high-power devices

Hao Zhang, Chuantong Chen, Jinting Jiu, Katsuaki Suganuma

18th International Conference on Electronic Packaging Technology, ICEPT 2017　p. 624-627　2017/09/19　Research paper (international conference proceedings)

Corrosion process study of Zn-30Sn high-temperature lead-free solder

Zhenghong Wang, Gong Zhang, Chuantong Chen, Katsuaki Suganuma

18th International Conference on Electronic Packaging Technology, ICEPT 2017　p. 1254-1257　2017/09/19　Research paper (international conference proceedings)

Printable and Flexible Copper-Silver Alloy Electrodes with High Conductivity and Ultrahigh Oxidation Resistance

Wanli Li, Dawei Hu, Lingying Li, Cai Fu Li, Jinting Jiu, Chuantong Chen, Toshiyuki Ishina, Tohru Sugahara, Katsuaki Suganuma

ACS Applied Materials and Interfaces　Vol. 9　No. 29　p. 24711-24721　2017/07/26　Research paper (scientific journal)

Effect of size and shape of Ag particles for mechanical properties of sintered Ag joints evaluated by micro-compression test

Chuantong Chen, Shijo Nagao, Tohru Sugahara, Hao Zhang, Jinting Jiu, Katsuaki Suganuma, Tomohito Iwashige, Kazuhiko Sugiura, Kazuhiro Tsuruta

2017 International Conference on Electronics Packaging, ICEP 2017　p. 130-134　2017/06/05　Research paper (international conference proceedings)

Microstructural homogeneity of sintered Ag joint after pressureless sintering process

Hao Zhang, Chuantong Chen, Jinting Jiu, Shijo Nagao, Katsuaki Suganuma

2017 International Conference on Electronics Packaging, ICEP 2017　p. 122-124　2017/06/05　Research paper (international conference proceedings)

Silver sinter joining for WBG die-attach

Katsuaki Suganuma, Shijo Nagao, Toru Sugahara, Hao Zhang, Chuantong Chen, Toshiyuki Ishina, Jinting Jiu

2017 International Conference on Electronics Packaging, ICEP 2017　p. 90-93　2017/06/05　Research paper (international conference proceedings)

First failure point of a SiC power module with sintered Ag die-attach on reliability tests

Kazuhiko Sugiura, Tomohito Iwashige, Kazuhiro Tsuruta, Chuantong Chen, Shijo Nagao, Hao Zhang, Tohru Sugahara, Katsuaki Suganuma

2017 International Conference on Electronics Packaging, ICEP 2017　p. 97-100　2017/06/05　Research paper (international conference proceedings)

Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices

Chuantong Chen, Shijo Nagao, Katsuaki Suganuma, Jinting Jiu, Tohru Sugahara, Hao Zhang, Tomohito Iwashige, Kazuhiko Sugiura, Kazuhiro Tsuruta

Acta Materialia　Vol. 129　No. 1　p. 41-51　2017/05/01　Research paper (scientific journal)

Metal-paste sintering die-attach for high temperature power devices

S. Nagao, H. Zhang, C. Chen, A. Shimoyama, K. Suganuma

2017/04　Research paper (international conference proceedings)

Bonding technology for large area by silver stress migration bonding

S. Noh, C. Chen, T. Ishina, S. Nagao, K. Suganuma

2017/04　Research paper (international conference proceedings)

Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design

Chuantong Chen, Shijo Nagao, Hao Zhang, Jinting Jiu, Tohru Sugahara, Katsuaki Suganuma, Tomohito Iwashige, Kazuhiko Sugiura, Kazuhiro Tsuruta

Journal of Electronic Materials　Vol. 46　No. 3　p. 1576-1586　2017/03/01　Research paper (scientific journal)

Highly reliable and highly conductive submicron Cu particle patterns fabricated by low temperature heat-welding and subsequent flash light sinter-reinforcement

Wanli Li, Hao Zhang, Yue Gao, Jinting Jiu, Cai-Fu Li, Chuantong Chen, Dawei Hu, Yusuke Goya, Yutao Wang, Hirotaka Koga, Shijo Nagao, Katsuaki Suganuma

JOURNAL OF MATERIALS CHEMISTRY C　Vol. 5　No. 5　p. 1155-1164　2017/02　Research paper (scientific journal)

Thermal Fatigue Behavior of Silicon-Carbide-Doped Silver Microflake Sinter Joints for Die Attachment in Silicon/Silicon Carbide Power Devices

Hao Zhang, Chuantong Chen, Shijo Nagao, Katsuaki Suganuma

Journal of Electronic Materials　Vol. 46　No. 2　p. 1055-1060　2017/02/01　Research paper (scientific journal)

Thermal stability improvement of sintered Ag materials by addition of tungsten compound particles

Proceedings of JIEP Annual Meeting　Vol. 31　No. 0　p. 178-179　2017

Highly reliable and highly conductive submicron Cu particle patterns fabricated by low temperature heat-welding and subsequent flash light sinter-reinforcement

Wanli Li, Hao Zhang, Yue Gao, Jinting Jiu, Cai Fu Li, Chuantong Chen, Dawei Hu, Yusuke Goya, Yutao Wang, Hirotaka Koga, Shijo Nagao, Katsuaki Suganuma

Journal of Materials Chemistry C　Vol. 5　No. 5　p. 1155-1164　2017　Research paper (scientific journal)

Prominent interface structure and bonding material of power module for high temperature operation

Kazuhiko Sugiura, Tomohito Iwashige, Jun Kawai, Kazuhiro Tsuruta, Chuantong Chen, Shijo Nagao, Hao Zhang, Tohru Sugahara, Katsuaki Suganuma, Seigo Kurosaka, Yuichi Sakuma, Yukinori Oda

Proceedings of the International Symposium on Power Semiconductor Devices and ICs　p. 491-494　2017　Research paper (international conference proceedings)

Electrochemical behavior of Zn-xSn high-temperature solder alloys in 0.5 M NaCl solution

Zhenghong Wang, Chuantong Chen, Jinting Jiu, Shijo Nagao, Masaya Nogi, Hirotaka Koga, Hao Zhang, Gong Zhang, Katsuaki Suganuma

Journal of Alloys and Compounds　Vol. 716　No. 5　p. 231-239　2017　Research paper (scientific journal)

Self-healing of cracks in Ag joining layer for die-attachment in power devices

Chuantong Chen, Shijo Nagao, Katsuaki Suganuma, Jinting Jiu, Hao Zhang, Tohru Sugahara, Tomohito Iwashige, Kazuhiko Sugiura, Kazuhiro Tsuruta

Applied Physics Letters　Vol. 109　No. 9　2016/08/29　Research paper (scientific journal)

Low-Stress Design for SiC Power Modules with Sintered Porous Ag Interconnection

Chuantong Chen, Shijo Nagao, Hao Zhang, Tohru Sugahara, Katsuaki Suganuma, Tomohito Iwashige, Kazuhiko Sugiura, Kazuhiro Tsuruta

Proceedings - Electronic Components and Technology Conference　Vol. 2016-August　p. 2058-2062　2016/08/16　Research paper (international conference proceedings)

Dry-growth of silver single-crystal nanowires from porous Ag structure

Chuantong Chen, Shijo Nagao, Jinting Jiu, Hao Zhang, Tohru Sugahara, Katsuaki Suganuma

Applied Physics Letters　Vol. 108　No. 26　p. 1-5　2016/06/27　Research paper (scientific journal)

A novel mechanism of silver microflakes sinter joining

Hao Zhang, Shijo Nagao, Shih Kang Lin, Emi Yokoi, Chuantong Chen, Katsuaki Suganuma

China Semiconductor Technology International Conference 2016, CSTIC 2016　p. 1-3　2016/05/02　Research paper (international conference proceedings)

Investigation of continuous deformation behavior around initial yield point of single crystal copper by using micro scale torsion test

Kozo Koiwa, Nobuyuki Shishido, Chuantong Chen, Masaki Omiya, Shoji Kamiya, Hisashi Sato, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Toshiaki Suzuki, Takeshi Nokuo

Scripta Materialia　Vol. 111　p. 94-97　2016/01/15　Research paper (scientific journal)

Evaluation of adhesion energy and its correlation to apparent strength for Cu/SiN interface in copper damascene interconnect structures

S. Kamiya, C. Chen, N. Shishido, M. Omiya, K. Koiwa, H. Sato, M. Nishida, T. Suzuki, T. Nakamura, T. Nokuo, T. Suzuki

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015　p. 151-153　2015/11/10　Research paper (international conference proceedings)

Specimen size effect on elastic-plastic strength evaluation of interface between thin films

Chuantong Chen, Kozo Koiwa, Nobuyuki Shishido, Shoji Kamiya, Masaki Omiya, Hisashi Sato, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Takeshi Nokuo, Tadahiro Nagasawa

Engineering Fracture Mechanics　Vol. 131　p. 371-381　2014/12/01　Research paper (scientific journal)

Evaluation for interface strength fluctuations induced by inhomogeneous grain structure of Cu line in LSI Interconnects

Chuantong Chen, Nobuyuki Shishido, Shoji Kamiya, Kozo Koiwa, Hisashi Sato, Masaki Omiya, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Takeshi Nokuo, Toshiaki Suzuki

Microelectronic Engineering　Vol. 120　p. 52-58　2014/05/25　Research paper (scientific journal)

Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures

Masaki Omiya, Kozo Koiwa, Nobuyuki Shishido, Shoji Kamiya, Chuantong Chen, Hisashi Sato, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Toshiaki Suzuki, Takeshi Nokuo

Microelectronics Reliability　Vol. 53　No. 4　p. 612-621　2013/04　Research paper (scientific journal)

Macroscopic and microscopic interface adhesion strength of copper damascene interconnects

N. Shishido, S. Kamiya, C. Chen, H. Sato, K. Koiwa, M. Omiya, M. Nishida, T. Suzuki, T. Nakamura, T. Nokuo, T. Suzuki

Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013　p. 1-4　2013　Research paper (international conference proceedings)

Specimen size effect of interface strength distribution induced by grain structure of Cu line

Chuantong Chen, Nobuyuki Shishido, Kozo Koiwa, Shoji Kamiya, Hisashi Sato, Masahiro Nishida, Masaki Omiya, Takashi Suzuki, Tomoji Nakamura, Toshiaki Suzuki, Takeshi Nokuo

Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A　Vol. 79　No. 799　p. 354-358　2013　Research paper (scientific journal)

OS2406 A statistical study for distribution of local adhesion strength in semiconductor device metallization systems

CHEN Chuantong, NAGASAWA Tadahiro, NOKUO Takeshi, SHISHIDO Nobuyuki, MATSUMOTO Satoru, KAMIYA Shoji, SATO Hisashi, NISHIDA Masahiro, OMIYA Masaki, SUZUKI Takashi, NAKAMURA Tomoji

The Proceedings of the Materials and Mechanics Conference　Vol. 2011　No. 0　p. _OS2406-1_-_OS2406-3_　2011

104 Specimen size effect on interface adhesion measurement for Cu metallization systems in integrated circuits

SHISHIDO Nobuyuki, NAGASAWA Tadahiro, CHEN Chuantong, KAMIYA Shoji, OMIYA Masaki, SATO Hisashi, NISHIDA Masahiro, SUZUKI Takashi, NAKAMURA Tomoji, NOKUO Takeshi

The Proceedings of The Computational Mechanics Conference　Vol. 2011　No. 0　p. 9-11　2011　Research paper (conference, symposium, etc.)

Interface toughness evaluation with specimens fabricated by focused ion beam for micro scale devices and packages

Nobuyuki Shishido, Satoru Matsumoto, Chuantong Chen, Hisashi Sato, Masaki Omiya, Shoji Kamiya, Masahiro Nishida, Takeshi Nokuo, Tadahiro Nagasawa, Takashi Suzuki, Tomoji Nakamura

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011　Vol. 1　p. 425-+　2011　Research paper (international conference proceedings)

Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects

Shoji Kamiya, Hisashi Sato, Masahiro Nishida, Chuantong Chen, Nobuyuki Shishido, Masaki Omiya, Takashi Suzuki, Tomoji Nakamura, Takeshi Nokuo, Tadahiro Nagasawa

AIP Conference Proceedings　Vol. 1300　p. 33-38　2010　Research paper (international conference proceedings)